TW200814333A - Flexible substrate with electronic devices formed thereon - Google Patents

Flexible substrate with electronic devices formed thereon Download PDF

Info

Publication number
TW200814333A
TW200814333A TW096127807A TW96127807A TW200814333A TW 200814333 A TW200814333 A TW 200814333A TW 096127807 A TW096127807 A TW 096127807A TW 96127807 A TW96127807 A TW 96127807A TW 200814333 A TW200814333 A TW 200814333A
Authority
TW
Taiwan
Prior art keywords
substrate
plastic
electronic device
particulate material
plastic material
Prior art date
Application number
TW096127807A
Other languages
English (en)
Chinese (zh)
Inventor
Timothy J Tredwell
Roger S Kerr
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of TW200814333A publication Critical patent/TW200814333A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Thin Film Transistor (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
TW096127807A 2006-07-31 2007-07-30 Flexible substrate with electronic devices formed thereon TW200814333A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/461,080 US7678701B2 (en) 2006-07-31 2006-07-31 Flexible substrate with electronic devices formed thereon

Publications (1)

Publication Number Publication Date
TW200814333A true TW200814333A (en) 2008-03-16

Family

ID=38669806

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096127807A TW200814333A (en) 2006-07-31 2007-07-30 Flexible substrate with electronic devices formed thereon

Country Status (5)

Country Link
US (2) US7678701B2 (https=)
EP (1) EP2047513A1 (https=)
JP (1) JP2009545878A (https=)
TW (1) TW200814333A (https=)
WO (1) WO2008016479A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
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TWI387138B (zh) * 2009-07-10 2013-02-21 Ind Tech Res Inst 磁性發光元件、磁性發光裝置以及氮化物半導體模板
TWI400673B (zh) * 2009-02-18 2013-07-01 Prime View Int Co Ltd 可撓性顯示面板及其製作方法
US8502259B2 (en) 2008-01-11 2013-08-06 Industrial Technology Research Institute Light emitting device

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US7977170B2 (en) * 2006-10-03 2011-07-12 Eastman Kodak Company Flexible substrate with electronic devices and traces
US7913381B2 (en) * 2006-10-26 2011-03-29 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
KR101408510B1 (ko) * 2007-05-18 2014-06-17 삼성전자주식회사 표시소자용 연성기판 및 이를 이용한 디스플레이 소자
US20090200543A1 (en) * 2008-02-08 2009-08-13 Roger Stanley Kerr Method of forming an electronic device on a substrate supported by a carrier and resultant device
US8800138B2 (en) * 2008-02-08 2014-08-12 Carestream Health, Inc. Method for conditioning a substrate surface for forming an electronic device thereon and resultant device
US20100032702A1 (en) * 2008-08-11 2010-02-11 E. I. Du Pont De Nemours And Company Light-Emitting Diode Housing Comprising Fluoropolymer
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US20130188324A1 (en) * 2010-09-29 2013-07-25 Posco Method for Manufacturing a Flexible Electronic Device Using a Roll-Shaped Motherboard, Flexible Electronic Device, and Flexible Substrate
USRE49869E1 (en) * 2015-02-10 2024-03-12 iBeam Materials, Inc. Group-III nitride devices and systems on IBAD-textured substrates
KR20160127892A (ko) * 2015-04-27 2016-11-07 삼성디스플레이 주식회사 플렉서블 기판 및 이를 포함하는 표시 장치
US11535017B2 (en) 2017-04-04 2022-12-27 W. L. Gore & Associates Gmbh Dielectric composite with reinforced elastomer and integrate electrode
JP2019121734A (ja) * 2018-01-10 2019-07-22 株式会社Ｊｏｌｅｄ 半導体装置および表示装置
WO2019216883A1 (en) 2018-05-08 2019-11-14 W.L. Gore & Associates, Inc. Flexible printed circuits for dermal applications
WO2019217503A1 (en) 2018-05-08 2019-11-14 W.L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
AU2018422666B2 (en) 2018-05-08 2022-03-10 W. L. Gore & Associates, Inc. Flexible and stretchable printed circuits on stretchable substrates
CN109285462B (zh) * 2018-12-12 2021-04-20 武汉天马微电子有限公司 柔性显示面板及其制作方法、柔性显示装置
KR102084519B1 (ko) * 2019-07-16 2020-03-04 주식회사 오플렉스 자외선(uv) 경화형 점착제층을 포함하는 백플레이트 필름 및 이를 이용한 유기 발광 표시 장치 제조 방법

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8502259B2 (en) 2008-01-11 2013-08-06 Industrial Technology Research Institute Light emitting device
TWI400673B (zh) * 2009-02-18 2013-07-01 Prime View Int Co Ltd 可撓性顯示面板及其製作方法
TWI387138B (zh) * 2009-07-10 2013-02-21 Ind Tech Res Inst 磁性發光元件、磁性發光裝置以及氮化物半導體模板

Also Published As

Publication number Publication date
US20100136777A1 (en) 2010-06-03
EP2047513A1 (en) 2009-04-15
US20080026581A1 (en) 2008-01-31
JP2009545878A (ja) 2009-12-24
US7678701B2 (en) 2010-03-16
US7964507B2 (en) 2011-06-21
WO2008016479A1 (en) 2008-02-07

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