TW200801538A - Jig for substrate inspection and substrate inspection apparatus equipped with the same - Google Patents

Jig for substrate inspection and substrate inspection apparatus equipped with the same

Info

Publication number
TW200801538A
TW200801538A TW096118413A TW96118413A TW200801538A TW 200801538 A TW200801538 A TW 200801538A TW 096118413 A TW096118413 A TW 096118413A TW 96118413 A TW96118413 A TW 96118413A TW 200801538 A TW200801538 A TW 200801538A
Authority
TW
Taiwan
Prior art keywords
guide holes
plate part
substrate inspection
upper plate
probes
Prior art date
Application number
TW096118413A
Other languages
Chinese (zh)
Inventor
Minoru Kato
Makoto Fujino
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW200801538A publication Critical patent/TW200801538A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

To provide a new substrate inspection apparatus of which precision in positioning a probe of the substrate inspection apparatus is improved. The substrate inspection apparatus includes a jig for inspection. The jig for inspection comprises an upper plate part and a lower plate part held at a prescribed interval from each other and a plurality of probes. A plurality of guide holes are formed in each of the upper plate part and the lower plate part. The plurality of probes are held by insertion through the guide holes of the upper plate part and the guide holes of the lower plate part corresponding to the former guide holes. Since the guide holes of the upper plate part and the guide holes of the lower plate part corresponding to the former guide holes are slightly displaced from each other, the probes are inclined in the directions of displacement and in contact with specific locations in the circumferential edges of the guide holes of the upper plate at all times. The probes have flexibility and an elastic force to bending stress and come into elastic contact with wiring patterns of substrates to be inspected.
TW096118413A 2006-05-30 2007-05-23 Jig for substrate inspection and substrate inspection apparatus equipped with the same TW200801538A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006150715A JP2007322179A (en) 2006-05-30 2006-05-30 Jig for substrate inspection and substrate inspection apparatus equipped with same

Publications (1)

Publication Number Publication Date
TW200801538A true TW200801538A (en) 2008-01-01

Family

ID=38855143

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096118413A TW200801538A (en) 2006-05-30 2007-05-23 Jig for substrate inspection and substrate inspection apparatus equipped with the same

Country Status (3)

Country Link
JP (1) JP2007322179A (en)
KR (1) KR20070115658A (en)
TW (1) TW200801538A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101192209B1 (en) 2008-09-05 2012-10-17 니혼덴산리드가부시키가이샤 The fixture for circuit board inspection
JP6527042B2 (en) * 2015-07-13 2019-06-05 オルガン針株式会社 Wire probe holding structure
JP6872943B2 (en) * 2017-03-24 2021-05-19 株式会社日本マイクロニクス Electrical connection device
JP6600387B2 (en) * 2018-07-12 2019-10-30 東京特殊電線株式会社 Probe and probe contact method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0662474U (en) * 1993-02-10 1994-09-02 株式会社ヨコオ Connector for electrical connection
DE69326609T2 (en) * 1993-07-23 2000-04-27 Ibm Test probe arrangement with articulation needles
JP2001255340A (en) * 2000-03-13 2001-09-21 Yokowo Co Ltd Contact probe, and socket for inspecting ic package with the same
JP3505495B2 (en) * 2000-09-13 2004-03-08 日本電産リード株式会社 Inspection jig for substrate inspection, substrate inspection device provided with the inspection jig, and method of assembling inspection jig for substrate inspection
JP2002311050A (en) * 2001-04-12 2002-10-23 Alps Electric Co Ltd Measuring device of electronic unit
JP2003215210A (en) * 2002-01-28 2003-07-30 Fuji Electric Co Ltd Device for testing printed circuit board
JP3905850B2 (en) * 2003-03-13 2007-04-18 日本電産リード株式会社 Substrate inspection probe and substrate inspection apparatus using the same
JP2005338065A (en) * 2004-04-26 2005-12-08 Koyo Technos:Kk Inspection jig and inspection equipment
JP4574222B2 (en) * 2004-05-06 2010-11-04 日本電産リード株式会社 Substrate inspection contact, substrate inspection jig and substrate inspection apparatus using the same
JP3944196B2 (en) * 2004-06-28 2007-07-11 日本電産リード株式会社 Probe device and substrate inspection device

Also Published As

Publication number Publication date
JP2007322179A (en) 2007-12-13
KR20070115658A (en) 2007-12-06

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