US20080160658A1 - Mold structure for packaging led chips and method thereof - Google Patents
Mold structure for packaging led chips and method thereof Download PDFInfo
- Publication number
- US20080160658A1 US20080160658A1 US11/854,066 US85406607A US2008160658A1 US 20080160658 A1 US20080160658 A1 US 20080160658A1 US 85406607 A US85406607 A US 85406607A US 2008160658 A1 US2008160658 A1 US 2008160658A1
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- mold
- receiving spaces
- bottom mold
- flow channels
- led chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Definitions
- the present invention relates to a mold structure for packaging LED chips and a method thereof, and particularly relates to a mold structure and a method for preventing package resins from overflowing on a rear face of a substrate of the LED chips.
- a known mold structure m includes a top mold 1 a and a bottom mold 2 a mated with the top mold 1 a .
- the bottom mold 2 a has a plurality of receiving spaces 20 a of a larger size.
- a substrate 3 a is etched to form a plurality of chip carrying areas 30 a and a plurality of positive contact pins 300 a and negative contact pins 301 a that correspond to the chip carrying areas 30 a.
- each LED chip 4 a is arranged on the corresponding chip carrying areas 30 a , respectively.
- a positive pole and a negative pole (not shown) of each LED chip 4 a are electrically connected with the corresponding positive contact pin 300 a and negative contact pin 301 a via leading wires 40 a by a wire-bounding method.
- the LED chips 4 a are divided into a plurality of LED chip areas.
- Each LED chip area has a plurality of LED chips 4 a arranged in a matrix shape. For example, in the FIG. 3 each LED chip area has a 5*5 LED chip matrix.
- a self-adhesive tape 5 a is attached on a rear face of the substrate 3 a.
- the substrate 3 a is deformed easily and the package resins 6 a overflow easily on the rear face (as shown by the arrows in FIG. 5 ) of the substrate 3 a due to thermal expansion and pressure concentration (because the size of the receiving space 20 a is larger).
- the know mold structure not only wastes package resins but it is difficult to clean the package resins that overflow on the substrate.
- the cost of the self-adhesive tape 5 a is high, and the prior art needs to use a precision adhesion instrument to adhere the self-adhesive tape 5 a on the rear face of the substrate 3 a.
- the LED chips 4 a are too close to each other, so that the structural strength of the LED chip package is inadequate.
- One particular aspect of the present invention is to provide a mold structure for packaging LED chips and a method thereof.
- the present invention prevents package resins from overflowing on a rear face of a substrate of the LED chips.
- the present invention provides a mold structure for packaging LED chips, comprising a top mold and a bottom mold.
- the bottom mold is mated with the top mold.
- the bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.
- the present invention provides a method of packaging LED chips, comprising: providing a top mold and a bottom mold that are mated with each other, wherein the bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold; and then pressing a plurality of wire-bonded LED chips that have finished a wire-bonding process into the corresponding receiving spaces via the top mold mating with the bottom mold.
- the method further comprises pouring package resins from the main flow channel to each receiving space through the secondary flow channels and filling each receiving space with package resins for packaging each wire-bonded LED chip, and then removing upward the top mold so that the top mold is separated from the packaged LED chips that have been packaged; and then pushing the packaged LED chips out of the bottom mold via the ejection pins.
- the mold structure and the method for packaging LED chips have some advantages, as follows:
- the present invention prevents the package resins from overflowing on a rear face of the substrate.
- FIG. 1 is a lateral, exploded, schematic view of a mold structure for packaging LED chips according to the prior art
- FIG. 2 is a top view of a bottom mold of the prior art
- FIG. 3 is a top view of LED chips disposed on a substrate (sheet) according to the prior art
- FIG. 4 is a schematic view (before a top mold and a bottom mold are mated together) according to the prior art
- FIG. 5 is a schematic view (when package resin overflows on a rear face of an adhesive tape) according to the prior art
- FIG. 6 is a lateral, exploded, schematic view of a mold structure for packaging LED chips according to the present invention.
- FIG. 7 is a top view of a bottom mold of a mold structure for packaging LED chips according to the first embodiment of the present invention.
- FIG. 8 is a top view of a bottom mold of a mold structure for packaging LED chips according to the second embodiment of the present invention.
- FIG. 9 is a top view of LED chips disposed on a substrate (sheet) according to the present invention.
- FIG. 10 is a flowchart of a method of packaging LED chips according to the present invention.
- FIGS. 11A to 11E are packaging schematic views of a method of packaging LED chips according to the present invention.
- FIG. 12 is a schematic view of packaged LED chips separated from a bottom mold via ejection pins according to the present invention.
- FIG. 13 is a schematic view of liquid package resin pouring into receiving spaces according to the first embodiment of the present invention.
- FIG. 14 is a schematic view of liquid package resin pouring into receiving spaces according to the second embodiment of the present invention.
- the present invention provides a mold structure M for packaging LED chips, including: a top mold 1 and a bottom mold 2 mated with the top mold 1 .
- the top mold 1 has a plane 10 facing the bottom mold 2 for mating with the bottom mold 2 .
- the bottom mold 2 has a main flow channel 20 , a plurality of receiving spaces 21 , a plurality of secondary flow channels 22 , and a plurality of ejection pins 23 .
- the receiving spaces 21 are arranged in a matrix shape.
- the receiving spaces 21 are respectively formed beside two opposite sides of the main flow channel 20 .
- the secondary flow channels 22 are alternately disposed on one lateral side between each two receiving spaces 21 for respectively and transversely communicating the receiving spaces 21 with each other.
- the transverse receiving spaces 21 are communicated with each other via the corresponding secondary flow channels 22 .
- the ejection pins 23 penetrate through the bottom mold 2 , and each ejection pin 23 is expansibly projected into the corresponding receiving space 21 .
- a bottom mold 2 ′ has a main flow channel 20 ′, a plurality of receiving spaces 21 ′, a plurality of secondary flow channels 22 ′, and a plurality of ejection pins 23 ′.
- the receiving spaces 21 ′ are arranged in a matrix shape.
- the receiving spaces 21 ′ are respectively formed beside two opposite sides of the main flow channel 20 ′.
- each two secondary flow channels 22 ′ are formed on two opposite lateral sides between each two receiving spaces 21 ′ for respectively and transversely communicating the receiving spaces 21 with each other's .
- the transverse receiving spaces 21 ′ are communicated with each other via the corresponding secondary flow channels 22 ′.
- the ejection pins 23 ′ penetrate through the bottom mold 2 ′, and each ejection pin 23 ′ is expansibly projected outside a support 24 ′ of the bottom mold 2 ′ and among a part of the receiving spaces 21 ′.
- the structure of the bottom molds 2 , 2 ′ should not be used to limit the present invention.
- the receiving spaces 21 , 21 ′ can be formed beside the same side of the main flow channel 20 , 20 ′.
- a substrate 3 is etched to form a plurality of chip carrying areas 30 and a plurality of positive contact pins 300 and negative contact pins 301 that correspond to the chip carrying areas 30 .
- a plurality of LED chips 4 is arranged on the corresponding chip carrying areas 30 , respectively.
- a positive pole and a negative pole (not shown) of each LED chip 4 are electrically connected with the corresponding positive contact pin 300 and negative contact pin 301 via leading wires 40 by a wire-bounding method.
- the present invention provides a method of packaging LED chips.
- the method includes the following steps: firstly, referring to FIG. 11A , providing a top mold 1 and a bottom mold 2 that are mated with each other, and the bottom mold 2 having a main flow channel 20 (as shown in FIG. 6 ), a plurality of receiving spaces 21 formed beside the main flow channel 20 , a plurality of secondary flow channels 22 for respectively and transversely communicating the receiving spaces 21 with each other, and a plurality of ejection pins 23 penetrating through the bottom mold 2 (S 100 ).
- the method includes pressing a plurality of wire-bonded LED chips 4 that have finished a wire-bonding process into the corresponding receiving spaces 21 via the top mold 1 mating with the bottom mold 2 (S 102 ).
- the method includes pouring package resins 5 from the main flow channel 20 to each receiving space 21 through the secondary flow channels 22 and filling each receiving space 21 with package resins 5 for packaging each wire-bonded LED chip 4 (S 104 ).
- the method includes removing upward the top mold 1 (the top mold 1 is separated from the bottom mold 2 at the same time) for the top mold 1 separating from the packaged LED chips 4 that have been packaged (S 106 ).
- the method includes pushing the packaged LED chips 4 out of the bottom mold 2 via the ejection pins 23 (S 108 ).
- each ejection pin 23 is expansibly projected into the corresponding receiving space 21 .
- the method includes pushing the packaged LED chips 4 out of the bottom mold 2 via the ejection pins 23 ′ (S 108 ).
- each ejection pin 23 ′ is expansibly projected outside the support 24 ′ of the bottom mold 2 ′ and among a part of the receiving spaces 21 ′.
- the secondary flow channels 22 are alternately disposed on one lateral side between each two receiving spaces 21 for making the receiving spaces 21 and the secondary flow channels 22 mate with each other to form a plurality of continuous S-shaped flow channels (as shown by the arrows in FIG. 13 ).
- the design ensures that the corners C in the receiving spaces 21 are filled with the package resin 5 , thus ensuring that packaging defects are avoided.
- each two secondary flow channels 22 ′ are formed on two opposite lateral sides between each two receiving spaces 21 ′.
- the design ensures that the corners C′ in the receiving spaces 21 ′ are filled with the package resin 5 , thus ensuring that packaging defects are avoided.
- the mold structure and the method for packaging LED chips have some advantages, as follows:
- the present invention prevents the package resins from overflowing on a rear face of the substrate 3 .
- the packaged LED chips 4 are separated easily from the bottom mold ( 2 or 2 ′) by matching the receiving spaces ( 21 or 21 ′) and the support 24 ′. Therefore, the yield rate of the pattern draw is increased.
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a mold structure for packaging LED chips and a method thereof, and particularly relates to a mold structure and a method for preventing package resins from overflowing on a rear face of a substrate of the LED chips.
- 2. Description of the Related Art
- Referring to
FIGS. 1 and 2 , a known mold structure m includes a top mold 1 a and abottom mold 2 a mated with the top mold 1 a. Thebottom mold 2 a has a plurality of receivingspaces 20 a of a larger size. - Referring to
FIG. 3 , asubstrate 3 a is etched to form a plurality ofchip carrying areas 30 a and a plurality of positive contact pins 300 a andnegative contact pins 301 a that correspond to thechip carrying areas 30 a. - Moreover, a plurality of
LED chips 4 a is arranged on the correspondingchip carrying areas 30 a, respectively. In addition, a positive pole and a negative pole (not shown) of eachLED chip 4 a are electrically connected with the corresponding positive contact pin 300 a andnegative contact pin 301 avia leading wires 40 a by a wire-bounding method. Furthermore, theLED chips 4 a are divided into a plurality of LED chip areas. Each LED chip area has a plurality ofLED chips 4 a arranged in a matrix shape. For example, in theFIG. 3 each LED chip area has a 5*5 LED chip matrix. - Referring to
FIG. 4 , before thesubstrate 3 a is arranged under the top mold 1 a, a self-adhesive tape 5 a is attached on a rear face of thesubstrate 3 a. - Referring to
FIG. 5 , after the top mold 1 a and thebottom mold 2 a are mated together andpackage resins 6 a are poured into thereceiving spaces 20 a, thesubstrate 3 a is deformed easily and the package resins 6 a overflow easily on the rear face (as shown by the arrows inFIG. 5 ) of thesubstrate 3 a due to thermal expansion and pressure concentration (because the size of thereceiving space 20 a is larger). Hence, the know mold structure not only wastes package resins but it is difficult to clean the package resins that overflow on the substrate. - Moreover, the prior art still some other defects, as follows:
- 1. The cost of the self-
adhesive tape 5 a is high, and the prior art needs to use a precision adhesion instrument to adhere the self-adhesive tape 5 a on the rear face of thesubstrate 3 a. - 2. The
LED chips 4 a are too close to each other, so that the structural strength of the LED chip package is inadequate. - 3. Because the size of the receiving spaces is larger, the packaged
LED chips 4 a are difficult to separate from thebottom mold 2 a. Therefore, the yield rate of the pattern draw is decreased. - One particular aspect of the present invention is to provide a mold structure for packaging LED chips and a method thereof. The present invention prevents package resins from overflowing on a rear face of a substrate of the LED chips.
- In order to achieve the above-mentioned aspects, the present invention provides a mold structure for packaging LED chips, comprising a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.
- In order to achieve the above-mentioned aspects, the present invention provides a method of packaging LED chips, comprising: providing a top mold and a bottom mold that are mated with each other, wherein the bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold; and then pressing a plurality of wire-bonded LED chips that have finished a wire-bonding process into the corresponding receiving spaces via the top mold mating with the bottom mold.
- The method further comprises pouring package resins from the main flow channel to each receiving space through the secondary flow channels and filling each receiving space with package resins for packaging each wire-bonded LED chip, and then removing upward the top mold so that the top mold is separated from the packaged LED chips that have been packaged; and then pushing the packaged LED chips out of the bottom mold via the ejection pins.
- Hence, the mold structure and the method for packaging LED chips have some advantages, as follows:
- 1. Because the size of the receiving spaces is small, the structural strength of the substrate is increased by matching the receiving spaces and a support. Therefore, the present invention prevents the package resins from overflowing on a rear face of the substrate.
- 2. Because the present invention does not need to use adhesive tape, costs are reduced.
- 3. Because the size of the receiving spaces is small, the packaged LED chips are separated easily from the bottom mold by matching the receiving spaces and the support. Therefore, the yield rate of the pattern draw is increased.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.
- The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:
-
FIG. 1 is a lateral, exploded, schematic view of a mold structure for packaging LED chips according to the prior art; -
FIG. 2 is a top view of a bottom mold of the prior art; -
FIG. 3 is a top view of LED chips disposed on a substrate (sheet) according to the prior art; -
FIG. 4 is a schematic view (before a top mold and a bottom mold are mated together) according to the prior art; -
FIG. 5 is a schematic view (when package resin overflows on a rear face of an adhesive tape) according to the prior art; -
FIG. 6 is a lateral, exploded, schematic view of a mold structure for packaging LED chips according to the present invention; -
FIG. 7 is a top view of a bottom mold of a mold structure for packaging LED chips according to the first embodiment of the present invention; -
FIG. 8 is a top view of a bottom mold of a mold structure for packaging LED chips according to the second embodiment of the present invention; -
FIG. 9 is a top view of LED chips disposed on a substrate (sheet) according to the present invention; -
FIG. 10 is a flowchart of a method of packaging LED chips according to the present invention; -
FIGS. 11A to 11E are packaging schematic views of a method of packaging LED chips according to the present invention; -
FIG. 12 is a schematic view of packaged LED chips separated from a bottom mold via ejection pins according to the present invention; -
FIG. 13 is a schematic view of liquid package resin pouring into receiving spaces according to the first embodiment of the present invention; and -
FIG. 14 is a schematic view of liquid package resin pouring into receiving spaces according to the second embodiment of the present invention. - Referring to
FIG. 6 , the present invention provides a mold structure M for packaging LED chips, including: a top mold 1 and abottom mold 2 mated with the top mold 1. The top mold 1 has aplane 10 facing thebottom mold 2 for mating with thebottom mold 2. - Referring to
FIGS. 6 and 7 , with regard to the first embodiment of the present invention, thebottom mold 2 has amain flow channel 20, a plurality of receivingspaces 21, a plurality ofsecondary flow channels 22, and a plurality ofejection pins 23. - Moreover, the receiving
spaces 21 are arranged in a matrix shape. The receivingspaces 21 are respectively formed beside two opposite sides of themain flow channel 20. In addition, thesecondary flow channels 22 are alternately disposed on one lateral side between each two receivingspaces 21 for respectively and transversely communicating the receivingspaces 21 with each other. In other words, the transverse receivingspaces 21 are communicated with each other via the correspondingsecondary flow channels 22. Furthermore, the ejection pins 23 penetrate through thebottom mold 2, and eachejection pin 23 is expansibly projected into the corresponding receivingspace 21. - Referring to
FIG. 8 , with regard to the second embodiment of the present invention, abottom mold 2′ has amain flow channel 20′, a plurality of receivingspaces 21′, a plurality ofsecondary flow channels 22′, and a plurality of ejection pins 23′. - The receiving
spaces 21′ are arranged in a matrix shape. The receivingspaces 21′ are respectively formed beside two opposite sides of themain flow channel 20′. In addition, each twosecondary flow channels 22′ are formed on two opposite lateral sides between each two receivingspaces 21′ for respectively and transversely communicating the receivingspaces 21 with each other's . In other words, the transverse receivingspaces 21′ are communicated with each other via the correspondingsecondary flow channels 22′. Furthermore, the ejection pins 23′ penetrate through thebottom mold 2′, and eachejection pin 23′ is expansibly projected outside asupport 24′ of thebottom mold 2′ and among a part of the receivingspaces 21′. - However, the structure of the
bottom molds spaces main flow channel - Referring to
FIG. 9 , asubstrate 3 is etched to form a plurality ofchip carrying areas 30 and a plurality of positive contact pins 300 and negative contact pins 301 that correspond to thechip carrying areas 30. A plurality ofLED chips 4 is arranged on the correspondingchip carrying areas 30, respectively. In addition, a positive pole and a negative pole (not shown) of eachLED chip 4 are electrically connected with the correspondingpositive contact pin 300 andnegative contact pin 301 via leadingwires 40 by a wire-bounding method. - Referring to FIGS. 10 and 11A-11E, the present invention provides a method of packaging LED chips. The method includes the following steps: firstly, referring to
FIG. 11A , providing a top mold 1 and abottom mold 2 that are mated with each other, and thebottom mold 2 having a main flow channel 20 (as shown inFIG. 6 ), a plurality of receivingspaces 21 formed beside themain flow channel 20, a plurality ofsecondary flow channels 22 for respectively and transversely communicating the receivingspaces 21 with each other, and a plurality of ejection pins 23 penetrating through the bottom mold 2 (S100). - Next, referring to
FIG. 11B , the method includes pressing a plurality of wire-bondedLED chips 4 that have finished a wire-bonding process into the corresponding receivingspaces 21 via the top mold 1 mating with the bottom mold 2 (S102). - Thirdly, referring to
FIG. 11C , the method includes pouringpackage resins 5 from themain flow channel 20 to each receivingspace 21 through thesecondary flow channels 22 and filling each receivingspace 21 withpackage resins 5 for packaging each wire-bonded LED chip 4 (S104). - Fourthly, referring to
FIG. 11D , the method includes removing upward the top mold 1 (the top mold 1 is separated from thebottom mold 2 at the same time) for the top mold 1 separating from the packagedLED chips 4 that have been packaged (S106). - According to the first embodiment, and referring to
FIG. 11E , the method includes pushing the packagedLED chips 4 out of thebottom mold 2 via the ejection pins 23 (S108). In addition, eachejection pin 23 is expansibly projected into the corresponding receivingspace 21. - According to the second embodiment, and referring to
FIG. 12 , the method includes pushing the packagedLED chips 4 out of thebottom mold 2 via the ejection pins 23′ (S108). In addition, eachejection pin 23′ is expansibly projected outside thesupport 24′ of thebottom mold 2′ and among a part of the receivingspaces 21′. - Referring to
FIG. 13 , in the first embodiment, thesecondary flow channels 22 are alternately disposed on one lateral side between each two receivingspaces 21 for making the receivingspaces 21 and thesecondary flow channels 22 mate with each other to form a plurality of continuous S-shaped flow channels (as shown by the arrows inFIG. 13 ). Hence, it is easy for the package resins 5 to fill in the receivingspaces 21 to the full. In addition, the design ensures that the corners C in the receivingspaces 21 are filled with thepackage resin 5, thus ensuring that packaging defects are avoided. - Referring to
FIG. 14 , in the second embodiment, each twosecondary flow channels 22′ are formed on two opposite lateral sides between each two receivingspaces 21′. Hence, it is easy for the package resins 5 to fill in the receivingspaces 21′ to the full. In addition, following the same principle described above, the design ensures that the corners C′ in the receivingspaces 21′ are filled with thepackage resin 5, thus ensuring that packaging defects are avoided. - In conclusion, the mold structure and the method for packaging LED chips have some advantages, as follows:
- 1. Because the size of the receiving spaces (21 or 21′) is small, the structural strength of the
substrate 3 is increased by matching the receiving spaces (21 or 21′) and thesupport 24′. Therefore, the present invention prevents the package resins from overflowing on a rear face of thesubstrate 3. - 2. Because the present invention does not need to use adhesive tapes, costs are reduced.
- 3. Because the size of the receiving spaces (21 or 21′) is small, the packaged
LED chips 4 are separated easily from the bottom mold (2 or 2′) by matching the receiving spaces (21 or 21′) and thesupport 24′. Therefore, the yield rate of the pattern draw is increased. - Although the present invention has been described with reference to the preferred best molds thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Claims (19)
Applications Claiming Priority (3)
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TW096100234A TW200830573A (en) | 2007-01-03 | 2007-01-03 | Mold structure for packaging light-emitting diode chip and method for packaging light-emitting diode chip |
TW96100234A | 2007-01-03 | ||
TW96100234 | 2007-01-03 |
Publications (2)
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US20080160658A1 true US20080160658A1 (en) | 2008-07-03 |
US7803641B2 US7803641B2 (en) | 2010-09-28 |
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US11/854,066 Expired - Fee Related US7803641B2 (en) | 2007-01-03 | 2007-09-12 | Mold structure for packaging LED chips and method thereof |
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Cited By (9)
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US20110128004A1 (en) * | 2009-12-01 | 2011-06-02 | Lim Ssang Gun | Apparatus for inspecting light emitting diode package and inspecting method using the same |
US8890533B2 (en) * | 2009-12-01 | 2014-11-18 | Samsung Electronics Co., Ltd. | Apparatus for inspecting light emitting diode package and inspecting method using the same |
US20120107975A1 (en) * | 2010-10-29 | 2012-05-03 | Advanced Optoelectronic Technology, Inc. | Method for packaging light emitting diode |
CN102456780A (en) * | 2010-10-29 | 2012-05-16 | 展晶科技(深圳)有限公司 | Packaging method of light emitting diode (LED) |
US8409885B2 (en) * | 2010-10-29 | 2013-04-02 | Advanced Optoelectronic Technology, Inc. | Method for packaging light emitting diode |
US20170040299A1 (en) * | 2015-08-05 | 2017-02-09 | Harvatek Corporation | Display device and light-emitting array module thereof |
US9685428B2 (en) * | 2015-08-05 | 2017-06-20 | Harvatek Corporation | Display device and light-emitting array module thereof |
WO2020019940A1 (en) * | 2018-07-26 | 2020-01-30 | 宁波舜宇光电信息有限公司 | Photosensitive component, photosensitive component panel, molding component panel and manufacturing method |
US11552219B2 (en) * | 2020-04-15 | 2023-01-10 | Harvatek Corporation | LED display screen module |
Also Published As
Publication number | Publication date |
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TWI321365B (en) | 2010-03-01 |
TW200830573A (en) | 2008-07-16 |
US7803641B2 (en) | 2010-09-28 |
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