WO2007055012A1

WO2007055012A1 - Contact unit and testing system

Info

Publication number: WO2007055012A1
Application number: PCT/JP2005/020635
Authority: WO
Inventors: Shigeki Ishikawa; Takashi Nidaira
Original assignee: Nhk Spring Co., Ltd.
Priority date: 2005-11-10
Filing date: 2005-11-10
Publication date: 2007-05-18
Also published as: KR20080072044A; CN101317099A; KR101046353B1; CN101317099B; TWI292828B; TW200718948A

Abstract

A contact unit which has a simple configuration and can perform precise alignment with a test object is provided. On the top surface of a holder base (15) provided to a contact unit (2), contact probes (13) are arranged correspondingly to the arrangement pattern of test pads (11) provided in a circuit-forming region (5a), which is a test object, and groups of detecting probes (14a to 14d) are arranged correspondingly to dummy pads (7a to 7d). Each group of detecting probes (14) consists of probes (19, 20) connected respectively to a light-emitting diode (12) and a voltage source (21) which constitute a positional relationship detector (22). Since the light-emitting diode (12) emits light when the probes (19, 20) comes in contact with the corresponding dummy pad (7) to become conductive with each other in a test using the contact unit (2), whether or not the alignment has been performed precisely can be judged by checking the emission state of the light-emitting diode (12).

Description

Specification

Contact unit and inspection system

[0001] The present invention relates to a contact unit and a contact unit for making an electrical connection to a wiring structure with respect to an inspection object in which a plurality of conductive regions including the wiring structure used for input or output of an electric signal are formed on the surface. It relates to the inspection system used.

Background art

[0002] Conventionally, for example, a configuration using a tape carrier package (T) such as TAB (Tape Automated Bonding; COF (Chip On Film), etc., for a driver circuit of a liquid crystal panel constituting a liquid crystal display is known. TCP is formed by mounting a semiconductor chip on a flexible film substrate having a wiring structure on the surface and sealing the mounted semiconductor chip with grease.

[0003] A TCP having such a structure is formed by forming a wiring structure corresponding to a plurality of packages on the same film, and mounting a semiconductor chip for each knocker and then separating them into individual packages. Manufactured by. Therefore, the wiring structure is formed on the substrate prepared for each individual package, and it has an advantage in that it is superior in terms of production efficiency as compared with the conventional package on which each semiconductor chip is mounted. In addition, the film base material that constitutes TCP has a very small material thickness compared to conventional semiconductor substrates and is highly flexible. Therefore, when used in a liquid crystal display, etc., the entire device can be downsized. Etc.

[0004] When manufacturing a powerful TCP, an inspection relating to electrical characteristics is performed for the purpose of detecting defective products as in the case of other semiconductor integrated circuits. Specifically, for example, inspection of the presence or absence of an electrical short circuit or disconnection in a wiring structure formed on a film substrate, or a predetermined inspection signal is applied to a semiconductor chip via a wiring structure after mounting a semiconductor chip. On the other hand, operation characteristics inspection etc. are performed.

[0005] When performing electrical characteristic inspection, in order to accurately input and output inspection signals, It is necessary to align the input / output terminals provided and the wiring structure formed on the film substrate. For this reason, a conventional inspection apparatus is usually provided with a mechanism for visually recognizing a portion where the input / output terminal and the wiring structure are in contact with each other.

[0006] As a simple mechanism for visually recognizing the contact portion, a contact portion force is formed by forming a through-hole extending straight to the outside, and the positional relationship of the contact portion is externally determined through the through-hole. Inspection apparatuses that can be visually recognized are known. In addition, since it is difficult to form such a linear through-hole depending on the structure of the inspection apparatus, a through-hole bent in the middle is formed, and an optical member such as a mirror is disposed at a bent portion of the through-hole. An inspection apparatus that employs a mechanism for guiding the image of the contact portion to the outside has also been proposed (see, for example, Patent Document 1).

[0007] Patent Document 1: JP 2000-9753 A

Disclosure of the invention

Problems to be solved by the invention

[0008] However, the conventional inspection apparatus that performs alignment by visually recognizing the positional relationship between the input / output terminals provided in the inspection apparatus and the wiring structure formed on the film base has a structure. However, there is a problem that the positioning accuracy may be lowered. In the following, the problems that will be worked out will be described in sequence.

[0009] First, when a configuration for visually recognizing the positional relationship is adopted, it is necessary to form a predetermined through hole and, if necessary, a mirror or the like as described above. Therefore, in the inspection apparatus, it is necessary to achieve a predetermined physical strength while securing an area for forming a through hole in advance. In an inspection system that employs a configuration for visually recognizing the positional relationship, it directly contacts the inspection object. Therefore, there is a problem that the structure of the outer contour unit is complicated or large. In addition, depending on the inspection object or the structure of the contact unit, it may be difficult to place optical members such as through holes and mirrors at appropriate locations. In that case, it is necessary to adopt another structure. .

[0010] In addition, when a configuration in which the alignment is performed by visually recognizing the contact portion, the alignment accuracy may be reduced. In other words, if a configuration is used that relies on the inspector's five senses for alignment, the alignment can be performed to the extent that there is no problem in performing the inspection. It is difficult to objectively determine the power force accurately performed. In addition, if the inspector is changed, the alignment accuracy will change due to differences in proficiency, etc., which is not appropriate.

[0011] The present invention has been made in view of the above, and has a simple configuration and an inspection using a contact unit and a contact unit that can be accurately aligned with an inspection object. The purpose is to realize the system.

Means for solving the problem

[0012] In order to solve the above-described problems and achieve the object, the contact shoe according to claim 1 has a plurality of conductive regions including a wiring structure used for input or output of an electric signal formed on the surface. A contact unit for making an electrical connection to the wiring structure with respect to the inspection object, the wiring unit being arranged corresponding to an arrangement pattern of the wiring structure, and electrically connected to the corresponding wiring structure; And an input / output terminal that inputs and / or outputs a predetermined electrical signal, and a plurality of terminals that are arranged corresponding to the predetermined conductive region, and that passes through the corresponding conductive region. A group of detection terminals used for detecting the positional relationship between the contact unit and the inspection object according to the presence or absence of conduction between a plurality of terminals, the input / output terminals, and the detection terminals; The group is characterized in that a holder substrate that holds.

[0013] According to the invention of claim 1, since the detection terminal group is provided corresponding to the conductive region provided in the inspection target, the inspection target is determined based on the presence or absence of conduction between the detection terminal group and the conductive region. It is possible to detect whether or not a force has occurred between the contact unit and the contact unit. Furthermore, since the terminals constituting the detection terminal group can be formed by the same configuration as the input / output terminals, the structure of the contact unit is complicated even when the detection terminal group is newly arranged. It is possible to detect misalignment with a simple configuration.

[0014] In the contact unit according to claim 2, in the above invention, a plurality of the detection terminal groups are arranged corresponding to the plurality of the conductive regions, and the plurality of detection terminal groups are the inspection target. Among them, the contact unit is arranged at a position corresponding to the vicinity of the different end of the region in contact with the contact unit. [0015] Further, in the contact unit according to claim 3, in the above invention, a portion of the inspection object that is electrically connected to the contact unit has a rectangular shape, and the detection terminal group includes a plurality of detection terminal groups. A plurality of the detection terminal groups are arranged corresponding to the conductive regions, and the plurality of detection terminal groups are arranged in regions corresponding to the rectangular diagonal lines or in the vicinity of the apexes, respectively.

[0016] Further, in the above invention, the contact unit according to claim 4 is electrically connected to a plurality of terminals forming the detection terminal group, and is connected via the conductive region corresponding to the detection terminal group. The apparatus further comprises a positional relationship detecting means for detecting a positional relationship between the contact unit and the inspection object in accordance with the presence / absence of conduction between the plurality of terminals.

[0017] Further, in the contact unit according to claim 5, in the above invention, the positional relationship detecting means is connected in series with a voltage source for supplying a predetermined voltage, the voltage source, and the plurality of terminals. And a passive element that forms a closed circuit with the voltage source when conducting through the conductive region and performs a predetermined action based on a potential supplied by the voltage source. .

[0018] In the contact unit according to claim 6, in the above invention, the passive element is a light emitting diode.

[0019] In the contact unit according to claim 7, in the above invention, the detection terminal group is arranged corresponding to a dummy pad electrically insulated from the wiring structure in the conductive region. It is characterized by that.

[0020] Further, in the contact unit according to claim 8, in the above invention, the detection terminal group is arranged corresponding to a wiring structure in the conductive region, and the positional relationship detecting means includes a corresponding wiring structure. On the other hand, when an electric signal is input or output through the input / output terminal, switch means capable of stopping voltage supply to the passive element is further provided.

[0021] Further, the inspection system according to claim 9 relates to an inspection object in which a plurality of conductive regions including a wiring structure used for at least one of input and output of an electric signal are formed on a surface. Input and output of electrical signals through a mechanical connection An inspection system for performing inspection by the method, wherein the inspection system is arranged corresponding to the wiring structure, electrically connected to the corresponding wiring structure, and at least one of input and output of a predetermined electric signal to the wiring structure And the contact unit formed by the presence or absence of conduction between the plurality of terminals via the corresponding conductive region. A contact unit including a detection terminal group used for detecting a positional relationship with an inspection object, a holder substrate for holding the input / output terminal and the detection terminal group, and an electrical signal used for inspection of the inspection object. A signal processing device that generates and analyzes the electrical signal output by the inspection object, and electrically connects the signal processing device and the outer contour unit. A connection board connection to, and further comprising a.

The invention's effect

[0022] Since the contact unit and the inspection system according to the present invention are provided with the detection terminal group corresponding to the conductive region provided in the inspection object, the presence or absence of conduction between the detection terminal group and the conductive region is determined. Based on this, it is possible to detect whether or not a positional deviation has occurred between the inspection object and the contact unit. In addition, since the terminals constituting the detection terminal group can be formed in the same configuration as the input / output terminals, the structure of the outer contour unit is complicated even when the detection terminal group is newly arranged. This has the effect of being able to detect misalignment with a simple configuration.

Brief Description of Drawings

FIG. 1 is a schematic diagram showing an overall configuration of an inspection system according to a first embodiment.

FIG. 2 is a schematic diagram showing a configuration of a contact unit provided in the inspection system.

FIG. 3 is a schematic cross-sectional view showing the structure of a probe provided in the contact unit.

[FIG. 4] FIG. 4 is a schematic diagram showing functions of a detection probe group and a positional relationship detection unit in the case of positional deviation due to parallel movement.

FIG. 5 is a schematic diagram showing functions of a detection probe group and a positional relationship detection unit when a positional shift occurs due to parallel movement.

[Fig. 6] Fig. 6 shows detection probe groups and positional relationship detection in the case of positional deviation due to rotation. It is a schematic diagram which shows the function of an exit part.

FIG. 7 is a schematic diagram showing the functions of the detection probe group and the positional relationship detection unit when the object to be inspected and the contact unit are relatively inclined.

FIG. 8 is a schematic diagram showing an overall configuration of an inspection system according to a second embodiment.

FIG. 9 is a schematic diagram showing a configuration of a contact unit provided in the inspection system.

FIG. 10 is a schematic diagram showing the functions of a detection probe group and a positional relationship detection unit when detecting displacement.

FIG. 11 is a schematic diagram showing functions of a detection probe group and a positional relationship detection unit at the time of inspection.

FIG. 12 is a schematic diagram showing a modification of the inspection system according to the second embodiment.

FIG. 13 is a schematic diagram illustrating a configuration of a contact unit provided in the inspection system according to the third embodiment.

Explanation of symbols

1, 31 Inspection target

2, 32, 35, 41 Contact unit

3 Signal processor

4 Connection board

5a, 36 Circuit formation area

5b Sprocket Honoré

6 Wiring structure

7, 7a ~ 7h Dummy pad

8 Semiconductor chip

9 Inner lead

10 Outer lead

11, l la ~ l ll, 37a ~ 37d test node

12, 12a ~ 12d light emitting diode

13 Contact probe 14, 14a-14d Detection probe group

15, 42 Honoreda substrate

16, 17 Screw member

19, 19a-19d, 20, 20a-20d Probe

21, 21a-21d Voltage source

22, 22a-22d, 33, 33a-33d Position relationship detector

24, 25 Needle-shaped member

26 Panel members

27 opening

28 Lead wire

34, 34a-34d switch

38a, 38b Through wiring

BEST MODE FOR CARRYING OUT THE INVENTION

The best mode for carrying out the contact unit and the inspection system according to the present invention (hereinafter referred to as “embodiment”) will be described in detail below with reference to the drawings. It should be noted that the drawings are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like are different from the actual ones. Of course, there are also parts with different dimensional relationships and ratios. In addition, as for the reference numerals in the drawings, those having the same configuration are shown as “light emitting diode 12a” and “light emitting diode 12b”, for example, and collectively described as “light emitting diode 12” as necessary.

(Embodiment 1)

First, the inspection system according to the first embodiment will be described. FIG. 1 is a schematic diagram showing the overall configuration of the inspection system according to the first embodiment. As shown in FIG. 1, the inspection system according to the first embodiment is configured to generate a contact unit 2 for realizing an electrical connection to the inspection object 1 and an electric signal to be input to the inspection object. The signal processing device 3 to be performed, and the connection substrate 4 for electrically connecting the signal processing device 3 and the contact unit 2 are configured. [0027] Inspection object 1 is an object to be inspected by the inspection system according to the first embodiment. Specifically, the inspection object 1 is a sprocket hole 5b in which a plurality of circuit formation regions 5a are arranged in a longitudinal direction on a predetermined film substrate, and are provided at regular intervals in the longitudinal direction in the vicinity of the end in the lateral direction. It has a long tape-like structure equipped with, and is moved in the longitudinal direction by the handler through the sprocket hole 5b during inspection. In addition, a conductive region including the wiring structure 6, specifically, a plurality of wiring structures 6 and dummy pads 7 are formed on the circuit forming region 5 a, and a semiconductor chip 8 is mounted.

[0028] Each wiring structure 6 includes an inner lead 9 that is electrically connected to the semiconductor chip 8, and an outer lead 10 that is electrically connected to the inner lead 9 and is used for electrical connection with an external device during mounting. And a test pad 11 electrically connected to the outer lead 10 and used for input / output of an electric signal at the time of inspection. By forming a plurality of wiring structures 6 corresponding to the connection terminals provided on the semiconductor chip 8, electrical connection between the semiconductor chip 8 and an external device is realized.

[0029] The dummy pad 7 functions as an example of a conductive region in the claims. Specifically, the dummy pad 7 is formed by a conductive region electrically insulated from any of the plurality of wiring structures 6, and is not electrically connected to the semiconductor chip 8, It does not function at all for the input and output of electrical signals used for inspection. In the first embodiment, the positional relationship between the inspection object 1 and the contact unit 2 is determined by effectively using the dummy pad 7 as will be described later.

[0030] In addition to the function of generating an electrical signal used for inspection, the signal processing device 3 outputs the generated electrical signal to the inspection object 1 and analyzes the response signal for the input electrical signal. This is for analyzing the electrical characteristics of the inspection object 1. Specifically, the electrical signal generated by the signal processing device 3 is sequentially input to the inspection object 1 via the connection board 4 and the contact unit 2, and the response signal output from the inspection object 1 is the contact unit. 2 and the connection board 4 are sequentially input to the signal processing device 3. Note that the electrical connection between the signal processing device 3 and the connection board 4 is actually performed using a large number of wirings, but such a connection mode is irrelevant to the main part of the present invention. In FIG. 1, the electrical connection between the two is only shown schematically.

The connection substrate 4 is for electrically connecting the contact unit 2 and the signal processing device 3. Theoretically, it is possible to adopt a configuration in which the connection board 4 that can be directly connected between the connection terminal on the contact unit 2 side and the connection terminal on the signal processing device 3 side using a predetermined wiring or the like can be omitted. It is. However, since the connection terminals on the contact unit 2 side are actually arranged to correspond to the test probe provided on the inspection object 1, the distance between the connection terminals becomes very small, and the signal processing device 3 is directly connected. It is not easy to connect to. Therefore, in the first embodiment, for example, a connection board 4 on which a plurality of wiring structures formed so that the distance between each other is increased as it is extended is newly provided, and the connection board 4 that can be obtained is provided. The signal processing device 3 and the contact unit 2 are electrically connected via the cable.

[0032] Next, the contact unit 2 will be described. The contact unit 2 is for making electrical contact with the inspection object 1 when performing an inspection using the inspection system according to the first embodiment. Specifically, the contact unit 2 includes light emitting diodes 12a to 12d that display the detection results of the positional relationship, a plurality of contact probes 13 that are arranged corresponding to the plurality of test pads 11 provided in the inspection object 1, and 1 It has a configuration provided with detection probe groups 14a to 14d arranged corresponding to the above dummy pads 7, and a holder substrate 15 that holds the contact probes 13 and the detection probe groups 14a to 14d. The holder substrate 15 is composed of a plurality of substrates, and the plurality of substrates to be covered are fixed to each other by screw members 16. The holder substrate 15 has a structure that is fixed to the connection substrate 4 by a screw member 17.

[0033] The light emitting diodes 12a to 12d are intended to function as an example of a passive element in the claims. Specifically, the light emitting diodes 12a to 12d constitute the positional relationship detection units 22a to 22d described later, and the light emission state changes according to the positional deviation between the contact unit 2 and the inspection object 1. It has a function.

[0034] The position where the detection probe groups 14a to 14d and the contact probe 13 are arranged and the configuration of the positional relationship detection units 22a to 22d including the detection probe groups 14a to 14d will be described. . FIG. 2 is a schematic diagram conceptually showing the planar structure of the contact unit 2 when the side force of the inspection object 1 is also viewed and the structure of the positional relationship detectors 22a to 22d corresponding to the detection probe groups 14a to 14d. In Fig. 2, in order to easily understand the positional relationship with inspection object 1 at the time of inspection, the positions of the components of inspection object 1 when ideally aligned are indicated by broken lines. And

As shown in FIG. 2, the contact probe 13 is arranged in accordance with a pattern corresponding to the arrangement pattern of the test pads 11 provided in the inspection object 1, and is arranged in accordance with such a pattern so that it can be used for inspection. Input / output of electrical signals to inspection object 1 is possible. On the other hand, the detection probe groups 14a to 14d are arranged corresponding to the dummy pads 7 located at the four corners of the circuit formation region 5a. Specifically, the probes 19a to 19d and 20a to 20d constituting each of the detection probe groups 14a to 14d are respectively dummy when accurate alignment is performed between the contact unit 2 and the inspection target 1. The pads 7a to 7d are arranged so as to overlap with each other.

[0036] The contact probe 13 functions as an example of an input / output terminal in the claims. Specifically, the contact probe 13 is arranged corresponding to the arrangement pattern of the test pads 11 provided in the inspection object 1 and physically contacts with each of the test pads 11 so that a predetermined contact with the inspection object 1 is obtained. It has a function to perform at least one of input and output of electrical signals.

[0037] The detection probe group 14 functions as an example of a detection terminal group in the scope of the claims, and for the purpose of detecting the quality of the positional relationship between the inspection target 1 and the contact unit 2 at the time of inspection. It is what is used. Specifically, each of the detection probe groups 14a to 14d includes two probes 19a to 19d and 20a to 20d each functioning as an example of a terminal in the claims. When two probes come into contact with a predetermined conductive area (dummy pads 7a to 7d), it is decided to detect the quality of the positional relationship using the fact that the two probes conduct through the conductive area. .

[0038] The contact unit 2 includes positional relationship detection units 22a to 22d corresponding to the detection probe groups 14a to 14d. The positional relationship detection unit 22 has a configuration in which a light emitting diode 12 and a voltage source 21 are connected in series as shown in FIG. Specifically, for example The positional relationship detection unit 22a has a configuration in which the anode of the voltage source 21a and the cathode of the light emitting diode 12a are connected via a predetermined wiring.

In addition, the positional relationship detection unit 22 has a configuration that is electrically connected to the probe 19 and the probe 20 that constitute the detection probe group 14. Specifically, for example, in the positional relationship detection unit 22a, the cathode of the voltage source 21a is electrically connected to the probe 20a via a predetermined wiring, and the anode of the light emitting diode 12a is connected via a predetermined wiring. The probe is electrically connected to the probe 19a.

Next, specific structures of the contact probe 13 and the probes 19 and 20 will be described. In the first embodiment, the contact probe 13 and the probes 19 and 20 have the same structure, and the specific structure will be described below by taking the probe 19 as an example.

FIG. 3 is a schematic cross-sectional view showing the structure of the probe 19. The probe 19 has a structure that can be expanded and contracted in the normal direction of the upper surface of the holder substrate 15 that constitutes the contact unit 2 (the surface that faces the inspection object 1 during the inspection). Specifically, as shown in FIG. 3, the probe 19 has a structure in which needle-like members 24 and 25 are arranged at both ends, and a panel member 26 is arranged between the needle-like members 24 and 25. The needle-like members 24 and 25 and the panel member 26 are each formed of a conductive material such as metal, and the needle-like member 24 and the panel member 26 and the panel member 26 and the needle-like member 25 are fixed to each other, so that The structure is integrated and electrically connected.

[0042] The holder substrate 15 is formed with an opening 27 having a central axis parallel to the vertical direction with respect to the above-described upper surface. By accommodating the probe 19 in the opening 27, the holder substrate 15 is Hold probe 19. On the other hand, the probe 19 has a function of expanding and contracting in a direction parallel to the central axis of the opening 27 by being accommodated in the opening 27, and the panel member with respect to the test pad 11 is inspected. It will be in contact while applying the splinter caused by 26.

In addition to the probe 19, a lead wire 28 can be cited as a member accommodated in the opening 27. The lead wire 28 is accommodated in the opening 27 so as to be located on the side opposite to the inspection object 1 with respect to the probe 19, and in the opening 27, one end of the lead wire 28 and the needle-like member 25 are mutually connected. It is arranged to be in contact with the main body. When the lead wire 28 comes into contact with the probes 19 and 20, the lead wire 28 functions as a wiring for connecting to the light emitting diode 12 and the voltage source 21 constituting the positional relationship detection unit 22, respectively. Functions as a wiring for electrically connecting a predetermined wiring structure provided on the connection board 4 and the needle-like member 25.

Next, functions performed by the detection probe group 14 and the positional relationship detection unit 22 in the detection system according to the first embodiment will be described. 4 and 5 are schematic diagrams for explaining the functions of the detection probe group 14 and the positional relationship detection unit 22. FIG. 4 shows accurate alignment between the detection target 1 and the contact unit 2. Fig. 5 shows the case where a positional shift occurs due to the relative translation of the inspection object 1 and the contact unit 2. 4 and 5 show only the components disposed around the positional relationship detection unit 22a and the positional relationship detection unit 22a, but the functions described below also hold for the positional relationship detection units 22b to 22d. Of course.

[0045] As shown in FIG. 4, when accurate alignment is performed, the probes 19a and 20a come into contact with the dummy pad 7a, and the probes 19a and 20a are electrically connected via the dummy pad 7a. Will be connected. Therefore, in the positional relationship detection unit 22a, the light emitting diode 12a and the voltage source 21a form a closed circuit, and the light emitting diode 12a emits light with a predetermined luminance based on the potential supplied by the voltage source 21a. Become.

[0046] On the other hand, as shown in FIG. 5, when the positional alignment between the contact unit 2 and the inspection object 1 is not performed correctly and a positional deviation occurs by a predetermined distance, the light emitting diode 12a Does not emit light. That is, the positional relationship between the probes 19a and 20a and the dummy pad 7a is caused by the positional deviation between the contact unit 2 and the inspection object 1, and for example, as shown in FIG. The probe 20a is in contact with the dummy pad 7a, while the probe 19a is not in contact with the dummy pad 7a.

As is clear from FIG. 5, in such a case, the probe 19a, 20a is not electrically connected between the light emitting diode 12a and the voltage source 21a in the positional relationship detection unit 22a. No circuit is formed. Accordingly, the light emitting diode 12a does not emit light without being supplied with a potential difference from the voltage source 21a to the light emitting diode 12a. That is, in the inspection system according to the first embodiment, when accurate alignment is performed between the contact unit 2 and the inspection target 1, the light emission provided in the positional relationship detection units 22a to 22d, respectively. When the diodes 12a to l 2d emit light and a position shift occurs, at least one of the light emitting diodes 12a to 12d does not emit light. In other words, the correct characteristic is correct positioning when all of the light emitting diodes 12a to 12d emit light, and misalignment occurs when any of the light emitting diodes 12a to 12d does not emit light. Means that That is, the user of the inspection system can determine whether or not the force has been accurately aligned by confirming the light emitting state of the light emitting diodes 12a to 12d.

[0049] In the first embodiment, a device for adjusting the accuracy of alignment is applied! Specifically, as shown in FIG. 4, each of the probes 19a and 20a has a longitudinal center axis (indicating the probes 19a and 20a in FIG. 4) when the alignment is performed accurately. The distance between the center of the circle) and the peripheral edge of the dummy pad 7a is set in advance so as to have a predetermined value. Specifically, as shown in FIG. 4, when accurate alignment is performed, the center axis of the probe 19a is the largest of the peripheral edges of the dummy node 7a with respect to the rectangular dummy pad 7a. It is arranged so that the distance between two adjacent sides is d, d,

1 2

The center axis of the probe 20a is arranged so that the distance between the two closest sides is d and d

3 4

The

In FIG. 4, although the outer diameters of the probes 19a and 20a are highlighted, the actual outer diameters of the probes 19a and 20a are usually very small. Therefore, in the inspection system according to the first embodiment, for example, when the contact unit 2 is displaced by d in the y direction with respect to the inspection object 1, the probe 19a is detached from the dummy pad 7a.

2

In other words, since the light emitting diode 12a does not emit light, it can be detected that a positional shift has occurred. On the other hand, even when the position shift occurs from the state shown in FIG. 4, for example, the contact unit 2 is not positioned in the y direction by d (く d) with respect to the inspection object 1.

5 2

In this case, the probes 19a and 20a still maintain the contact state with the dummy pad 7a, so that the light emitting diode 12a emits light.

[0051] These are because a certain allowable range is set in the determination of the presence or absence of positional deviation. Means that In other words, in all cases where even a slight misalignment has occurred from the state shown in FIG. 4, even if a misalignment that does not need to be detected as a misalignment has occurred, the inspection should not be hindered. It is practically desirable not to detect it as a positional deviation. Therefore, in the first embodiment, when the position where the probes 19a and 20a are arranged is devised to cause a positional shift that does not cause a problem in the inspection, the light emitting diode 12a is removed. The light is emitted, that is, not detected as a displacement. Note that the specific values of d to d are subject to inspection 1

14

The force determined by the structure etc. is preferably 20 μm to 50 μm, more preferably d = d = d = d = 30 m.

1 2 3 4

Misalignment detection is not performed, and it is possible to reliably detect misalignment that may cause inspection problems. Of course, if the structure to be inspected is further miniaturized due to future advances in microfabrication technology, it is preferable to set a value smaller than 30 m.

The specific value of 14 is preferably 10 to 20 μm, for example.

Further, the inspection system according to the first embodiment includes a plurality of positional relationship detection units 22 in the contact unit 2. Therefore, in the first embodiment, only a positional shift in the direction parallel to the X direction and the y direction in FIG. 4, that is, a positional shift caused by a relative translation of the contact unit 2 and the inspection object 1 will be used. First, even when the inspection object 1 is relatively rotated with the normal direction of the upper surface of the holder substrate 15 as the central axis, it is possible to detect the displacement.

FIG. 6 is a schematic diagram showing a case where the inspection object 1 is relatively rotated between the contact unit 2 and the inspection object 1 with the normal direction of the upper surface of the holder substrate 15 as the central axis. As shown in Fig. 6, if there is a displacement due to relative rotation around the dummy pad 7a and the probe 19a, 20a, electrical contact between the probe 19a, 20a and the dummy pad 7a Therefore, the positional relationship detection unit 22a alone cannot detect that an abnormality has occurred in the positional relationship between the contact unit 2 and the inspection object 1.

However, in the first embodiment, the contact unit 2 includes not only the positional relationship detection unit 22a but also the positional relationship detection units 22b to 22d. And contact When relative rotation occurs between the unit 2 and the inspection object 1, as shown in FIG. 6, a position shift occurs at a portion other than the rotation center. Therefore, each of the positional relationship detectors 22b to 22d is not in contact with the dummy pads 7b to 7d corresponding to the probes 19b to 19d, 20b to 20d, and the light emitting diodes 12b to l 2d. Since each of them does not emit light, it is possible to detect misalignment. Therefore, since the inspection system according to the first embodiment includes the plurality of positional relationship detection units 22, even when rotation occurs between the contact unit 2 and the inspection target 1, Abnormalities can be detected reliably.

[0055] Further, the inspection system according to the first embodiment is not limited to detection of displacement in the in-plane direction, that is, the X direction and the y direction shown in FIG. Can also be detected. As shown in FIG. 3, detection probe groups 14 a to 14 d corresponding to the positional relationship detection units 22 a to 22 d correspond to the four corners of the circuit formation region 5 a provided in the inspection target 1 on the upper surface of the holder substrate 15. Is located. Therefore, when an inclination occurs between the inspection target 1 and the contact unit 2, contact between the probes 19 and 20 and the corresponding dummy pad 7 does not occur in any of the positional relationship detection units 22a to 22d. Thus, the light emitting diode 12 does not emit light.

FIG. 7 is a schematic diagram showing a case where an inclination occurs between the inspection object 1 and the contact unit 2. As shown in FIG. 7, when the inspection object 1 is brought close to the contact unit 2 with an inclination between each other, for example, the detection probe group 14b is in contact with the dummy pad 7b, while the detection probe Group 14c will not come into contact with dummy pad 7c. Accordingly, in the case of FIG. 7, the light emitting diode 12b provided in the positional relationship detection unit 22b corresponding to the detection probe group 14b emits light, whereas the light emitting diode 12c corresponding to the detection probe group 14c does not emit light, and strong light emission. The occurrence of the pattern allows the inspection system user to detect the abnormality.

Next, advantages of the inspection system according to the first embodiment will be described. First, in the inspection system according to the first embodiment, it is possible to detect the occurrence of displacement between the contact unit 2 and the inspection object 1 based on the mechanism described above. From the viewpoint of performing such displacement detection, the simplest configuration is a single detection probe group 14 and By providing a plurality of force detection probe groups 14 and positional relationship detection units 22 that can be realized by providing the positional relationship detection unit 22, further effects can be obtained.

That is, as in the case shown in FIG. 6 and FIG. 7, when a positional deviation due to relative rotation or a positional deviation due to inclination occurs between the detection target and the contact unit 2, the detection probe is used. By providing a plurality of groups 14 and positional relationship detection units 22, it is possible to perform more reliable positional deviation detection. It should be noted that, from the viewpoint of reliably detecting misalignment, it is preferable to arrange the distance between the plurality of detection probe groups 14 to be as large as possible. That is, for example, when a positional deviation occurs due to a rotational motion, the degree of the positional deviation increases as the rotational center force increases. Therefore, when one of the plurality of detection probe groups 14 coincides with the rotation center (for example, detection probe group 14a in FIG. 6), the other detection probe groups 14 detect detection probes that coincide with the rotation center. It is preferable from the viewpoint of improving the accuracy of detection of force and displacement. From this point of view, in the first embodiment, with respect to the plurality of detection probe groups 14a to 14d, the position where the mutual distance becomes the maximum, specifically, the inspection object 1 (in this embodiment 1, the inspection object 1 is configured. The circuit is formed near the edge of the circuit formation region 5a). More specifically, the distance between the detection probe groups 14a to 14d is determined by arranging the circuit forming region 5a in the vicinity of each vertex corresponding to the rectangular shape of the circuit forming region 5a, that is, the positions corresponding to the four corners of the circuit forming region 5a. Is configured to maximize. In Embodiment 1, since the circuit formation region 5a has a rectangular shape, each of the detection probe groups 14a to 14d has a rectangular diagonal line among the regions near the end of the rectangular shape in the circuit formation region 5a. Trying to place on top. By arranging at a position where it can be applied, a sufficient interval can be secured for a plurality of detection probe groups, and more accurate alignment can be performed.

[0059] Further, the inspection system according to the first embodiment can perform alignment with a simple configuration. Specifically, the inspection system according to the first embodiment does not form a through-hole for visual recognition or the like on the holder substrate 15 as in the prior art, but contacts necessary for electrical connection to the inspection object. Probe 1 with the same structure as probe 13 Only the detection probe group 14 consisting of 9 and 20 is provided. Since a large number of contact probes 13 are inherently provided corresponding to the test pads 11, it is possible to hold the probes 19 and 20 having the same structure as the contact probe 13 newly. It is possible to realize a simple configuration without complicating the structure.

In addition, the positional relationship detection unit 22 connected to the probes 19 and 20 is also a simple one constituted only by the voltage source 21 and the light emitting diode 12. Furthermore, the electrical connection between the voltage source 21 and the light emitting diode 12 and the probes 19 and 20 is also performed using the same structure (lead wire 28) as the contact probe 13 as shown in FIG. It is possible. As described above, the structure of the outer contour unit 2 is not complicated by newly providing the detection probe group 14 and the positional relationship detection unit 22 in the first embodiment. The system enables positioning with a simple configuration.

[0061] In addition, since the inspection system according to the first embodiment employs a configuration that detects a positional shift using the positional relationship detection unit 22, it is possible to perform accurate positioning. Have That is, the positional relationship detection unit 22 uses an objective determination criterion that causes the light emitting diode 12 to emit light only when conduction through the dummy pad 7 occurs in the probes 19 and 20. For this reason, it is possible to perform objective and accurate displacement detection that does not cause a difference depending on the skill level of the user of the inspection system when determining the presence or absence of displacement.

[0062] (Embodiment 2)

Next, an inspection system according to the second embodiment will be described. The second embodiment employs a configuration that enables accurate alignment when inspecting an inspection object that does not include a conductive region corresponding to a dummy pad.

FIG. 8 is a schematic diagram showing the overall configuration of the inspection system according to the second embodiment. As shown in FIG. 8, the inspection system according to the second embodiment has a configuration including the signal processing device 3 and the connection board 4 as in the first embodiment, but does not include a dummy pad. Corresponding to 31, the contact probe 32 has been newly provided with a modified arrangement pattern of the detection probe group 14. In the second embodiment, the actual Components having the same reference numerals as those in the first embodiment have the same structure as the components in the first embodiment unless otherwise specified.

FIG. 9 is a schematic diagram showing the arrangement pattern of the detection probe group 14 on the upper surface of the contact unit 32 and the configuration of the positional relationship detection unit including the detection probe group 14. As shown in FIG. 9, in the second embodiment, the contact probe 13 arranged on the upper surface of the contact unit 32 is arranged according to a pattern corresponding to the arrangement pattern of the test pads 11 in the inspection object 31. .

[0065] On the other hand, in the second embodiment, the dummy pad is not formed on the inspection target 31, and the configuration of the first embodiment in which the detection probe group 14 is arranged corresponding to the dummy pad is adopted. I can't do it. Therefore, in the second embodiment, the test pad 11 is used as the conductive region in the claims, and the predetermined force (the test pad l la in FIG. The detection probe groups 14a to 14d are arranged so as to correspond to ˜l Id (the same applies to the following description). In FIG. 9, test pads lle to lll function as input / output of electrical signals via the corresponding contact probes 13 as in the case of the test pads 11 in the first embodiment.

[0066] Further, the configuration of the positional relationship detection units 33a to 33d is different from the configuration of the positional relationship detection unit 22 in the first embodiment in response to the change in the arrangement mode of the detection probe groups 14a to 14d. Yes. Specifically, the positional relationship detection unit 33 has a configuration in which a switch 34 is newly provided between the probe 19 and the anode of the light emitting diode 12 in addition to the configuration of the first embodiment, so that the positioning can be accurately performed. A configuration is adopted in which the switch 34 is turned on only when determining whether or not the operation is performed.

Next, functions and advantages performed by the positional relationship detection units 33a to 33d in the inspection system according to the second embodiment will be described. In the following description, among the positional relationship detection units 33a to 33d, the positional relationship detection unit 33a will be described as an example, but the positional relationship detection units 33b to 33d are of course the same.

[0068] FIG. 10 is a schematic diagram illustrating an operation in determining whether or not the positional relationship detection unit 33a is a force with which the alignment between the inspection target 31 and the contact unit 32 is accurately performed. FIG. As shown in FIG. 10, the switch 34a is controlled to be in the on state when making a determination regarding alignment. Accordingly, when the test pad 11a and the probes 19a and 20a come into contact with each other, the positional relationship detection unit 33a forms a closed circuit, and the light emitting diode 12a emits light based on the potential supplied by the voltage source 21a. Therefore, the user of the inspection system detects the presence or absence of light emission of the light emitting diode 12a in the same manner as in the first embodiment, so that the alignment between the inspection target 31 and the contact unit 32 is accurately performed. It is possible to determine whether the power is broken. Also in the second embodiment, the detection when the inspection object 31 and the contact unit 32 rotate relatively by setting a predetermined allowable range and providing the plurality of positional relationship detection units 33 is also provided. In addition, it is possible to detect when the inspection object 31 and the contact unit 32 are inclined with respect to each other.

Next, functions and advantages performed by the positional relationship detection units 33a to 33d when performing a predetermined inspection on the inspection object 31 using the inspection system according to the second embodiment will be described. FIG. 11 is a schematic diagram showing the positional relationship detection unit 33a at the time of inspection. As shown in FIG. 11, when the inspection is performed by the inspection system, the electric signal generated by the signal processing device 3 is input / output via the contact probe 13 to the test pad 11a. The Therefore, when the positional relationship detection unit 33a constitutes a closed circuit at the time of inspection, an electrical signal input / output via the contact probe 13 may affect the positional relationship detection unit 33a. For example, when the input electric signal is a high potential, the potential of the test pad 11a also rises, and the potential to be applied functions as the voltage source 21a or the light emitting diode 12a constituting the positional relationship detection unit 33a. There is a possibility of damage.

Accordingly, in the second embodiment, the positional relationship detection unit 33a is newly provided with a switch 34a, and the electrical signal to be input / output is changed by changing the switch 34a to the OFF state at the time of inspection. This prevents the light emitting diode 12a constituting the positional relationship detection unit 33a from being affected. It should be noted that by turning off the switch 34a at the time of inspection, the voltage source 21a and the like constituting the positional relationship detection unit 33a can affect the inspection result. That is, when the switch 34a is kept on during the inspection, noise generated in the positional relationship detection unit 33a is input to the test pad 1la. There is a risk of being. As described above, when the positional relationship detection unit 33a forms a closed circuit at the time of inspection, the noise signal is input to the test pad 1 la in a state of being mixed with the electric signal for inspection, thereby affecting the inspection result. Therefore, in the second embodiment, it is possible to prevent such an adverse effect from occurring by turning off the switch 34a during the inspection.

[0071] (Modification)

Next, a modification of the inspection system according to the second embodiment will be described. In the inspection system according to this modification, in a part of the wiring structure formed on the circuit formation region provided in the inspection object 1, a plurality of test pads are directly electrically connected rather than via the semiconductor chip 8. In the case of having a wiring structure to be used, it is possible to make accurate alignment by making use of the wiring structure that makes use of it.

[0072] FIG. 12 shows probes 19 and 20 constituting a detection probe group on the upper surface of the contact unit 35 (that is, the surface in contact with the inspection object 1) provided in the inspection system that is effective in this modification. It is a schematic diagram shown about this arrangement | positioning aspect. In FIG. 12, as in FIG. 2, etc., in order to easily understand the positional relationship between the contact unit 35 and the inspection object 1 at the time of inspection, the inspection object 1 when ideally aligned ( The structure of the circuit formation region 36) is indicated by a broken line.

[0073] As shown in FIG. 12, on the circuit forming region 36, the test pad 11 electrically connected to the semiconductor chip 8 via the inner lead 9 and the outer lead 10 is provided. The test pads 37a to 37d located at the four corners are directly connected to each other by through wirings 38a and 38b without being electrically connected to the semiconductor chip 8.

[0074] Then, in accordance with the structure of the circuit forming region 36 that works, in this modification, the probe 19a constituting the detection probe group 14a is arranged corresponding to the test pad 37d, and the probe 20a is attached to the test pad 37a. Correspondingly arranged. The probe 19b constituting the detection probe group 14b is arranged corresponding to the test pad 37c, and the probe 20b is arranged corresponding to the test pad 37b.

[0075] Even in the case where a profitable configuration is adopted, as in the second embodiment, accurate inspection is performed. It is possible to align. Hereinafter, the detection probe group 14a (probes 19a, 20a) will be described as an example. Specifically, when the probe 19a is in contact with the test pad 37d and the probe 20a is in contact with the test pad 37a during the inspection, that is, when accurate alignment is performed, the test pads 37a, 37d and the through The probes 19a and 20a are electrically connected through the conductive region constituted by the wiring 38a. Therefore, as in the second embodiment, as long as the switch 34a included in the positional relationship detection unit 33a is kept on, the positional relationship detection unit 33a forms a closed circuit, and the light emitting diode 12a emits light. It is possible to detect that accurate alignment is performed.

[0076] As described above, it is also effective to adopt a configuration in which the probes 19, 20 constituting the same detection probe group 14 are brought into contact with different test pads or dummy pads. In other words, even if different test pads, etc., are configured so that different test pads, etc. are maintained at the same potential, it should be considered that the conductive region in the claims is formed as a whole. Therefore, accurate alignment can be performed based on the same mechanism as in the first and second embodiments.

[0077] (Embodiment 3)

Next, an inspection system according to the third embodiment will be described. The inspection system according to the third embodiment has a configuration in which inspection is performed on a plurality of circuit formation regions at a time, and a detection system that enables accurate alignment is realized.

FIG. 13 is a schematic diagram showing an arrangement pattern of contact probes 13 and detection probe groups 14 arranged on the holder substrate in the inspection system according to the third embodiment. In addition, in FIG. 13, as in FIGS. 2 and 9, in order to easily understand the positional relationship, the positions of the components of the inspection target 1 when ideally aligned are indicated by broken lines. To do. Although not shown in the drawings, the detection system according to the third embodiment is provided with the signal processing device 3 and the connection board 4 and has the same names as the constituent elements in the first and second embodiments. Those denoted by reference numerals have the same structure 'function as the constituent elements in the first and second embodiments unless otherwise specified.

As shown in FIG. 13, Embodiment 3 employs a configuration in which a plurality of circuit formation regions 5a are inspected in one inspection. In response to adopting a profitable configuration, The holder substrate 42 provided in the contact unit 41 employs a configuration in which the area of the upper surface is enlarged so as to be in contact with the plurality of circuit formation regions 5a, and the test pads 11 provided in the plurality of circuit formation regions 5a as shown in FIG. The contact probe 13 is arranged corresponding to

In the third embodiment, the detection probe groups 14a to 14d are also arranged at positions corresponding to the plurality of circuit formation regions 5a. Specifically, the detection probe groups 14a and 14b are arranged at positions corresponding to the dummy pads 7a and 7b as in the first embodiment, while the detection probe groups 14c and 14d are dummy pads 7c, Instead of corresponding to 7d, it is arranged at a position corresponding to dummy pads 7g and 7h provided in another adjacent circuit formation region 5a.

[0081] In the third embodiment, since the number of dummy pads 7 is larger than the number of detection probe groups 14a to 14d, a plurality of arrangement patterns of detection probe groups 14a to 14d can be taken. . In such a case, an arbitrary arrangement pattern may be used. However, in the third embodiment, an arrangement pattern in which the detection probe groups 14a to 14d are most separated from each other is adopted. As shown in the examples of FIGS. 6 and 7, when a plurality of detection probe groups 14 are used, the detection accuracy of the positional deviation improves as the distance between them increases.

Note that when the number of dummy pads 7 exceeds the number of detection probe groups 14 as in the third embodiment, the dummy pads 7 corresponding to the detection probe groups 14 are selected based on the area. It's also good. For example, when it is used as a driver IC for a TCP power liquid crystal panel used as the inspection target 1 (an IC that controls the selection and supply potential of the pixel electrode arranged in the liquid crystal panel), it must be The input terminal force used for inputting the video signal or the like usually has a larger area than the output terminal connected to the liquid crystal panel. Specifically, when the dummy pads 7a, 7b, 7e, and 7f are used as input terminals and the dummy pads 7c, 7d, 7g, and 7h are used as output terminals, the detection probe groups 14a to 14d are connected to dummy nodes having a large area. It is also preferable to arrange so as to correspond to 7a, 7b, 7e, 7f.

[0083] While the present invention has been described using the first to third embodiments, the present invention should not be construed as being limited to the above-described embodiments. Variations can be conceived. For example, in the embodiment, it is within the scope of the claims. It is not necessary to limit to the configuration that uses a contact probe as an input / output terminal and a detection probe group as a detection terminal group. This structure can be used as a group of input / output terminals and detection terminals. In addition, although a light emitting diode is used as an example of a passive element, it is also effective to adopt another configuration. For example, it is also effective to use a voice generation mechanism as a passive element to inform the user of positional information as voice information. Furthermore, regarding the inspection target, the present invention can be applied to an inspection system used as an inspection target for general integrated circuits that need not be limited to the so-called TCP.

Industrial applicability

As described above, the contact unit and the inspection system according to the present invention relate to an inspection object in which a plurality of conductive regions including a wiring structure used for input or output of an electric signal are formed on the surface. This is useful when electrical connection is made, and is particularly suitable when performing an operation characteristic inspection such as TCP in which a semiconductor chip is mounted on a flexible film substrate having a wiring structure formed on the surface.

Claims

The scope of the claims

[1] A contact unit that performs electrical connection to the wiring structure with respect to an inspection object in which a plurality of conductive regions including a wiring structure used for input or output of an electric signal are formed on a surface,

An input / output terminal arranged corresponding to an arrangement pattern of the wiring structure, electrically connected to the corresponding wiring structure, and performing at least one of input or output of a predetermined electric signal to the wiring structure;

A position of the contact unit and the inspection object according to presence or absence of conduction between the plurality of terminals formed by a plurality of terminals arranged corresponding to the predetermined conductive region. A group of detection terminals used for detecting the relationship;

A holder substrate for holding the input / output terminals and the detection terminal group;

A contact unit comprising:

[2] A plurality of the detection terminal groups are arranged corresponding to the plurality of conductive regions, and the plurality of detection terminal groups correspond to the vicinity of different end portions of the inspection target that are in contact with the contact unit. The contact unit according to claim 1, wherein the contact unit is disposed at a position.

[3] Of the object to be inspected, the portion that is electrically connected to the contact unit has a rectangular shape,

A plurality of the detection terminal groups are arranged corresponding to the plurality of conductive regions, and the plurality of detection terminal groups are arranged in regions corresponding to the rectangular diagonal lines or in the vicinity of the vertices, respectively. The contact unit according to claim 1.

[4] A plurality of terminals that are electrically connected to the plurality of terminals forming the detection terminal group, and are connected to the outside of the connector according to the presence or absence of conduction between the plurality of terminals through the conductive region corresponding to the detection terminal group. 2. The contact unit according to claim 1, further comprising a positional relationship detecting means for detecting a positional relationship between the unit and the inspection object.

[5] The positional relationship detection means includes:

A voltage source for supplying a predetermined voltage;

Connected in series with the voltage source, the plurality of terminals are conducted through the conductive region 5. The contact unit according to claim 4, further comprising a passive element that forms a closed circuit with the voltage source and performs a predetermined action based on a potential supplied by the voltage source. .

6. The contact unit according to claim 5, wherein the passive element is a light emitting diode.

7. The contact unit according to claim 1, wherein the detection terminal group is arranged corresponding to a dummy pad that is electrically insulated from the wiring structure in the conductive region.

[8] The detection terminal group is arranged corresponding to a wiring structure in the conductive region,

The positional relationship detection means further includes switch means capable of stopping voltage supply to the passive element when an electrical signal is input or output via the input / output terminal to the corresponding wiring structure. The contact unit according to claim 1, wherein:

[9] With respect to an inspection object in which a plurality of conductive regions including a wiring structure used for at least one of input and output of an electric signal are formed on the surface, input / output of the electric signal is performed through an electrical connection to the wiring structure. An inspection system for performing an inspection by performing the inspection, wherein the inspection system is arranged corresponding to the wiring structure, electrically connected to the corresponding wiring structure, and at least a predetermined electric signal is input or output to the wiring structure. It is formed by an input / output terminal that performs one and a plurality of terminals arranged corresponding to the predetermined conductive region.

A detection terminal group used for detecting the positional relationship between the contact unit and the inspection object based on the presence or absence of conduction between the plurality of terminals via the corresponding conductive region, and the input / output terminal and the detection terminal group. A contact unit comprising a holder substrate for holding;

A signal processing device that generates an electrical signal used for an inspection of the inspection object and analyzes the electric signal output by the inspection object;

An inspection system comprising: a connection board that electrically connects the signal processing device and the contact unit.