200844027 九、發明說明： _【發明所屬之技術領域】 • 本發明是關於一種用來將例如液晶用玻璃等薄板狀基 板從輸送帶移載至處理裝置等的基板搬送裝置。 【先前技術】 在例如液晶顯示面板所使用的玻璃等之類的薄板狀基 板的製程中，設有用來搬送基板的搬送生產線。可藉由搬 (送生產線搬送基板，並且在沿著搬送生產線配置的處理工 作站對基板進行必要的處理。在這種搬送生產線中設有用 來將由滾輪輸送帶等搬送手段所搬送的基板移載至處理裝 置的基板搬送裝置。 這種基板搬送裝置之一係揭示於日本特開平、58844 號公報（以下稱為專利文獻1)。專利文獻1的基板搬送裝置 是將由搬送輸送帶所搬送的基板，暫時移載至搬入甩的輔 助輸送帶，再從搬送輸送帶拉入處理裝置侧。接著，由配 ί設在處理裝置附近的機器人的機器手臂將基板從辅助輸送 帶取出，並且改變此機器人手臂的方向而將基板移載至處 理裝置。又，專利文獻1的基板搬送裝置是由機器人手臂 將在處理装置完成處理的基板從處理裝置取出。接著，改 變此機裔人手臂的方向而將基板載置於搬出用的輔助輸送 帶，並將基板送回搬送輸送帶。 然而，若是專利文獻1的基板搬送裝置，不僅有除了 搬送輸送帶之外還需要輔助輸送帶的問題，而且有必須確 保用以設置輔助輸送帶或機器人之空間及機器人手臂之移 319950 5 200844027 動空間的問題。 即使在不使用如專利文獻1之基板搬送裝置的輔助輸 ’送帶的情況下，在搬送輸送帶與處理裝置之間必須確保用 來移載基板的機器人所需之設置空間及機器人手臂之移動 空間的問題亦依然存在。 尤其，在基板為液晶用玻璃的情況下，隨著近年來玻 璃基板的大型化，用來移載此玻璃基板的機器人所需的空 ^間也會擴大。因此，如上所述的問題將更為顯著。 【發明内容】 本發明疋馨於上述课題而研創者，其目的在於提供一 種能以更少的空間進行基板之適當移載的基板搬送裝置。 為了達成上述目的，本發明之基板搬送裝置是用來將 由輸送帶所搬送的基板移送至沿著上述輸送帶配設的處理 裝置的基板搬送裝置，其特徵為具備Γ移載手段，係以可 載置上述基板的方式，在其下方具備朝橫貫上述輪送帶之 L方向延伸設置的複數個支持體而配設在上述輸送帶的上 方且可使上述支持體在用以於上述輸送帶與上述支持體 之間進行上述基板之授受的第丨位置與用以在上述處理裝 置與上述支持體之間進行上述基板之授受的第2位置之間 朝橫貫上述輸送帶的方向移動；以及升降手段，係配設在 由上述輸送帶所搬送的上述基板之移動執跡的外侧而連結 於上述移載手段，並且使上述移載手段升 =上述第〗位置時’使上述支持雜下降至比由2 輪”所搬送的上述基板之下表面更低的預定下降位置， 319950 6 200844027 另方面，使上述支持體上升至比由上述輸送帶所搬送的 上述基板之上面更向的預定上升位置。 以此方式構成的基板搬送裝置中，移載手段在其下方 具備複數個支持體，且此移載手段是配設在輸送帶的上 方。支持體是以可載置基板的方式朝橫貫輸送帶的方向延 滑設置。在由輸送帶搬送時之基板的移動執跡之外側，配 设有用以使移載手段升降的升降手段。 在為了在輸送帶與支持體之間進行基板之授受的第] 位置中，升料段使移載手段最為下降的情況下，支持體 係下降至比由輸送帶所搬送的基板之下表面更低的預定下 降位置。因此’基板藉由輸送帶被搬送時，基板並不會盘 支持體干擾而可通過支持體的上方。 ㈢/' 另一方面，被舉起至上升的支持體的基板，會因為移 載手段使支持體朝橫貫輸送帶的方向從第丨位置移動至第 2位置而往處理裝置鄉動。藉此，便可騎基板對 理裝置的授受。 又，當支持體處於這種狀態時，若升降手段使 段上升，則支持體會隨著移載手段的上升而上升。此時， 支持體會將由輸送帶搬送到支持體上方的基板從輸送帶舉 起。在升降手段使移載手段最為上升的情況下，支㈣會 上升至比由輸送帶所搬送的基板之上表面更高的預定上; 位置°因此’在由支持體舉起的基板之後由輸送帶搬送而 來的基板’並不會與支持體干擾而可通過支持體的下方。 因此只要在由 移載手段由於是配設在輸送帶的上方 319950 7 200844027 .輸▼所搬送的基板之移動軌跡的外侧_保用來配置升降 .手段的空間，就不需要確保機器人手臂等的設置空間、或 •機器人手臂的移冑空間。因此，比起以往的基板搬送裝置， 能以更少的空間移載基板。又，由於藉由支持體將輸送帶 上的基板從輸送帶舉起，因此在輸送帶與處理裝置之間進 行基板之移載的㈣，可使之後由輸送帶搬送而來的基板 通過支持體下方並朝下游側搬送。因此，可更有效地利用 $輸送帶進行基板的搬送。 較佳為，上述支持體是分別形成棒狀，且一端被保持 在上述移載手段，而在上述輸送帶中，在橫切上述輸送帶 的方向形成有用來收容藉由上述升降手段而下降的上述各 個支持體的凹處。 以此方式構成的基板搬送裝置中，在藉由升降手段使 移載手段下降時，形成棒狀且一端被保持在移載手段的支 /持體係分別被收容在朝橫切輸送帶的方向形成的凹處内。 V因此可確實防止由輸送帶所搬送的基板與支持體的干擾。 ^較佳為，上述支持體是由：設置成可載置上述基板的 複數個第1支持體、以及位在被載置於上述第！支持體的 基板之上表面的更上方且可載置與被載置於上述第1支持 體的基板不同之基板的第2支持體所構成，上述移載手段 是使上述第1支持體與第2支持體可各自獨立地朝橫切上 述輸送帶的方向移動。 以此方式構成的基板搬送裝置中，在第〗位置使第1 支持趾下降至下降位置之後，當由輸送帶所搬送的基板位 319950 8 200844027 於第1支持體的上方時，若由弁 由第一輸送帶移接載著手： 第二支持體移動至第2位置時，便可在處理裝置與 第支持體之間進行基板的授受。 當第1支持體位於第】位置時 罾名筮？ A ®从Μ /、受將第2支持體配 理的L， 處理裝置與第2支持體之間進行已 受’則使第1支持體從第1位置朝第 it置t動時，即可使第2支持體從第2位置朝第！位置 移動。¥第2支持體到達第1位詈 置之後，升降手段係使移 載手長下降’因此可將以處理裝置完成處理的基板從第2 支持體交給輸送帶。當第1支持體位於第2位置，且第2 支持體位於第1位置時’也是以同樣的方式利用第！支持 體及弟2支持體進行基板之移載。 因此可同時進行利用第j支持體施行之基板從輸送 帶到處理裝置的移載、以及利用第2支持體施行之基板從 處理裝置到輸送帶的移載。又，可同時進行利用第2支持 體施行之基板從輸送帶到處理裝置的移載、以及利用第ι 支持體施行之基板從處理裝置到輸送帶的移載。結果，比 起使在處理裝置完成處理的基板返回輸送帶之後再將基板 從輸送帶移載至處理裝置的情況，可更有效地進行基板之 移載。 【實施方式】 以下’根據圖式，針對本發明之實施形態加以說明。 第1圖是本發明之一實施形態的基板搬送裝置所適用 9 319950 200844027 的生產線之-部分的概略平面圖。在此生產線中，進行例 如液晶顯示面板或電榮顯示器等所使用的薄板狀破璃基板 (以下稱為基板）2之處理。 如第1圖所示，在此生產線中，複數個基板2是由輸 运帶4朝圖中的箭頭八方向搬送。輸送帶斗中，在輸送帶 ^的側方兩端部沿著搬送方向隔著職寬度的間隙配設有 分別具有複數個搬送滾輪乜的複數個驅動單元仆。各搬 送滾輪4a是藉由未圖示的動力源傳達動力而旋轉。基板2 之相對^搬送方向位於側方的兩緣部是分別從下面被支持 在驅動單元4b的搬送滾輪4a，並藉由搬送滾輪4a的旋轉 在輸送帶4上被搬送。 輸▼ 4中，在驅動單元朴的内側，如第}圖所示併 設有複數個空氣噴出單元4c，基板2之搬送方向中的各空 氣喷出單元4c的位置實際上與各驅動單元4b的位置一 致^因此’基板2之搬送方向中的各列之各空氣嘴出單元 4c係與各驅動單元仆同樣地朝搬送方向隔著預定寬度的 而排列。在各空氣喷出單元4c供應有從未圖示的^縮 空氣供應源而來的空氣。空氣喷出單元乜的上表面是位於 比由搬送滾輪4a所支持的基板2之下表面更低的位置，藉 ，從空氣噴出|元4(：的上表面朝向基板2的下表面喷出空 氣二氣噴出單元4c會以與基板2不接觸的方式支持基板 2 ° 在此生產線上，相對於輸送帶4的搬送方向在側方配 置有對由輸送帶4搬送而來的基板2進行預定之處理的處 319950 10 200844027 理裝置6及處理裝置8。而且，夾著輸送帶4在處理裝置6 的相反側，在成為由輸送帶4所搬送的基板2之移動軌跡 之外侧的位置配設有一對升降單元（升降手段）1〇。同樣 =，夾著輸送帶4在處理裝置8的相反側，在成為由輪送 帶4所搬送的基板2之移動執跡之外側的位置配設有一 升降單元（升降手段）12。 在升降單元10連結有位於輸送帶4上方的移載單元 (移载手段）14,升降單元10是在輸送冑4的上方使移载單 疋14升降。同樣地，在升降單元12冑結有位於輪送帶* 上方的移載單元（移載手段）16，升降單元12是在輸送帶* 的上方使移載單元16升降。 如第！圖中的移載單元14侧之虛線所示，當基板] 3送帶4搬送至移載單元14的下方時，移载單元心 j ®中的處理裝置6侧之兩點鏈線所示將該基板2移 处理裝置6。並且’移载單元14會將在處理裝置6完 成處理的基板2再度送回輪详俄 的㈣…… ▼ 同樣地’如第1圖中 A 虛線所示’當基板2由輸送帶4被搬送 ::單元16的下方時，移載單元…第】圖二 理裳置8側之兩點鏈線所 8。並且，移載單元161將該基板2移載至處理裝置 7五痒… ， 會將在處理裝置8完成處理的基板 -再度送回輸送帶4。 2 ..... :廷種利用移載單元14及16移載 基板2的砰細方法容後敘述。 早的基板2之移載及利用升降單幻2施行的= 319950 】1 200844027 載單元16之升降是以與 此，以下針㈣F q 的方式進行。因 ★卜針對私载早το 14做代表性的說明。 14的第平2面困固是Π4的斜視圖，第3圈是移栽單元 _处± · 4 ®及弟5圖分別是移載單元14處於不 同狀怨時的侧面圖，第6圖是移載單元14的正處於不 卜、^^圖式料，移載單元14具備單元主體…、第 是^女 及第2滑動構件14C°第1滑動構件⑽ 致u字形狀，兩端是被支持在單元主體w 箭頭=ΙΓ件㈣係相對於單元主體i4a可朝圖中的 致”形狀=1!持第在i滑動構件14c也是形成大 滑動構件14c是”心二:=體⑷的下面。第2 ”弟β動構件14b獨立地可相對於單亓 動構^4 朝圖中的箭頭B及其相反方向滑動。在朝第2滑 構之滑動方向觀看時，如第6圖所示，第2滑動 =cr、r第1滑動構件_的内侧，第1滑動構件 第/、〜/月動構件14c可彼此不互相干擾地滑動。而且， 月動構件14b及第2滑動構件HC可藉由内建在單元 14a之未圖示的驅動源傳達動力*如上所述滑動。 •在第、1,,月動構件14b固定有形成棒狀並且指向與輸送 ▼ 4 t搬运方向正交的方向的複數個第1支持體14d各自 之端各第1支持體14d是配置成令各第^持體⑷ 的上表面大致位於水平的同—平面，且可如第2圖至第6 圖中的-點鏈線所示載置基板2。另一方面，與第】支持 體⑷同樣地，在第2滑動構件14c固定有形成棒狀並且 319950 12 200844027 指向與輸送帶4之搬送方向正交的方向的複數個第2支持 體14e各自之一端。各第2支持體丨扑也與第！支持體 同樣地，配置成令各第2支持體14e的上表面位於水平的 同平面’且可如第4圖至第6圖中的一點鏈線所示载置 基板2。 此外’第1支持體14d及第2支持體14e的開放端側（也 就是第3圖的右方）係為處理裝置6侧，第i支持體⑷及 第2支持體ue係藉由分別声圖中的箭頭B方向移動而接 近處理裝置6。因此’帛4圖顯示第1滑動構件14b離處 理裝置6最运、且第2滑動構件〗4c最接近處理裝置6之 狀態時的移載單元14。而第5圖顯示第！滑動構件丨仆最 接近處理裝置6、且第2滑動構件14c離處理裝置6最遠 之狀態時的移載單元14。 如第4圖至第6圖所示，第2支持體14e係位於第1 支持體14d的上方，而且以令第2支持冑…的下端部形 成於比被載置於第i支持體14d的基板2之上表面更高的 位，的方式構成。又’如第6圖所示，從滑動方向觀看時 之第1滑動構件l4b之内側的寬度是被設定成比基板2的 寬度大。因此’第i滑動構件14b與第！支持體i4d、以 及第2滑動構件14c與第2支持體丨补不會與分別被载置 的基板2干擾’而可朝各圖中的箭頭B及其相反方向移動。 —第7圖是移載單元14及其周邊的平面圖，為了顯示出 本=施形態之基板搬送裝置的動作狀態，€以虛線表示移 載單元14的單元主體14a。 夕 319950 13 200844027 第7圖係顯示移載單元14的第1支持體14d在水平方 向位於離處理裝置6最遠之位置的第丨位置、並且第2支 持體14e在水平方向位於最接近處理裝£ 6之位置的第2 位置的狀態。亦即’第i支持體…及第2支持體…是 形成第4圖所示的狀態。 位於第1位置的各第1支持體14d是如第7圖所示， 被配置在朝搬送方向排列的各驅動單元仆之間所形成的[Technical Field] The present invention relates to a substrate transfer apparatus for transferring a thin plate-like substrate such as a glass for liquid crystal from a conveyor belt to a processing apparatus or the like. [Prior Art] In a process of a thin plate-shaped substrate such as glass used for a liquid crystal display panel, a transfer line for transporting a substrate is provided. The substrate can be transported by the transfer line, and the substrate can be subjected to necessary processing at a processing station disposed along the transfer line. The transfer line is provided with a substrate for transporting the substrate transported by a transport means such as a roller conveyor. The substrate transfer device of the processing device is disclosed in Japanese Laid-Open Patent Publication No. JP-A No. 58-84 (hereinafter referred to as Patent Document 1). The substrate transfer device of Patent Document 1 is a substrate to be transported by a transport conveyor. Temporarily transferred to the auxiliary conveyor that was loaded into the magazine, and then pulled into the processing device from the conveyor belt. Then, the robot is removed from the auxiliary conveyor by the robot arm of the robot located near the processing device, and the robot arm is changed. In the substrate transfer device of Patent Document 1, the substrate that has been processed by the processing device is taken out from the processing device by the robot arm. Then, the direction of the human arm is changed to change the substrate. It is placed on the auxiliary conveyor for loading and unloading, and the substrate is returned to the conveyor belt. In the substrate transfer apparatus of Patent Document 1, there is a problem that an auxiliary conveyor belt is required in addition to the conveyance conveyor belt, and it is necessary to secure a space for arranging the auxiliary conveyor belt or the robot and the movement of the robot arm 319950 5 200844027 Even in the case where the auxiliary transfer belt of the substrate transfer apparatus of Patent Document 1 is not used, the installation space required for the robot for transferring the substrate and the robot arm must be secured between the transfer conveyor and the processing device. In particular, when the substrate is a glass for liquid crystal, the space required for the robot for transferring the glass substrate will increase as the size of the glass substrate increases in recent years. The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate transfer apparatus capable of appropriately transferring a substrate with a small space. To achieve the above object, the substrate transfer apparatus of the present invention is for transferring a substrate conveyed by a conveyor belt to The substrate transfer device of the processing device in which the transport belt is disposed is characterized in that the sputum transfer means is provided so that the substrate can be placed thereon, and a plurality of the slabs extending in the L direction of the traverse belt are provided below the substrate a support body disposed above the conveyor belt and capable of causing the support body to perform a second position for transferring the substrate between the conveyor belt and the support body, and for using the processing device and the support body The second position between the transfer and the substrate is moved in a direction transverse to the transport belt; and the elevating means is disposed outside the movement trace of the substrate transported by the transport belt, and is coupled to the shift Carrying means, and raising the above-mentioned transfer means to the above-mentioned position "to reduce the support impurities to a lower predetermined lower position than the lower surface of the substrate conveyed by the two wheels", 319950 6 200844027 The support body is raised to a predetermined rising position that is more toward the upper surface of the substrate conveyed by the conveyor belt. In the substrate transfer apparatus configured as described above, the transfer means includes a plurality of supports below the transfer means, and the transfer means is disposed above the transfer belt. The support body is arranged to extend in a direction transverse to the conveyor belt so that the substrate can be placed. On the side of the movement of the substrate when transported by the conveyor belt, an elevating means for moving the transfer means is provided. In the first position where the substrate is transferred between the conveyor belt and the support, in the case where the lift section causes the transfer means to be the most lowered, the support system is lowered to a lower surface than the lower surface of the substrate conveyed by the conveyor belt. The scheduled drop position. Therefore, when the substrate is transported by the conveyor belt, the substrate can pass through the support without the interference of the disk support. (3) /' On the other hand, the substrate lifted up to the rising support body moves the support body to the processing device from the second position to the second position in the direction across the conveyor belt by the transfer means. Thereby, it is possible to ride the substrate management device. Further, when the support body is in such a state, if the lifting means raises the section, the support body rises as the transfer means rises. At this time, the support lifts the substrate conveyed by the conveyor to the support from the conveyor. In the case where the lifting means maximizes the transfer means, the branch (4) rises to a higher predetermined position than the upper surface of the substrate conveyed by the conveyor belt; the position is thus 'conveyed after the substrate lifted by the support body The substrate "carryed with the carrier" does not interfere with the support and can pass under the support. Therefore, it is not necessary to secure the robot arm or the like as long as the transfer means is disposed outside the transport path of the substrate 319950 7 200844027. Set the space, or the moving space of the robot arm. Therefore, the substrate can be transferred with less space than the conventional substrate transfer device. Further, since the substrate on the conveyor belt is lifted from the conveyor belt by the support, (4) the substrate is transferred between the conveyor belt and the processing device, and the substrate that has been transported by the conveyor belt can be passed through the support. Move below and toward the downstream side. Therefore, the substrate can be transported more efficiently using the conveyor belt. Preferably, the support body is formed in a rod shape, and one end is held by the transfer means, and in the conveyor belt, a direction transverse to the conveyor belt is formed for accommodating the lowering by the lifting means. The recess of each of the above supports. In the substrate transfer apparatus configured as described above, when the transfer means is lowered by the elevating means, the support/hold system which is formed in a rod shape and whose one end is held by the transfer means is accommodated in the direction of the cross-cut conveyor. Inside the recess. Therefore, it is possible to surely prevent interference between the substrate conveyed by the conveyor belt and the support. Preferably, the support is composed of a plurality of first supports that are placed to mount the substrate, and the bits are placed on the first! a second support body on which a substrate different from a substrate placed on the first support is placed above the upper surface of the substrate of the support, and the transfer means is the first support and the first support 2 The support bodies are each independently movable in a direction transverse to the above-mentioned conveyor belt. In the substrate transfer apparatus configured as described above, after the first support toe is lowered to the lowered position at the first position, when the substrate position 319950 8 200844027 conveyed by the conveyance belt is above the first support, The first conveyor is transferred to the carrier: When the second support is moved to the second position, the substrate can be transferred between the processing device and the first support. When the first support is in the first position, what is the name? When A ® is Μ /, L is treated by the second support, and the treatment device and the second support are subjected to 'the first support is moved from the first position to the first position, The second support is turned from the second position to the first! Location Move. After the second support reaches the first position, the lifting means lowers the transfer length. Thus, the substrate processed by the processing device can be transferred from the second support to the conveyor. When the first support is in the second position and the second support is in the first position, the same is used in the same way! Support and body 2 support for substrate transfer. Therefore, the transfer of the substrate by the j-th support from the conveyance belt to the processing apparatus and the transfer of the substrate by the second support from the processing apparatus to the conveyance belt can be simultaneously performed. Further, the transfer of the substrate by the second support from the conveyance belt to the processing apparatus and the transfer of the substrate by the first support from the processing apparatus to the conveyance belt can be simultaneously performed. As a result, the substrate can be transferred more efficiently than when the substrate that has been processed by the processing device is returned to the conveyor belt and then transferred from the conveyor belt to the processing device. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. Fig. 1 is a schematic plan view showing a portion of a production line of 9 319950 200844027 to which a substrate transfer apparatus according to an embodiment of the present invention is applied. In this production line, a thin plate-shaped glass substrate (hereinafter referred to as a substrate) 2 used for, for example, a liquid crystal display panel or a gyro display is used. As shown in Fig. 1, in this production line, a plurality of substrates 2 are conveyed by the transport belt 4 in the direction of the arrow in the figure. In the conveyor belt, a plurality of drive units each having a plurality of transport rollers 配 are disposed at the both end portions of the side of the conveyor belt along the transport direction. Each of the transport rollers 4a is rotated by transmitting power by a power source (not shown). The two edge portions of the substrate 2 that are located on the side opposite to each other are supported by the transport roller 4a of the drive unit 4b from the lower side, and are transported on the transport belt 4 by the rotation of the transport roller 4a. In the transmission ▼ 4, a plurality of air ejection units 4c are provided on the inner side of the driving unit as shown in Fig. 1, and the positions of the respective air ejection units 4c in the conveying direction of the substrate 2 are actually the same as those of the respective driving units 4b. In the same manner, the respective air nozzles 4c of the respective rows in the transport direction of the substrate 2 are arranged in the transport direction with a predetermined width in the same manner as the respective drive units. Air is supplied to each of the air ejection units 4c from a compressed air supply source (not shown). The upper surface of the air ejection unit 乜 is located lower than the lower surface of the substrate 2 supported by the conveying roller 4a, and the air is ejected from the upper surface of the substrate 2 toward the lower surface of the substrate 2 The two-electrode discharge unit 4c supports the substrate 2° so as not to be in contact with the substrate 2. On the production line, the substrate 2 conveyed by the conveyor belt 4 is disposed sideways with respect to the conveyance direction of the conveyor belt 4. The processing unit 319950 10 200844027 is disposed between the processing device 6 and the processing device 8. Further, on the opposite side of the processing device 6 with the conveyor belt 4 interposed therebetween, a position is provided on the outer side of the movement path of the substrate 2 conveyed by the conveyor belt 4 The lifting unit (elevating means) is 1 〇. Similarly, the conveyor belt 4 is disposed on the opposite side of the processing device 8 and is provided with a lifting position at a position on the outer side of the movement of the substrate 2 conveyed by the carrier belt 4. Unit (elevating means) 12. A transfer unit (transfer means) 14 located above the conveyor 4 is coupled to the elevating unit 10, and the elevating unit 10 raises and lowers the transfer unit 14 above the transport cassette 4. Similarly, In the lifting unit 12 A transfer unit (transfer means) 16 is disposed above the transfer belt*, and the lift unit 12 raises and lowers the transfer unit 16 above the conveyor belt*. As shown in the dotted line on the side of the transfer unit 14 in Fig. When the substrate 3 is transported to the lower side of the transfer unit 14, the two-point chain line on the processing device 6 side of the transfer unit core j is moved to the processing device 6 as shown by the two-point chain line. The carrier unit 14 will again return the substrate 2 that has been processed by the processing device 6 to the wheel (4). ▼ Similarly, as shown by the dotted line in Fig. 1A, when the substrate 2 is transported by the conveyor belt 4: When the lower part of 16 is, the transfer unit is in the middle of the two-point chain line 8 on the 8 side, and the transfer unit 161 transfers the substrate 2 to the processing device 7 and it will be processed. The substrate 8 that has been processed by the device 8 is again sent back to the conveyor belt 4. 2 ..... : The finer method of transferring the substrate 2 by the transfer units 14 and 16 is described later. The transfer of the early substrate 2 and Using the lifting single magic 2 = 319950 】 1 200844027 The lifting and lowering of the loading unit 16 is carried out in the same way as the following needle (four) F q. A representative description of the private carrier early το 14. The first flat 2 face of the 14 is a slanted view of the Π 4, and the third lap is the transplanting unit _ at the position of ± 4 ® and the younger 5 are respectively the transfer unit 14 The side view of the different grievances, the sixth figure is the transcript of the transfer unit 14, the transfer unit 14 is provided with the unit main body, the first female and the second sliding member 14C° first The sliding member (10) is in the shape of a U-shape, and both ends are supported on the unit main body w. The arrow=ΙΓ(4) is relative to the unit main body i4a. The shape of the unit can be formed in the figure. The member 14c is "heart 2: = under the body (4). The second "negative member 14b" is independently slidable relative to the single turbulence structure 4 toward the arrow B in the figure and its opposite direction. When viewed in the sliding direction of the second sliding structure, as shown in Fig. 6, The second sliding member =cr, r inside the first sliding member_, the first sliding member /, / / moon moving member 14c can slide without interfering with each other. Moreover, the lunar moving member 14b and the second sliding member HC can be borrowed The power is transmitted by a driving source (not shown) built in the unit 14a. * Sliding as described above. • In the first and the first, the lunar member 14b is fixed in a rod shape and directed in a direction orthogonal to the conveying direction. Each of the first support bodies 14d at the respective ends of the plurality of first support bodies 14d is arranged such that the upper surface of each of the second holding bodies (4) is substantially horizontal, and can be as shown in FIGS. 2 to 6 The substrate 2 is placed on the dotted line. On the other hand, similarly to the first support (4), the second sliding member 14c is fixed in a rod shape and the 319950 12 200844027 is directed orthogonal to the transport direction of the conveyor belt 4. One of the plurality of second support bodies 14e in the direction. Each of the second support bodies is also connected to the first support body. Similarly, the upper surface of each of the second support bodies 14e is disposed so as to be in the horizontal plane of the same, and the substrate 2 can be placed as indicated by the one-dot chain line in FIGS. 4 to 6. Further, the 'first support body 14d' And the open end side of the second support 14e (that is, the right side of FIG. 3) is the processing device 6 side, and the i-th support (4) and the second support ue are moved in the direction of the arrow B in the respective sound maps. Further, the processing device 6 is approached. Therefore, the map 4 shows that the first sliding member 14b is the most transported from the processing device 6, and the second sliding member 4c is closest to the state of the processing device 6. The fifth drawing shows The transfer member 14 when the sliding member is closest to the processing device 6 and the second sliding member 14c is farthest from the processing device 6. As shown in Figs. 4 to 6, the second support 14e is It is located above the first support 14d, and is formed such that the lower end portion of the second support member is formed at a higher position than the upper surface of the substrate 2 placed on the i-th support 14d. As shown in Fig. 6, the width of the inner side of the first sliding member 14b when viewed from the sliding direction is set to be larger than the substrate 2 Therefore, the width of the i-th sliding member 14b and the first support member i4d and the second sliding member 14c and the second support are not interfered with the substrate 2 placed on each other, and can be made to the respective figures. The arrow B and its opposite direction are moved. - Fig. 7 is a plan view of the transfer unit 14 and its periphery. In order to show the operation state of the substrate transfer apparatus of the present embodiment, the unit main body 14a of the transfer unit 14 is indicated by a broken line.夕 319950 13 200844027 Fig. 7 shows that the first support 14d of the transfer unit 14 is located at the third position at the position farthest from the processing device 6 in the horizontal direction, and the second support 14e is located in the closest direction in the horizontal direction. The state of the 2nd position at the position of £6. That is, the 'i-th support body» and the second support body are in the state shown in Fig. 4. Each of the first support bodies 14d located at the first position is formed between the drive units arranged in the transport direction as shown in FIG.
凹處4d、以及朝搬送方向排列的各空氣喷出單元&之間 所形成的凹處4e的上方。亦即，這些凹處，及私是對‘ 於各第1支持體14d朝橫切輸送帶4的方向排列而形成： 因此’當升降單元H)使移載單元14下降時，第i支持體 14d會被收容在這些凹處切及钓内。 第8圖是以此方式使移鮮元叫為下降時之沿 7圖中的VIII-VII線的剖面圖。如第8圖所示第 體⑷會隨著移載單心的下降，分別進入對應的凹處 及4e内’並且下降至比由輸送帶4所搬送的基板2之 :表面更低的位置(下降位置)。藉由以此方式使第！支持 體⑷被收容在這些凹處，當基板2由輸送帶 1搬送時’基板2即不會與第1支持體Hd干擾，而可確 貫通過第1支持體14d的上方。 當第1支持體14d處於如第8圖所示的狀態時，告義 輸送帶4搬送和支持體14d的上方時，利；ς 运可4進仃的基板2之搬送會暫時停止，之後，升 1〇係使移載單元14上升。藉此1 i支持體！4d會抵接 319950 14 200844027 於基板2的下表面，並將基板2從輸送帶4舉起。 第9圖是以此方式使移载單元14最為上升時之 圖的VIII-VIII線的剖面圖。如第9㈣$ 1 體14d會載置基板2而從輸送帶4舉起，並 t之 ==帶4搬送而來的基板2之上表面更高的位置心 *柱縣此，基板2由輸达帶4搬送時，基板2不會盘第 持體⑷干擾’而可通過第1支持體14d的下方。、 如此，當基板2被载置於第i支持體⑷ U成為最為上升的狀態 巧早兀 件⑽朝第7圖中的箭頭丑方白载^1/糸使41滑動構 Ww ㈣，藉此使第1支持體 〇處理装置6，而朝向橫貫輸送帶4的方向移動。盥 =同時，移載單元“係使第2滑動構件14。朝 〜 相反的方向滑動’使位於處理裝置6側的第 、e面向輸送帶4’而朝向橫貫輸送帶*的方向移 動。此外，如前所述，當第！滑動構件⑽及第2 ==:二第1支持體⑷、第2支持體…及被載 支持體14d的基板2並不會互相干擾。如此，當 2持體⑷到達成為處理裝置6之上方的第2位置， 同時U支持體14e到達成為輸送帶4上方的^位 广第1滑動構件_及第2滑動構件14c ==此時，第1支持體⑷及第2支持體…是 办成如第5圖所示的狀態。 —在這種狀態下’由升降單元10係使移载單元η下降， 猎此’被載置於位在第2位置的第！支持體⑷的基板2 319950 15 200844027 會下降。隨著基板2的下降，配設在處理裝置6上面的複 數個插銷6a會抵接於基板2的下表面，基板2會由插銷 -6a所支持。藉此，即完成基板2從第1支持體到處理 裝置6之授受，且在處理裝置6可對基板2進行必要的處 理。 另一方面’朝輸送帶4侧移動而位於第1位置的第2 支持體14e係與第1支持體14d的情況相同地，位於各驅 〔動單元4b之間的凹處4d、以及各空氣喷出單元4c之間的 凹處4e的上方。因此，當升降單元1〇使移載單元14下降 時，各第2支持體14e會被收容在對應的這些凹處4d及 4e内。當移載單元14成為最為下降的狀態時，第2支持 體14e會如第8圖中的虛線所示，下降至比由輸送帶々所 搬送的基板2之下表面更低的位置（下降位置）。以此方式 使第2支持體i4e被收容在這些凹處4d及4e内，在基板 2由輸送帶4搬送時，基板2不會與第2支持體14e干擾， 、而可確實通過第2支持體ue的上方。 當第2支持體14e處於第8圖中虛線所示的狀態時’ 當在處理裝置6中的基板2之處理結束，而且尚未完成利 用處理裝置6所進行之處理的基板（以下稱為未處理基板^ :輸送帶4被搬送到第2支持體14e的上方時，利用輸送 進订的未處理基才反2之搬送會暫時停止，之後再由 降，70 10使移載單元14上升。藉此’帛2支持體“e會 抵，於未處理基板2的下表面，並且將未處理基板2從輸 运▼4舉起。此時，在處理農置6側，第i支持體⑷會 319950 16 200844027 隨著移載單元14的上升而上升。第】支持體—會抵接於 .以處理裝置6完成處理的基板（以下稱為處理完畢基板）2 的下表面，並且將處理完畢基板2從處理裝置6的插銷心 舉起。 形成未處理基板2被載置於第2支持體14e的上表 面、且移載單元14最為上升的狀態時，帛2支持體… 係如第9圖中的虛線所示，將未處理基板2從輸送帶4舉 起並且上升至比之後由輸送帶4搬送而來的基板2之上 Π的？置(上升位置)。因此，基板2由輸送帶4搬 ^時’基板2不會與第2支持體干擾，而可通過第2 支持體14e的下方。 如此在移載早元14成為最為上升的狀態之後，移載單 :二係使第2滑動構件⑷朝第7圖中的箭頭b方向滑 送帶2支持體…面向處理裝置6，而朝橫貫輸 滑動構件14hT動。與此之同時，移載單元14係使第1 使=二T與第：圖中的箭頭B相反的方向滑動， 朝橫貫二二4 6側的第1支持體⑷面向輸送帶4，而 月也、貝輸达贡4的方向移動。 時：支動構件Μ及第2滑動構件Me滑動 ^ 14d ^ d、第2支持體14e、被載置於第1支持 :广的處理完畢基板2以及被載置於第 未處理基板2並不合互相；说 d 14e的 到達成為處理裝置:上方二。:二:第2支持體146 到達成為輸送帶4上方『，位置、而且幻支持體14d 上方的弟1位置時，移載單元14係使第 319950 17 200844027 1滑動構件14b及第2滑動構件14c的滑動停止。此時，The recess 4d and the recess 4e formed between the respective air ejection units & That is, the recesses and the private portions are formed by arranging the first support bodies 14d in the direction transverse to the conveyor belt 4: Therefore, when the lifting unit H lowers the transfer unit 14, the i-th support 14d will be contained in these recesses and cut and caught. Fig. 8 is a cross-sectional view taken along line VIII-VII of Fig. 7 in which the fresh-keeping element is referred to as descending in this manner. As shown in Fig. 8, the first body (4) enters the corresponding recess and 4e respectively as the transfer center drops, and descends to a position lower than the surface of the substrate 2 transported by the conveyor belt 4 ( Down position). By making the first in this way! The support (4) is accommodated in these recesses, and when the substrate 2 is transported by the transport belt 1, the substrate 2 does not interfere with the first support Hd, and can pass through the upper side of the first support 14d. When the first support 14d is in the state shown in Fig. 8, when the conveyance belt 4 is conveyed and supported above the support body 14d, the conveyance of the substrate 2 that has been transported is temporarily stopped, and thereafter, The lift 1 causes the transfer unit 14 to rise. Take this 1 i support! 4d abuts 319950 14 200844027 on the lower surface of the substrate 2 and lifts the substrate 2 from the conveyor belt 4. Fig. 9 is a cross-sectional view taken along line VIII-VIII of the figure when the transfer unit 14 is raised most in this manner. The ninth (fourth) $1 body 14d is placed on the substrate 2 and lifted from the conveyor belt 4, and the === belt 4 is transported from the upper surface of the substrate 2 to a higher position. When the tape 4 is conveyed, the substrate 2 can pass through the lower side of the first support 14d without interfering with the disk holder (4). In this way, when the substrate 2 is placed on the i-th support (4), U becomes the most ascending state, and the element (10) is swept toward the arrow in the seventh figure, and the 41 is swept to Ww (four). The first support body is moved by the processing device 6 in a direction transverse to the conveyor belt 4.盥 = At the same time, the transfer unit "slides the second sliding member 14 in the opposite direction" so that the first e on the processing device 6 side faces the conveyor belt 4' and moves in a direction transverse to the conveyor belt *. As described above, the first sliding member (10) and the second ==: two first support members (4), the second support member, and the substrate 2 on which the support member 14d is supported do not interfere with each other. (4) reaching the second position above the processing device 6, and the U support 14e reaches the first sliding member _ and the second sliding member 14c which are above the conveyor belt 4 == at this time, the first support (4) and The second support body is in a state as shown in Fig. 5. - In this state, the transfer unit η is lowered by the lift unit 10, and the hunt is placed in the second position. The substrate 2 319950 15 200844027 of the support body (4) is lowered. As the substrate 2 is lowered, a plurality of pins 6a disposed on the processing device 6 abut against the lower surface of the substrate 2, and the substrate 2 is replaced by the pin -6a. Supporting, thereby completing the receiving and receiving of the substrate 2 from the first support to the processing device 6, and in the processing device (6) The necessary processing can be performed on the substrate 2. On the other hand, the second support 14e, which is moved toward the conveyor belt 4 and located at the first position, is located in each of the drive units 4b as in the case of the first support 14d. The recess 4d between the recesses 4d and the recesses 4e between the air ejecting units 4c. Therefore, when the elevating unit 1 lowers the transfer unit 14, each of the second supporting bodies 14e is accommodated in the corresponding In the recesses 4d and 4e, when the transfer unit 14 is in the most descending state, the second support 14e is lowered to be lower than the substrate 2 conveyed by the conveyor belt as indicated by the broken line in FIG. The lower surface (down position) of the surface is such that the second support body i4e is housed in the recesses 4d and 4e, and when the substrate 2 is transported by the transport belt 4, the substrate 2 does not contact the second support body 14e. The interference can be surely passed over the second support body ue. When the second support body 14e is in the state shown by the broken line in Fig. 8, when the processing of the substrate 2 in the processing device 6 is completed, and the use is not completed yet. Substrate processed by the processing device 6 (hereinafter referred to as unprocessed substrate ^: input When the belt 4 is conveyed to the upper side of the second support body 14e, the transfer of the unprocessed base by the transport order is temporarily stopped, and then the transfer unit 14 is raised by the drop 7010. The support "e" will abut on the lower surface of the unprocessed substrate 2, and lift the unprocessed substrate 2 from the transport ▼4. At this time, on the side of the processing plant 6, the i-th support (4) will be 319950 16 200844027 The transfer unit 14 rises and rises. The first support member abuts on the lower surface of the substrate (hereinafter referred to as the processed substrate) 2 that has been processed by the processing device 6, and the processed substrate 2 is processed from the processing device. 6 bolts lifted up. When the unprocessed substrate 2 is placed on the upper surface of the second support 14e and the transfer unit 14 is most raised, the 帛2 support is as shown by the broken line in Fig. 9, and the unprocessed substrate 2 is placed. Lifting from the conveyor belt 4 and ascending to the upper side of the substrate 2 conveyed by the conveyor belt 4 later? Set (up position). Therefore, when the substrate 2 is transported by the transport belt 4, the substrate 2 does not interfere with the second support, but passes through the lower side of the second support 14e. After the transfer element 14 is in the most elevated state as described above, the transfer sheet: the second sliding member (4) is directed toward the processing device 6 toward the processing device 6 in the direction of the arrow b in FIG. The sliding member 14hT is moved. At the same time, the transfer unit 14 slides the first direction = two T in the opposite direction to the arrow B in the figure: and faces the conveyor belt 4 toward the first support body (4) that traverses the second and fourth sides. It is also moving in the direction of Beigong. When the supporting member Μ and the second sliding member Me are slid, the second support 14e is placed on the first support: the wide processed substrate 2 and the second unprocessed substrate 2 are placed. Mutual; say that the arrival of d 14e becomes the processing device: two above. : 2: When the second support 146 reaches the upper position of the upper side of the conveyor belt 4, and the position of the first position above the phantom support 14d, the transfer unit 14 is the 319950 17 200844027 1 sliding member 14b and the second sliding member 14c. The slide stops. at this time,
第1支持體14d及第2支持體14e會再度形成如第4 J -示的狀態。 固所 在廷種狀態下，升降單元1〇係使移載單元Μ下降， ，，，被載置於第2支持體14e的未處理基板2會下降。’ 隨著未處理基板2的下降，配設在處理裝置6之丄二 數個插銷6a會抵接於未處理基板2的下表面，未處理^ Γ 2會由插銷6&所支持。藉此便完成未處理基板2從第^ 持體14e到處理裝置6的於為 理美核2、二：處理裝置6對未處 理卷扳2進行必要的處理。 另一方面，在輸送帶4側，升降單元 二降’藉此」被載置於第1支持體14d的處理完畢= 的下矣通者處理完畢基板2的下降，處理完畢基板2 4a上，而—士老 4之各驅動早兀4b的搬送滾輪 而元成處理完畢基板2從第〗支 (4的授受。接著， 弟幻寺體⑷到輸送帶 ^ 1yl田多载早70 14成為最為下降的狀態時， 乐1克持體14d會如筮r国私- 搬送的基板2 不下降至比由輸送帶4所 板2由二4面更低的位置(下降位置)。因此，基 锻』由輸达帶4搬送時，其姑？ 土 干擾，而可通迥第】^ 不會與第1支持體14d J逍過第1支持體14d的上方。 第心體=再度反覆進行上述步驟，可交互進行利用 1支持體14d施二了，未ί理基板2之移载、以及利用第 合這樣的摔作，：二理凡畢基板2之移载。而且，可配 作父互進行利用第2支持體Ue施行的處理 319950 18 200844027 元畢基板2之移巷、、 理基板2之移载。以及利用第2支持體14e施行的未處 亦即，當繁1 4- 支持體14 d位;η μ班 π ^ 0 ± 4i 體146位於第2值置時，二t第1位置’且第2支持 從最為下降的狀態上：，C由升降單元:° 會被交給第1支持靜 ；4的未處理基板2就 畢基板2會被交給第2支持於處理裝置6的處理完 成為最為上升的狀態時，移載單著，當移載^元14 14b從輸送帶4側朝 係使第1滑動構件 構件14c從處理裝置置6側滑動，並且使第2滑動 動構件⑽及第2、滑動^輸送帶4侧滑動。藉由第1滑 板2的第i支持體:4。的滑動，載置有未處理基 置往第2位置蒋叙θ朝橫貫輸送帶4的方向從第】位 直你罘2位置移動，並 支持體14e會朝橫貫龄、” f置有處理完畢基板2的第2 置移動。 别、▼ 4的方向從第2位置往第】位 葛第1支持體14d到達第9 & # 到達第1付署歧弟 置’同時第2支持體14e 位置時，移載單元14會 隨著移载單元14的下降，被載置於第t = : = 置於第2支持體14e的處 ，:上’而且，被載 4的搬送滾輪4…之後，在處=置 板2進行必要的處理，另—方面，^嫌處，基 完畢基板2會由輸送帶4朝下游側搬送了輸送Η的處理 另—方面，當第2支持體…位於第1位置，且第】 319950 19 200844027 支持體14d位於第2位置時，當 .10從最為下降的狀態上升，心2早7014错由升降單元The first support 14d and the second support 14e are again formed in a state as shown in the fourth J-. In the state in which the lift unit 1 is configured to lower the transfer unit, the unprocessed substrate 2 placed on the second support 14e is lowered. As the unprocessed substrate 2 is lowered, the plurality of pins 6a disposed in the processing device 6 abut against the lower surface of the unprocessed substrate 2, and the unprocessed 2 is supported by the pins 6 & Thereby, the unprocessed substrate 2 is processed from the second holding body 14e to the processing device 6, and the processing device 6 performs the necessary processing on the unprocessed reel 2. On the other hand, on the side of the conveyor belt 4, the elevating unit 2 is lowered by the lower side of the processing of the first support 14d, and the lower substrate of the processed substrate 2 is processed, and the processed substrate 2 4a is lowered. And - each of the old 4 drives the transfer roller as early as 4b and the finished substrate 2 is processed from the first branch (4). Then, the young temple (4) to the conveyor belt ^ 1yl field is more than 70 14 is the most In the descending state, the Le 1 gram holder 14d will be as 筮r-national-transported substrate 2 does not fall to a lower position (down position) than the plate 4 of the conveyor belt 4 by two planes. Therefore, the base forging When the conveyor belt 4 is transported, the soil is disturbed, and the first support body 14d does not pass over the first support body 14d. The first core body = the above steps are repeated again. It can be interactively performed by the 1 support body 14d, the unloading of the substrate 2, and the use of the splicing of the first combination: the second substrate is transferred to the substrate 2. Moreover, it can be configured as a parent. Processing by the second support Ue 319950 18 200844027 The transfer of the substrate 2, the transfer of the substrate 2, and the use The second support 14e is not implemented, that is, when the complex 1 4-support 14 d position; the η μ class π ^ 0 ± 4i body 146 is located at the second value, the second t first position 'and the second support From the most declining state: C is lifted by the lifting unit: ° will be handed over to the first support static; 4 of the unprocessed substrate 2 will be delivered to the second support of the processing device 6 In the state of the load, the transfer member is slid, and when the transfer member 14 14b is slid from the side of the conveyance belt 4 toward the side of the processing device 6, the second sliding member (10) and the second member are made. The sliding belt 4 slides on the side of the conveyor belt 4. The sliding of the ith support of the first slide plate 2: 4, the untreated base is placed on the second position, and the direction is traversed from the ninth position to the traverse belt 4 Straight you 罘 2 position movement, and the support body 14e will move toward the second level, "f will be placed in the second movement of the processed substrate 2. No, the direction of ▼ 4 from the second position to the first] georgette first support 14d When the arrival of the 9th &# arrives at the 1st position of the second support body 14e, the transfer unit 14 is placed at the t-th as the transfer unit 14 descends. = : = placed on the second support 14e, above: and after the transfer roller 4 of the load 4 is placed, the necessary processing is performed at the place=the plate 2, and the other is the base plate. 2, the conveyance belt 4 conveys the conveyance raft to the downstream side, and the second support body is located at the first position, and the 319950 19 200844027 support body 14d is located at the second position, when .10 is the most The falling state rises, the heart 2 is early 7014 wrong by the lifting unit
畢基板2會被交給第！支持體14d ，、H 成為最為上•升的狀態時’移載單幻4會使二Substrate 2 will be handed over to the first! When the support body 14d, H becomes the most up-up state, 'transfer single magic 4 will make two
Wc從輸送帶4側朝處理裝置6側严 :、 構件14b從虛理驻番< 7 '月’並且使第1滑動 = 攸處縣置6側朝輸送帶 動構件14b及第2滑動構μ =猎由弟^月 板2的第2支持體14e會朝’載置有未處理基 置往筮？仞罢较心 月棱貝輸廷贡4的方向從第j位 支持二二ΤΙ 時’载置有處理完畢基板2的第1 橫貫輸送帶4的方向從第2位置往第1位 §第2支持體i4e到遠筮9 — 到達第！位置時，移…弟1支持體14d 隨著二：？ 14會藉由升降單元10而下降。 思考移載單凡14的下降士# 理義杯9合^ 載置於第2支持體14e的未處 :板2 θ被父付在處理裝置6的插銷以上，同時被載置 的辦、\支持體⑷的處理完畢基板2會被交付在輸送帶4 進：廷滾輪牦上。之後’在處理裝置6對於未處理基板2 其^丁必要的處理’另一方面，被交給輸送帶4的處理完畢 基板2會，送帶4朝下游側搬送。 6 —基板2由輸送帶4 一片一片地搬送，並且在處理裝置 亦η ^一片對基板2進行處理時的步驟如以上所述。然而， 的二此有不連‘地進行利用輸送帶4施行的基板2之搬送 、情況、或不進行在處理裝置6的處理，而是直接以輸送 319950 20 200844027 板2朝下游側搬送的情況。在這種情況下，為了 使私載早兀u形成待機狀態，移載h 件14b及第2滑動構件14c會同時 ，弟π動構 ^ t , Jit ^ , U岈朝輸迗帶4側滑動，使 =持請及第2支持體l4e皆位於第〗位置吏 = Π210使移載單元14成為最為下降的狀態，而 使第1支持體14d及第2支持體14e皆 所搬送的基板2之下表面更低的位f , 兩1^ 4 又1R的位置。由此，基板2由銓 送帶4搬送時，基板2並不會 ^由輸 +曰興弟1支持體14d及第2支 如4e干擾，而可通過第i支持體⑷及第2支持體… 的上方。 Π73且 心…·^ /义阀始進行輸送帶4盥 匕理裝置6之間的基板2之移載時，是藉由與前述利用第 二持：14d施行的基板2之移載同樣的步驟，開始進行 =輸送d朝處理裝置6的基板2之移载。之後， 述’可藉由第2支持體14e及第i皮 板2之移載。 及弟1支持體⑷父互進行基 以上已針對利用移載單元14施行的基板2之移載加以 如前所述，移載單元16也是以與移載單元Η同樣 贫式構成，因此利用移载單元16施行的輸送帶4與處理 的基板2之移载、以及移載單元16至待機狀態 轉換也是以與上述移載單元Μ同樣的方式進行。 如以上所述’在使用第1支持體14d及第2支持體14e 之任-個，使未處縣板2從輸送帶4減_置 的期間’可使用第i支持體14d及第2支持 = 319950 21 200844027 -個’使處理完畢基板2從處理裝置6朝輸送帶々移動。 因此，可有效地進行輸送帶4與處理裴置6 <間的基板2 之移動。 f 本實施形態的基板搬送裝置是在輪送帶4的上方酉^ 有移載單元Η，此移載單元“{藉由配設在輸送=己= 侧方外側的升降單元10而升降。再者，移載單元Μ的 1支持體14d及第2支持體14e可在成為輸送帶4之上方 的第1位置與處理裝置6侧的第2位置之間移動。因此， 只要在由輸送帶4所搬送的基板2之移動軌跡的外俾 用，配置升降單元10所需的空間，就不需要確保機器人手、 臂等的設置空間、或機器人手臂的移動空間。結果，比 以往的基板搬送裝置，能以更少的空間移載基^ 2。’ ^起 再者，當第1支持體Ud或第2支持體A14e位於 :二在升降單元10使移載單元14.最為下降的情況下， 基板2_ 支持體14e干擾，而可通過第i支持體i4d 體14e的上方。另一方面，當第i支持體⑷或第 主 :::第1位置時’在升降單元1〇使移載單元Μ最 為上：的情況下，由輸送帶4所搬送的基 虚= =請或第2支持趙…干擾，而可通過第；： 肢⑷或第2支持體14e的下方。因此， ^ :"成為最為下降的狀態或最為上 ·早 ^處理裝置6之間進行基板2之移載的期間 早，之後搬送而來的基板2搬送到下游側。結果= 319950 22 200844027 更有效率地湘輸送帶4進行基板2之搬送。 此外’以上的效果在與移載單元14同樣構成的移載單 元16中也可同樣獲得。 以上已針對本發明之一實施形態的基板搬送裝置加以 說明，但是本發明並不限於上述實施形態。 上述μ把形態中，在配置於輸送帶4之側方外側的升 ，單70 10係連結有移載單元14，而升降單元1〇係使移載 單7L 14升降。然而，升降單元1〇的配置並不限於輸送帶 4的侧方外侧。例如，亦可從天花板垂吊#，再藉由配設 在輸送帶4之上方的升降單元1〇使移載單元14升降。如 此在配設升降單元1G的情況下，亦不需要用以在地面設置 升降單元10的空間。這種構成在移載單元16及升降單元 12中也能以同樣方式實施。 又上述只鈀形態中，基板2是藉由從空氣喷出單元 4c朝向基板2之下表面喷出的空氣，而以非接觸的方式被 支持，並藉由與基寺反2之下表面相接觸的輸送帶4的搬送 滾輪4a之旋轉而被搬送。然而，利用輸送帶4進行的基板 2之搬送方法並不限於此。例如，亦可省略空氣喷出單元 4c，使基板2僅藉由搬送滾輪4a來搬送。 再者上述只把形怨是在移載單元1 4設置由第1支持 版14d及第2支持體I4e所構成的兩組支持體，但是亦可 僅設置任—者。在此情況下，耗無法藉由使兩組支持體 交互移動而更有效地移載基板2 ’但是可縮小移載基板2 所需的空間的效果與上述實施形態同樣地能夠獲得。 319950 23 200844027 又’上述實施形態是使第1支持體14d及第2支持體 14e父互移動，因此基板2可有效地被移載。然而，亦可 配合利用輸送帶4進行的基板2之搬送形態，使第丨支持 體14d及第2支持體14e朝相同方向移動。又，藉由適當 調整輸送帶4與處理裝置6或8的高度以及第1支持體14d 及第2支持體14e的高度，即可適當變更第1支持體 及第2支持體14e的移動順序。 (再者’上述實施形態的處理裝置、支持體、驅動單元、 或空氣喷出單元等的數量僅為一例，可適當變更。 如以上所述，本發明可進行各種變更。這種變更並不 會脫離本發明的主旨及範圍。 【圖式簡單說明】 第1圖是本發明一實施形態的基板搬送裝置所適用的 生產線之一部分的概略平面圖。 第2圖是第1圖之基板搬送裝置所使用的移載裝置的 ( 斜視圖。 第3圖是第1圖之基板搬送裝置所使用的移載裝置的 平面圖。 第4圖是第1圖之基板搬送裝置所使用的移載裝置的 側面圖。 第5圖是第1圖之基板搬送裝置所使用的移載裝置的 側面圖。 第6圖是第1圖之基板搬送裝置所使用的移載裝置的 正面圖。 24 319950 200844027 第7圖是第1圖之基板搬送裝置的動作狀態的平面圖 第8圖是移载單元處於最為下降的狀態時之沿著第 圖中之VIII-VIII線的剖面圖。 第9圖是移载單元處於最為上升的狀態時之 圖中之VIII-VIII線的剖面圖。 者弟 【主要元件符號說明】 2 4a 4c 6 Λ 8 10 基板 4 搬送滾輪 4b 空氣噴出單元 4d - 4e 處理裝置 6a 升降單元 12 移載單元（移載手段) 14a 14c 14e 14、16 單元主體 第2滑動構件 第2支持體 輸送帶 驅動單元 凹處 插銷 升降單元（升降手段) 14b第1滑動構件 ⑷第1支持體 319950 25Wc is from the side of the conveyor belt 4 toward the side of the processing device 6: the member 14b is shammed from the stagnation < 7 'month' and the first sliding = the county is placed 6 toward the conveying member 14b and the second sliding member = Hunting from the second support body 14e of the moon board 2 will be placed on the unprocessed base?仞 较 较 较 较 棱 输 输 输 的 的 的 的 的 4 4 4 4 4 4 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Support i4e to far 9 - reach the first! Position when moving... brother 1 support body 14d with two:? 14 will be lowered by the lifting unit 10. Thinking about the transfer of the single Fan 14 of the descendant #理义杯9合^ Placed in the second support 14e: the board 2 θ is paid by the father above the latch of the processing device 6, and is placed at the same time, The processed substrate 2 of the support (4) is delivered on the conveyor belt 4: the wheel roller. Then, the processing of the unprocessed substrate 2 by the processing device 6 is performed. On the other hand, the processed substrate 2 is delivered to the conveyance belt 4, and the conveyance belt 4 is conveyed toward the downstream side. 6 - The substrate 2 is transported one by one by the conveyor belt 4, and the steps when the processing apparatus also processes the substrate 2 are as described above. However, there is a case where the substrate 2 to be transported by the conveyor belt 4 is not transported, or the processing of the processing device 6 is not performed, but the 319950 20 200844027 board 2 is directly transported to the downstream side. . In this case, in order to form the standby state for the private load, the transfer member 14b and the second sliding member 14c are simultaneously slid, and the Jt, Jit, U岈 slides toward the belt 4 side. The substrate 2 is transported by the first support 14d and the second support 14e in the state where the transfer unit 14 is in the most descending state, and the second support l4e is located at the first position 吏=Π210. The lower surface has a lower position f, two 1^4 and 1R positions. Therefore, when the substrate 2 is transported by the feed belt 4, the substrate 2 does not interfere with the support body 14d and the second branch such as 4e, but can pass the i-th support (4) and the second support. Above the .... When the transfer of the substrate 2 between the transfer device 4 and the processing device 6 is performed, the same steps as the transfer of the substrate 2 by the second holding: 14d are performed. The transfer of the transfer d to the substrate 2 of the processing device 6 is started. Thereafter, the description can be carried out by the second support 14e and the i-th board 2. The parent 1 (4) parent interaction base has been transferred to the substrate 2 performed by the transfer unit 14 as described above, and the transfer unit 16 is also configured to be as lean as the transfer unit ,, so The transfer of the conveyor belt 4 and the processed substrate 2 carried out by the carrier unit 16 and the transition of the transfer unit 16 to the standby state are also performed in the same manner as the above-described transfer unit Μ. As described above, 'the first support 14d and the second support 14e are used, and the i-th support 14d and the second support can be used during the period in which the lower plate 2 is removed from the conveyor 4 = 319950 21 200844027 - The 'processed substrate 2 is moved from the processing device 6 toward the conveyor belt. Therefore, the movement of the substrate 2 between the conveyor belt 4 and the processing unit 6 can be efficiently performed. f The substrate transfer apparatus of the present embodiment is provided with a transfer unit 酉 above the transfer belt 4, and the transfer unit "{" is moved up and down by the elevating unit 10 disposed outside the conveyance=self=side. The support body 14d and the second support body 14e of the transfer unit 移动 can move between the first position above the conveyor belt 4 and the second position on the processing device 6 side. Therefore, as long as the conveyor belt 4 is It is not necessary to secure the installation space of the robot hand, the arm, or the movement space of the robot arm for the outer circumference of the movement path of the substrate 2 to be conveyed, and it is not necessary to secure the movement space of the robot arm. It is possible to transfer the base 2 with less space. When the first support Ud or the second support A14e is located at the second position, in the case where the lifting unit 10 causes the transfer unit 14 to be the most descending, The substrate 2_ is supported by the support 14e, and can pass through the upper side of the i-th support i4d body 14e. On the other hand, when the i-th support (4) or the main::: first position, the transfer unit is moved in the elevating unit 1 ΜThe top: In the case of the conveyor belt 4, the base is false = = please or the second With Zhao... interference, it can pass through the :: limb (4) or the second support 14e. Therefore, ^ :" becomes the most descending state or the most upstream and early processing device 6 is transferred between the substrate 2 In the case of the substrate 2, the substrate 2 is transported to the downstream side. The substrate transfer device of the embodiment of the present invention has been described above. However, the present invention is not limited to the above embodiment. The μ handle is disposed on the side of the conveyor belt 4 The outer side rises, the single 70 10 series is coupled with the transfer unit 14, and the lift unit 1 is configured to lift and lower the transfer sheet 7L 14. However, the arrangement of the lift unit 1 is not limited to the lateral outer side of the conveyor belt 4. For example, It is also possible to hang the ceiling # from the ceiling, and then lift and lower the transfer unit 14 by means of the lifting unit 1 disposed above the conveyor belt 4. Thus, in the case where the lifting unit 1G is provided, it is not required to be placed on the ground. Lifting list The space of 10. This configuration can also be carried out in the same manner in the transfer unit 16 and the lifting unit 12. In the above-described palladium only form, the substrate 2 is ejected from the air ejection unit 4c toward the lower surface of the substrate 2. The air is supported in a non-contact manner and conveyed by the rotation of the transport roller 4a of the conveyor belt 4 in contact with the lower surface of the base temple. However, the substrate 2 by the conveyor belt 4 is carried. The transport method is not limited thereto. For example, the air ejecting unit 4c may be omitted, and the substrate 2 may be transported only by the transport roller 4a. Further, the above-mentioned only complaint is that the transfer unit 14 is provided with the first support version. There are two sets of supports composed of 14d and the second support I4e, but only one of them may be provided. In this case, the effect of moving the substrate 2' more efficiently by moving the two sets of supports alternately, but the effect of reducing the space required for transferring the substrate 2 can be obtained in the same manner as in the above embodiment. 319950 23 200844027 Further, in the above embodiment, the first support 14d and the second support 14e are moved to each other, so that the substrate 2 can be effectively transferred. However, the second support body 14d and the second support body 14e may be moved in the same direction in accordance with the transport form of the substrate 2 by the conveyor belt 4. Further, by appropriately adjusting the height of the conveyor belt 4 and the processing device 6 or 8, and the heights of the first support 14d and the second support 14e, the order of movement of the first support and the second support 14e can be appropriately changed. Further, the number of the processing device, the support, the drive unit, or the air ejection unit of the above-described embodiment is merely an example, and can be appropriately changed. As described above, the present invention can be variously modified. 1 is a schematic plan view of a portion of a production line to which a substrate transfer device according to an embodiment of the present invention is applied. Fig. 2 is a substrate transfer device of Fig. 1 3 is a plan view of a transfer device used in the substrate transfer device of Fig. 1. Fig. 4 is a side view of the transfer device used in the substrate transfer device of Fig. 1 Fig. 5 is a side view of the transfer device used in the substrate transfer device of Fig. 1. Fig. 6 is a front view of the transfer device used in the substrate transfer device of Fig. 1. 24 319950 200844027 Fig. 7 Fig. 8 is a plan view showing an operation state of the substrate transfer apparatus of Fig. 1 taken along the line VIII-VIII in the figure when the transfer unit is in the most lowered state. Fig. 9 is a transfer unit at The cross-sectional view of the line VIII-VIII in the most elevated state. The younger [description of the main components] 2 4a 4c 6 Λ 8 10 Substrate 4 Transfer roller 4b Air ejection unit 4d - 4e Processing device 6a Lifting unit 12 Carrier unit (transfer means) 14a 14c 14e 14, 16 unit main body second sliding member second support transport belt drive unit recessed latch lift unit (lifting means) 14b first sliding member (4) first support 319950 25