WO2008152827A1 - プリント配線板およびその製造方法 - Google Patents

プリント配線板およびその製造方法 Download PDF

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Publication number
WO2008152827A1
WO2008152827A1 PCT/JP2008/051490 JP2008051490W WO2008152827A1 WO 2008152827 A1 WO2008152827 A1 WO 2008152827A1 JP 2008051490 W JP2008051490 W JP 2008051490W WO 2008152827 A1 WO2008152827 A1 WO 2008152827A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed
wiring board
manufacturing
same
transmission line
Prior art date
Application number
PCT/JP2008/051490
Other languages
English (en)
French (fr)
Inventor
Ryoichi Toyoshima
Original Assignee
Nippon Mektron, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron, Ltd. filed Critical Nippon Mektron, Ltd.
Publication of WO2008152827A1 publication Critical patent/WO2008152827A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　折り曲げ、屈曲に適し、多層化せずに基板の高密度化が可能な擬似同軸構造を有するプリント配線板およびその製造法を提供することを目的とする。 　部品実装部８と、この部品実装部に連設された伝送線路部７とをそなえたプリント配線板において、前記伝送線路部は、中心に配された信号配線４の周囲に、絶縁樹脂層２を介して接地層３が配置され、前記伝送線路部の信号配線の幅が５～３０μmの範囲にあり、前記絶縁樹脂層の厚さが前記信号配線の幅に対応する５～４０μmの範囲にあって、前記伝送線路部７の接地層１６，２０が前記部品実装部８に設けられた接地層３０と接続されたことを特徴とするプリント配線板、およびその製造法。
PCT/JP2008/051490 2007-06-12 2008-01-31 プリント配線板およびその製造方法 WO2008152827A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007154903A JP2008311270A (ja) 2007-06-12 2007-06-12 プリント配線板およびその製造方法
JP2007-154903 2007-06-12

Publications (1)

Publication Number Publication Date
WO2008152827A1 true WO2008152827A1 (ja) 2008-12-18

Family

ID=40129441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051490 WO2008152827A1 (ja) 2007-06-12 2008-01-31 プリント配線板およびその製造方法

Country Status (3)

Country Link
JP (1) JP2008311270A (ja)
TW (1) TW200850098A (ja)
WO (1) WO2008152827A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105578733A (zh) * 2016-02-26 2016-05-11 青岛海信移动通信技术股份有限公司 一种pcb及其制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04313300A (ja) * 1991-04-10 1992-11-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP2002324949A (ja) * 2001-04-24 2002-11-08 Nippon Mektron Ltd 回路基板及びその製造法
JP2003249731A (ja) * 2002-02-25 2003-09-05 National Institute Of Advanced Industrial & Technology 同軸線路構造を有するプリント配線基板およびその製造方法
JP2004119604A (ja) * 2002-09-25 2004-04-15 Nippon Mektron Ltd シールド型回路基板およびその製造方法
JP2006041102A (ja) * 2004-07-26 2006-02-09 Fujikura Ltd プリント配線板およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04313300A (ja) * 1991-04-10 1992-11-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP2002324949A (ja) * 2001-04-24 2002-11-08 Nippon Mektron Ltd 回路基板及びその製造法
JP2003249731A (ja) * 2002-02-25 2003-09-05 National Institute Of Advanced Industrial & Technology 同軸線路構造を有するプリント配線基板およびその製造方法
JP2004119604A (ja) * 2002-09-25 2004-04-15 Nippon Mektron Ltd シールド型回路基板およびその製造方法
JP2006041102A (ja) * 2004-07-26 2006-02-09 Fujikura Ltd プリント配線板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105578733A (zh) * 2016-02-26 2016-05-11 青岛海信移动通信技术股份有限公司 一种pcb及其制作方法

Also Published As

Publication number Publication date
JP2008311270A (ja) 2008-12-25
TW200850098A (en) 2008-12-16

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