TW200802984A - Optoelectronic semiconductor chip - Google Patents
Optoelectronic semiconductor chipInfo
- Publication number
- TW200802984A TW200802984A TW096114571A TW96114571A TW200802984A TW 200802984 A TW200802984 A TW 200802984A TW 096114571 A TW096114571 A TW 096114571A TW 96114571 A TW96114571 A TW 96114571A TW 200802984 A TW200802984 A TW 200802984A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- semiconductor
- sequence
- optoelectronic semiconductor
- semiconductor chip
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 9
- 230000005693 optoelectronics Effects 0.000 title abstract 3
- 230000005855 radiation Effects 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
- H01L33/145—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006019725 | 2006-04-27 | ||
DE102006034847A DE102006034847A1 (de) | 2006-04-27 | 2006-07-27 | Optoelektronischer Halbleiterchip |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200802984A true TW200802984A (en) | 2008-01-01 |
TWI381545B TWI381545B (zh) | 2013-01-01 |
Family
ID=38542466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096114571A TWI381545B (zh) | 2006-04-27 | 2007-04-25 | 光電半導體晶片 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8378371B2 (zh) |
EP (1) | EP2011160B1 (zh) |
JP (1) | JP5404386B2 (zh) |
KR (1) | KR101294911B1 (zh) |
CN (1) | CN101427392B (zh) |
DE (1) | DE102006034847A1 (zh) |
TW (1) | TWI381545B (zh) |
WO (1) | WO2007124708A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102132427B (zh) * | 2008-10-20 | 2013-07-17 | Lg伊诺特有限公司 | 发光器件及其制造方法 |
TWI406433B (zh) * | 2009-03-17 | 2013-08-21 | Tekcore Co Ltd | Vertical gallium nitride based light emitting diode and manufacturing method thereof |
TWI723002B (zh) * | 2014-11-06 | 2021-04-01 | 荷蘭商露明控股公司 | 具有位於一頂部接點下方之溝渠之發光裝置 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007020291A1 (de) | 2007-01-31 | 2008-08-07 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung einer Kontaktstruktur für einen derartigen Chip |
US10463774B2 (en) * | 2007-02-27 | 2019-11-05 | Deka Products Limited Partnership | Control systems and methods for blood or fluid handling medical devices |
CN102037575B (zh) * | 2008-03-27 | 2013-04-10 | 宋俊午 | 发光元件及其制造方法 |
DE102008035110A1 (de) * | 2008-07-28 | 2010-02-11 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
KR20110049799A (ko) * | 2008-08-19 | 2011-05-12 | 라티스 파워(지앙시) 코포레이션 | 양면 패시베이션을 갖는 반도체 발광 디바이스 제작 방법 |
KR101047634B1 (ko) * | 2008-11-24 | 2011-07-07 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
TWI389355B (zh) * | 2009-01-05 | 2013-03-11 | Epistar Corp | 發光半導體裝置 |
KR100969126B1 (ko) | 2009-03-10 | 2010-07-09 | 엘지이노텍 주식회사 | 발광 소자 |
KR20100122998A (ko) * | 2009-05-14 | 2010-11-24 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
KR101007140B1 (ko) | 2009-07-28 | 2011-01-10 | 엘지이노텍 주식회사 | 발광 소자 |
KR101072034B1 (ko) * | 2009-10-15 | 2011-10-10 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
KR101631599B1 (ko) * | 2009-12-02 | 2016-06-27 | 삼성전자주식회사 | 발광 소자 및 그 제조 방법 |
KR101039946B1 (ko) * | 2009-12-21 | 2011-06-09 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 패키지 및 발광 소자 제조방법 |
CN102237464B (zh) * | 2010-04-26 | 2013-07-03 | 亿光电子工业股份有限公司 | 发光二极管结构及其制作方法 |
SG185547A1 (en) * | 2010-05-18 | 2012-12-28 | Agency Science Tech & Res | Method of forming a light emitting diode structure and a light emitting diode structure |
JP5801542B2 (ja) | 2010-07-13 | 2015-10-28 | 昭和電工株式会社 | 発光ダイオード及び発光ダイオードランプ |
US8283652B2 (en) * | 2010-07-28 | 2012-10-09 | SemiLEDs Optoelectronics Co., Ltd. | Vertical light emitting diode (VLED) die having electrode frame and method of fabrication |
US20130001510A1 (en) * | 2011-06-29 | 2013-01-03 | SemiLEDs Optoelectronics Co., Ltd. | Optoelectronic device having current blocking insulation layer for uniform temperature distribution and method of fabrication |
US9419182B2 (en) * | 2012-01-05 | 2016-08-16 | Micron Technology, Inc. | Solid-state radiation transducer devices having at least partially transparent buried-contact elements, and associated systems and methods |
US8816379B2 (en) | 2012-05-17 | 2014-08-26 | High Power Opto, Inc. | Reflection curved mirror structure of a vertical light-emitting diode |
US8546831B1 (en) * | 2012-05-17 | 2013-10-01 | High Power Opto Inc. | Reflection convex mirror structure of a vertical light-emitting diode |
US8748928B2 (en) | 2012-05-17 | 2014-06-10 | High Power Opto, Inc. | Continuous reflection curved mirror structure of a vertical light-emitting diode |
DE102012110836A1 (de) | 2012-11-12 | 2014-02-27 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips |
JP2016528728A (ja) * | 2013-07-18 | 2016-09-15 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 高反射フリップチップledダイ |
FR3054725B1 (fr) * | 2016-07-26 | 2019-05-17 | Institut Polytechnique De Grenoble | Dispositif optoelectronique et son procede de fabrication |
US10643980B2 (en) | 2018-01-23 | 2020-05-05 | Epistar Corporation | Light-emitting device, manufacturing method thereof and display module using the same |
KR102596625B1 (ko) | 2021-11-15 | 2023-11-02 | 조대성 | 숯불 구이기 및 숯불 구이기용 메인기어모듈 |
Family Cites Families (29)
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JPH01117220A (ja) | 1988-09-10 | 1989-05-10 | Omron Tateisi Electron Co | 開閉器の製造方法 |
JPH0715038A (ja) * | 1993-06-21 | 1995-01-17 | Toshiba Corp | 半導体発光素子 |
JP2927158B2 (ja) * | 1993-09-29 | 1999-07-28 | サンケン電気株式会社 | 半導体発光素子 |
US6057562A (en) * | 1997-04-18 | 2000-05-02 | Epistar Corp. | High efficiency light emitting diode with distributed Bragg reflector |
US5789768A (en) * | 1997-06-23 | 1998-08-04 | Epistar Corporation | Light emitting diode having transparent conductive oxide formed on the contact layer |
JP3763667B2 (ja) * | 1998-04-23 | 2006-04-05 | 株式会社東芝 | 半導体発光素子 |
JP2001274456A (ja) * | 2000-01-18 | 2001-10-05 | Sharp Corp | 発光ダイオード |
JP2001223384A (ja) * | 2000-02-08 | 2001-08-17 | Toshiba Corp | 半導体発光素子 |
US20020017652A1 (en) * | 2000-08-08 | 2002-02-14 | Stefan Illek | Semiconductor chip for optoelectronics |
US6905900B1 (en) * | 2000-11-28 | 2005-06-14 | Finisar Corporation | Versatile method and system for single mode VCSELs |
TW577178B (en) * | 2002-03-04 | 2004-02-21 | United Epitaxy Co Ltd | High efficient reflective metal layer of light emitting diode |
JP2004088083A (ja) | 2002-06-25 | 2004-03-18 | Matsushita Electric Ind Co Ltd | 半導体発光素子、その製造方法及びその実装方法 |
US20040140474A1 (en) * | 2002-06-25 | 2004-07-22 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device, method for fabricating the same and method for bonding the same |
WO2004032248A2 (de) * | 2002-09-30 | 2004-04-15 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes halbleiterbauelement und verfahren zu dessen herstellung |
US6995401B2 (en) * | 2002-10-23 | 2006-02-07 | Shin-Etsu Handotai Co., Ltd. | Light emitting device and method of fabricating the same |
US7041529B2 (en) * | 2002-10-23 | 2006-05-09 | Shin-Etsu Handotai Co., Ltd. | Light-emitting device and method of fabricating the same |
DE10346606B4 (de) | 2003-08-29 | 2012-03-01 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement |
JP2007504639A (ja) * | 2003-08-29 | 2007-03-01 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放射放出半導体素子 |
DE10346605B4 (de) | 2003-08-29 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungemittierendes Halbleiterbauelement |
KR100571818B1 (ko) * | 2003-10-08 | 2006-04-17 | 삼성전자주식회사 | 질화물계 발광소자 및 그 제조방법 |
JP2005123409A (ja) * | 2003-10-16 | 2005-05-12 | Shin Etsu Handotai Co Ltd | 発光素子 |
EP1709694B1 (de) * | 2004-01-26 | 2017-03-15 | OSRAM Opto Semiconductors GmbH | Dünnfilm-led mit einer stromaufweitungsstruktur |
US7026653B2 (en) * | 2004-01-27 | 2006-04-11 | Lumileds Lighting, U.S., Llc | Semiconductor light emitting devices including current spreading layers |
TWI288486B (en) * | 2004-03-17 | 2007-10-11 | Epistar Corp | Light-emitting diode and method for manufacturing the same |
DE102004021175B4 (de) | 2004-04-30 | 2023-06-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterchips für die Optoelektronik und Verfahren zu deren Herstellung |
DE102004026231B4 (de) | 2004-05-28 | 2019-01-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Bereichs mit reduzierter elektrischer Leitfähigkeit innerhalb einer Halbleiterschicht und optoelektronisches Halbleiterbauelement |
DE102004057802B4 (de) * | 2004-11-30 | 2011-03-24 | Osram Opto Semiconductors Gmbh | Strahlungemittierendes Halbleiterbauelement mit Zwischenschicht |
JP2007059623A (ja) * | 2005-08-24 | 2007-03-08 | Visual Photonics Epitaxy Co Ltd | 反射層を具えた高輝度発光ダイオードの製造方法 |
DE202006003360U1 (de) * | 2006-03-03 | 2006-06-01 | Schön, Hendrik | Lichtemittierender Feldeffekttransistor |
-
2006
- 2006-07-27 DE DE102006034847A patent/DE102006034847A1/de not_active Withdrawn
-
2007
- 2007-03-26 WO PCT/DE2007/000554 patent/WO2007124708A1/de active Application Filing
- 2007-03-26 CN CN2007800146393A patent/CN101427392B/zh not_active Expired - Fee Related
- 2007-03-26 KR KR1020087028955A patent/KR101294911B1/ko active IP Right Grant
- 2007-03-26 EP EP07722113.3A patent/EP2011160B1/de not_active Ceased
- 2007-03-26 JP JP2009506904A patent/JP5404386B2/ja not_active Expired - Fee Related
- 2007-03-26 US US12/298,750 patent/US8378371B2/en active Active
- 2007-04-25 TW TW096114571A patent/TWI381545B/zh not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102132427B (zh) * | 2008-10-20 | 2013-07-17 | Lg伊诺特有限公司 | 发光器件及其制造方法 |
TWI406433B (zh) * | 2009-03-17 | 2013-08-21 | Tekcore Co Ltd | Vertical gallium nitride based light emitting diode and manufacturing method thereof |
TWI723002B (zh) * | 2014-11-06 | 2021-04-01 | 荷蘭商露明控股公司 | 具有位於一頂部接點下方之溝渠之發光裝置 |
Also Published As
Publication number | Publication date |
---|---|
WO2007124708A1 (de) | 2007-11-08 |
EP2011160A1 (de) | 2009-01-07 |
DE102006034847A1 (de) | 2007-10-31 |
KR101294911B1 (ko) | 2013-08-08 |
EP2011160B1 (de) | 2018-08-15 |
JP2009534857A (ja) | 2009-09-24 |
JP5404386B2 (ja) | 2014-01-29 |
CN101427392B (zh) | 2011-04-06 |
KR20090009912A (ko) | 2009-01-23 |
CN101427392A (zh) | 2009-05-06 |
US20100019268A1 (en) | 2010-01-28 |
US8378371B2 (en) | 2013-02-19 |
TWI381545B (zh) | 2013-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |