TW200809427A - Novel nanoparticle patterning process - Google Patents
Novel nanoparticle patterning process Download PDFInfo
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- TW200809427A TW200809427A TW096119652A TW96119652A TW200809427A TW 200809427 A TW200809427 A TW 200809427A TW 096119652 A TW096119652 A TW 096119652A TW 96119652 A TW96119652 A TW 96119652A TW 200809427 A TW200809427 A TW 200809427A
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- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/421,894 US7745101B2 (en) | 2006-06-02 | 2006-06-02 | Nanoparticle patterning process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200809427A true TW200809427A (en) | 2008-02-16 |
Family
ID=38790662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096119652A TW200809427A (en) | 2006-06-02 | 2007-06-01 | Novel nanoparticle patterning process |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7745101B2 (https=) |
| EP (1) | EP2024790B1 (https=) |
| JP (1) | JP2009539252A (https=) |
| TW (1) | TW200809427A (https=) |
| WO (1) | WO2007142809A2 (https=) |
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| JP4972728B2 (ja) * | 2005-08-30 | 2012-07-11 | 日本電信電話株式会社 | 有機材料層形成方法 |
| US9156004B2 (en) * | 2005-10-17 | 2015-10-13 | Stc.Unm | Fabrication of enclosed nanochannels using silica nanoparticles |
| US10060904B1 (en) | 2005-10-17 | 2018-08-28 | Stc.Unm | Fabrication of enclosed nanochannels using silica nanoparticles |
| US10231344B2 (en) | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
| US8404160B2 (en) | 2007-05-18 | 2013-03-26 | Applied Nanotech Holdings, Inc. | Metallic ink |
| US8506849B2 (en) | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
| US8815104B2 (en) | 2008-03-21 | 2014-08-26 | Alliance For Sustainable Energy, Llc | Copper-assisted, anti-reflection etching of silicon surfaces |
| US8729798B2 (en) | 2008-03-21 | 2014-05-20 | Alliance For Sustainable Energy, Llc | Anti-reflective nanoporous silicon for efficient hydrogen production |
| US20090236317A1 (en) * | 2008-03-21 | 2009-09-24 | Midwest Research Institute | Anti-reflection etching of silicon surfaces catalyzed with ionic metal solutions |
| US8075792B1 (en) | 2008-03-21 | 2011-12-13 | Alliance For Sustainable Energy, Llc | Nanoparticle-based etching of silicon surfaces |
| US9730333B2 (en) | 2008-05-15 | 2017-08-08 | Applied Nanotech Holdings, Inc. | Photo-curing process for metallic inks |
| JP2010103345A (ja) * | 2008-10-24 | 2010-05-06 | Konica Minolta Holdings Inc | 機能性層の製造方法及び電子デバイス |
| JP5435699B2 (ja) * | 2009-03-06 | 2014-03-05 | ナミックス株式会社 | 配線基板の製造方法、配線基板および半導体装置 |
| US8647979B2 (en) | 2009-03-27 | 2014-02-11 | Applied Nanotech Holdings, Inc. | Buffer layer to enhance photo and/or laser sintering |
| US8422197B2 (en) | 2009-07-15 | 2013-04-16 | Applied Nanotech Holdings, Inc. | Applying optical energy to nanoparticles to produce a specified nanostructure |
| US20110027719A1 (en) * | 2009-07-31 | 2011-02-03 | Pei-Chang Wang | Photomask etching method for chemical vapor deposition film |
| CA2815754A1 (en) | 2009-11-11 | 2011-05-19 | Alliance For Sustainable Energy, Llc | Wet-chemical systems and methods for producing black silicon substrates |
| US8349547B1 (en) * | 2009-12-22 | 2013-01-08 | Sandia Corporation | Lithographically defined microporous carbon structures |
| US8828765B2 (en) | 2010-06-09 | 2014-09-09 | Alliance For Sustainable Energy, Llc | Forming high efficiency silicon solar cells using density-graded anti-reflection surfaces |
| US11251318B2 (en) | 2011-03-08 | 2022-02-15 | Alliance For Sustainable Energy, Llc | Efficient black silicon photovoltaic devices with enhanced blue response |
| ITMI20110363A1 (it) * | 2011-03-09 | 2012-09-10 | Cretec Co Ltd | Metodo per ricavare un percorso conduttivo mediante irradiazione laser |
| US20130036925A1 (en) * | 2011-08-09 | 2013-02-14 | Moshe Nakash | Offset imaging system |
| GB201114048D0 (en) * | 2011-08-16 | 2011-09-28 | Intrinsiq Materials Ltd | Curing system |
| US11133118B2 (en) | 2012-05-22 | 2021-09-28 | University Of Massachusetts | Patterned nanoparticle structures |
| TW201419315A (zh) | 2012-07-09 | 2014-05-16 | Applied Nanotech Holdings Inc | 微米尺寸銅粒子的光燒結法 |
| JPWO2014050421A1 (ja) * | 2012-09-25 | 2016-08-22 | 東レ株式会社 | 配線パターンの形成方法および配線パターン形成物 |
| KR101665037B1 (ko) * | 2015-02-10 | 2016-10-12 | 인하대학교 산학협력단 | 스트레인 게이지의 제조방법 및 이에 따라 제조된 스트레인 게이지 |
| CA2990278C (en) | 2015-07-03 | 2024-02-13 | National Research Council Of Canada | Method of printing ultranarrow-gap lines |
| US11185918B2 (en) | 2015-07-03 | 2021-11-30 | National Research Council Of Canada | Self-aligning metal patterning based on photonic sintering of metal nanoparticles |
| JP2018529218A (ja) | 2015-07-03 | 2018-10-04 | ナショナル リサーチ カウンシル オブ カナダ | 極細配線を印刷する方法 |
| WO2017091802A1 (en) * | 2015-11-27 | 2017-06-01 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Pattern definition of nanocellulose sheets through selective ashing via lithographic masking |
| JP7291727B2 (ja) * | 2018-12-27 | 2023-06-15 | 株式会社カネカ | レジストパターンの形成に用いられる樹脂組成物、及び半導体製品の製造方法 |
| US11892771B2 (en) | 2020-04-20 | 2024-02-06 | Applied Materials, Inc. | Methods for increasing the density of high-index nanoimprint lithography films |
| US12573766B2 (en) | 2020-06-16 | 2026-03-10 | 3M Innovative Properties Company | Patterned article including metallic bodies |
| CA3210159A1 (en) | 2021-01-29 | 2022-08-04 | Armonica Technologies, Inc. | Enhancement structures for surface-enhanced raman scattering |
| WO2023043140A1 (ko) * | 2021-09-14 | 2023-03-23 | 한국화학연구원 | 동박 적층판용 적층체, 이의 제조방법 및 미세 패턴 형성방법 |
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| DE1943972A1 (de) | 1968-09-11 | 1970-09-03 | Rca Corp | Photographisches Verfahren zur Herstellung eines metallischen Musters auf einer Oberflaeche |
| US3775117A (en) * | 1971-07-13 | 1973-11-27 | Siemens Ag | Process for selective metallization of insulating material bodies |
| EP0090089B1 (en) * | 1981-12-19 | 1988-10-05 | Daikin Kogyo Co., Ltd. | Resist material and process for forming fine resist pattern |
| JPS604879A (ja) | 1983-06-23 | 1985-01-11 | Seiko Instr & Electronics Ltd | 腕時計用飾り板の製造方法 |
| JPS60141644A (ja) | 1983-12-28 | 1985-07-26 | Seiko Instr & Electronics Ltd | カバ−ガラスの加飾方法 |
| JPS60176949A (ja) | 1984-02-21 | 1985-09-11 | Seiko Instr & Electronics Ltd | カバ−ガラスの加飾方法 |
| US4973572A (en) * | 1987-12-21 | 1990-11-27 | Eastman Kodak Company | Infrared absorbing cyanine dyes for dye-donor element used in laser-induced thermal dye transfer |
| KR900018743A (ko) | 1988-05-24 | 1990-12-22 | 스즈끼 가즈오 | 포지티브(positive)형 전자선 레지스트 및 이를 이용한 레지스트 패턴 형성방법 |
| CA2019669A1 (en) * | 1989-11-21 | 1991-05-21 | John Woods | Anionically polymerizable monomers, polymers thereof, and use of such polymers in photoresists |
| US5891602A (en) * | 1992-05-29 | 1999-04-06 | Eastman Kodak Company | Dye donor binder for laser-induced thermal dye transfer |
| JP3057402B2 (ja) | 1993-08-20 | 2000-06-26 | 東亞合成株式会社 | ポジ型電子線レジスト |
| JPH07336020A (ja) * | 1994-06-10 | 1995-12-22 | Sumitomo Metal Ind Ltd | 導体パターンの形成方法 |
| US5468591A (en) * | 1994-06-14 | 1995-11-21 | Eastman Kodak Company | Barrier layer for laser ablative imaging |
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| JPH10301153A (ja) * | 1997-04-23 | 1998-11-13 | Sony Corp | 光源装置とこれを用いた光学測定装置および露光装置 |
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| JP2002184802A (ja) * | 2000-12-15 | 2002-06-28 | Pioneer Electronic Corp | 微小バンプの製造方法 |
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| US20030119282A1 (en) * | 2001-09-20 | 2003-06-26 | Takayasu Yamazaki | Method for producing semiconductor fine particles |
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| US6695029B2 (en) * | 2001-12-12 | 2004-02-24 | Eastman Kodak Company | Apparatus for permitting transfer of organic material from a donor to form a layer in an OLED device |
| EP1510861A1 (en) | 2003-08-26 | 2005-03-02 | Sony International (Europe) GmbH | Method for patterning organic materials or combinations of organic and inorganic materials |
| US20070210393A1 (en) | 2004-04-08 | 2007-09-13 | Jean-Luc Rehspringer | Lithographic Method Products Obtained And Use Of Said Method |
| US7291365B2 (en) * | 2004-05-27 | 2007-11-06 | Eastman Kodak Company | Linear laser light beam for making OLEDS |
| JP2006019478A (ja) * | 2004-07-01 | 2006-01-19 | Pentax Corp | 描画システム |
| JP2006120888A (ja) * | 2004-10-22 | 2006-05-11 | Seiko Epson Corp | 電子部品の製造方法 |
-
2006
- 2006-06-02 US US11/421,894 patent/US7745101B2/en not_active Expired - Fee Related
-
2007
- 2007-05-18 EP EP07795130A patent/EP2024790B1/en not_active Ceased
- 2007-05-18 WO PCT/US2007/012099 patent/WO2007142809A2/en not_active Ceased
- 2007-05-18 JP JP2009513174A patent/JP2009539252A/ja active Pending
- 2007-06-01 TW TW096119652A patent/TW200809427A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007142809A2 (en) | 2007-12-13 |
| JP2009539252A (ja) | 2009-11-12 |
| EP2024790A2 (en) | 2009-02-18 |
| US7745101B2 (en) | 2010-06-29 |
| EP2024790B1 (en) | 2012-01-11 |
| WO2007142809A3 (en) | 2008-05-08 |
| US20070281249A1 (en) | 2007-12-06 |
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