JP2009545878A - 電子デバイスが形成されたフレキシブル基板 - Google Patents

電子デバイスが形成されたフレキシブル基板 Download PDF

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Publication number
JP2009545878A
JP2009545878A JP2009522771A JP2009522771A JP2009545878A JP 2009545878 A JP2009545878 A JP 2009545878A JP 2009522771 A JP2009522771 A JP 2009522771A JP 2009522771 A JP2009522771 A JP 2009522771A JP 2009545878 A JP2009545878 A JP 2009545878A
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Japan
Prior art keywords
substrate
electronic device
particulate material
plastic material
thin film
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Pending
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JP2009522771A
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English (en)
Japanese (ja)
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JP2009545878A5 (https=
Inventor
ティモシー ジョン トレッドウェル
ロジャー スタンリー カー
Original Assignee
イーストマン コダック カンパニー
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Publication of JP2009545878A publication Critical patent/JP2009545878A/ja
Publication of JP2009545878A5 publication Critical patent/JP2009545878A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Thin Film Transistor (AREA)
  • Laminated Bodies (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
JP2009522771A 2006-07-31 2007-07-16 電子デバイスが形成されたフレキシブル基板 Pending JP2009545878A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/461,080 US7678701B2 (en) 2006-07-31 2006-07-31 Flexible substrate with electronic devices formed thereon
PCT/US2007/016085 WO2008016479A1 (en) 2006-07-31 2007-07-16 Flexible substrate with electronic devices formed thereon

Publications (2)

Publication Number Publication Date
JP2009545878A true JP2009545878A (ja) 2009-12-24
JP2009545878A5 JP2009545878A5 (https=) 2011-09-08

Family

ID=38669806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009522771A Pending JP2009545878A (ja) 2006-07-31 2007-07-16 電子デバイスが形成されたフレキシブル基板

Country Status (5)

Country Link
US (2) US7678701B2 (https=)
EP (1) EP2047513A1 (https=)
JP (1) JP2009545878A (https=)
TW (1) TW200814333A (https=)
WO (1) WO2008016479A1 (https=)

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JP2010506400A (ja) * 2006-10-03 2010-02-25 イーストマン コダック カンパニー 電子デバイス及びトレースを有するフレキシブル基板
JP2019121734A (ja) * 2018-01-10 2019-07-22 株式会社Ｊｏｌｅｄ 半導体装置および表示装置
KR102084519B1 (ko) * 2019-07-16 2020-03-04 주식회사 오플렉스 자외선(uv) 경화형 점착제층을 포함하는 백플레이트 필름 및 이를 이용한 유기 발광 표시 장치 제조 방법

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US20090200543A1 (en) * 2008-02-08 2009-08-13 Roger Stanley Kerr Method of forming an electronic device on a substrate supported by a carrier and resultant device
US8800138B2 (en) * 2008-02-08 2014-08-12 Carestream Health, Inc. Method for conditioning a substrate surface for forming an electronic device thereon and resultant device
US20100032702A1 (en) * 2008-08-11 2010-02-11 E. I. Du Pont De Nemours And Company Light-Emitting Diode Housing Comprising Fluoropolymer
TWI400673B (zh) * 2009-02-18 2013-07-01 Prime View Int Co Ltd 可撓性顯示面板及其製作方法
US8074349B2 (en) * 2009-04-16 2011-12-13 Carestream Health, Inc. Magnetic hold-down for foil substrate processing
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TWI387138B (zh) * 2009-07-10 2013-02-21 Ind Tech Res Inst 磁性發光元件、磁性發光裝置以及氮化物半導體模板
EP2404650A1 (de) * 2010-07-09 2012-01-11 Bayer MaterialScience AG Vorrichtung und Verfahren zur Fest-/Flüssig-Trennung von Fest-Flüssig-Suspensionen
US20130188324A1 (en) * 2010-09-29 2013-07-25 Posco Method for Manufacturing a Flexible Electronic Device Using a Roll-Shaped Motherboard, Flexible Electronic Device, and Flexible Substrate
USRE49869E1 (en) * 2015-02-10 2024-03-12 iBeam Materials, Inc. Group-III nitride devices and systems on IBAD-textured substrates
KR20160127892A (ko) * 2015-04-27 2016-11-07 삼성디스플레이 주식회사 플렉서블 기판 및 이를 포함하는 표시 장치
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010506400A (ja) * 2006-10-03 2010-02-25 イーストマン コダック カンパニー 電子デバイス及びトレースを有するフレキシブル基板
JP2019121734A (ja) * 2018-01-10 2019-07-22 株式会社Ｊｏｌｅｄ 半導体装置および表示装置
KR102084519B1 (ko) * 2019-07-16 2020-03-04 주식회사 오플렉스 자외선(uv) 경화형 점착제층을 포함하는 백플레이트 필름 및 이를 이용한 유기 발광 표시 장치 제조 방법

Also Published As

Publication number Publication date
US20100136777A1 (en) 2010-06-03
EP2047513A1 (en) 2009-04-15
US20080026581A1 (en) 2008-01-31
US7678701B2 (en) 2010-03-16
US7964507B2 (en) 2011-06-21
TW200814333A (en) 2008-03-16
WO2008016479A1 (en) 2008-02-07

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