TW200831714A - Guide device used for electroplating treatment system - Google Patents

Guide device used for electroplating treatment system Download PDF

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Publication number
TW200831714A
TW200831714A TW096109192A TW96109192A TW200831714A TW 200831714 A TW200831714 A TW 200831714A TW 096109192 A TW096109192 A TW 096109192A TW 96109192 A TW96109192 A TW 96109192A TW 200831714 A TW200831714 A TW 200831714A
Authority
TW
Taiwan
Prior art keywords
sheet
pipe
workpiece
pair
shaped
Prior art date
Application number
TW096109192A
Other languages
English (en)
Chinese (zh)
Other versions
TWI351448B (ko
Inventor
Isao Wada
Yasushi Hatano
Original Assignee
Plant Co Ltd I
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plant Co Ltd I filed Critical Plant Co Ltd I
Publication of TW200831714A publication Critical patent/TW200831714A/zh
Application granted granted Critical
Publication of TWI351448B publication Critical patent/TWI351448B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C25D17/04—External supporting frames or structures
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
TW096109192A 2007-01-22 2007-03-16 Guide device used for electroplating treatment system TW200831714A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007011957A JP2008174827A (ja) 2007-01-22 2007-01-22 電気メッキ処理システムに用いられるガイド装置

Publications (2)

Publication Number Publication Date
TW200831714A true TW200831714A (en) 2008-08-01
TWI351448B TWI351448B (ko) 2011-11-01

Family

ID=39702048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109192A TW200831714A (en) 2007-01-22 2007-03-16 Guide device used for electroplating treatment system

Country Status (3)

Country Link
JP (1) JP2008174827A (ko)
KR (1) KR20080069108A (ko)
TW (1) TW200831714A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106591932A (zh) * 2016-12-30 2017-04-26 宁波工程学院 用于深孔电镀的电镀制具及电镀方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009287098A (ja) * 2008-05-30 2009-12-10 I Plant:Kk メッキ処理装置
JP5398223B2 (ja) * 2008-10-23 2014-01-29 上村工業株式会社 処理液槽のゲート装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818798B2 (ja) * 1980-01-14 1983-04-14 東洋技研工業株式会社 プリント配線基板のスル−ホ−ルめつき方法とその装置
JP2642282B2 (ja) * 1992-08-11 1997-08-20 新日本製鐵株式会社 液体供給装置
JPH07331493A (ja) * 1994-06-08 1995-12-19 C Uyemura & Co Ltd 小幅スリットノズル装置
JP3366319B2 (ja) * 2000-07-25 2003-01-14 和夫 大場 連続自動メッキ装置
JP3382610B1 (ja) * 2001-10-15 2003-03-04 丸仲工業株式会社 メッキ液噴出管を設けた液中搬送式のメッキ処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106591932A (zh) * 2016-12-30 2017-04-26 宁波工程学院 用于深孔电镀的电镀制具及电镀方法
CN106591932B (zh) * 2016-12-30 2023-09-29 宁波工程学院 用于深孔电镀的电镀制具及电镀方法

Also Published As

Publication number Publication date
TWI351448B (ko) 2011-11-01
KR20080069108A (ko) 2008-07-25
JP2008174827A (ja) 2008-07-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees