CN101198208A - Substrate with multi-layer plating through hole and multi-layer plating through hole forming method thereof - Google Patents
Substrate with multi-layer plating through hole and multi-layer plating through hole forming method thereof Download PDFInfo
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- CN101198208A CN101198208A CNA2006101610931A CN200610161093A CN101198208A CN 101198208 A CN101198208 A CN 101198208A CN A2006101610931 A CNA2006101610931 A CN A2006101610931A CN 200610161093 A CN200610161093 A CN 200610161093A CN 101198208 A CN101198208 A CN 101198208A
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Abstract
The invention relates to a substrate with a plurality of layers of plated through holes, wherein at least one dielectric layer and one electroplated layer formed in deposition mode are formed inside one plated through hole of a substrate main body; the dielectric layer is locally covered on the circuit layer of the substrate and realizes electrical isolation of the electroplated layer and the plated through hole, thereby saving the plated through hole arrangement space of the substrate and obtaining the efficacy of multilayered plated through holes. Preferably, the dielectric layer is formed through electrophoretic deposition to ensure that the deposition thickness of the dielectric layer is uniform and very thin without further drilling and aligning; moreover, electric efficiency is increased and crosstalk effect is reduced.
Description
[technical field]
The invention relates to multilayer circuit board (multi-layercircuit board), be meant a kind of substrate and manufacture method thereof especially with multilayer plated-through-hole.
[background technology]
In each electronic product, generally can use the connection of multilayer circuit board as electrically signal conduction, power supply supply, ground connection.Multi-functional and complicated development along with electronic product, the line layer number of plies of multilayer circuit board can increase with vertical place of electrical connection, therefore the plated-through-hole (Plated Through Hole, PTH) the electrically conducting mutually that need One's name is legion as line layer between the different layers.
No. the 589729th, Taiwan patent announcement " having substrate of protected type plated-through-hole structure and forming method thereof ", disclose a kind of substrate, the hole wall of its plated-through-hole is formed with the tubular metal screen earlier, cover a last dielectric layer again, in addition signal transmission circuit is disposed in the hole that this dielectric layer surrounds.Wherein, this dielectric layer riddles earlier in the tubular metal screen in the filling mode, forms a hole with boring method again, forms this signal at last again and transmits circuit in the hole.Yet the boring contraposition also can't be controlled at quite accurately in the scope, the cladding thickness of this dielectric layer has thickness difference, cause signal to transmit the spaced size variation of meeting between circuit and the tubular metal screen, even short risk is arranged, be not suitable for the structure of multilayer plated-through-hole.
Taiwan letters patent I242783 number " pore column dividing type intercommunicating pore structure and manufacture method thereof ", disclose a kind of pore column dividing type intercommunicating pore structure, comprise at least two separate type conductors, forming a hole column structure, and between this two separate types conductor, be rip cutting or the gap of cutting sth. askew.In brief, exactly a plated-through-hole is cut into two halves, or cut into multi-disc, and be connected with at least one top circuit or below circuit individually, no matter right such free of conductors is to cut at that time or the application of final pdm substrate, all has the phenomenon of the structure reduction of plated-through-hole, be easy to fracture, the thermal stress that can't resist substrate takes place.In addition, the primary and secondary through hole structure of the described coaxial line type in the past of case has the high and generation inductive effect of resistance value before being somebody's turn to do, all be since in the forming process of dielectric layer with dielectric material consent mode fill up plated-through-hole hole again form in through hole, square afterwards one-tenth internal layer conductive component causes the interior medium thickness that forms of plated-through-hole to differ by thickness and is caused in interior through hole.
[summary of the invention]
Main purpose of the present invention is to provide a kind of the have substrate of multilayer plated-through-hole and the formation method of multilayer plated-through-hole thereof, a dielectric layer and an electrodeposited coating that it forms with depositional mode in a plated-through-hole of a substrate, this dielectric layer is formed in this plated-through-hole and the local line layer that covers this substrate, and this plated-through-hole of this electrodeposited coating of electrical isolation and this substrate, with the plated-through-hole of saving substrate the space is set, reach the effect of multilayer plated-through-hole, to reduce substrate size or can design for high-density line.
Of the present invention time a purpose is to provide a kind of the have substrate of multilayer plated-through-hole and the formation method of multilayer plated-through-hole thereof, wherein this dielectric layer in order to this plated-through-hole of electrical isolation and this electrodeposited coating is formed by electrophoretic deposition (electrophoretic deposition), the deposit thickness of its this dielectric layer of may command is for evenly and quite thin, need not to hole again contraposition, can promote electrical property efficiency and reduce cross-talk (cross-talk) effect.
According to the present invention, a kind of substrate with multilayer plated-through-hole mainly comprises base main body, a dielectric layer and the electrodeposited coating with a plated-through-hole.This base main body has more one first line layer and one second line layer, and this plated-through-hole is electrically conducted this first line layer and this second line layer.This dielectric layer is formed in this plated-through-hole with depositional mode, and local this first line layer and this second line layer of covering.This electrodeposited coating is formed at this dielectric layer, this this electrodeposited coating of dielectric layer electrical isolation and this plated-through-hole.Therefore another plated-through-hole of being made up of this dielectric layer and this electrodeposited coating can be set again in this plated-through-hole, to reach the effect of multilayer plated-through-hole, its plated-through-hole that can save substrate is provided with the space, effectively utilizes substrate space, to reduce substrate size or can design for high-density line.
[description of drawings]
This case specifies representative graph to be: Fig. 1
The element numbers explanation of this representative graph:
100 substrates
110 base main body, 111 upper surfaces
112 lower surfaces
113 first line layers, 114 second line layers
115 plated-through-holes
116 first electrodeposited coatings, 117 first air rings
118 second air rings
120 dielectric layers, 130 second electrodeposited coatings
131 electroless-plating layers
132 extensions
Fig. 1: according to first specific embodiment of the present invention, a kind of three-dimensional biopsy cavity marker devices schematic diagram of multilayer plated-through-hole of substrate.
Fig. 2: according to first specific embodiment of the present invention, this has the schematic cross-section of the substrate of multilayer plated-through-hole.
Fig. 3 A to 3E: according to first specific embodiment of the present invention, the schematic cross-section of this substrate in its multilayer plated-through-hole forming process.
Fig. 4: according to second specific embodiment of the present invention, another kind has the schematic cross-section of the substrate of multilayer plated-through-hole.
Fig. 5: according to first specific embodiment of the present invention, electrophoretic deposition is with the reaction mechanism of the dielectric layer that forms this substrate.
The primary clustering symbol description
11 dry films, 12 dry films
21 dry films, 22 dry films
100 substrates
110 base main body, 111 upper surfaces
112 lower surfaces
113 first line layers, 114 second line layers
115 plated-through-hole 115A electroless-plating layers
116 first electrodeposited coatings, 117 first air rings
118 second air rings
119 through holes
120 dielectric layers, 130 second electrodeposited coatings
131 electroless-plating layers
132 extensions
200 substrates
210 base main body, 211 upper surfaces
212 lower surfaces
213 first line layers, 214 second line layers
215 plated-through-holes
216 first electrodeposited coatings
220 first dielectric layers, 230 second electrodeposited coatings
240 second dielectric layers 250 the 3rd electrodeposited coating
[embodiment]
One embodiment of the invention are described as follows, and as Fig. 1 and shown in Figure 2, a kind of substrate 100 with multilayer plated-through-hole comprises a base main body 110, and this base main body 110 has a upper surface 111 and a lower surface 112, and it can be multilayer board.This base main body 110 has one first line layer 113, one second line layer 114 and a plated-through-hole 115.This first line layer 113 is formed at this upper surface 111 of this base main body 110; This second line layer 114 is formed at this lower surface 112 of this base main body 110; This plated-through-hole 115 is through to this lower surface 112 by this upper surface 111.This plated-through-hole 115 can include electroless-plating layer 115A and one first electrodeposited coating 116, to be electrically conducted at this first line layer 113 of this upper surface 111 and this second line layer 114 at this lower surface 112.In the present embodiment, this first line layer 113 has one first air ring 117, and this second line layer 114 has one second air ring 118, this 116 connections of first electrodeposited coating this first air ring 117 and this second air ring 118.
Form at least one another plated-through-hole in this plated-through-hole 115, it is made of a dielectric layer 120 and one second electrodeposited coating 130.
Wherein, this dielectric layer 120 is formed in this plated-through-hole 115 with depositional mode, and local this first line layer 113 and this second line layer 114 that cover.Preferably, this dielectric layer 120 is formed by electrophoretic deposition (electrophoretic deposition), so that this dielectric layer 120 that forms in this plated-through-hole 115 has thin thickness, thickness is even and spreadability is good advantage.The deposit thickness of this dielectric layer 120 is between 10～50 microns, do not have the problem that thickness difference causes blocking this plated-through-hole 115, in addition, the electrophoretic deposition mode of this dielectric layer 120 has good selectivity, only be covered in exposed metal surface, do not have the problem that produces electrical short circuit and consent in the plated-through-hole that makes.And this second electrodeposited coating 130 is formed at this dielectric layer 120, and by this second electrodeposited coating 130 of these dielectric layer 120 electrical isolation this first electrodeposited coating 116 with this plated-through-hole 115.In addition, in the present embodiment, this dielectric layer 120 can cover this first air ring 117, this second air ring 118 and this first electrodeposited coating 116 fully, this dielectric layer 120 has generally the cross section that is " worker " word and center hollow, to reach in the good hole electrical isolation and hollow aperture unanimity in order to the effect of electroplating this second electrodeposited coating 130.
As shown in Figure 2, this second electrodeposited coating 130 is formed at this dielectric layer 120, and has an extension 132, and it extends to this upper surface 111 of this base main body 110, and this extension 132 also can be connected to other circuit of this first line layer 113.In addition, in this plated-through-hole 115, can form at least one second electrodeposited coating 130 and by this second electrodeposited coatings 130 of dielectric layer 120 electrical isolation different layers, so that this first electrodeposited coating 116 can transmit different electric signals individually with this second electrodeposited coating 130, the space is set or the application that can supply high-density base board 100 with the plated-through-hole that significantly reduces substrate 100.
See also a kind of concrete enforceable forming process of multilayer plated-through-hole that Fig. 3 A to Fig. 3 E illustrates this substrate 100.At first, as shown in Figure 3A, one base main body 110 is provided, this base main body 110 has this first line layer 113 and this second line layer 114, and utilizing machinery or radium-shine bore mode to form a through hole 119, this through hole 119 is through to this lower surface 112 of this substrate 100 by this upper surface 111 of this base main body 110.In Fig. 3 B, utilize electroless-plating and electroplating technology that the copper layer is deposited in this through hole 119, include this plated-through-hole 115 of this electroless-plating layer 115A and this first electrodeposited coating 116 with formation, and this plated-through-hole 115 is electrically conducted this first line layer 113 and this second line layer 114.In this step, this plated-through-hole 115 should be hollow and is not filled, and wherein this first electrodeposited coating 116 is revealed in this plated-through-hole 115.
Then, shown in Fig. 3 C, this upper surface 111 in this base main body 110 respectively forms a dry film 11,12 with this lower surface 112, through exposure imaging, cover this first line layer 113 and this second line layer 114 with the part, this dry film 11,12 appears this first electrodeposited coating 116, this first air ring 117 and this second air ring 118.Afterwards, utilize electrophoretic deposition technique that this dielectric layer 120 is formed at this first electrodeposited coating 116, this first air ring 117 and this second air ring 118.In the present embodiment, the material of this dielectric layer 120 can be polyimide (polymide, PI), earlier the predecessor with polyimide is formed at the metal surface in the electrophoretic deposition mode, toasts to aggregate into polyimide again.And the reaction mechanism of these dielectric layer 120 electrophoretic depositions is shown in the chemical formula of Fig. 5.
After removing those dry films 11,12, shown in Fig. 3 D, form a dry film 21,22 this upper surface 111 and this lower surface 112 again in this base main body 110.In the present embodiment, after exposure imaging, these dry film 21,22 parts appear this dielectric layer 120 and local this upper surface 111 and this lower surface 112 that appears this base main body 110.Afterwards, an electroless-plating layer 131 (electroless plating layer) is formed at the position that appears of this upper surface 111 with this lower surface 112 of this dielectric layer 120 and this base main body 110.Then, shown in Fig. 3 E, utilize electroplating technology this second electrodeposited coating 130 can be formed at this electroless-plating layer 131, this second electrodeposited coating 130 can electrically connect this first line layer 113 and this second line layer 114, and with this first electrodeposited coating 116 be electrical isolation.At last, remove those dry films 21,22 and carry out the processing of back processing procedure, for example hot laminating, plating or the like is to form this substrate with multilayer plated-through-hole 100.
Another embodiment of the present invention is described as follows, as shown in Figure 4, another kind has the substrate 200 of multilayer plated-through-hole, it comprises a base main body 210, this base main body 210 has a upper surface 211 and a lower surface 212, and this base main body 210 has one first line layer 213, one second line layer 214 and a plated-through-hole 215, forms an electrodeposited coating and a dielectric layer in this plated-through-hole 215 in regular turn at interval.This plated-through-hole 215 has one first electrodeposited coating 216, to be electrically conducted this first line layer 213 and this second line layer 214, one first dielectric layer 220 is formed in this plated-through-hole 215 and local this first line layer 213 and this second line layer 214 that cover with depositional mode, one second electrodeposited coating 230 is formed at this first dielectric layer 220, and by these first dielectric layer, 220 electrical isolation this first electrodeposited coating 216 and this second electrodeposited coating 230, in the present embodiment, this second electrodeposited coating 230 is a metal screen layer, and it is electrically independent or only is connected to the ground structure of this substrate 200.One second dielectric layer 240 is formed in this plated-through-hole 215 and also is formed at this second electrodeposited coating 230 with depositional mode, one the 3rd electrodeposited coating 250 is formed in this plated-through-hole 215 and is formed at this second dielectric layer 240, and these second dielectric layer, 240 electrical isolation this second electrodeposited coating 230 and the 3rd electrodeposited coating 250.The 3rd electrodeposited coating 250 electrically connects this first line layer 213 and this second line layer 214, perhaps can electrically connect other line layer.By the metallic shield effect of this second electrodeposited coating 230, prevent that effectively 250 of this first electrodeposited coating 216 and the 3rd electrodeposited coatings from producing the phenomenon of cross-talk or signal interference, to promote the electrical property efficiency of multilayer plated-through-holes 215 in the high-density base board 200.
Protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining, and anyly knows this skill person, and any variation and the modification done without departing from the spirit and scope of the present invention all belong to protection scope of the present invention.
Claims (10)
1. the substrate with multilayer plated-through-hole is characterized in that, comprises:
One base main body, it has one first line layer, one second line layer and a plated-through-hole, and this plated-through-hole includes one first electrodeposited coating, to be electrically conducted this first line layer and this second line layer;
One dielectric layer, it is formed in this plated-through-hole and local this first line layer and this second line layer of covering with depositional mode; And
One second electrodeposited coating, it is formed at this dielectric layer, and by this first electrodeposited coating of this second electrodeposited coating of this dielectric layer electrical isolation and this plated-through-hole.
2. the substrate with multilayer plated-through-hole as claimed in claim 1 is characterized in that wherein this dielectric layer has generally the cross section that is " worker " word and center hollow.
3. the substrate with multilayer plated-through-hole as claimed in claim 1, it is characterized in that, wherein this first line layer has one first air ring, and this second line layer has one second air ring, this first electrodeposited coating connects this first air ring and this second air ring, and this dielectric layer covers this first air ring, this second air ring and this first electrodeposited coating fully.
4. the substrate with multilayer plated-through-hole as claimed in claim 1 is characterized in that, wherein this second electrodeposited coating extends on this base main body, and is connected to this first line layer.
5. the substrate with multilayer plated-through-hole as claimed in claim 1 is characterized in that, other includes one second dielectric layer and one the 3rd electrodeposited coating, and it is formed at this plated-through-hole, and this this second electrodeposited coating of second dielectric layer electrical isolation and the 3rd electrodeposited coating.
6. the substrate with multilayer plated-through-hole as claimed in claim 1 is characterized in that, wherein is formed with an electroless-plating layer (electroless plating layer) between this dielectric layer and this second electrodeposited coating in addition.
7. the formation method of the multilayer plated-through-hole of a substrate is characterized in that, comprises:
One base main body is provided, and it has one first line layer, one second line layer and a plated-through-hole, and this plated-through-hole includes one first electrodeposited coating, to be electrically conducted this first line layer and this second line layer;
Form a dielectric layer also local this first line layer and this second line layer of covering in this plated-through-hole with depositional mode; And
Form one second electrodeposited coating, it is formed at this dielectric layer, and by this first electrodeposited coating of this second electrodeposited coating of this dielectric layer electrical isolation and this plated-through-hole.
8. the formation method of the multilayer plated-through-hole of substrate as claimed in claim 7 is characterized in that, wherein this dielectric layer is formed at this first electrodeposited coating in electrophoretic deposition (electrophoretic deposition) mode.
9. the formation method of the multilayer plated-through-hole of substrate as claimed in claim 7, it is characterized in that, wherein this first line layer has one first air ring, and this second line layer has one second air ring, this first electrodeposited coating connects this first air ring and this second air ring, and this dielectric layer covers this first air ring, this second air ring and this first electrodeposited coating fully;
Wherein this second electrodeposited coating extends on this base main body, and is connected to this first line layer.
10. the formation method of the multilayer plated-through-hole of substrate as claimed in claim 7, it is characterized in that, other includes: form one second dielectric layer and one the 3rd electrodeposited coating in this plated-through-hole, and this this second electrodeposited coating of second dielectric layer electrical isolation and the 3rd electrodeposited coating;
Before forming this second electrodeposited coating, be formed with an electroless-plating layer (electroless plating layer) in this dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101610931A CN101198208A (en) | 2006-12-06 | 2006-12-06 | Substrate with multi-layer plating through hole and multi-layer plating through hole forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101610931A CN101198208A (en) | 2006-12-06 | 2006-12-06 | Substrate with multi-layer plating through hole and multi-layer plating through hole forming method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101198208A true CN101198208A (en) | 2008-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101610931A Pending CN101198208A (en) | 2006-12-06 | 2006-12-06 | Substrate with multi-layer plating through hole and multi-layer plating through hole forming method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529290A (en) * | 2016-06-21 | 2017-12-29 | 通用电气公司 | Include the Printed circuit board and manufacturing methods of heavy wall through hole |
| CN109429433A (en) * | 2017-08-29 | 2019-03-05 | 湖北龙腾电子科技有限公司 | A kind of pcb board uses electrophoresis resin method for plugging |
| CN114900973A (en) * | 2022-06-28 | 2022-08-12 | 生益电子股份有限公司 | Groove plugging piece, manufacturing method of PCB side wall circuit and PCB |
-
2006
- 2006-12-06 CN CNA2006101610931A patent/CN101198208A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529290A (en) * | 2016-06-21 | 2017-12-29 | 通用电气公司 | Include the Printed circuit board and manufacturing methods of heavy wall through hole |
| CN109429433A (en) * | 2017-08-29 | 2019-03-05 | 湖北龙腾电子科技有限公司 | A kind of pcb board uses electrophoresis resin method for plugging |
| CN114900973A (en) * | 2022-06-28 | 2022-08-12 | 生益电子股份有限公司 | Groove plugging piece, manufacturing method of PCB side wall circuit and PCB |
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Open date: 20080611 |