TW200826775A - Wiring board - Google Patents

Wiring board Download PDF

Info

Publication number
TW200826775A
TW200826775A TW96137196A TW96137196A TW200826775A TW 200826775 A TW200826775 A TW 200826775A TW 96137196 A TW96137196 A TW 96137196A TW 96137196 A TW96137196 A TW 96137196A TW 200826775 A TW200826775 A TW 200826775A
Authority
TW
Taiwan
Prior art keywords
conductor
interlayer insulating
wiring
layer
wiring board
Prior art date
Application number
TW96137196A
Other languages
English (en)
Chinese (zh)
Inventor
Hajime Saiki
Mikiya Sakurai
Atsuhiko Sugimoto
Original Assignee
Ngk Spark Plug Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Publication of TW200826775A publication Critical patent/TW200826775A/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW96137196A 2006-10-04 2007-10-04 Wiring board TW200826775A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006272820 2006-10-04
JP2007260364A JP2008112987A (ja) 2006-10-04 2007-10-03 配線基板

Publications (1)

Publication Number Publication Date
TW200826775A true TW200826775A (en) 2008-06-16

Family

ID=39445317

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96137196A TW200826775A (en) 2006-10-04 2007-10-04 Wiring board

Country Status (2)

Country Link
JP (1) JP2008112987A (ja)
TW (1) TW200826775A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579989B (zh) * 2012-06-14 2017-04-21 Zhuhai Advanced Chip Carriers&Electronic Substrate Solutions Technologies Co Ltd 具有一體化金屬芯的多層電子支撐結構

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8895873B2 (en) 2011-09-28 2014-11-25 Ibiden Co., Ltd. Printed wiring board
US9497849B2 (en) 2012-07-10 2016-11-15 Ibiden Co., Ltd. Printed wiring board
KR101531097B1 (ko) * 2013-08-22 2015-06-23 삼성전기주식회사 인터포저 기판 및 이의 제조방법
JP6316609B2 (ja) 2014-02-05 2018-04-25 新光電気工業株式会社 配線基板及び半導体装置と配線基板の製造方法及び半導体装置の製造方法
JP6982383B2 (ja) 2016-08-10 2021-12-17 上村工業株式会社 還元処理と同時に用いられる無電解めっき用前処理液、およびプリント配線基板の製造方法
CN115942651B (zh) * 2023-01-10 2023-06-06 浙江万正电子科技股份有限公司 一种多层超厚铜两阶埋盲孔电路板的制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002198650A (ja) * 2000-12-26 2002-07-12 Ngk Spark Plug Co Ltd 多層配線基板とその製造方法
JP2003023252A (ja) * 2001-07-10 2003-01-24 Ibiden Co Ltd 多層プリント配線板
JP5191074B2 (ja) * 2001-07-10 2013-04-24 イビデン株式会社 多層プリント配線板
JP4780857B2 (ja) * 2001-05-31 2011-09-28 京セラ株式会社 配線基板の製造方法
JP2005159268A (ja) * 2003-10-29 2005-06-16 Kyocera Corp 配線基板及びその製造方法
JP4647990B2 (ja) * 2003-12-16 2011-03-09 日本特殊陶業株式会社 多層配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579989B (zh) * 2012-06-14 2017-04-21 Zhuhai Advanced Chip Carriers&Electronic Substrate Solutions Technologies Co Ltd 具有一體化金屬芯的多層電子支撐結構

Also Published As

Publication number Publication date
JP2008112987A (ja) 2008-05-15

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