CN108957807A - A kind of binding detection system and display panel - Google Patents
A kind of binding detection system and display panel Download PDFInfo
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- CN108957807A CN108957807A CN201810897140.1A CN201810897140A CN108957807A CN 108957807 A CN108957807 A CN 108957807A CN 201810897140 A CN201810897140 A CN 201810897140A CN 108957807 A CN108957807 A CN 108957807A
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- binding
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
Abstract
The present invention provides a kind of binding detection system, including substrate and including the chipset of at least one chip；Substrate includes multiple binding pads, and each binding pad is for the input terminal of the binding detection circuit of corresponding chip to be electrically connected with output end；Chip detects binding state by corresponding binding detection circuit, and multiple adjacent binding detection circuits are connected and form at least one set of binding detection circuit string by a plurality of conducting wire；Chipset further includes at least one set of sending module, receiving module and abnormal feedback module, and a sending module sends the input terminal of detection input signal to a binding detection circuit string；The corresponding detection output signal that abnormal feedback module does not normally receive the output end output of binding detection circuit string according to receiving module issues error signal to self-test front end system.The present invention also provides a kind of display panels.Binding detection system of the invention and display panel can be used for the automatic detection of the chip bonding of display panel, improve the safety that display panel uses.
Description
Technical field
The present invention relates to the detection field of display panel more particularly to a kind of binding detection system and display panels.
Background technique
With the development of car-mounted display, more and more liquid crystal display panels are applied on vehicle, especially instrument board
Gradually shown by showing to be converted to by mechanical indicator by liquid crystal display panel.The information that instrument board is shown is for safe driving
There is very important effect, if problem occurs for liquid crystal display panel itself and show wrong information, driver be will do it
Mistake judgement and traffic accidents may be caused.
Therefore, liquid crystal display panel itself will carry out every detection, once it goes wrong and should notify in time by detecting detection
Onboard system, onboard system remind driver to avoid danger to accomplish to cope in advance with sound or other means.Wherein, existing
It is different that the detection content of some liquid crystal display panel detections specifically includes that whether the display system of 1. detection liquid crystal display panels sends
The signals such as normal HV, DE, CLOCK；2. whether the circuit temperature for detecting liquid crystal display panel is excessively high；3. detecting liquid crystal display panel
With the presence or absence of glass breakage.
But vehicle is influenced by high temperature, low temperature, vibration etc. during using many years, may make liquid crystal
It is bad to show that the binding of the chip on panel occurs, exception occurs in the display in turn resulting in liquid crystal display panel, to peace occur
Full hidden danger.
Summary of the invention
In view of this, it is an object of that present invention to provide a kind of binding detection system, for solving the binding shape of detection chip
The problem of state.
Specifically, the embodiment of the present invention provides a kind of binding detection system, including substrate and including at least one chip
Chipset.The substrate includes multiple binding pads, and each binding pad is used to the binding of the corresponding chip detecting electricity
The input terminal on road is electrically connected with output end；Each chip of the chipset is bundled in the substrate by corresponding binding pad
On, and corresponding binding state is detected by the corresponding binding detection circuit, a plurality of conducting wire is by multiple adjacent institutes
Binding detection circuit series connection is stated, and forms at least one set of binding detection circuit string.The chipset further includes at least one set of transmission
Module, receiving module and abnormal feedback module, a sending module send detection input signal to a binding detection circuit string
Input terminal, the exception feedback module do not normally receive the output of corresponding binding detection circuit string in the receiving module
Error signal is issued when holding the corresponding detection output signal of output to self-test front end system.
Further, the binding detection circuit includes two test sides, is the input of the binding detection circuit respectively
End and output end, described two test sides are connected with the both ends of corresponding binding pad.
Further, the binding pad is rectangle.
Further, a plurality of conducting wire connects whole binding detection circuits of whole chips of the chipset
It is connected into a group binding detection circuit string.
Further, a plurality of conducting wire connects the binding detection circuit for belonging to same chip more to obtain one by one
Group binding detection circuit string.
Further, the binding detection circuit being connect with the sending module and the binding being connect with receiving module inspection
Slowdown monitoring circuit is on the same chip.
Further, the conducting wire for the binding detection circuit that connection belongs to same chip is chip interior route.
Further, the detection input signal is a high level signal or a pulse signal.
Further, the substrate is array of display substrate or touch base plate.
The embodiment of the present invention also provides a kind of display panel, including binds detection system as described above.
Binding detection system provided by the invention and display panel, sending module send detection input signal to bind detection
The input terminal of circuit string, conduction when chip group binding between binding detection circuit adjacent on the binding pad and chip of substrate
Route is serially connected road into a line, and the output end output detection of binding detection circuit string outputs signal to receiving module, abnormal
Feedback module can normally receive corresponding detection output signal according to receiving module to judge chip bonding qualification, and can basis
Receiving module does not normally receive corresponding detection output signal and issues error signal to self-test front end system, can be used for display surface
The automatic detection of the chip bonding of plate improves the safety that display panel uses.
For above and other objects, features and advantages of the invention can be clearer and more comprehensible, preferred embodiment is cited below particularly,
And cooperate institute's accompanying drawings, it is described in detail below.
Detailed description of the invention
Fig. 1 is the circuit frame figure for the binding detection system that first embodiment of the invention provides.
Fig. 2 is the work flow diagram for the binding detection system that first embodiment of the invention provides.
Fig. 3 is the circuit connection diagram for the binding detection system that second embodiment of the invention provides.
Fig. 4 is the circuit connection diagram for the binding detection system that third embodiment of the invention provides.
Fig. 5 is the circuit connection diagram for the binding detection system that fourth embodiment of the invention provides.
Specific embodiment
Further to illustrate that the present invention is the technical means and efficacy realizing expected purpose and being taken, below in conjunction with attached drawing
And preferred embodiment, to specific embodiment, method, the step of binding detection system proposed according to the present invention and display panel
Suddenly, structure, feature and effect, detailed description is as follows.
For the present invention aforementioned and other technology contents, feature and effect refer to the preferable reality of schema in following cooperation
Applying in the detailed description of example to be clearly presented.By the explanation of specific embodiment, when expection can be reached to the present invention
The technical means and efficacy that purpose is taken be able to more deeply and it is specific understand, however institute's accompanying drawings be only to provide with reference to
Purposes of discussion is not intended to limit the present invention.
First embodiment
Fig. 1 is the circuit frame figure for the binding detection system that first embodiment of the invention provides.As shown in Figure 1, this implementation
The binding detection system of example includes substrate 100 and the chipset 200 including at least one chip 210.Wherein, substrate 100 includes
Multiple binding pads 101, each binding pad 101 be used for the input terminal of the binding detection circuit 211 of corresponding chip 210 and
Output end electrical connection；Chipset 200 includes at least one chip 210, and each chip 210 is tied up by corresponding binding pad 101
It is fixed and corresponding binding state to be detected by corresponding binding detection circuit 211 on the substrate 100, wherein bind pad 101 and
Binding detection circuit 211 is correspondingly that as in the example of figure 1, substrate 100 may include multiple binding pads 101 (in figure
Show 4), chipset 200 includes multiple chips 210 (2 are shown in figure), wherein each chip 210 is by corresponding more
A binding pad 101 (2 are shown in figure) is bound on the substrate 100, and each chip 210 includes and corresponding multiple bindings
The corresponding multiple binding detection circuits 211 (2 are shown in figure) of pad 101 (2 are shown in figure), wherein chipset 200
Multiple binding detection circuits 211 (4 are shown in figure) and substrate 100 multiple binding pads 101 (4 are shown in figure) it is mutual
It corresponds.It will be appreciated by persons skilled in the art that can according to need the number of setting binding pad 101, chipset
The number for the binding detection circuit 211 that 200 numbers and chip 210 including chip 210 include.Binding detection circuit 211 can be with
For detecting the binding state at corresponding binding pad 101, such as binding detection circuit 211 can be used for receiving detection input
Simultaneously the output one when binding qualification detects output signal to signal accordingly, and cannot export accordingly when binding unqualified
Output signal.A plurality of conducting wire 212 connects multiple adjacent binding detection circuits 211, and forms at least one set of binding inspection
Slowdown monitoring circuit string.As in the example of figure 1, conducting wire 212 can be used for two binding detection circuits 211 of same chip 210,
The two binding detection circuits 211 that can be used for connecting different chips 210, are connected with this and are connected into a binding detection circuit string.
Chipset 200 further includes at least one set of sending module 220, receiving module 230 and abnormal feedback module 240, a sending module 220
The input terminal of detection input signal to a binding detection circuit string is sent, abnormal feedback module 240 is not normal in receiving module 230
Error signal is issued when receiving the corresponding detection output signal of the output end output of corresponding binding detection circuit string to certainly
Examine front end system (not shown in figure 1).
In addition, the conducting wire 212 between two adjacent binding detection circuits 211 of the present embodiment is not limited to be two
Route between a adjacent binding detection circuit 211 on chip 210, can also according to binding detection circuit 211 with it is corresponding
The connected relationship of pad 101 is bound, conducting wire 212 is also possible between two adjacent binding detection circuits 211 in substrate
Route on 100 etc..Below with conducting wire 212 be between two adjacent binding detection circuits 211 on chip 210
It is illustrated for route.
In one embodiment, a plurality of conducting wire 212 detects whole bindings of whole chips 210 of chipset 200
The series connection of circuit 211 is connected into a group binding detection circuit string.
In one embodiment, it the binding detection circuit 211 that is connect with sending module 220 and is connect with receiving module 230
Binding detection circuit 211 on same chip 210.And in one embodiment, sending module 220 and receiving module 230 exist
On same chip.
In one embodiment, a plurality of conducting wire 212 can will belong to the binding detection circuit 211 of same chip 210
It is connected one by one to obtain multiple groups binding detection circuit string.
In one embodiment, it is core that connection, which belongs to the conducting wire 212 of the binding detection circuit 211 of same chip 210,
210 internal wiring of piece.
In one embodiment, detection input signal can be a high level signal or a pulse signal.
In one embodiment, substrate 100 can be array of display substrate or touch base plate.
In one embodiment, substrate 100 can be glass substrate.
Specifically, when binding the binding qualification at pad 101, the corresponding detection for binding the output of detection circuit 211 is defeated
What signal and received detection input signal can be identical perhaps same nature out is for example all high level or is all pulse
Signal, then when the binding accordingly at the corresponding all binding pads 101 of binding detection circuit string is all qualified, corresponding binding inspection
Detection output signal and the received detection input signal of slowdown monitoring circuit string output can be it is identical or same nature, such as together
It for high level or is all pulse signal.
Specifically, Fig. 2 is the work flow diagram for the binding detection system that first embodiment of the invention provides, the present embodiment
Workflow can refer to Fig. 2, and workflow is: the transmission detection of sending module 220 input signal (such as high level or pulse letter
Number) to the input terminal of a binding detection circuit string, the binding pad 101 and chipset 200 of substrate 100 when chipset 200 is bound
Conducting wire 212 between upper adjacent binding detection circuit 211 is serially connected road into a line, then detecting input signal can be with
Binding pad 101 is first passed through when chip 210 is bound and transmits one section on the substrate 100, then by conducting wire 212 in chip
On 210 transmit one section, and repeat on the substrate 100 on chip 210 staggeredly transmit.It is each according to what is be connected to bind detection circuit string
The binding state at the corresponding binding pad 101 of detection circuit 211 is bound in the output end output phase of binding detection circuit string
The detection answered outputs signal to receiving module 230, and whether abnormal feedback module 240 can normally receive according to receiving module 230
Corresponding detection output signal (such as high level or pulse signal), judges whether chip 210 is tied up in binding pad 101 accordingly
Fixed qualification, and corresponding detection output signal (such as high level or pulse letter can not be normally received according to receiving module 230
Number) when issue error signal to self-test front end system, and on can also being carried out again automatically when judging that chip 210 binds qualification
The workflow stated.Specifically, when the binding of corresponding binding pad 101 is qualified, then corresponding each binding detection is electric
Road 211 can receive corresponding detection input signal (such as high level or pulse signal) and export corresponding detection output signal
(such as high level or pulse signal), the then output end for binding detection circuit string can export a corresponding detection output signal
(such as high level or pulse signal) to receiving module 230, abnormal feedback module 240 is normally received according to receiving module 230
Corresponding detection output signal (such as high level or pulse signal) judges that chip 210 is corresponding in binding detection circuit string
It binds and binds qualification at pad 101.Specifically, the binding in corresponding binding pad 101 is all unqualified or part is unqualified
When, then binding detection circuit 211 cannot export corresponding detection output signal (such as high level or pulse signal) accordingly, from
And prevent the output end for binding detection circuit string from exporting corresponding detection output signal (such as high level or pulse signal)
To receiving module 230, receiving module 230 according to that cannot receive corresponding detection output signal, (such as believe by high level or pulse
Number) judge to bind binding of the corresponding chip 210 of detection circuit string at binding pad 101 be all unqualified or part not
Qualification, abnormal feedback module 240 can not normally receive corresponding detection output signal according to receiving module 220 and issue mistake letter
Number to self-test front end system.Wherein, the error signal that abnormal feedback module 240 issues can be one from high level to low level
Signal.To which the binding detection system of the present embodiment realizes the detection of the binding to chip 210, and is displayed for face
The automatic detection that the chip 210 of plate is bound, improves the safety that display panel uses.
The binding detection system of the present embodiment, sending module 220 send detection input signal to binding detection circuit string
Input terminal, binding detection circuit 211 adjacent on the binding pad 101 and chipset 200 of substrate 100 when chipset 200 is bound
Between conducting wire be serially connected road into a line, the output end output detection of binding detection circuit string outputs signal to reception
Module 230, abnormal feedback module 240 can normally receive corresponding detection output signal according to receiving module 230 to judge core
Piece 210 binds qualification, and can not normally receive corresponding detection output signal according to receiving module 230 and issue error signal extremely
Self-test front end system, therefore be convenient to carry out the automatic detection of chip bonding, it may also be used for the chip 210 of display panel is bound
Automatic detection, improve the safety that display panel uses.
Second embodiment
Fig. 3 is the circuit connection diagram for the binding detection system that second embodiment of the invention provides.The present embodiment and first is in fact
It is essentially identical to apply example, the difference is that: chipset 200 only has a chip 210；Binding detection circuit 211 includes two inspections
Survey end 211a and 211b, respectively be bind detection circuit 211 input terminal and output end, two test side 211a and 211b with it is right
The both ends for the binding pad 101 answered are connected.
In one embodiment, binding pad 101 is rectangle.
In one embodiment, the conducting wire 212 for connecting and binding detection circuit 211 can all be the inside of chip 210
Route.
Specifically, the detection process of the present embodiment is: chipset 200 only includes one group of sending module 220, receiving module
230 tie up with abnormal feedback module 240, the transmission detection of sending module 220 input signal (such as high level or pulse signal) to one
The binding detection circuit 211 and the disjunct test side 211a of conducting wire 212 of the starting of regular inspection slowdown monitoring circuit string, chipset 200
Conducting wire 212 when binding between binding detection circuit 211 adjacent on the binding pad 101 and chipset 200 of substrate 100
It is serially connected road into a line, then binding pad 101 can be first passed through in substrate when chip 210 is bound by detecting input signal
Transmit one section on 100, then transmit one section on chip 210 by conducting wire 212, and repeatedly on the substrate 100 with chip 210
It is upper staggeredly to transmit.And it binds at corresponding binding pad 101 of the detection circuit string according to connected each binding detection circuit 211
Binding state binds detection circuit string and connects in the corresponding detection output signal of output end output of binding detection circuit string
All binding detection circuit 211 and in last binding detection circuit 211 and the disjunct test side 211b of conducting wire 212
The corresponding detection of output outputs signal to receiving module 230, and whether abnormal feedback module 240 can normal according to receiving module 230
Corresponding detection output signal (such as high level or pulse signal) is received, judges chip 210 in binding pad 101 accordingly
Qualification whether is bound, and can not normally receive corresponding detection output signal (such as high level or arteries and veins according to receiving module 230
Rush signal) when issue error signal to self-test front end system, and when judging that chip 210 binds qualification can also automatically again into
The above-mentioned workflow of row.Specifically, when the binding of corresponding binding pad 101 is qualified, then corresponding each binding inspection
Slowdown monitoring circuit 211 can receive corresponding detection input signal (such as high level or pulse signal) by a test side 211a simultaneously
Corresponding detection output signal (such as high level or pulse signal) is exported in another test side 211b, then binds detection circuit string
Output end can export corresponding detection output signal (such as high level or pulse signal) to receiving module 230, it is different
Normal feedback module 240 according to receiving module 230 normally receives corresponding detection output signal, and (such as high level or pulse are believed
Number) judge that chip 210 binds qualification at the corresponding binding pad 101 of binding detection circuit string.Specifically, corresponding
The binding for binding pad 101 is all unqualified or when part is unqualified, then binding detection circuit 211 is unable to output phase and answers accordingly
Detection output signal (such as high level or pulse signal) so that binding detection circuit string output end be unable to output phase
The detection output signal (such as high level or pulse signal) answered is to receiving module 230, and receiving module 230 is according to cannot receive
Corresponding detection output signal (such as high level or pulse signal) judges that binding the corresponding chip 210 of detection circuit string exists
Binding at binding pad 101 is all unqualified or part is unqualified, and abnormal feedback module 240 can be according to receiving module 220 not
It normally receives corresponding detection output signal and issues error signal to self-test front end system.Wherein, abnormal feedback module 240 is sent out
Error signal out can be a signal from high to low level.In one embodiment, abnormal feedback module 240 is such as
It can be set shown in Fig. 3 between two adjacent binding pads 101.To which the binding detection system of the present embodiment realizes
To the binding detection at whole bindings of single-chip 210, and it is displayed for the automatic detection of the binding of chip 210 of panel,
Improve the safety that display panel uses.
The binding detection system of the present embodiment, sending module 220 send detection input signal to binding detection circuit string
Input terminal, binding detection circuit 211 adjacent on the binding pad 101 and chipset 200 of substrate 100 when chipset 200 is bound
Between conducting wire be serially connected road into a line, the output end output detection of binding detection circuit string outputs signal to reception
Module 230, abnormal feedback module 240 can normally receive corresponding detection output signal according to receiving module 230 to judge core
Piece 210 binds qualification, and can not normally receive corresponding detection output signal according to receiving module 230 and issue error signal extremely
Self-test front end system, therefore be convenient to carry out the automatic detection that single-chip 210 is bound, it may also be used for the single-chip of display panel
The automatic detection of 210 bindings, improves the safety that display panel uses.
3rd embodiment
Fig. 4 is the circuit connection diagram for the binding detection system that third embodiment of the invention provides.The present embodiment and second is in fact
It is essentially identical to apply example, the difference is that: chipset 200 includes multiple chips 210；A plurality of conducting wire 212 is by chipset 200
Whole binding detection circuits 211 series connection of whole chips 210 be connected into a group binding detection circuit string.
In one embodiment, it the binding detection circuit 211 that is connect with sending module 220 and is connect with receiving module 230
Binding detection circuit 211 on same chip 210.And in one embodiment, sending module 220 and receiving module 230 exist
On same chip.
In one embodiment, the connection type for connecting the conducting wire 212 of two binding detection circuits 211 is also possible to
The opposite end that two on the substrate 100 corresponding with the two binding detection circuits 211 bind pad 101 is led
Electric line 212 connects.Such as in the present embodiment, chipset 200 as shown in Figure 4 includes 3 chips 210, in 3 chips 210
Between have the connection of the conducting wire 212 that two of two chips 210 binding detection circuits 211 are belonging respectively at 4, connection side
Formula is also possible to two on the substrate 100 corresponding with two binding detection circuits 211 binding the opposite of pad 101
End carries out conducting wire 212 and connects, more specifically, can be to be electrically connected two binding detection circuits 211 two
The opposite end that pad 101 is bound at corresponding two on the substrate 100 of a test side 211a and 211b carries out conducting wire
212 connections.In addition, the present embodiment is also possible to belong to the conducting wire of two binding detection circuits 211 of the same chip 210
212 connection, connection type are also possible to two on the substrate 100 corresponding with two binding detection circuits 211
The opposite end of a binding pad 101 carries out conducting wire 212 and connects, more specifically, can be two binding detection circuits 211
Pad 101 is bound at corresponding two on the substrate 100 of two test sides 211a and 211b being electrically connected
Opposite end carries out conducting wire 212 and connects.
Specifically, the detection process of the present embodiment is: chipset 200 includes one group of sending module 220, receiving module 230
With abnormal feedback module 240, a sending module 220 sends detection input signal (such as high level or pulse signal) to binding inspection
The binding detection circuit 211 and the disjunct test side 211a of conducting wire 212 of the starting of slowdown monitoring circuit string, chipset 200 are bound
When substrate 100 binding pad 101 and chipset 200 on adjacent binding detection circuit 211 between 212 phase of conducting wire
It mutually is connected into a route, then binding pad 101 can be first passed through in substrate 100 when chip 210 is bound by detecting input signal
Upper one section of transmission, then one section is transmitted on chip 210 by conducting wire 212, and repeat on the substrate 100 and on chip 210
Staggeredly transmit.And detection circuit string is bound according to tying up at the corresponding binding pad 101 of connected each binding detection circuit 211
Determine state in the corresponding detection output signal of output end output of binding detection circuit string, i.e. binding detection circuit string has been connected institute
Some binding detection circuits 211 are simultaneously defeated in last binding detection circuit 211 and the disjunct test side 211b of conducting wire 212
Corresponding detection outputs signal to receiving module 230 out, and whether abnormal feedback module 240 can normally connect according to receiving module 230
Corresponding detection output signal (such as high level or pulse signal) is received, judges that chip 210 is in binding pad 101 accordingly
No binding is qualified, and corresponding detection output signal (such as high level or pulse can not be normally received according to receiving module 230
Signal) when issue error signal to self-test front end system, and can also be carried out again automatically when judging that chip 210 binds qualification
Above-mentioned workflow.Specifically, when the binding of corresponding binding pad 101 is qualified, then corresponding each binding detection
Circuit 211 can be received by a test side 211a corresponding detection input signal (such as high level or pulse signal) and
Another corresponding detection output signal (such as high level or pulse signal) of test side 211b output, then bind detection circuit string
Output end can export corresponding detection output signal (such as high level or pulse signal) to receiving module 230, exception
Feedback module 240 normally receives corresponding detection output signal (such as high level or pulse signal) according to receiving module 230
Judge that binding the corresponding chip 210 of detection circuit string binds binding qualification at pad 101.Specifically, in corresponding binding
When the binding of pad 101 is all unqualified or part is unqualified, then binding detection circuit 211 cannot export corresponding inspection accordingly
It surveys output signal (such as high level or pulse signal), so that the output end of binding detection circuit string cannot export accordingly
Output signal (such as high level or pulse signal) is detected to receiving module 230, receiving module 230 is corresponding according to that cannot receive
Detection output signal (such as high level or pulse signal) judge chip 210 in the corresponding binding of binding detection circuit string
Binding at pad 101 is all unqualified or part is unqualified, and abnormal feedback module 240 can be abnormal according to receiving module 220
It receives corresponding detection output signal and issues error signal to self-test front end system.Wherein, abnormal feedback module 240 issues
Error signal can be a signal from high to low level, and in one embodiment, and abnormal feedback module 240 is as schemed
It can be set shown in 3 between two adjacent binding detection circuits 211.Therefore, each chip 210 can pass through respective hair
Module 220, receiving module 230 and abnormality detection module are sent, it is corresponding in binding detection circuit string to detect respective chip 210
Bind the binding state at pad 101.To which the binding detection system of the present embodiment realizes the whole to multi-chip 210
Binding detection at binding, and the automatic detection that the chip 210 for being displayed for panel is bound, improve display panel use
Safety.
The binding detection system of the present embodiment, sending module 220 send detection input signal to binding detection circuit string
Input terminal, binding detection circuit 211 adjacent on the binding pad 101 and chipset 200 of substrate 100 when chipset 200 is bound
Between conducting wire be serially connected road into a line, the output end output detection of binding detection circuit string outputs signal to reception
Module 230, abnormal feedback module 240 can normally receive corresponding detection output signal according to receiving module 230 to judge core
Piece 210 binds qualification, and can not normally receive corresponding detection output signal according to receiving module 230 and issue error signal extremely
Self-test front end system, therefore be convenient to carry out the automatic detection that multi-chip 210 is bound, it may also be used for the chip of display panel
The automatic detection of 210 bindings, improves the safety that display panel uses.
Fourth embodiment
Fig. 5 is the circuit connection diagram for the binding detection system that fourth embodiment of the invention provides.The present embodiment and third are real
Apply that example is essentially identical, the difference is that: a plurality of conducting wire 212 passes through the binding detection electricity that will only belong to same chip 210
Road 211 is connected one by one to obtain multiple groups binding detection circuit string.
Specifically, the detection process of the present embodiment is: chipset 200 includes multiple groups sending module 220, receiving module 230
With abnormal feedback module 240, each chip 210 includes one group of sending module 220, receiving module 230 and abnormal feedback module
240, the corresponding sending module 220 of each chip 210 sends detection input signal (such as high level or pulse signal) to the core
The binding detection circuit 211 of the starting of binding detection circuit string on piece 210 and the disjunct test side of conducting wire 212
211a, when chip 210 is bound between binding detection circuit 211 adjacent on the binding pad 101 and chip 210 of substrate 100
Conducting wire 212 is serially connected road into a line, then binding pad can be first passed through when chip 210 is bound by detecting input signal
101 transmit one section on the substrate 100, then one section are transmitted on chip 210 by conducting wire 212, and repeat on the substrate 100
With staggeredly transmission on chip 210.And it binds detection circuit string and is welded according to the corresponding binding of connected each binding detection circuit 211
The binding state of Pan101Chu is in the corresponding detection output signal of output end output of binding detection circuit string, i.e. binding detection electricity
Road connected one single chip 210 all binding detection circuits 211 and in last binding detection circuit 211 and conductor wire
The corresponding detection of the disjunct test side 211b in road 212 output outputs signal to receiving module 230, and abnormal feedback module 240 can
Corresponding detection output signal (such as high level or pulse signal) whether is normally received according to receiving module 230, judges core
Whether piece 210 binds qualification in binding pad 101 accordingly, and can not normally receive corresponding inspection according to receiving module 230
Error signal is issued when surveying output signal (such as high level or pulse signal) to self-test front end system, and is judging chip 210
Binding can also carry out above-mentioned workflow when qualified again automatically.Specifically, equal in the binding of corresponding binding pad 101
When qualified, then corresponding each binding detection circuit 211 can receive corresponding detection input letter by a test side 211a
Number (such as high level or pulse signal) and another test side 211b export corresponding detection output signal (such as high level or
Pulse signal), then bind detection circuit string output end can export a corresponding detection output signal (such as high level or
Pulse signal) to receiving module 230, abnormal feedback module 240 normally receives corresponding detection output according to receiving module 230
It is qualified that signal judges that chip 210 is bound at the corresponding binding pad 101 of binding detection circuit string.Specifically, in correspondence
Binding pad 101 binding it is all unqualified or when part is unqualified, then binding detection circuit 211 is unable to output phase accordingly
The detection output signal (such as high level or pulse signal) answered, so that the output end of binding detection circuit string cannot export
Corresponding detection output signal (such as high level or pulse signal) is to receiving module 230, and receiving module 230 is according to cannot receive
Judge that chip 210 is corresponding in binding detection circuit string to corresponding detection output signal (such as high level or pulse signal)
Binding pad 101 at binding it is all unqualified or part is unqualified, abnormal feedback module 240 can be according to receiving module 220
Corresponding detection output signal is not normally received issues error signal to self-test front end system.Wherein, abnormal feedback module 240
The error signal of sending can be a signal from high to low level, and in one embodiment, abnormal feedback module
240 can be set between two adjacent binding detection circuits 211 as shown in Figure 3.Therefore, each chip 210 can pass through
Respective sending module 220, receiving module 230 and abnormality detection module detect respective chip 210 in binding detection circuit string
Binding state at corresponding binding pad 101.In the present embodiment, because each chip 210 individually has a connection institute
In the binding detection circuit string of all binding detection circuits 211 of chip 210, thus, the binding detection system of the present embodiment can
To realize that the binding to each chip 210 of multi-chip 210 detects, and the chip 210 for being displayed for panel bind from
Dynamic detection, improves the safety that display panel uses.
The binding detection system of the present embodiment, sending module 220 send detection input signal to binding detection circuit string
Input terminal, binding detection circuit 211 adjacent on the binding pad 101 and chipset 200 of substrate 100 when chipset 200 is bound
Between conducting wire be serially connected road into a line, the output end output detection of binding detection circuit string outputs signal to reception
Module 230, abnormal feedback module 240 can normally receive corresponding detection output signal according to receiving module 230 to judge core
Piece 210 binds qualification, and can not normally receive corresponding detection output signal according to receiving module 230 and issue error signal extremely
Self-test front end system, therefore be convenient to carry out the automatic detection that multi-chip 210 is bound, it may also be used for the chip of display panel
The automatic detection of 210 bindings, improves the safety that display panel uses.
5th embodiment
The present embodiment provides a kind of display panels comprising the binding detection system of an above-mentioned embodiment.
The display panel of the present embodiment, sending module 220 send detection input signal to the input for binding detection circuit string
End, when chipset 200 is bound between binding detection circuit 211 adjacent on the binding pad 101 and chipset 200 of substrate 100
Conducting wire be serially connected road into a line, the output end output detection of binding detection circuit string outputs signal to receiving module
230, abnormal feedback module 240 can normally receive corresponding detection output signal according to receiving module 230 to judge chip 210
Binding is qualified, and can not normally receive corresponding detection output signal according to receiving module 230 and issue error signal to self-test
Front end system can be used for the automatic detection that the chip 210 of display panel is bound, improve the safety that display panel uses.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, though
So the present invention has been disclosed as a preferred embodiment, however is not limited to invent, any person skilled in the art,
It is not departing within the scope of inventive technique scheme, when the technology contents using the disclosure above make a little change or are modified to equivalent
The equivalent embodiment of variation, but it is all without departing from inventive technique scheme content, and the technical spirit according to invention is to above embodiments
Made any simple modification, equivalent change and modification, all of which are still within the scope of the technical scheme of the invention.
Claims (10)
1. a kind of binding detection system, the binding detection system includes substrate (100) and including at least one chip (210)
Chipset (200), which is characterized in that
The substrate (100) includes multiple binding pads (101), and each binding pad (101) is used for the corresponding chip
(210) input terminal of binding detection circuit (211) is electrically connected with output end；
Each chip (210) of the chipset (200) is bundled in the substrate (100) by corresponding binding pad (101)
On, and corresponding binding state is detected by the corresponding binding detection circuit (211), a plurality of conducting wire (212) will be more
A adjacent binding detection circuit (211) series connection, and form at least one set of binding detection circuit string；The chipset
It (200) further include at least one set of sending module (220), receiving module (230) and abnormal feedback module (240), a transmission
Module (220) sends the input terminal of detection input signal to a binding detection circuit string, and the exception feedback module (240) is in institute
State the corresponding detection output letter that receiving module (230) does not normally receive the output end output of corresponding binding detection circuit string
Number when issue error signal to self-test front end system.
2. binding detection system as described in claim 1, which is characterized in that the binding detection circuit (211) includes two
Test side is the input terminal and output end of binding detection circuit (211) respectively.
3. binding detection system as described in claim 1, which is characterized in that the binding pad (101) is rectangle.
4. binding detection system as described in claim 1, which is characterized in that a plurality of conducting wire (212) is by the core
Whole binding detection circuit (211) series connection of whole chips (210) of piece group (200) are connected into a group binding detection circuit string.
5. binding detection system as described in claim 1, which is characterized in that a plurality of conducting wire (212) will belong to together
The binding detection circuit (211) of one chip (210) is connected one by one to obtain multiple groups binding detection circuit string.
6. binding detection system as described in claim 1, which is characterized in that the binding being connect with the sending module (220)
Detection circuit (211) and the binding detection circuit (211) connecting with the receiving module (230) are on same chip (210).
7. binding detection system as described in claim 1, which is characterized in that connection belongs to the binding inspection of same chip (210)
The conducting wire (212) of slowdown monitoring circuit (211) is the internal wiring of chip (210).
8. binding detection system as described in claim 1, which is characterized in that the detection input signal is a high level letter
Number or a pulse signal.
9. as described in claim 1 binding detection system, which is characterized in that the substrate (100) be array of display substrate or
Person's touch base plate.
10. a kind of display panel, which is characterized in that including binding detection system as described in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810897140.1A CN108957807A (en) | 2018-08-08 | 2018-08-08 | A kind of binding detection system and display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810897140.1A CN108957807A (en) | 2018-08-08 | 2018-08-08 | A kind of binding detection system and display panel |
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| CN201810897140.1A Pending CN108957807A (en) | 2018-08-08 | 2018-08-08 | A kind of binding detection system and display panel |
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Address after: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Applicant after: Kunshan Longteng Au Optronics Co. Address before: 215301, 1, Longteng Road, Kunshan, Jiangsu, Suzhou Applicant before: INFOVISION OPTOELECTRONICS (KUNSHAN) Co.,Ltd. |
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Application publication date: 20181207 |
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