TW200821752A - Colored photosensitive resin composition - Google Patents

Colored photosensitive resin composition Download PDF

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Publication number
TW200821752A
TW200821752A TW096142535A TW96142535A TW200821752A TW 200821752 A TW200821752 A TW 200821752A TW 096142535 A TW096142535 A TW 096142535A TW 96142535 A TW96142535 A TW 96142535A TW 200821752 A TW200821752 A TW 200821752A
Authority
TW
Taiwan
Prior art keywords
compound
resin composition
photosensitive resin
colored photosensitive
acid
Prior art date
Application number
TW096142535A
Other languages
English (en)
Chinese (zh)
Other versions
TWI376569B (enrdf_load_stackoverflow
Inventor
Dai Shiota
Masaru Shida
Yasuhide Ohuchi
Tetsuya Kato
Kiyoshi Uchikawa
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200821752A publication Critical patent/TW200821752A/zh
Application granted granted Critical
Publication of TWI376569B publication Critical patent/TWI376569B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B11/00—Diaryl- or thriarylmethane dyes
    • C09B11/04—Diaryl- or thriarylmethane dyes derived from triarylmethanes, i.e. central C-atom is substituted by amino, cyano, alkyl
    • C09B11/10—Amino derivatives of triarylmethanes
    • C09B11/24—Phthaleins containing amino groups ; Phthalanes; Fluoranes; Phthalides; Rhodamine dyes; Phthaleins having heterocyclic aryl rings; Lactone or lactame forms of triarylmethane dyes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW096142535A 2006-11-14 2007-11-09 Colored photosensitive resin composition TW200821752A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006308397A JP4949809B2 (ja) 2006-11-14 2006-11-14 着色感光性樹脂組成物

Publications (2)

Publication Number Publication Date
TW200821752A true TW200821752A (en) 2008-05-16
TWI376569B TWI376569B (enrdf_load_stackoverflow) 2012-11-11

Family

ID=39448536

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096142535A TW200821752A (en) 2006-11-14 2007-11-09 Colored photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP4949809B2 (enrdf_load_stackoverflow)
KR (1) KR100929723B1 (enrdf_load_stackoverflow)
CN (1) CN101183218B (enrdf_load_stackoverflow)
TW (1) TW200821752A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5173543B2 (ja) * 2008-04-08 2013-04-03 東京応化工業株式会社 ポジ型感光性樹脂組成物
US8829070B2 (en) 2009-08-31 2014-09-09 Kabushiki Kaisha Toshiba Ultraviolet-curable resin material for pattern transfer and magnetic recording medium manufacturing method using the same
TWI570509B (zh) * 2010-10-05 2017-02-11 Sumitomo Chemical Co Coloring the photosensitive resin composition
JP4988032B2 (ja) * 2010-12-08 2012-08-01 株式会社東芝 磁気記録媒体の製造方法
JP5039199B2 (ja) * 2010-12-08 2012-10-03 株式会社東芝 パターン転写に用いられる紫外線硬化性樹脂材料
JP5744528B2 (ja) * 2011-01-11 2015-07-08 東京応化工業株式会社 タッチパネル用着色感光性樹脂組成物、タッチパネル、及び表示装置
JP6708367B2 (ja) * 2014-03-31 2020-06-10 日鉄ケミカル＆マテリアル株式会社 遮光膜用感光性樹脂組成物、これを硬化した遮光膜及びカラーフィルター

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5204378A (en) * 1986-03-24 1993-04-20 Nippon Telegraph And Telephone Corporation Fluorine-containing epoxy(meth)acrylate resin adhesive cured in presence of photoinitiator
JP2001281861A (ja) * 2000-04-03 2001-10-10 Fujifilm Arch Co Ltd ポジ型感光性樹脂組成物
AU2003280695A1 (en) * 2002-11-06 2004-06-07 Asahi Glass Company, Limited Negative type photosensitive resin composition
JP2004198542A (ja) * 2002-12-16 2004-07-15 Showa Denko Kk カラーフィルターブラックマトリックスレジスト組成物及びその組成物に用いる感光性組成物
CN100356204C (zh) * 2003-03-12 2007-12-19 三菱化学株式会社 光敏组合物、光敏着色组合物、滤色器和液晶显示设备
JP3938375B2 (ja) * 2003-03-12 2007-06-27 三菱化学株式会社 感光性着色組成物、カラーフィルタ、及び液晶表示装置
JP4595374B2 (ja) * 2003-04-24 2010-12-08 住友化学株式会社 黒色感光性樹脂組成物
JP4290483B2 (ja) * 2003-06-05 2009-07-08 新日鐵化学株式会社 ブラックレジスト用感光性樹脂組成物並びにこれを用いて形成された遮光膜
JP5177933B2 (ja) * 2003-08-12 2013-04-10 東洋インキＳｃホールディングス株式会社 隔壁用組成物、それを用いた画素形成用基板および画素の形成方法
JP4448381B2 (ja) * 2004-05-26 2010-04-07 東京応化工業株式会社 感光性組成物
JP4611724B2 (ja) * 2004-12-03 2011-01-12 東京応化工業株式会社 遮光膜形成用感光性組成物、該遮光膜形成用感光性組成物で形成されたブラックマトリクス
CN101107566B (zh) * 2005-07-20 2012-08-29 凸版印刷株式会社 碱性显影型感光性着色组合物

Also Published As

Publication number Publication date
CN101183218A (zh) 2008-05-21
KR20080043703A (ko) 2008-05-19
JP2008122805A (ja) 2008-05-29
CN101183218B (zh) 2011-06-01
JP4949809B2 (ja) 2012-06-13
KR100929723B1 (ko) 2009-12-03
TWI376569B (enrdf_load_stackoverflow) 2012-11-11

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