TW200826775A - Wiring board - Google Patents
Wiring board Download PDFInfo
- Publication number
- TW200826775A TW200826775A TW96137196A TW96137196A TW200826775A TW 200826775 A TW200826775 A TW 200826775A TW 96137196 A TW96137196 A TW 96137196A TW 96137196 A TW96137196 A TW 96137196A TW 200826775 A TW200826775 A TW 200826775A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductor
- interlayer insulating
- wiring
- layer
- wiring board
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006272820 | 2006-10-04 | ||
JP2007260364A JP2008112987A (ja) | 2006-10-04 | 2007-10-03 | 配線基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200826775A true TW200826775A (en) | 2008-06-16 |
Family
ID=39445317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96137196A TW200826775A (en) | 2006-10-04 | 2007-10-04 | Wiring board |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2008112987A (ja) |
TW (1) | TW200826775A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI579989B (zh) * | 2012-06-14 | 2017-04-21 | Zhuhai Advanced Chip Carriers&Electronic Substrate Solutions Technologies Co Ltd | 具有一體化金屬芯的多層電子支撐結構 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8895873B2 (en) | 2011-09-28 | 2014-11-25 | Ibiden Co., Ltd. | Printed wiring board |
US9497849B2 (en) | 2012-07-10 | 2016-11-15 | Ibiden Co., Ltd. | Printed wiring board |
KR101531097B1 (ko) * | 2013-08-22 | 2015-06-23 | 삼성전기주식회사 | 인터포저 기판 및 이의 제조방법 |
JP6316609B2 (ja) | 2014-02-05 | 2018-04-25 | 新光電気工業株式会社 | 配線基板及び半導体装置と配線基板の製造方法及び半導体装置の製造方法 |
JP6982383B2 (ja) | 2016-08-10 | 2021-12-17 | 上村工業株式会社 | 還元処理と同時に用いられる無電解めっき用前処理液、およびプリント配線基板の製造方法 |
CN115942651B (zh) * | 2023-01-10 | 2023-06-06 | 浙江万正电子科技股份有限公司 | 一种多层超厚铜两阶埋盲孔电路板的制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002198650A (ja) * | 2000-12-26 | 2002-07-12 | Ngk Spark Plug Co Ltd | 多層配線基板とその製造方法 |
JP2003023252A (ja) * | 2001-07-10 | 2003-01-24 | Ibiden Co Ltd | 多層プリント配線板 |
JP5191074B2 (ja) * | 2001-07-10 | 2013-04-24 | イビデン株式会社 | 多層プリント配線板 |
JP4780857B2 (ja) * | 2001-05-31 | 2011-09-28 | 京セラ株式会社 | 配線基板の製造方法 |
JP2005159268A (ja) * | 2003-10-29 | 2005-06-16 | Kyocera Corp | 配線基板及びその製造方法 |
JP4647990B2 (ja) * | 2003-12-16 | 2011-03-09 | 日本特殊陶業株式会社 | 多層配線基板 |
-
2007
- 2007-10-03 JP JP2007260364A patent/JP2008112987A/ja active Pending
- 2007-10-04 TW TW96137196A patent/TW200826775A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI579989B (zh) * | 2012-06-14 | 2017-04-21 | Zhuhai Advanced Chip Carriers&Electronic Substrate Solutions Technologies Co Ltd | 具有一體化金屬芯的多層電子支撐結構 |
Also Published As
Publication number | Publication date |
---|---|
JP2008112987A (ja) | 2008-05-15 |
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