TW200830573A - Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip - Google Patents

Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip Download PDF

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Publication number
TW200830573A
TW200830573A TW096100234A TW96100234A TW200830573A TW 200830573 A TW200830573 A TW 200830573A TW 096100234 A TW096100234 A TW 096100234A TW 96100234 A TW96100234 A TW 96100234A TW 200830573 A TW200830573 A TW 200830573A
Authority
TW
Taiwan
Prior art keywords
emitting diode
light
packaging
mold
accommodating spaces
Prior art date
Application number
TW096100234A
Other languages
English (en)
Chinese (zh)
Other versions
TWI321365B (cg-RX-API-DMAC7.html
Inventor
Bily Wang
Jonnie Chuang
hui-yan Huang
Original Assignee
Harvatek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harvatek Corp filed Critical Harvatek Corp
Priority to TW096100234A priority Critical patent/TW200830573A/zh
Priority to US11/854,066 priority patent/US7803641B2/en
Publication of TW200830573A publication Critical patent/TW200830573A/zh
Application granted granted Critical
Publication of TWI321365B publication Critical patent/TWI321365B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW096100234A 2007-01-03 2007-01-03 Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip TW200830573A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096100234A TW200830573A (en) 2007-01-03 2007-01-03 Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip
US11/854,066 US7803641B2 (en) 2007-01-03 2007-09-12 Mold structure for packaging LED chips and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096100234A TW200830573A (en) 2007-01-03 2007-01-03 Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip

Publications (2)

Publication Number Publication Date
TW200830573A true TW200830573A (en) 2008-07-16
TWI321365B TWI321365B (cg-RX-API-DMAC7.html) 2010-03-01

Family

ID=39584560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096100234A TW200830573A (en) 2007-01-03 2007-01-03 Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip

Country Status (2)

Country Link
US (1) US7803641B2 (cg-RX-API-DMAC7.html)
TW (1) TW200830573A (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414089B (zh) * 2010-12-06 2013-11-01 Advanced Optoelectronic Tech 發光二極體封裝方法
TWI455252B (zh) * 2008-08-28 2014-10-01 玉晶光電股份有限公司 A mold release mechanism for a light emitting diode package process
CN104465938A (zh) * 2013-09-22 2015-03-25 展晶科技(深圳)有限公司 模具及使用该模具制造发光二极管的方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101168316B1 (ko) * 2009-12-01 2012-07-25 삼성전자주식회사 발광다이오드 검사 장치
CN102447035B (zh) * 2010-10-06 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 发光二极管、制造该发光二极管的模具及方法
CN102456780B (zh) * 2010-10-29 2014-11-05 展晶科技(深圳)有限公司 发光二极管封装方法
KR101850979B1 (ko) * 2011-06-03 2018-04-20 서울반도체 주식회사 발광소자의 봉지재 성형장치 및 방법
TWM511681U (zh) * 2015-08-05 2015-11-01 宏齊科技股份有限公司 顯示裝置及其發光陣列模組
WO2020019940A1 (zh) * 2018-07-26 2020-01-30 宁波舜宇光电信息有限公司 感光组件、感光组件拼板、模塑组件拼板以及制造方法
US11515174B2 (en) * 2019-11-12 2022-11-29 Micron Technology, Inc. Semiconductor devices with package-level compartmental shielding and associated systems and methods
TWI728779B (zh) * 2020-04-15 2021-05-21 宏齊科技股份有限公司 Led顯示屏模組
DE102021129753A1 (de) 2020-12-17 2022-06-23 Infineon Technologies Ag Halbleiter-Packages und Verfahren zum Herstellen derselben
CN114334929B (zh) * 2021-12-30 2026-01-13 广东晶科电子股份有限公司 一种led封装结构、封装器件及封装方法

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US4368168A (en) * 1978-07-17 1983-01-11 Dusan Slepcevic Method for encapsulating electrical components
US5846477A (en) * 1994-12-08 1998-12-08 Nitto Denko Corporation Production method for encapsulating a semiconductor device
DE69625623T2 (de) * 1996-01-31 2003-11-06 Sumitomo Bakelite Co. Ltd., Tokio/Tokyo Verfahren zur Herstellung von in Epoxyharz eingekapselter Halbleitervorrichtung
KR19990004211A (ko) * 1997-06-27 1999-01-15 한효용 게이트슬롯이 형성된 서브스트레이트
US6525386B1 (en) * 1998-03-10 2003-02-25 Masimo Corporation Non-protruding optoelectronic lens
US6344162B1 (en) * 1998-07-10 2002-02-05 Apic Yamada Corporation Method of manufacturing semiconductor devices and resin molding machine
JP3897478B2 (ja) * 1999-03-31 2007-03-22 松下電器産業株式会社 樹脂封止型半導体装置の製造装置及びその製造方法
KR200291282Y1 (ko) * 1999-04-14 2002-10-14 앰코 테크놀로지 코리아 주식회사 반도체패키지용 인쇄회로기판
JP2001135659A (ja) * 1999-11-09 2001-05-18 Towa Corp 電子部品の樹脂封止成形用金型
US6309916B1 (en) * 1999-11-17 2001-10-30 Amkor Technology, Inc Method of molding plastic semiconductor packages
JP3581814B2 (ja) * 2000-01-19 2004-10-27 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂封止装置
US6856006B2 (en) * 2002-03-28 2005-02-15 Siliconix Taiwan Ltd Encapsulation method and leadframe for leadless semiconductor packages
US7384582B2 (en) * 2000-08-04 2008-06-10 Renesas Technology Corp. Mold cleaning sheet and method for producing semiconductor devices using the same
JP4669166B2 (ja) * 2000-08-31 2011-04-13 エルピーダメモリ株式会社 半導体装置
US6803089B2 (en) * 2001-08-15 2004-10-12 Advanced Semiconductor Engineering Inc. Cleaning substrate for cleaning and regenerating a mold
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP2006269486A (ja) * 2005-03-22 2006-10-05 Renesas Technology Corp 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455252B (zh) * 2008-08-28 2014-10-01 玉晶光電股份有限公司 A mold release mechanism for a light emitting diode package process
TWI414089B (zh) * 2010-12-06 2013-11-01 Advanced Optoelectronic Tech 發光二極體封裝方法
CN104465938A (zh) * 2013-09-22 2015-03-25 展晶科技(深圳)有限公司 模具及使用该模具制造发光二极管的方法

Also Published As

Publication number Publication date
TWI321365B (cg-RX-API-DMAC7.html) 2010-03-01
US20080160658A1 (en) 2008-07-03
US7803641B2 (en) 2010-09-28

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