KR20080072044A - Contact unit and testing system - Google Patents

Abstract

A contact unit which has a simple configuration and can perform precise alignment with a test object is provided. On the top surface of a holder base (15) provided to a contact unit (2), contact probes (13) are arranged correspondingly to the arrangement pattern of test pads (11) provided in a circuit-forming region (5a), which is a test object, and groups of detecting probes (14a to 14d) are arranged correspondingly to dummy pads (7a to 7d). Each group of detecting probes (14) consists of probes (19, 20) connected respectively to a light-emitting diode (12) and a voltage source (21) which constitute a positional relationship detector (22). Since the light-emitting diode (12) emits light when the probes (19, 20) comes in contact with the corresponding dummy pad (7) to become conductive with each other in a test using the contact unit (2), whether or not the alignment has been performed precisely can be judged by checking the emission state of the light-emitting diode (12).

Description

Contact unit and inspection system {CONTACT UNIT AND TESTING SYSTEM}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection object having a plurality of conductive regions formed on a surface thereof, including a wiring structure used for input or output of an electrical signal. It's about the system.

Background Art Conventionally, for example, a configuration using a tape carrier package (TCP) such as Tape Automated Bonding (TAB), Chip On Film (COF), or the like for a driver circuit of a liquid crystal panel constituting a liquid crystal display is known. TCP is formed by mounting a semiconductor chip on the flexible film base material which provided the wiring structure on the surface, and sealing the mounted semiconductor chip with resin.

The TCP which has such a structure is manufactured by forming the wiring structure corresponding to a some package on the same film, separating each individual package after mounting a semiconductor chip etc. for every package. Therefore, compared with the conventional package which forms a wiring structure on the board | substrate prepared for every package, and mounts a semiconductor chip, respectively, it has the advantage that it is excellent in the point of a productive efficiency. Moreover, since the film base material which comprises TCP has a very small material thickness compared with the conventional semiconductor substrate, and is abundant in flexibility, when using for a liquid crystal display etc., it has the advantage of being able to downsize the whole apparatus.

When manufacturing such a TCP, the inspection regarding an electrical characteristic is performed for the purpose of detecting a defective item like the other semiconductor integrated circuit. Specifically, for example, an inspection for the presence or absence of an electrical short circuit or disconnection in a wiring structure formed on a film substrate, or an operation characteristic of inputting / outputting a predetermined inspection signal to the semiconductor chip via the wiring structure after mounting the semiconductor chip. Inspection and the like are performed.

In performing the electrical characteristic inspection, in order to accurately input and output the inspection signal, it is necessary to perform alignment between the input / output terminal provided in the inspection apparatus and the wiring structure formed on the film substrate. For this reason, in the conventional inspection apparatus, it is usual that the mechanism for visually confirming the part where the input / output terminal and the wiring structure contact each other is provided.

As a simple mechanism for visually confirming the contact portion, a through hole extending linearly from the contact portion to the outside is formed so that the positional relationship of the contact portion can be visually confirmed through the through hole. Inspection apparatus are known. In addition, since such a straight through hole is difficult to be formed depending on the structure of the inspection apparatus, contact is provided by forming an optical member such as a mirror in the bent portion of the through hole and forming a through hole bent midway. An inspection apparatus employing a mechanism for guiding an image of a part to the outside is also proposed (see Patent Document 1, for example).

[Patent Document 1]

Japanese Patent Application Laid-Open No. 2000-9753

However, the conventional inspection apparatus which performs alignment by visually confirming the positional relationship between the input / output terminal provided in the inspection apparatus and the wiring structure formed on the film base material has a complicated structure and a positioning accuracy. The problem is that there is a risk of deterioration. Hereinafter, such a subject is demonstrated in order.

First, in the case of adopting a configuration for visually confirming the positional relationship, it is necessary to form a predetermined through hole and a mirror or the like as necessary. Therefore, in the inspection apparatus, it is necessary to realize a predetermined physical strength and the like while securing the through hole forming region in advance, and in the inspection system employing a configuration for visually confirming the positional relationship, the structure of the contact unit that makes direct contact with the inspection object Has the task of increasing complexity or size. In addition, depending on the structure of the inspection object or the contact unit, it may be difficult to arrange optical members such as through-holes and mirrors at an appropriate place from the beginning, and in that case, it is necessary to adopt another structure.

Moreover, when employ | adopting the structure which performs alignment by visually confirming a contact part, there exists a possibility that alignment accuracy may fall. That is, when employing a configuration in which the alignment is performed on the five senses of the inspector, it is difficult to objectively determine whether or not the alignment is accurately performed to such an extent that there is no problem in performing the inspection. In the case where the inspectors alternate, the accuracy of alignment changes due to differences in skill and the like, which is not appropriate.

This invention is made | formed in view of the above, and an object of this invention is to implement | achieve the contact system which has a simple structure, and can perform accurate alignment between an inspection object and a contact unit.

In order to solve the above-mentioned problems and achieve the object, the contact unit according to claim 1 relates to an inspection object in which a plurality of conductive regions including a wiring structure used for input or output of an electrical signal are formed on a surface thereof. A contact unit for making electrical connection to a wiring structure, the contact unit being arranged in correspondence with an arrangement pattern of the wiring structure, electrically connecting with the corresponding wiring structure, and for inputting or outputting a predetermined electrical signal to the wiring structure. The contact unit and the inspection according to the presence or absence of conduction between the input / output terminals which perform at least one of the terminals and a plurality of terminals disposed corresponding to the predetermined conductive region, and the plurality of terminals passing through the corresponding conductive region. A detection terminal group used to detect a positional relationship with an object, the input / output terminal and the detection terminal group Underground it is characterized by having a substrate holder.

According to the invention of claim 1, since the detection terminal group is provided corresponding to the conductive region provided in the inspection object, the inspection object and the contact are made based on the presence or absence of conduction between the detection terminal group and the conductive region. It is possible to detect whether or not a positional shift has occurred between the units. In addition, since the terminal which comprises a detection terminal group can be formed by the same structure as an input / output terminal, even if a detection terminal group is newly arrange | positioned, it does not complicate the structure of a contact unit, and it positions by a simple structure. It is possible to detect the deviation.

In the invention, the contact unit according to claim 2 is provided with a plurality of detection terminal groups corresponding to a plurality of the conductive regions, and the plurality of detection terminal groups contacts the contact unit among the inspection objects. The said region is arrange | positioned at the position corresponding to other edge part vicinity.

Moreover, in the said invention, the contact unit which concerns on Claim 3 has the rectangular shape in the part which performs the electrical connection with the said contact unit among the said test object, The said detection terminal group respond | corresponds to a some of the said conductive area | regions in multiple numbers. It is arrange | positioned, The some detection terminal group is respectively arrange | positioned in the area | region corresponding on the diagonal of the said rectangular shape, or the vertex vicinity, It is characterized by the above-mentioned.

In the invention, the contact unit according to claim 4 is electrically connected to a plurality of terminals forming the detection terminal group, and conduction is conducted between the plurality of terminals passing through the conductive region corresponding to the detection terminal group. And position detection means for detecting a positional relationship between the contact unit and the inspection object, in accordance with the presence or absence of.

In the contact unit according to claim 5, in the invention, the positional relationship detecting means is connected in series with a voltage source for supplying a predetermined voltage and the voltage source, and the plurality of terminals are connected via the conductive region. And a passive element which forms a closed circuit between the voltage source and performs a predetermined action based on the potential supplied by the voltage source.

In the contact unit according to claim 6, in the above invention, the passive element is a light emitting diode.

The contact unit according to claim 7 is characterized in that, in the invention, the detection terminal group is disposed corresponding to a dummy pad electrically insulated from the wiring structure in the conductive region.

In the invention, in the contact unit according to claim 8, the detection terminal group is arranged in correspondence with a wiring structure in the conductive region, and the positional relationship detecting means connects the input / output terminal with respect to the corresponding wiring structure. It is characterized in that it further comprises a switch means for stopping the supply of voltage to the passive element when the rough electrical signal is input or output.

In addition, the inspection system according to claim 9 is connected to the wiring structure with respect to the inspection object in which a plurality of conductive regions including a wiring structure used for at least one of the input or output of the electrical signal are formed on the surface thereof. An inspection system that performs inspection by performing input and output of an electrical signal, the inspection system being arranged corresponding to the wiring structure, electrically connected to the corresponding wiring structure, and at least the input or output of a predetermined electrical signal to the wiring structure. The contact unit and the inspection object formed by an input / output terminal which performs one side and a plurality of terminals arranged corresponding to the predetermined conductive region, and the conduction between the plurality of terminals passing through the corresponding conductive region A detection terminal group used for detecting a positional relationship with A contact unit having a holder substrate to the base, a signal processing device for generating an electrical signal for use in the inspection of the inspection object, and analyzing the electrical signal output by the inspection object, the signal processing device and the contact It is characterized by comprising a connecting substrate for electrically connecting with the unit.

Since the contact unit and the inspection system according to the present invention are provided with a detection terminal group corresponding to the conductive region provided in the inspection object, inspection is performed based on the presence or absence of conduction between such a detection terminal group and the conductive region. It has the effect that detection of the position shift between a subject and a contact unit can be performed. In addition, since the terminals constituting the detection terminal group can be formed by the same configuration as the input / output terminals, even if the detection terminal group is newly arranged, the structure of the contact unit is not complicated, and the configuration of the positional shift due to the simple configuration can be achieved. It has the effect that detection can be performed.

1 is a schematic diagram showing an overall configuration of an inspection system according to a first embodiment;

2 is a schematic diagram showing the configuration of a contact unit included in the inspection system;

3 is a schematic cross-sectional view showing the structure of a probe provided in a contact unit;

4 is a schematic diagram showing the functions of a detection probe group and a positional relationship detecting unit at the time of positional shift due to parallel movement;

5 is a schematic diagram showing the functions of a detection probe group and a positional relationship detecting unit at the time of positional shift due to parallel movement;

6 is a schematic diagram showing the functions of the detection probe group and the positional relationship detection unit at the time of positional shift due to rotation;

7 is a schematic diagram showing the functions of a detection probe group and a positional relationship detection unit when an inspection object and a contact unit are inclined relatively;

8 is a schematic diagram showing an overall configuration of an inspection system according to a second embodiment;

9 is a schematic diagram showing the configuration of a contact unit included in the inspection system;

10 is a schematic diagram showing the functions of a detection probe group and a positional relationship detection unit at the time of position shift detection;

11 is a schematic diagram showing the functions of a detection probe group and a positional relationship detection unit at the time of inspection;

12 is a schematic diagram illustrating a modification of the inspection system according to the second embodiment;

It is a schematic diagram which shows the structure of the contact unit with which the inspection system which concerns on Embodiment 3 is equipped.

※ Explanation of code for main part of drawing

1, 31: inspection target 2, 32, 35, 41: contact unit

3: signal processing device 4: connection board

5a, 36: circuit formation area 5b: sprocket hole

6: wiring structure 7, 7a-7h: dummy pad

8: semiconductor chip 9: inner lead

10: outer lead

11, 11a-11l, 37a-37d: test pad

12, 12a-12d: Light emitting diode 13: Contact probe

14, 14a-14d: detection probe group 15, 42: holder substrate

16, 17: screw member

19, 19a-19d, 20, 20a-20d: probe

21, 21a to 21d: voltage source

22, 22a to 22d, 33, 33a to 33d: position relationship detecting unit

24, 25: needle-shaped member 26: spring member

27: opening 28: lead wire

34, 34a to 34d: switches 38a and 38b: through wiring

EMBODIMENT OF THE INVENTION Below, the best form (henceforth "embodiment") for implementing the contact unit and inspection system which concern on this invention is demonstrated in detail, referring drawings. In addition, the drawings are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like should be noted that they are different from the actual ones. Of course, the part is included. In addition, about the code | symbol in drawing, what has the same structure is shown as "light emitting diode 12a" and "light emitting diode 12b", for example, collectively as "light emitting diode 12" as needed. Describe.

(Embodiment 1)

First, the inspection system which concerns on Embodiment 1 is demonstrated. FIG. 1: is a schematic diagram which shows the whole structure of the inspection system which concerns on this Embodiment 1. FIG. As shown in FIG. 1, the inspection system according to the first embodiment includes a contact unit 2 for realizing electrical connection to the inspection object 1, signal processing for generating an electrical signal input to the inspection object, and the like. It consists of the apparatus 3 and the connection board 4 for electrically connecting the signal processing apparatus 3 and the contact unit 2. As shown in FIG.

The inspection object 1 becomes an object of inspection performed by the inspection system according to the first embodiment. Specifically, the inspection object 1 has a plurality of circuit formation regions 5a disposed on a predetermined film substrate in a long direction, and sprockets provided at regular intervals in a long direction near the end of the short direction. It has a long tape-shaped structure with a hole 5b, and at the time of inspection, the movement in the long direction by the handler is performed via the sprocket hole 5b. Further, on the circuit formation region 5a, a conductive region including the wiring structure 6, specifically, a plurality of wiring structures 6 and a dummy pad 7 is formed, and the semiconductor chip 8 is mounted thereon. Has a configuration.

The individual wiring structure 6 is electrically connected to the inner lead 9 electrically connected to the semiconductor chip 8 and the inner lead 9, and used for electrical connection with an external device at the time of mounting. It is comprised by the tester 11 electrically connected to the outer lead 10 and the outer lead 10, and used for the input / output of an electrical signal at the time of an inspection. By forming a plurality of such wiring structures 6 corresponding to the connection terminals provided in the semiconductor chip 8, electrical connection between the semiconductor chip 8 and an external device is realized.

The dummy pad 7 functions as an example of the conductive region in the claims. Specifically, the dummy pad 7 is formed of an electrically insulated conductive region in any of the plurality of wiring structures 6, and is not electrically connected to the semiconductor chip 8, thereby inspecting it. It does not function at all in the input / output of the electric signal used at the time. In the first embodiment, as described later, the positional relationship between the inspection object 1 and the contact unit 2 is determined by effectively utilizing the dummy pad 7.

In addition to the function of generating an electrical signal used for inspection, the signal processing apparatus 3 outputs the generated electrical signal to the inspection object 1 and analyzes the response signal to the input electrical signal, thereby analyzing the inspection object ( It is for analyzing the electrical characteristics of 1). Specifically, the electrical signal generated by the signal processing apparatus 3 is input to the inspection subject 1 via the connecting substrate 4 and the contact unit 2 in sequence, and output from the inspection subject 1. The response signal is input to the signal processing apparatus 3 via the contact unit 2 and the connecting substrate 4 in sequence. In addition, although the electrical connection between the signal processing apparatus 3 and the connection board 4 is actually performed using many wirings, since such a connection form is independent of the main part of this invention, in FIG. Regarding the electrical connection between the two, it will only be shown schematically.

The connection board 4 is for electrically connecting the contact unit 2 and the signal processing apparatus 3. In theory, the connection terminal between the contact terminal on the contact unit 2 side and the connection terminal on the signal processing apparatus 3 side may be directly connected by using a predetermined wiring or the like, and the connection substrate 4 may be omitted. It is also possible. In reality, however, since the connection terminals on the contact unit 2 side are arranged corresponding to the test probes provided on the inspection object 1, the intervals between the connection terminals are minute, so that the signal processing apparatus 3 It is not easy to connect directly with. Therefore, in the first embodiment, for example, a connecting board 4 having a plurality of wiring structures formed so as to be widened with each other as the drawing is widened will be newly provided, and such a connecting board 4 will be provided. It is assumed that the signal processing device 3 and the contact unit 2 are electrically connected via each other.

Next, the contact unit 2 will be described. The contact unit 2 is for performing electrical contact with the inspection object 1 when inspecting using the inspection system according to the first embodiment. Specifically, the contact unit 2 includes a plurality of light emitting diodes 12a-12d for displaying the detection result of the positional relationship and a plurality of test pads 11 provided in the inspection object 1. Holder substrate 15 holding contact probe 13, detection probe groups 14a-14d disposed corresponding to one or more dummy pads 7, and contact probe 13 and detection probe groups 14a-14d. ) Has a configuration with. Moreover, the holder board | substrate 15 is comprised by the some board | substrate, and these some board | substrates are mutually fixed by the screw member 16. As shown in FIG. The holder substrate 15 has a structure fixed by the screw member 17 with respect to the connecting substrate 4.

The light emitting diodes 12a to 12d are intended to function as an example of a passive element in the claims. Specifically, the light emitting diodes 12a to 12d constitute the positional relationship detecting units 22a to 22d described later, and emit light in response to the positional shift between the contact unit 2 and the inspection object 1. Has the function of changing.

The structure where the detection probe groups 14a-14d and the contact probe 13 are arrange | positioned, and the positional relationship detection parts 22a-22d containing the detection probe groups 14a-14d are demonstrated. FIG. 2 is a schematic diagram conceptually showing the planar structure of the contact unit 2 as viewed from the inspection target 1 side and the structures of the positional relationship detection units 22a to 22d corresponding to the detection probe groups 14a to 14d. In addition, in FIG. 2, in order to easily understand the positional relationship with the inspection object 1 at the time of inspection, the position of the component of the inspection object 1 in the case where ideal alignment is performed is shown with a broken line. Shall be.

As also shown in FIG. 2, the contact probe 13 is arrange | positioned according to the pattern corresponding to the arrangement pattern of the test pad 11 with which the test object 1 is equipped, and arrange | positions according to such a pattern, and is at the time of inspection The input / output of the electric signal to the inspection target 1 is enabled. On the other hand, detection probe groups 14a-14d are arrange | positioned corresponding to the dummy pad 7 located in four edge | corners of the circuit formation area | region 5a. Specifically, the probes 19a to 19d and 20a to 20d constituting each of the detection probe groups 14a to 14d are precisely aligned between the contact unit 2 and the inspection object 1. If present, they are arranged at positions overlapping the dummy pads 7a to 7d, respectively.

The contact probe 13 functions as an example of an input / output terminal in the claims. Specifically, the contact probe 13 is disposed in correspondence with the arrangement pattern of the test pad 11 provided in the inspection object 1, and by physically contacting each of the test pads 11, the inspection object 1 ) An input or output of a predetermined electric signal.

The detection probe group 14 functions as an example of the detection terminal group in the claims, and is a positive or negative part of the positional relationship between the inspection object 1 and the contact unit 2 at the time of inspection. It is used for the purpose of detecting. Specifically, the detection probe groups 14a to 14d are each composed of two probes 19a to 19d and 20a to 20d serving as an example of a terminal in the claims. In the first embodiment, When such two probes come into contact with a predetermined conductive area (dummy pads 7a to 7d), the two probes are conducted through the conductive area to detect the positional relationship.

Moreover, the contact unit 2 is provided with the position relationship detection part 22a-22d corresponding to the detection probe group 14a-14d. As also shown in FIG. 2, the positional relationship detection part 22 has the structure which the light emitting diode 12 and the voltage source 21 were connected in series, respectively. Specifically, for example, in the positional relationship detecting section 22a, the anode of the voltage source 21a and the cathode of the light emitting diode 12a are connected via a predetermined wiring.

Moreover, the positional relationship detection part 22 has a structure electrically connected with the probe 19 and the probe 20 which comprise the detection probe group 14. Specifically, for example, in the positional relationship detecting section 22a, the cathode of the voltage source 21a is electrically connected to the probe 20a via a predetermined wiring, and the anode of the light emitting diode 12a connects the predetermined wiring. It has a structure electrically connected with the probe 19a via.

Next, the specific structures of the contact probe 13 and the probes 19 and 20 will be described. In the first embodiment, the contact probes 13 and the probes 19 and 20 each have the same structure. Hereinafter, the concrete structure will be described using the probe 19 as an example.

3 is a schematic cross-sectional view showing the structure of the probe 19. The probe 19 has a structure which can be stretched and contracted in the normal direction of the upper surface of the holder substrate 15 constituting the contact unit 2 (surface facing the inspection object 1 at the time of inspection). Specifically, the probe 19 has a structure in which needle members 24 and 25 are disposed at both ends, and the spring member 26 is disposed between the needle members 24 and 25, as shown in FIG. 3. Has The needle-shaped members 24 and 25 and the spring member 26 are each formed of a conductive material such as metal, and the needle-shaped member 24, the spring member 26, the spring member 26 and the needle-shaped member ( 25) adheres to each other, thereby physically integrating and electrically connecting each other.

The holder substrate 15 is provided with an opening 27 having a central axis parallel to the upper direction perpendicular to the upper surface. The holder substrate 15 is formed by accommodating the probe 19 in the opening 27. 19). On the other hand, the probe 19 has a function to expand and contract in the direction parallel to the central axis of the opening 27 by being accommodated in the opening 27, and at the time of inspection, with respect to the test pad 11, the spring member ( 26) and make contact while applying the elastic force due to.

Moreover, the lead wire 28 other than the probe 19 can be mentioned as a member accommodated in the opening part 27. The lead wire 28 is accommodated in the opening 27 so as to be located on the side opposite to the inspection object 1 with respect to the probe 19, and one end of the lead wire 28 and the needle-shaped member 25 in the opening 27. ) Are arranged to be in contact with each other. When the lead wires 28 are in contact with the probes 19 and 20, the lead wires 28 function as wirings for connecting to the light emitting diodes 12 and the voltage source 21 constituting the positional relationship detector 22, respectively. In the case of contact with (13), it functions as a wiring for electrically connecting the predetermined wiring structure provided in the connecting board 4 and the needle-shaped member 25 to each other.

Next, the functions performed by the detection probe group 14 and the positional relationship detection unit 22 in the detection system according to the first embodiment will be described. 4 and 5 are schematic diagrams for explaining the functions of the detection probe group 14 and the positional relationship detecting unit 22, and FIG. 4 shows the exact alignment between the inspection object 1 and the contact unit 2. This case is shown, and FIG. 5 shows a case where a position shift occurs due to relatively parallel movement of the inspection object 1 and the contact unit 2. In addition, although only the components arrange | positioned around the positional relationship detection part 22a and the positional relationship detection part 22a are shown in FIG.4 and FIG.5, the function demonstrated below also holds true with respect to the positional relationship detection parts 22b-22d. Of course.

As shown in FIG. 4, when correct positioning is performed, the probes 19a and 20a come into contact with the dummy pad 7a, and the probes 19a and 20a are electrically connected via the dummy pad 7a. Will be connected. Therefore, in the positional relationship detecting section 22a, the light emitting diode 12a and the voltage source 21a form a closed circuit, and the light emitting diode 12a is set to a predetermined luminance based on the potential supplied by the voltage source 21a. It will emit light.

On the other hand, as shown in FIG. 5, when the position alignment is not made between the contact unit 2 and the test | inspection object 1, and a position shift is made by a predetermined distance, the light emitting diode 12a is carried out. It does not emit light. That is, a position shift occurs between the contact unit 2 and the inspection object 1, and thus a position shift occurs between the probes 19a and 20a and the dummy pad 7a. For example, FIG. As shown in FIG. 2, the probe 20a is in contact with the dummy pad 7a, while the probe 19a is not in contact with the dummy pad 7a.

As evident in Fig. 5, in such a case, the probes 19a and 20a are not electrically connected, and in the positional relationship detecting section 22a, a closed circuit between the light emitting diode 12a and the voltage source 21a. Is not formed. Therefore, the potential difference is not supplied to the light emitting diode 12a by the voltage source 21a, and the light emitting diode 12a does not emit light.

That is, in the inspection system according to the first embodiment, when accurate alignment is performed between the contact unit 2 and the inspection object 1, the light emitting diodes respectively provided in the positional relationship detection units 22a to 22d ( When 12a-12d emits light and a position shift occurs, at least one of the light emitting diodes 12a-12d does not emit light. In other words, in the case of all of the light emitting diodes 12a to 12d emitting light, accurate positioning is performed, and if any one of the light emitting diodes 12a to 12d does not emit light, a position shift occurs. it means. That is, the user of the inspection system can determine whether or not the alignment is performed correctly by confirming the light emitting state of the light emitting diodes 12a to 12d.

In the first embodiment, a study for adjusting the accuracy of alignment is conducted. Specifically, as shown in FIG. 4, when the alignment is performed correctly, each of the probes 19a and 20a represents the central axis in the longitudinal direction (the probes 19a and 20a in FIG. 4). Circle center] and the distance between the peripheral edge of the dummy pad 7a to be predetermined. Specifically, as shown in FIG. 4, in the case where accurate positioning is performed, the center axis of the probe 19a is the most of the peripheral edges of the dummy pad 7a with respect to the rectangular dummy pad 7a. the distance between the neighboring two sides of a central axis, the distance to the closest of the two sides d _1, d ₂ is arranged such that, the probe (20a) is arranged such that d _3, d _4.

In Fig. 4, the outer diameters of the probes 19a and 20a are highlighted, but the outer diameters of the actual probes 19a and 20a are usually very small. Therefore, in the inspection system according to the first embodiment, for example, when the contact unit ₂ is displaced by d _{2 in the} y direction with respect to the inspection object 1, the probe 19a is a dummy pad 7a. Since the light emitting diode 12a does not emit light, it is possible to detect that the position shift has occurred. On the other hand, even when a position shift occurs from the state shown in FIG. 4, for example, when the contact unit 2 is displaced in the y direction by d ₅ (<d ₂ ) with respect to the inspection object 1, the probe is still probed. Since the 19a and 20a are in contact with the dummy pad 7a, the light emitting diode 12a emits light.

These means that a certain allowable range is set in the judgment of the position shift. That is, it is not necessary to detect it as a position shift occurrence with respect to all the cases where a position shift generate | occur | produced even a little from the state shown in FIG. It is preferable practically not to detect it as a shift | offset | difference. Therefore, in the first embodiment, when the position where the probes 19a and 20a are placed is studied, when the positional deviation that does not cause a problem in the inspection occurs, the light emitting diode 12a is made to emit light, that is, It is supposed not to detect the position shift. In addition, the specific values of d _{1 to} d ₄ are determined by the structure of the inspection object 1, etc., but are preferably 20 µm to 50 µm, respectively, more preferably d ₁ = d ₂ = d ₃ = d ₄ = By setting it as 30 micrometers, it is possible to reliably detect the position shift which a problem may arise in a test | inspection, without detecting a slight position shift in a general test | inspection. Of course, when the structure of the inspection object is further miniaturized due to the progress of the later micromachining technology or the like, it is preferable to set the value smaller than 30 μm, and the specific value of d _{1 to} d ₄ is, for example, 10 to 20 μm. It is desirable to.

In addition, the inspection system according to the first embodiment includes a plurality of positional relationship detection units 22 in the contact unit 2. Therefore, in Embodiment 1, not only the position shift regarding the direction parallel to the x direction and the y direction in FIG. 4, ie, the position shift which arises from the relatively parallel movement of the contact unit 2 and the inspection object 1, Even when the inspection object 1 is relatively rotated with the normal line direction of the upper surface of the holder substrate 15 as the center axis, position shift can be detected.

FIG. 6: is a schematic diagram which shows the case where the inspection object 1 rotated relatively between the contact unit 2 and the inspection object 1 about the normal line direction of the upper surface of the holder substrate 15 as a center axis. . As shown in FIG. 6, when the position shift by relative rotation centered around the dummy pad 7a and the probes 19a and 20a, between the probes 19a and 20a and the dummy pad 7a. Electrical contact is maintained, and the positional relationship detecting unit 22a alone cannot detect that an abnormality has occurred in the positional relationship between the contact unit 2 and the inspection object 1.

However, in this Embodiment 1, the contact unit 2 has the structure which further provided not only the position relationship detection part 22a but also the position relationship detection parts 22b-22d. When relative rotation occurs between the contact unit 2 and the inspection object 1, as shown in Fig. 6, the position shift occurs at portions other than the rotation center. Therefore, in each of the position relationship detecting sections 22b to 22d, the probes 19b to 19d and 20b to 20d do not contact the dummy pads 7b to 7d, and each of the light emitting diodes 12b to 12d emits light. The position shift can be detected. Therefore, in the inspection system according to the first embodiment, since the plurality of positional relationship detection units 22 are provided, even when rotation occurs between the contact unit 2 and the inspection object 1, the positional relationship It is possible to reliably detect abnormalities.

In addition, the inspection system according to the first embodiment is generated between the inspection object 1 and the contact unit 2 in addition to the detection of positional shifts in the in-plane direction, that is, the x direction and the y direction shown in FIG. 4. It is also possible to detect the inclination. As also shown in FIG. 3, on the upper surface of the holder substrate 15, the circuit forming area 5a in which the detection probe group 14a-14d corresponding to the position relationship detection part 22a-22d is provided in the test | inspection object 1 is provided. It is arrange | positioned at the position corresponding to four corners of. Therefore, when the inclination has arisen between the test | inspection object 1 and the contact unit 2, the dummy pad 7 corresponding to the probes 19 and 20 in any one of the position relationship detection parts 22a-22d. No contact with the light source occurs, and the light emitting diode 12 does not emit light.

FIG. 7: is a schematic diagram which shows the case where the inclination generate | occur | produced between the test | inspection object 1 and the contact unit 2. FIG. As shown in FIG. 7, when the inspection object 1 approaches the contact unit 2 with the inclination between each other, for example, the detection probe group 14b is in contact with the dummy pad 7b. Thus, the detection probe group 14c does not come into contact with the dummy pad 7c. Therefore, in the case of FIG. 7, the light emitting diode 12b included in the positional relationship detecting unit 22b corresponding to the detection probe group 14b emits light while the light emitting diode 12c corresponding to the detection probe group 14c is emitted. No light emission occurs, and such a light emission pattern is generated, so that the user of the inspection system can detect abnormalities.

Next, the advantages of the inspection system according to the first embodiment will be described. First, in the inspection system according to the first embodiment, it is possible to detect the occurrence of positional shift between the contact unit 2 and the inspection object 1 based on the above mechanism. From the viewpoint of performing such position shift detection, the simplest configuration can be realized by providing a single detection probe group 14 and a positional relationship detecting section 22. However, the detection probe group 14 and the positional relationship detecting section ( It is possible to obtain a further effect by providing a plurality of 22).

That is, as in the cases shown in FIGS. 6 and 7, the detection probe group 14 is used for the case where a positional shift due to relative rotation or a positional shift due to an inclination occurs between the detection object and the contact unit 2. ) And a plurality of positional relationship detecting sections 22 can be provided, whereby more reliable position shift detection can be performed. In addition, it is preferable to arrange | position so that the distance between some detection probe group 14 may be as large as possible from a viewpoint of performing reliable position shift detection. That is, in the case where position shift occurs due to, for example, rotational movement, the degree of position shift becomes large as it is separated from the rotation center. Therefore, when any one of the plurality of detection probe groups 14 coincides with the rotation center (for example, the detection probe group 14a in FIG. 6), the other detection probe group 14 coincides with the rotation center. It is preferable to arrange | position as far as possible from the one detection probe group 14 from a viewpoint of the improvement of the position shift detection precision. From this point of view, in the first embodiment, with respect to the plurality of detection probe groups 14a to 14d, the positions at which the mutual distances are maximum, specifically, the inspection object 1 (in the first embodiment, the inspection object ( The circuit formation area 5a constituting 1). More specifically, between the detection probe groups 14a to 14d by arranging the circuit formation region 5a at a position corresponding to the four corners of the circuit formation region 5a near each vertex, that is, corresponding to the rectangular shape. It is configured so that the distance of is maximum. In addition, in this Embodiment 1, since the circuit formation area | region 5a has a rectangular shape, the detection probe groups 14a-14d are rectangular in the area | region near the edge part of the rectangular shape in circuit formation area | region 5a, respectively. It is arrange | positioned on the diagonal of a shape. By arrange | positioning at such a position, it becomes possible to ensure a sufficient space | interval with respect to a some detection probe group, and it is possible to perform more accurate alignment.

In addition, the inspection system according to the first embodiment makes it possible to perform positioning by a simple configuration. Specifically, the inspection system according to the first embodiment does not form through holes or the like for visual confirmation of the holder substrate 15 as in the prior art, but instead uses a contact probe (which is required for electrical connection to the inspection object). The detection probe group 14 which consists of the probes 19 and 20 of the same structure as 13 is just provided. Since the contact probes 13 are originally provided in correspondence with the test pads 11, even if the contact probes 13 and 20 having the same structure as the contact probes 13 are newly held, the holder substrate The structure of (15) is not complicated, and a simple structure can be realized.

Moreover, the positional relationship detection part 22 connected with the probes 19 and 20 is also a simple thing comprised only by the voltage source 21 and the light emitting diode 12. As shown in FIG. The electrical connection between the voltage source 21, the light emitting diodes 12, and the probes 19 and 20 is also performed using the same structure as the contact probe 13 (lead line 28) as shown in FIG. It is possible. In view of the above, the structure of the contact unit 2 is not complicated by providing the detection probe group 14 and the positional relationship detection unit 22 in the first embodiment, and the inspection system according to the first embodiment is simplified. One configuration makes it possible to perform alignment.

Moreover, since the inspection system which concerns on this Embodiment 1 employ | adopts the structure which detects a position shift using the positional relationship detection part 22, there exists an advantage that it is possible to perform accurate positioning. In other words, the positional relationship detector 22 uses an objective determination criterion that the light emitting diodes 12 emit light only when conduction via the dummy pads 7 occurs in the probes 19 and 20. For this reason, a difference does not arise in the determination of the position shift | offset | difference, etc. by the user's skill of an inspection system, and it becomes possible to perform objective and accurate position shift detection.

(Embodiment 2)

Next, an inspection system according to the second embodiment will be described. In the second embodiment, in the case of inspecting an inspection object that is not provided with a conductive area corresponding to the dummy pad, a configuration that enables accurate positioning is adopted.

FIG. 8: is a schematic diagram which shows the whole structure of the inspection system which concerns on this Embodiment 2. As shown in FIG. As shown in FIG. 8, the inspection system according to the second embodiment has a configuration in which the signal processing device 3 and the connection board 4 are provided, similarly to the first embodiment, and the inspection system does not include a dummy pad. Corresponding to the object 31, the contact unit 32, which has studied the arrangement pattern of the detection probe group 14, is newly provided. In addition, in this Embodiment 2, the component with the same code | symbol and name as Embodiment 1 shall have the same structure and function as the component in Embodiment 1 unless there is particular notice below.

9 is a schematic diagram showing the arrangement of the detection probe group 14 on the upper surface of the contact unit 32 and the configuration of the positional relationship detection unit including the detection probe group 14. As shown in FIG. 9, in this Embodiment 2, the contact probe 13 arrange | positioned at the upper surface of the contact unit 32 is a pattern corresponding to the arrangement pattern of the test pad 11 in the test | inspection object 31. As shown in FIG. Are arranged accordingly.

In addition, in this Embodiment 2, it is assumed that the dummy object is not formed in the test | inspection object 31, and the structure of Embodiment 1 which arrange | positions the detection probe group 14 corresponding to a dummy pad cannot be employ | adopted. . Therefore, in the second embodiment, the test pad 11 is used as the conductive region in the claims, and a predetermined one selected from a plurality of test pads 11 (in FIG. 9, the test pad 11a) is used. To 11 d). The same applies to the following descriptions]. The detection probe groups 14a to 14d are arranged to correspond to the above. 9, the test pads 11e to 11l function as input / output of an electrical signal passing through the corresponding contact probe 13 in the same manner as the test pad 11 in the first embodiment.

In addition, in response to the change in the arrangement of the detection probe groups 14a to 14d, the configuration of the positional relationship detection units 33a to 33d is also different from that of the positional relationship detection unit 22 in the first embodiment. Specifically, in addition to the structure of Embodiment 1, the positional relationship detection part 33 has the structure which newly provided the switch 34 between the probe 19 and the anode of the light emitting diode 12, and is correctly positioned The structure which turns on the switch 34 only when determining whether the alignment is performed is employ | adopted.

Next, in the inspection system according to the second embodiment, the functions and advantages performed by the position relationship detection units 33a to 33d will be described. In addition, below, although the positional relationship detection part 33a is demonstrated as an example among the positional relationship detection parts 33a-33d, it is a matter of course that the same is true also about the positional relationship detection parts 33b-33d.

FIG. 10: is a schematic diagram which shows the operation | movement at the time of determining whether the alignment between the test | inspection object 31 and the contact unit 32 is performed correctly with respect to the positional relationship detection part 33a. As shown in FIG. 10, at the time of determination regarding alignment, it is controlled so that the switch 34a may be in an on state. Therefore, when the test pad 11a and the probes 19a and 20a come into contact with each other, the positional relationship detector 33a forms a closed circuit, and the light emitting diode 12a is based on the potential supplied by the voltage source 21a. Emits light. Therefore, the user of the inspection system detects whether the light emitting diode 12a emits light as in the case of the first embodiment, thereby confirming whether the alignment between the inspection object 31 and the contact unit 32 is correctly performed. It is possible to determine whether or not. Also in the second embodiment, the predetermined allowable range is provided, and the detection object 31 and the contact unit 32 are relatively rotated by providing the plurality of positional relationship detection units 33, and the inspection. It is possible to detect the case where the object 31 and the contact unit 32 are inclined with each other.

Next, the functions and advantages performed by the positional relationship detection units 33a to 33d in performing a predetermined inspection on the inspection target 31 using the inspection system according to the second embodiment will be described. 11 is a schematic diagram of the positional relationship detection unit 33a at the time of inspection. As also shown in FIG. 11, when the inspection is performed by the inspection system, the electrical signal generated by the signal processing apparatus 3 and the like are inputted and outputted to the test pad 11a via the contact probe 13. Therefore, when the positional relationship detector 33a constitutes a closed circuit at the time of inspection, there is a fear that the electrical signals inputted and outputted through the contact probe 13 will affect the positional relationship detector 33a. For example, in the case where the input electric signal has a high potential, the potential of the test pad 11a also rises, and this potential causes the voltage source 21a or the light emitting diode 12a constituting the positional relationship detector 33a. There is a possibility of impairing the function of such.

Therefore, in the second embodiment, the positional relationship detecting section 33a is newly provided with a switch 34a. At the time of inspection, the switch 34a is turned off so that the input and output electrical signals are inputted to the positional relationship detecting section 33a. Influence on the light emitting diode 12a constituting the &lt; RTI ID = 0.0 &gt; In addition, by turning off the switch 34a at the time of test | inspection, it is also possible for the voltage source 21a etc. which comprise the positional relationship detection part 33a to influence the test result. That is, when the switch 34a is kept on at the time of inspection, the noise etc. which generate | occur | produce in the positional relationship detection part 33a may be input to the test pad 11a. In this case, when the positional relationship detection unit 33a forms a closed circuit at the time of inspection, since the noise signal is input to the test pad 11a while being mixed with the inspection electrical signal, the inspection result is affected. In the second embodiment, the switch 34a is turned off at the time of inspection, thereby making it possible to prevent such a problem from occurring.

(Variation)

Next, a modification of the inspection system according to the second embodiment will be described. In the inspection system according to the present modification, a part of the wiring structure formed on the circuit formation region included in the inspection object 1 is electrically connected directly between the plurality of test pads without passing through the semiconductor chip 8. In the case of having a wiring structure to be used, such a wiring structure is utilized to enable accurate positioning.

FIG. 12 shows probes 19 and 20 constituting a group of detection probes on the upper surface (that is, the surface on the side in contact with the inspection object 1) of the contact unit 35 provided in the inspection system according to the present modification. It is a schematic diagram showing the arrangement form of. In FIG. 12, similarly to FIG. 2 and the like, in order to easily understand the positional relationship between the contact unit 35 and the inspection object 1 at the time of inspection, the inspection object in the case where the alignment is ideally performed (1) The structure of the [circuit formation region 36] shall be represented by a broken line.

As shown in FIG. 12, the test pad 11 is electrically connected to the semiconductor chip 8 via the inner lead 9 and the outer lead 10 on the circuit formation region 36. Regarding the test pads 37a to 37d positioned at four corners of the formation region 36, the through wirings 38a and 38b are directly connected to each other without being electrically connected to the semiconductor chip 8. Is connected.

Corresponding to the structure of the circuit formation region 36, in this modification, the probe 19a constituting the detection probe group 14a is disposed corresponding to the test pad 37d, and the probe 20a is provided. Is disposed corresponding to the test pad 37a. Moreover, the probe 19b which comprises the detection probe group 14b is arrange | positioned corresponding to the test pad 37c, and the probe 20b is arrange | positioned corresponding to the test pad 37b.

Even when such a configuration is adopted, similarly to the second embodiment, accurate positioning can be performed at the time of inspection. Hereinafter, the detection probe group 14a (probes 19a and 20a) will be described as an example. Specifically, when the probe 19a is in contact with the test pad 37d at the time of inspection and the probe 20a is in contact with the test pad 37a, that is, when correct positioning is performed, the test pad 37a Between the probes 19a and 20a is conducted through the conductive region constituted by the line 37d and the through wiring 38a. Therefore, as in the second embodiment, the positional relationship detector 33a forms a closed circuit as long as the switch 34a provided in the positional relationship detector 33a is kept in the on state, and the light emitting diode 12a is It can emit light, and it is possible to detect that correct positioning is performed.

In this way, it is also effective to adopt a configuration in which the test units 19 and 20 constituting the same detection probe group 14 are brought into contact with other test pads or dummy pads. That is, even if other test pads or the like are configured such that the other test pads and the like are maintained at the same potential, it is possible to think of them as forming the conductive regions in the claims as a whole, and to the same mechanism as in the first and second embodiments. It is possible to perform accurate positioning on the basis of this.

(Embodiment 3)

Next, an inspection system according to the third embodiment will be described. In the inspection system according to the third embodiment, the inspection system has a configuration in which a plurality of circuit formation regions are inspected at the same time, and a detection system that enables accurate positioning is realized.

FIG. 13: is a schematic diagram which shows the arrangement pattern of the contact probe 13 and the detection probe group 14 arrange | positioned on a holder substrate in the inspection system which concerns on this Embodiment 3. As shown in FIG. In FIG. 13, similarly to FIGS. 2 and 9, in order to easily understand the positional relationship, the positions of the components of the inspected object 1 when ideally aligned are indicated by broken lines. Although not shown, the inspection system according to the third embodiment includes the signal processing device 3 and the connecting board 4, and the same names and codes as those in the first and second embodiments are given. Unless otherwise mentioned below, it shall have the same structure and function as the component in Embodiment 1, 2.

As shown in FIG. 13, in Embodiment 3, the structure which test | inspects the some circuit formation area | region 5a in one test | inspection is employ | adopted. In response to adopting such a configuration, the holder substrate 42 provided in the contact unit 41 adopts a configuration in which the area of the upper surface is enlarged so as to be in contact with the plurality of circuit formation regions 5a. As shown in FIG. 13, the contact probe 13 is arrange | positioned corresponding to the test pad 11 provided in the some circuit formation area 5a.

In the third embodiment, the detection probe groups 14a to 14d are also arranged at positions corresponding to the plurality of circuit forming regions 5a. Specifically, the detection probe groups 14a and 14b are disposed at positions corresponding to the dummy pads 7a and 7b in the same manner as in the first embodiment, while the detection probe groups 14c and 14d are dummy. It is not corresponding to the pads 7c and 7d, but is arranged at positions corresponding to the dummy pads 7g and 7h provided in the other adjacent circuit formation regions 5a.

In the third embodiment, since the number of the dummy pads 7 is larger than the number of the detection probe groups 14a to 14d, it is possible to take a plurality of arrangement patterns of the detection probe groups 14a to 14d. In such a case, arbitrary arrangement patterns may be used. In the third embodiment, arrangement patterns in which the detection probe groups 14a to 14d are most isolated from each other are adopted. 6 and 7, when the plurality of detection probe groups 14 are used, the larger the distance between them, the better the detection accuracy of position shift.

In addition, as in the third embodiment, when the number of the dummy pads 7 exceeds the number of the detection probe groups 14, the dummy pads 7 that correspond to the detection probe groups 14 are selected based on the area. You may do it. For example, when the TCP used as the inspection object 1 is used as a driver IC (an IC for controlling the selection and supply potential of pixel electrodes disposed in the liquid crystal panel) of a liquid crystal panel, a video signal from the outside, etc. It is common for the input terminal used for the input of to have a larger area than the output terminal connected to the liquid crystal panel. Specifically, when the dummy pads 7a, 7b, 7e, and 7f are input terminals, and the dummy pads 7c, 7d, 7g, and 7h are output terminals, the detection probe groups 14a to 14d are used as the input terminals. It is also preferable to arrange so as to correspond to the large dummy pads 7a, 7b, 7e, and 7f.

As mentioned above, although this invention was demonstrated using Embodiment 1-3, this invention should not be interpreted limited to the above-mentioned embodiment, It is possible for a person skilled in the art to coat various Examples and modifications. For example, in the embodiment, the contact probe is used as the input / output terminal in the scope of the claims, and the detection probe group is used as the detection terminal group. However, the present invention is not limited to such a configuration. As long as it can be taken, it is possible to use the thing of arbitrary structure as an input / output terminal and a detection terminal group. In addition, although a light emitting diode is used as an example of the passive element, it is also effective to adopt another configuration. For example, by using a voice generating mechanism as a passive element, a configuration in which the user is informed as voice information of the presence or absence of positional deviation is also effective. In addition, the inspection object need not be limited to so-called TCP, but the present invention can be applied to an inspection system used as an inspection object for the integrated circuit general.

As described above, the contact unit and the inspection system according to the present invention are electrically connected to the wiring structure with respect to the inspection object in which a plurality of conductive regions including the wiring structure used for the input or output of the electrical signal are formed on the surface. It is useful in the case of carrying out the test, and is particularly suitable in the case of performing an operation characteristic test such as TCP in which a semiconductor chip is mounted on a flexible film substrate having a wiring structure formed on its surface.

Claims (9)

In the contact unit which makes electrical connection with respect to the wiring structure with respect to the inspection object in which the some conductive area | region including the wiring structure used for the input or output of an electrical signal is formed on the surface, An input / output terminal arranged in correspondence with an arrangement pattern of the wiring structure, electrically connected to the corresponding wiring structure, and performing at least one of input or output of a predetermined electrical signal to the wiring structure; It is formed by a plurality of terminals disposed corresponding to the predetermined conductive region, and is used to detect the positional relationship between the contact unit and the inspection object according to the presence or absence of conduction between the plurality of terminals passing through the corresponding conductive region. The detection terminal group used, And a holder substrate for holding the input / output terminals and the detection terminal group. The method of claim 1, A plurality of detection terminal groups are disposed corresponding to the plurality of conductive regions, and a plurality of the detection terminal groups are arranged at positions corresponding to other end portions of regions in contact with the contact unit among the inspection objects. Contact unit. The method of claim 1, A portion of the inspection object that is electrically connected to the contact unit has a rectangular shape, And a plurality of the detection terminal groups are disposed corresponding to the plurality of the conductive regions, and the plurality of the detection terminal groups are each disposed in an area corresponding to a diagonal line or near a vertex of the rectangular shape, respectively. The method of claim 1, Between the contact unit and the inspection object, depending on whether there is conduction between the plurality of terminals electrically connected to the plurality of terminals forming the detection terminal group and passing through the conductive area corresponding to the detection terminal group. And a position relationship detecting means for detecting a positional relationship of the contact. The method of claim 4, wherein The position relationship detecting means, A voltage source for supplying a predetermined voltage, A passive element connected in series with the voltage source, forming a closed circuit between the voltage source when the plurality of terminals are conducted through the conductive region, and performing a predetermined action based on a potential supplied by the voltage source; A contact unit having a. The method of claim 5, And said passive element is a light emitting diode. The method of claim 1, And the detection terminal group is disposed corresponding to a dummy pad electrically insulated from the wiring structure in the conductive region. The method of claim 1, The detection terminal group is disposed corresponding to the wiring structure in the conductive region, And said position relationship detecting means further comprises a switch means for stopping the supply of voltage to said passive element when an electrical signal is input or output via said input / output terminal to a corresponding wiring structure. . The inspection is performed by inputting and outputting an electric signal through an electrical connection to the wiring structure with respect to a test object having a plurality of conductive regions including a wiring structure used on at least one of the input or output of the electrical signal on the surface. In the inspection system to perform, An input / output terminal disposed corresponding to the wiring structure, electrically connected to the corresponding wiring structure, and performing at least one of input or output of a predetermined electrical signal to the wiring structure, and corresponding to the predetermined conductive region A detection terminal group formed by a plurality of terminals arranged to be used for detecting a positional relationship between the contact unit and the inspection object with or without conduction between the plurality of terminals passing through the corresponding conductive region; A contact unit having an input / output terminal and a holder substrate for holding the detection terminal group; A signal processing device for generating an electrical signal used for the inspection of the inspection object and analyzing the electrical signal output by the inspection object; And a connecting substrate electrically connecting between the signal processing device and the contact unit.

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