TW200718948A - Contact uint and inspection system - Google Patents

Contact uint and inspection system

Info

Publication number
TW200718948A
TW200718948A TW094139569A TW94139569A TW200718948A TW 200718948 A TW200718948 A TW 200718948A TW 094139569 A TW094139569 A TW 094139569A TW 94139569 A TW94139569 A TW 94139569A TW 200718948 A TW200718948 A TW 200718948A
Authority
TW
Taiwan
Prior art keywords
contact
emitting diode
light emitting
probes
contact unit
Prior art date
Application number
TW094139569A
Other languages
Chinese (zh)
Other versions
TWI292828B (en
Inventor
Shigeki Ishikawa
Takashi Nidaira
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200718948A publication Critical patent/TW200718948A/en
Application granted granted Critical
Publication of TWI292828B publication Critical patent/TWI292828B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

This invention provides a contact unit having a simple construction and is capable of performing an accurate alignment of position with an object to be inspected. On an upper side of a holder substrate (15) provided in a contact unit (2), contact probes (13) are provided to correspond with an arrangement pattern of test pads (11) provided in a circuit forming region (5a) of the object to be inspected. A plurality of probe sets (14a)-(14d) are provided to correspond with dummy pads (7a)-(7b). Probe sets (14) comprise probes (19, 20) respectively connected to a light emitting diode (12) and a voltage source (21) constituting a positional relation detecting portion (22). When the contact unit (2) is used to perform an inspection, the light emitting diode (12) is caused to emit light as probes (19, 20) and the corresponding dummy pads (7) become conductive with each other by being brought into contact with each other and therefore whether or not the positional alignment is correctly performed can be determined by observing the emission of light from the light emitting diode (12).
TW094139569A 2005-11-10 2005-11-11 Contact unit and inspection system TWI292828B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/020635 WO2007055012A1 (en) 2005-11-10 2005-11-10 Contact unit and testing system

Publications (2)

Publication Number Publication Date
TW200718948A true TW200718948A (en) 2007-05-16
TWI292828B TWI292828B (en) 2008-01-21

Family

ID=38023023

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139569A TWI292828B (en) 2005-11-10 2005-11-11 Contact unit and inspection system

Country Status (4)

Country Link
KR (1) KR101046353B1 (en)
CN (1) CN101317099B (en)
TW (1) TWI292828B (en)
WO (1) WO2007055012A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101089846B1 (en) * 2011-04-06 2011-12-05 이상용 Multi-channel pwm waveforms measurement device
CN102928698B (en) * 2012-10-19 2015-12-09 广东欧珀移动通信有限公司 A kind of testing circuit of test point exception
CN103899986A (en) * 2012-12-31 2014-07-02 苏州璨宇光学有限公司 Backlight module
CN103323635B (en) * 2013-06-21 2015-12-02 深圳市华星光电技术有限公司 For detecting the probe module of contact effect
CN103558540A (en) * 2013-11-07 2014-02-05 周芸 General tester for characteristics of diode and audion
CN104658844B (en) * 2013-11-22 2017-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 A kind of tray supporting devices and plasma processing device
CN106093750B (en) * 2016-06-17 2018-12-18 深圳市燕麦科技股份有限公司 Switching circuit board and switching device for circuit board testing
CN106918777A (en) * 2017-05-16 2017-07-04 国网河南省电力公司平顶山供电公司 A kind of circuit edge connector welding position detection means
CN108480636B (en) * 2018-05-24 2024-03-29 成都青石激光科技有限公司 Laser additive manufacturing correction device
CN108957807A (en) * 2018-08-08 2018-12-07 昆山龙腾光电有限公司 A kind of binding detection system and display panel
JP7101577B2 (en) * 2018-09-21 2022-07-15 株式会社日本マイクロニクス Inspection method and inspection system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0174575U (en) * 1987-11-06 1989-05-19
JPH01129432A (en) * 1987-11-16 1989-05-22 Nec Corp Integrated circuit
JP2842598B2 (en) * 1988-12-01 1999-01-06 日本電気株式会社 Semiconductor integrated circuit
JPH09213757A (en) * 1996-02-07 1997-08-15 Kawasaki Steel Corp Method for facilitating wafer probe
JP3346707B2 (en) * 1996-08-30 2002-11-18 シャープ株式会社 Inspection method for semiconductor integrated circuit device
JP3214420B2 (en) * 1997-11-06 2001-10-02 日本電気株式会社 Film carrier type semiconductor device, inspection probe head, and alignment method

Also Published As

Publication number Publication date
KR20080072044A (en) 2008-08-05
CN101317099A (en) 2008-12-03
KR101046353B1 (en) 2011-07-04
CN101317099B (en) 2012-06-27
WO2007055012A1 (en) 2007-05-18
TWI292828B (en) 2008-01-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees