200850098 九、發明說明 【發明所屬之技術領域】 本發明是關於印刷配線板的製造方法，尤其是關於用 以將對應於電性、電子機器對於小型化、高性能化的要求 的高速訊號予以傳送的印刷配線板的製造方法。 【先前技術】 電子機器的訊號的處理速度是近年來愈提昇。所以通 過印刷配線板的訊號的傳送速度也變快速。在高速訊號的 傳送中，若來自外部的電磁波雜訊侵入到該訊號配線，則 成爲無法正確地傳訊號。電磁波雜訊的影響是訊號愈高速 愈變顯著。 一般，在印刷配線板中爲了抑制來自外部的電磁波雜 訊，將接地層配置於訊號配線的周圍以遮蔽電磁波。作爲 該手法，有導波線或微導波線等，惟如第1圖所示地，經 由配設於訊號配線1周圍的絕緣層2而藉由接地層3進行 覆蓋訊號配線1的同軸構造最有效。 在此，提案者僅對進行高速傳送的訊號配線，將半剛 性電纜等的同軸線路藉由表面安裝配置於基板上的手法（ 專利文獻1 )。又，也提案將同軸電纜埋設於基板內的手 法（專利文獻2 )。 又，也提案著連續地連接導波線的上，下接地層間’ 而模擬比作成同軸構造的手法（專利文獻3及4)。或是 ，提案著將接地層設在形成於訊號配線周邊的溝，而模擬 -4- 200850098 地作成同軸構造的手法（專利文獻5 )。又，提案著藉由 樹脂蝕刻除去位於訊號配線周圍的第一絕緣層一直到第一 接地層，而藉由電解澱積手法將第二絕緣層形成於配線周 圍，之後，形成第二接地層的手法（專利文獻6)。 一方面，電子機器是以手機爲主，謀求小型化、輕量 化’而被裝載於此的印刷配線板，也提高小型化、輕量化 的要求。爲了對應於此，採用藉由印刷配線板的薄型化， 表面安裝零件的低高度化等的手段作成高密度化的手法， 或是使用可撓性印刷配線板等而折疊基板予以安裝，作成 有效地利用機器內的手法。 專利文獻1 :日本特開2004-3 3 5 5 1 5號公報 專利文獻2 :日本特開平6-25 1 642號公報 專利文獻3 :日本特開200 1 - 1 6007號公報 專利文獻4 :日本特開2002-24973 1號公報 專利文獻5 :日本特開2000-323 846號公報 專利文獻6:日本特開2004-119604號公報 【發明內容】 上述習知例都有問題，爲如下所述。首先，擬表面安 裝半剛性電纜時’半剛性電纜爲傳送上所必需的距離而橫 跨基板表面。所以，該部位是無法安裝，而對高密度化不 適用。 又，擬將同軸電纜埋設在基板內時，一般具有1 00 // m以上的直徑之故，因而埋設所需要的樹脂厚度也成爲 -5- 200850098 需要1 00 // m以上。結果，基板全體變厚，對高密度化不 利。 又，擬作成模擬地同軸構造時，必須依次形成第一接 地層、訊號配線層、第二接地層，並予以積層。結果，基 板全體是成爲3層構造，而不適用於高密度化。 還有，爲了連接此些的模擬性的同軸構造的第一接地 層與第二接地層，而需要藉由雷射加工以形成溝，使得加 工時間變久。結果，產生降低生產性，增加生產成本等的 問題。 藉由樹脂飩刻及電解澱積手法擬製作模擬性同軸構造 時，可避免多層化，因樹脂蝕刻，因此藉由面內一倂加工 可形成溝，可說比雷射加工更有利。 然而，金屬所成的第一接地層連接於各同軸線路間的 構造之故，因而作爲基材不管適用富於可撓性的聚醯亞胺 ，也不適用於折疊用的安裝。 本發明是考慮上述事項而創作者，其目的在於提供適 用於折彎、屈曲，未做成多層化，而具有可作成基板的高 密度化的模擬同軸構造的印刷配線板及其製造方法。 爲了達成上述目的，本發明是提供： 一種印刷配線板，是具有零件安裝部，及連設於該零 件安裝部的傳送線路部的印刷配線板，其特徵爲： 上述傳送線路部是在配設於中心的信號配線的周圍， 經由絕緣樹脂層配置有接地層， 上述傳送線路部的訊號配線的寬度是在5至3 0 // m的 -6 - 200850098 範圍， 上述絕緣樹脂層的厚度是對應於上述訊號配線的寬度 的5至4 0 // m的範圍， 上述傳送線路部的接地層是與設在上述零件安裝部的 接地層相連接， 以及 一種印刷配線板的製造方法，是具有零件安裝部，及 連設於該零件安裝部的傳送線路部，上述傳送線路部是在 配設於中心的訊號配線的周圍，經由絕緣樹脂層配置有接 地層的同軸構造，一體地設有上述傳送線路部與上述零件 安裝部的印刷配線板的製造方法，其特徵爲： 具有： a·在絕緣性基材上設置上述訊號配線的工程；及 b ·除去上述訊號配線的周圍的上述絕緣性基材的工 程；及 c. 在上述訊號配線的周圍藉由電解澱積手法設置絕 緣層的工程；及 d. 在上述絕緣層的周圍設置上述接地層的工程。 依照本發明，僅將傳送線路作成選擇性且獨立的同軸 構造，成爲可製造不妨礙基板的高密度化，且適用於傳送 高速訊號的印刷配線板，甚至於有助於電子機器的高性能 化、小型化者。 (印刷配線板的構造） 200850098 第2圖是表示依本發明的印刷配線板的基 將傳送線路部作成選擇性且獨立的同軸構造。 板是接地層5經由絕緣層6配置於訊號配線4 體地具有分別獨立而可屈曲的同軸構造的傳送 件安裝部8，傳送線路部7的訊號配線4的寬 3 0 // m的範圍，而絕緣層6的厚度是對應於訊 度的5至40//m的範圍。 將該絕緣層作成聚醯亞胺或氟樹脂，則成 性賦予同軸構造的傳送線路，此些樹脂是介質 較小之故，因而成爲可減輕傳送高速訊號的介 損失，而對傳送高速訊號上有利。 又，同軸構造的傳送線路是各個獨立而可 因而對於扭轉方向的安裝，或對於習知在可撓 板具有不適用的旋轉機構的部位也可適用。 又，將訊號配線的寬度作成5〜2 0 // m的範 緣樹脂層的厚度作成5〜3 0 // m的範圍，則可形 正確爲5 0 Ω的同軸構造的傳送線路。 藉由本發明所形成的同軸構造的直徑是 之故，因而即使埋設於多層基板的內層的情形 埋設所用的樹脂厚度。 (印刷配線板的製造方法） 在本發明的製造方法中，除去基材上的訊 的基材，而在該訊號配線周圍設置絕緣層、接 :本構造，僅 該印刷配線 的周圍，一 線路7與零 度是在5至 號配線的寬 爲可將可撓 損耗角正切 質所產生的 屈曲之故， 性印刷配線 圍，而將絕 成特性阻抗 C 足 \00 μ m ，也可抑制 號配線周圍 地層，而僅 -8- 200850098 將印刷配線板的傳送線路部選擇性地作成同軸構造有助於 基板的小型化。 又，本發明的訊號配線層的形成方法是並未特別加以 限定者，惟爲了精度優異地控制訊號配線的線寬，以半加 性法較佳。又，藉由電解澱積手法來塗佈絕緣層，則成爲 精度優異地控制膜厚且可選擇性地形成絕緣層。 印刷配線板的製造方法的絕緣性基材是聚醯亞胺，而 除去訊號配線周圍的基材手段爲化學鈾刻也可以。基材除 去手法，有鼓風、雷射、電漿等。但是須考慮鼓風是會使 硏磨劑凹陷在配線等，而成爲很難除去的問題，而雷射是 如上述在加工大面積上費時，又，電漿是有其蝕刻時間過 久的情形。 結果，將絕緣性基材作爲聚醯亞胺，進行例如比聯氨 等的化學鈾刻較安全且對環境之負荷較少的以無機鹼成分 與水作爲主成分的TPE-3 000 (日本東麗技術股份有限公 司製）等的化學蝕刻，在對於配線的損傷，加工時間亦即 加工成本，甚至於製品的成本方面有利。使用於該蝕刻的 蝕刻液是藉由聚醯亞胺種籽會使蝕刻時間變化之故，因而 聚醯亞胺是單一者較佳，例如有「美達洛依亞路」（音譯 )(日本東洋「美達來依信」股份有限公司製）等。 藉由半加性法形成配線時，對於「卡普頓」（Kapton :美國杜邦公司商標名稱）等的單一組成的聚醯亞胺進行 濺鍍等乾式電鍍，或是無電解電鍍等的濕式電鍍者也可適 用。 -9- 200850098 又，藉由印刷配線板的製造方法的電解澱積手法所形 成的絕緣層，是聚醯亞胺或氟樹脂都可以。 【實施方式】 以下，參照所附圖式來說明本發明的實施形態。 實施例1 第3圖是表示依本發明的一實施例的同軸構造的形成 方法的工程斷面圖。 首先，如第3 A ( 1 )圖所示地，對於單一組成的聚醯 亞胺9的兩面形成0 · 1 // m之銅的晶種層1 〇，作爲兩面貼 銅板1 1。聚醯亞胺的種類是在此爲選擇厚度25 // m的「 卡普頓」100EN (東麗、杜邦股份有限公司製）。 又，晶種層的形成方法是有濺鍍、蒸鍍等的乾式電鍍 、無電解電鍍等的濕式電鍍等的手法，惟在此藉由濺鍍法 所形成。 之後，如第3 A ( 2 )圖所示地，形成電鍍光阻圖案1 2 ，把兩面貼銅板的單作成全面保護，而把另一面開口有訊 號配線形成部。電鍍光阻是具有對於電鍍液的耐性，比後 續進行的電鍍厚度還厚者就可以。在此，適用厚度1 9 // m 的乾薄膜光阻RY3219 (日立化成工業股份有限公司製） 。在此，訊號配線部的開口寬度是作爲1 4 // m。 然後，如第3 A ( 3 )圖所示地，藉由硫酸銅電鍍進行 1 3 // m電鍍以形成訊號配線1 3，並剝離電阻光阻1 2。之 -10- 200850098 後，如第3 A ( 4 )所示地，開口聚醯亞胺除去部14而形 成蝕刻保護層，藉由過硫酸鈉水溶液等的適當蝕刻劑以鍍 銅換算進行1 // m蝕刻，除去聚醯亞胺除去部1 4的晶種層 1 〇，俾剝離蝕刻保護層。 触刻保護層是在此選擇厚度20 // m的乾薄膜光阻 SPG202 (曰本旭化成電子股份有限公司製）。除去聚醯亞 胺除去部1 4的晶種層1 〇之後的訊號配線1 3的寬度是成 爲12/zm，厚度是成爲12/zm。 然後，如第3 B ( 5 )圖所示地，藉由化學鈾刻的手法 ，使用TPE-3 000 (東麗技術股份有限公司製），將留下 的晶種層1 〇作爲罩幕來除去聚醯亞胺9。 又，如第3 B ( 6 )圖所示地，藉由電解電鍍形成2 1 // m厚的絕緣層1 5。在絕緣層1 5適用介質常數，介質損 失低的樹脂，在傳送高速訊號上成爲有利，在此’適用將 聚醯亞胺作成樹脂分的「埃萊可得」PI (清水股份有限公 司製）。 之後，如第3 B ( 7 )圖所示地，在絕緣層1 5的周圍 以無電解電鍍，電解電鍍的順序形成接地層1 6。這時的接 地層1 6的厚度是作爲5 // m。又，如第3 B ( 8 )圖所示地 ，藉由在接地層16的周圍使用「埃萊可得」PI形成厚8 // m的保護層1 7，可形成有特性阻抗爲5 〇 Ω的同軸構造 的傳送線路。 實施例2 -11 - 200850098 第4圖是表示依本發明的第二實施例所 造的傳送線路的斷面圖。 將實施例1的絕緣層1 8的電解澱積樹 亞胺，適用作成比聚醯亞胺更低介質常數， 切的氟樹脂「埃萊可得耐斯隆」（清水股份 。此時的訊號配線1 9是在除去晶種層之後ff //m，厚度15//m，而電解澱積膜厚是作成] 又，接地層20是將銀蒸鍍0.5 // m。以 成接地層20，之後的保護層形成是成爲不需 層20爲薄至0.5//m之故，因而對折彎上有 形成將特性阻抗作爲5 0 Ω的同軸構造的傳送 實施例3 第 5A ( a) ( b)圖至第 5E ( a) ( b ) 發明的第三實施例的可撓性印刷配線板的工 圖中（a )是從訊號配線側觀看者’ （b )是 看者。 又，第 6A(a) (b)圖及第 6B(a) 著第5A圖的A-A’線及B-B’線切斷的斷面圖 首先，對於絕緣性基材2 1的厚度2 5 // 」100EN形成層間連接用的穴22’與貫施例 0.1 // m的銅，作成晶種層23。穴的種類是 貫通，又，若穴的形成方法是非貫通’則有 手法，若爲貫通，則有機械式的鑽機、衝孔 形成的同軸構 脂，代替聚醯 介質損耗角正 有限公司製） s成寬度15 I 8 // m 〇 貴金屬的銀作 要。又，接地 利。藉由此可 線路。 圖是表示依本 程俯視圖，各 從其相反側觀 (b )是表示沿 〇 m的「卡普頓 1同樣地濺鍍 不管非貫通， 雷射、蝕刻等 機、雷射、蝕 -12- 200850098 刻等的手法，惟並未特別加以限定者。在此’藉由uv_ YAG雷射形成Φ 50//m的貫通穴。 之後，如第5A圖及第6A圖所示地’藉由電鑛形成 包含訊號配線24的配線25。這時候，在電鍍光阻適用 RY32 19 (日立化成工業股份有限公司製）。 又，訊號配線24的光阻開口寬度是作成1 2 // m，電 鍍厚度是作成1 1 # nr。這時候，在層間連接用的穴22也 析出有電鍍之故，因而也可同時地進行層間連接。 然後，如第5B圖及第6B圖所示地，形成蝕刻光阻 SPG202成爲將聚醯亞胺除去部26予以開口，而使用過硫 酸鈉水溶液等的適當蝕刻劑來除去聚醯亞胺除去部26的 晶種層23。蝕刻是以鍍銅換算作爲1 // m，藉由此，除去 晶種層23之後的訊號配線24的寬度是成爲1 0 μ m，而厚 度是成爲1 〇 // m。 然後，如第5c圖及第6c圖所示地，使用TPE-3 000 來進行化學蝕刻聚醯亞胺除去部26的聚醯亞胺。 之後，除去留下的晶種層23，如第5D圖及第6D圖 所示地，將安裝部27及接地層連接部28施以罩幕，藉由 「埃累可得」PI來進行18 // m電解澱積而在配線25的周 圍形成絕緣層2 9。 罩幕的材料是適用比施以電解澱積的樹脂的厚度還厚 的罩幕材。在此，選擇厚度 50 // m的乾薄膜光阻 ALPHO411Y50 ( 「尼其我·莫頓」股份有限公司製）。剝 離罩幕材之後，在導體露出部的安裝部27及接地層連接 -13- 200850098 部2 8，將絕緣層2 9作爲罩幕而施以無電解鎳，之後進行 鍍金。 又’如第5E圖及第6E圖所示地，將訊號配線24及 接地層連接部2 8露出般地，藉由罩幕材以形成接地層圖 案，而將成爲接地層的銀3 0蒸鍍3 0 μ m，之後剝離罩幕 材。罩幕材是適用藉由蒸鍍時的熱未變成，而蒸鍍後容易 剝離者較佳。 在此’使用「克累普」罩幕帶No .293 (寺岡製作所股 份有限公司製）。藉由此，可形成傳送線路的特性阻抗大 約正確地具有5 0 Ω的同軸構造的可撓性印刷配線板。 【圖式簡單說明】 第1圖是表示本發明作爲指標的同軸構造的斷面圖。 第2圖是表示依本發明的同軸構造的槪念性的立體圖 〇 第3A(1)圖至第3A(4)圖是用以說明本發明的第 一實施例的局部工程斷面圖。 第3B(5)圖至第3B(8)圖是用以說明本發明的第 一實施例的局部工程斷面圖。 第4圖是表示用以說明本發明的第二實施例的斷面圖 〇 第5A圖是表示本發明的第三實施例的可撓性印刷配 線板的工程俯視圖’第5 A ( a )圖是表示從訊號配線側觀 看的圖式’第5 A ( b )圖是表示從其相反側觀看的圖式。 -14- 200850098 第5 B圖是表示本發明的第三實施例的可撓性印刷配 線板的工程俯視圖，第5 b ( a )圖是表示從訊號配線側觀 看的圖式，第5 B ( b )圖是_示從其相反側觀看的圖式。 第5 C圖是表示本發明的第三實施例的可撓性印刷配 線板的工程俯視圖，第5 C ( a )圖是表示從訊號配線側觀 看的圖式，第5C(b)圖是表示從其相反側觀看的圖式。 第5D圖是表示本發明的第三實施例的可撓性印刷配 線板的工程俯視圖，第5 D ( a )圖是表示從訊號配線側觀 看的圖式，第5 D ( b )圖是表示從其相反側觀看的圖式。 第5 E圖是表示本發明的第三實施例的可撓性印刷配 線板的工程俯視圖，第5 E ( a )圖是表示從訊號配線側觀 看的圖式，第5E(b)圖是表不從其相反側觀看的圖式。 第6A(a) (b)圖是表示沿著第5A圖的A-A’及B- B ’線所切斷的斷面的工程斷面圖。 第6B(a) (b)圖是表示沿著第5A圖的A-A’及B· B，線所切斷的斷面的工程斷面圖。 第6C(a) (b)圖是表示沿著第5A圖的Α·Α’及B- Β，線所切斷的斷面的工程斷面圖。 第6D(a) (b)圖是表示沿著第5Α圖的Α-Α’及Β- B，線所切斷的斷面的工程斷面圖。 第6E(a) (b)圖是表示沿著第5A圖的A-A’及B- B，線所切斷的斷面的工程斷面圖。 【主要元件符號說明】 -15- 200850098 1 :訊號配線 2 :絕緣層 3 :接地層 4 :訊號配線 5 :接地層 6 :絕緣層 7 :同軸構造的傳送線路部 8 :零件安裝部 9 :聚醯亞胺 1 〇 :晶種層 1 1 :兩面貼銅板 1 2 :電鍍光阻 1 3 :訊號配線 1 4 :聚醯亞胺除去部 1 5 :絕緣部 1 6 :接地層 1 7 :保護層 1 8 :絕緣層 1 9 :訊號配線 2 0 :接地層 21 :基材 22 :層間連接用穴 2 3 :晶種層 2 4 :訊號配線 -16- 200850098 2 5 :配線 26 :聚醯亞胺除去部 2 7 :安裝部 2 8 :接地層連接部 2 9 :絕緣層 3 0 :成爲接地層的銀 -17200850098 IX. EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to a method of manufacturing a printed wiring board, and more particularly to a high-speed signal for transmitting requirements for miniaturization and high performance in accordance with electrical and electronic equipment. A method of manufacturing a printed wiring board. [Prior Art] The processing speed of signals of electronic machines has increased in recent years. Therefore, the transmission speed of the signal through the printed wiring board is also fast. In the transmission of high-speed signals, if electromagnetic noise from the outside enters the signal wiring, the signal cannot be correctly transmitted. The effect of electromagnetic noise is that the higher the signal speed, the more significant it becomes. Generally, in order to suppress electromagnetic wave noise from the outside in the printed wiring board, a ground layer is disposed around the signal wiring to shield electromagnetic waves. As this method, there are a waveguide line, a micro-guide line, and the like. However, as shown in FIG. 1, the coaxial structure of the signal wiring 1 is most effectively covered by the ground layer 3 via the insulating layer 2 disposed around the signal wiring 1. . Here, the proponent is a method in which a coaxial line such as a semi-rigid cable is mounted on a substrate by surface mounting only for signal wiring for high-speed transmission (Patent Document 1). Further, a method of embedding a coaxial cable in a substrate has been proposed (Patent Document 2). Further, it has been proposed to continuously connect the upper and lower grounding layers of the waveguide line to simulate a method of making a coaxial structure (Patent Documents 3 and 4). Or, it is proposed to provide a grounding layer in a groove formed around the signal wiring, and to simulate a -4-200850098 method of forming a coaxial structure (Patent Document 5). Further, it is proposed to remove the first insulating layer located around the signal wiring to the first ground layer by resin etching, and to form a second insulating layer around the wiring by electrolytic deposition, and then form a second ground layer. Technique (Patent Document 6). On the other hand, the electronic equipment is a printed wiring board that is mainly used for mobile phones and is compact and lightweight, and is also required to be smaller and lighter. In order to cope with this, it is effective to reduce the thickness of the printed wiring board, to reduce the height of the surface-mounted components, or to use a flexible printed wiring board or the like to fold the substrate and mount it. Use the methods in the machine. [Patent Document 1] Japanese Patent Laid-Open No. 2004-3 3 5 5 1 5 Patent Document 2: Japanese Patent Laid-Open Publication No. Hei 6-25 No. Japanese Laid-Open Patent Publication No. JP-A-2004-119604 (Patent Document No. JP-A-2004-119604) SUMMARY OF THE INVENTION The above conventional examples have problems as described below. First, when a semi-rigid cable is to be surface mounted, the semi-rigid cable traverses the surface of the substrate for the necessary distance for transport. Therefore, this part cannot be installed, and it is not suitable for high density. Further, when the coaxial cable is to be embedded in the substrate, it generally has a diameter of 100 μm or more. Therefore, the thickness of the resin required for embedding is also -500 - 200850098, and it is required to be 100 / m or more. As a result, the entire substrate becomes thick, which is disadvantageous for high density. Further, when it is intended to be an analog coaxial structure, the first ground layer, the signal wiring layer, and the second ground layer must be sequentially formed and laminated. As a result, the entire substrate is a three-layer structure and is not suitable for high density. Further, in order to connect the first ground layer and the second ground layer of the analog coaxial structure, it is necessary to form a groove by laser processing, so that the processing time becomes long. As a result, problems such as reduction in productivity, increase in production cost, and the like are caused. When a pseudo-coaxial structure is prepared by resin engraving and electrodeposition, multi-layering can be avoided, and since the resin is etched, the groove can be formed by in-plane processing, which is more advantageous than laser processing. However, the first ground layer formed of metal is connected to the structure between the coaxial lines, and thus it is not suitable for the mounting for folding as a substrate regardless of the flexibility of the polyimide. The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a printed wiring board having a high-density analog coaxial structure which can be used as a substrate and which is suitable for bending and buckling, and which is not multilayered, and a method for manufacturing the same. In order to achieve the above object, the present invention provides a printed wiring board which is a printed wiring board having a component mounting portion and a transmission line portion connected to the component mounting portion, wherein the transmission line portion is disposed A ground layer is disposed around the signal wiring of the center via the insulating resin layer, and the width of the signal wiring of the transmission line portion is in the range of -6 - 200850098 of 5 to 30 // m, and the thickness of the insulating resin layer is corresponding In the range of 5 to 40 // m of the width of the signal wiring, the ground layer of the transmission line portion is connected to the ground layer provided in the component mounting portion, and a method of manufacturing the printed wiring board has a part The mounting portion and the transmission line portion connected to the component mounting portion, wherein the transmission line portion has a coaxial structure in which a ground layer is disposed via an insulating resin layer around the signal wiring disposed at the center, and the transmission is integrally provided A method of manufacturing a printed wiring board of a line portion and the component mounting portion, comprising: a: providing the signal on an insulating substrate The engineering of the wire; and b. the removal of the insulating substrate around the signal wiring; and c. the process of providing an insulating layer by electrolytic deposition around the signal wiring; and d. The construction of the above grounding layer is set around. According to the present invention, only the transmission line is formed as a selective and independent coaxial structure, and it is possible to manufacture a printed wiring board which is suitable for transmitting high-speed signals without impeding the increase in density of the substrate, and contributes to high performance of the electronic device. Miniaturizer. (Structure of Printed Wiring Board) 200850098 Fig. 2 is a view showing the structure of the printed wiring board according to the present invention. The transmission line portion is formed as a selective and independent coaxial structure. The board is a carrier mounting portion 8 having a coaxial structure in which the ground layer 5 is disposed on the signal wiring 4 via the insulating layer 6 and has an independent and flexible structure. The signal wiring 4 of the transmission line portion 7 has a width of 3 0 // m. The thickness of the insulating layer 6 is in the range of 5 to 40//m corresponding to the stimuli. When the insulating layer is made of a polyimide or a fluororesin, the transmission is provided to the transmission line of the coaxial structure. These resins are small in the medium, so that the dielectric loss of the high-speed signal can be reduced, and the high-speed signal is transmitted. advantageous. Further, the transmission lines of the coaxial structure are independent of each other and can be mounted in the torsional direction, or can be applied to a portion having a rotating mechanism which is not suitable for the flexible plate. Further, by setting the width of the signal wiring to a range of 5 to 2 0 / m, the thickness of the resin layer is 5 to 3 0 / m, and it is possible to form a transmission line of a coaxial structure of 50 Ω. The diameter of the coaxial structure formed by the present invention is such that the thickness of the resin used is buried even when buried in the inner layer of the multilayer substrate. (Manufacturing Method of Printed Wiring Board) In the manufacturing method of the present invention, the substrate on the substrate is removed, and an insulating layer is provided around the signal wiring, and the present structure is provided only around the printed wiring. 7 and zero are the width of the 5 to the wiring, which is the buckling of the flexible loss tangent, and the printed wiring is surrounded by the characteristic impedance C of \00 μ m. In the surrounding formation, only the -8-200850098 selectively forms the transmission line portion of the printed wiring board into a coaxial structure to contribute to the miniaturization of the substrate. Further, the method of forming the signal wiring layer of the present invention is not particularly limited, but it is preferable to control the line width of the signal wiring with excellent precision. Further, when the insulating layer is applied by an electrodeposition method, the film thickness is controlled with excellent precision and the insulating layer can be selectively formed. The insulating base material for the method of producing a printed wiring board is polyimine, and the means for removing the substrate around the signal wiring may be chemical uranium engraving. The substrate is removed, and there are blast, laser, plasma, and the like. However, it is necessary to consider that the blast is to cause the honing agent to sag in the wiring, etc., and it becomes a problem that it is difficult to remove, and the laser is time consuming in processing a large area as described above, and the plasma has a etch time too long. . As a result, the insulating base material is used as a polyimine, for example, TPE-3 000 containing an inorganic alkali component and water as a main component, which is safer than chemical uranium engraving such as hydrazine, and which has less environmental load. Chemical etching, such as manufactured by Lai Technology Co., Ltd., is advantageous in terms of damage to wiring, processing time, that is, processing cost, and even cost of the product. The etchant used in the etching is caused by the polyimine seed to change the etching time, so that the polyimide is preferable, for example, "Medalahia Road" (Japanese) Toyo "Mitato Ishin" Co., Ltd.) and so on. When the wiring is formed by the semi-additive method, dry plating such as sputtering of a single composition of "Kapton" (Kapton: DuPont brand name) is performed, or wet plating such as electroless plating. Electroplaters are also available. -9- 200850098 Further, the insulating layer formed by the electrodeposition method of the method for producing a printed wiring board may be either polyimide or fluororesin. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. (Embodiment 1) Fig. 3 is a cross-sectional view showing the construction of a coaxial structure according to an embodiment of the present invention. First, as shown in Fig. 3 A (1), a seed layer 1 铜 of 0·1 // m of copper is formed on both sides of a single-component polyimine 9 as a double-sided copper plate 1 1 . The type of polyimine is "Kapton" 100EN (made by Toray, DuPont Co., Ltd.) with a thickness of 25 // m. Further, the method of forming the seed layer is a method such as dry plating such as sputtering or vapor deposition or wet plating such as electroless plating, but is formed by sputtering. Thereafter, as shown in Fig. 3A (2), a plating resist pattern 1 2 is formed, the single-sided copper plate is integrally protected, and the other surface is provided with a signal wiring forming portion. The plating resist is resistant to the plating solution and may be thicker than the subsequent plating thickness. Here, a dry film photoresist RY3219 (manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 1 9 // m is applied. Here, the opening width of the signal wiring portion is 1 4 // m. Then, as shown in Fig. 3 A (3), 1 3 // m plating was performed by copper sulfate plating to form the signal wiring 13 and the resistance photoresist 1 2 was peeled off. -10-200850098, as shown in the third A (4), the polyimine removal portion 14 is opened to form an etching protective layer, and the appropriate etchant such as a sodium persulfate aqueous solution is used for copper plating. / m etching, removing the seed layer 1 of the polyimine removal portion 14 and removing the etching protective layer. The etched protective layer is a dry film photoresist SPG202 (manufactured by Sakamoto Asahi Kasei Electronics Co., Ltd.) having a thickness of 20 // m. The width of the signal wiring 1 3 after the seed layer 1 of the polyimide removal portion 14 was removed was 12/zm, and the thickness was 12/zm. Then, as shown in Fig. 3B(5), using TPE-3 000 (manufactured by Toray Technology Co., Ltd.) by chemical uranium engraving, the remaining seed layer 1 is used as a mask. Polyimine 9 is removed. Further, as shown in Fig. 3B(6), an insulating layer 15 of 2 1 // m thick is formed by electrolytic plating. In the case of the insulating layer 15 , a resin having a low dielectric loss and a low dielectric loss is advantageous in the transmission of a high-speed signal. Here, the "Elyco" PI (made by Shimizu Co., Ltd.) which uses polyimine as a resin is used. . Thereafter, as shown in Fig. 3B(7), the ground layer 16 is formed in the order of electroless plating and electrolytic plating around the insulating layer 15. The thickness of the ground plane 16 at this time is taken as 5 // m. Further, as shown in Fig. 3B(8), a protective layer 17 having a thickness of 8 // m can be formed by using "Electra" PI around the ground layer 16, and a characteristic impedance of 5 可 can be formed. Ω coaxial transmission line. Embodiment 2 -11 - 200850098 Fig. 4 is a cross-sectional view showing a transmission line constructed in accordance with a second embodiment of the present invention. The electrodeposited tree imine of the insulating layer 18 of Example 1 was applied to have a lower dielectric constant than that of the polyimine, and the fluororesin was cut "Ele Kede Nesslon" (Clean water shares. Signal at this time) The wiring 19 is ff //m after the seed layer is removed, and the thickness is 15//m, and the electrodeposited film thickness is formed. Further, the ground layer 20 is vapor-deposited 0.5 // m to form the ground layer 20 Then, the protective layer is formed so as not to require the layer 20 to be as thin as 0.5/m, and thus the transfer structure having the characteristic impedance of 50 Ω is formed on the bend. Embodiment 3 5A (a) (b Fig. 5E (a) (b) In the drawing of the flexible printed wiring board of the third embodiment of the invention, (a) is the viewer from the signal wiring side ' (b) is the viewer. Also, the 6A (a) (b) Figure 6B(a) Sectional view of the A-A' line and the B-B' line cut in Figure 5A First, the thickness of the insulating substrate 2 1 2 5 // 100EN forms a hole 22' for interlayer connection and a copper of 0.1 // m according to the example, and forms a seed layer 23. The type of the hole is continuous, and if the formation method of the hole is non-through, there is a technique. , there is machinery Drill, punching lipid structure coaxially formed, instead of positive dielectric loss angle Juxi Co., Ltd.) to a width of 15 I S 8 // m of silver as the noble metal to be square. Also, the grounding is good. By this, the line can be used. The figure is a top view of the process, and each side is viewed from the opposite side. (b) is the same as the "Kapton 1 along the 〇m. No matter whether it is non-through, laser, etching, etc., laser, etch-12- 200850098 The method of engraving, etc., is not specifically limited. Here, 'through hole of Φ 50//m is formed by uv_YAG laser. After that, as shown in Fig. 5A and Fig. 6A, 'by electricity The ore is formed with the wiring 25 including the signal wiring 24. At this time, RY32 19 (manufactured by Hitachi Chemical Co., Ltd.) is applied to the plating resist. Further, the photoresist opening width of the signal wiring 24 is made to be 1 2 // m, and the plating thickness is In this case, the holes 22 for interlayer connection are also plated, so that interlayer connection can be performed simultaneously. Then, as shown in FIGS. 5B and 6B, etching light is formed. The SPG 202 is opened by the polyimine removal unit 26, and the seed layer 23 of the polyimine removal unit 26 is removed by using an appropriate etchant such as a sodium persulfate aqueous solution. The etching is performed in terms of copper plating. m, by which the width of the signal wiring 24 after the seed layer 23 is removed It becomes 10 μm, and the thickness becomes 1 〇// m. Then, as shown in Fig. 5c and Fig. 6c, TPE-3 000 is used for chemical etching of the polyimine removal portion 26 After that, the remaining seed layer 23 is removed, and as shown in FIG. 5D and FIG. 6D, the mounting portion 27 and the ground layer connecting portion 28 are masked by "Ehra" PI. An 18/5 m electrolytic deposition is performed to form an insulating layer 29 around the wiring 25. The material of the mask is a mask material which is thicker than the thickness of the resin to be electrolytically deposited. Here, a dry film photoresist ALPHO411Y50 ("Niche" Morton Co., Ltd.) having a thickness of 50 // m was selected. After peeling off the mask material, the mounting portion 27 of the conductor exposed portion and the ground layer are connected to -13-200850098 portion 2, and the insulating layer 2 is applied as a mask to electroless nickel, followed by gold plating. Further, as shown in FIGS. 5E and 6E, the signal wiring 24 and the ground layer connecting portion 28 are exposed, and the ground layer pattern is formed by the mask material to vaporize the silver layer which becomes the ground layer. Plated at 30 μm, after which the mask was peeled off. The mask material is preferably used because it does not become hot during vapor deposition, and is easily peeled off after vapor deposition. Here, the 'Krepp' mask is used. No. 293 (made by Teraoka Manufacturing Co., Ltd.). Thereby, it is possible to form a flexible printed wiring board having a coaxial structure in which the characteristic impedance of the transmission line is approximately 50 Ω. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a coaxial structure as an index of the present invention. Fig. 2 is a perspective view showing the complication of the coaxial structure according to the present invention. Figs. 3A(1) to 3A(4) are partial sectional views for explaining the first embodiment of the present invention. 3B(5) to 3B(8) are partial sectional views for explaining the first embodiment of the present invention. Fig. 4 is a cross-sectional view showing a second embodiment of the present invention. Fig. 5A is a plan view "5A (a) of a flexible printed wiring board according to a third embodiment of the present invention. Fig. 5A(b) is a view seen from the opposite side as viewed from the signal wiring side. -14- 200850098 Fig. 5B is a plan view showing the flexible printed wiring board according to the third embodiment of the present invention, and Fig. 5b(a) is a view showing the signal line side, 5B ( b) The figure is a diagram showing from the opposite side. 5C is a plan view showing a flexible printed wiring board according to a third embodiment of the present invention, and FIG. 5C(a) is a view seen from the signal wiring side, and FIG. 5C(b) is a view showing A pattern viewed from the opposite side. 5D is a plan view showing a flexible printed wiring board according to a third embodiment of the present invention, and FIG. 5D(a) is a view seen from the signal wiring side, and FIG. 5D(b) is a view showing A pattern viewed from the opposite side. Fig. 5E is a plan view showing a flexible printed wiring board according to a third embodiment of the present invention, and Fig. 5E(a) is a view seen from the signal wiring side, and Fig. 5E(b) is a table. A pattern that is not viewed from the opposite side. Fig. 6A(a) and (b) are sectional views showing the cross section taken along the line A-A' and B-B' of Fig. 5A. Fig. 6B(a) and (b) are sectional views showing the cross section of the line taken along the line A-A' and B·B in Fig. 5A. Fig. 6C(a) and (b) are sectional views showing the section cut along the line taken along line Α·Α' and B-Β of Fig. 5A. Fig. 6D(a) and (b) are sectional views showing the section cut along the line Α-Α' and Β-B in Fig. 5 . Fig. 6E(a) and (b) are sectional views showing the cross section of the line taken along the line A-A' and B-B of Fig. 5A. [Main component symbol description] -15- 200850098 1 : Signal wiring 2 : Insulation layer 3 : Ground layer 4 : Signal wiring 5 : Ground layer 6 : Insulation layer 7 : Transmission line portion 8 of coaxial structure : Part mounting portion 9 : Poly醯imine 1 〇: seed layer 1 1 : double-sided copper plate 1 2 : plating resist 1 3 : signal wiring 1 4 : polyimine removal portion 1 5 : insulating portion 1 6 : ground layer 1 7 : protective layer 1 8 : Insulation layer 19 : Signal wiring 2 0 : Ground layer 21 : Substrate 22 : Hole for interlayer connection 2 3 : Seed layer 2 4 : Signal wiring - 16-200850098 2 5 : Wiring 26 : Polyimine Removal portion 2 7 : Mounting portion 2 8 : Ground layer connection portion 2 9 : Insulation layer 3 0 : Silver -17 serving as a ground layer