1292828 九、發明說明: 【發明所屬之技術領域】 本發明有關一種包括使用於電氣信號之輪入或輸出之 配線構造之複數個導電區域形成於表面上之檢查對^中, 用以對上述配線構造予以電性連接之接觸單元(c〇n伙d unit),及使用接觸單元之檢查系統。 【先前技術】 以往,例如構成液晶顯示器(LCD)之液晶顯示板 (liquid crystal display panel)之驅動電路(driving circuit)等,以使用 TAB(Tape Automated Bonding,捲帶 自動接合)、C0F(Chip On Film,晶粒薄膜接合)等之Tcp (Tape Carrier Package,捲帶式封裝體)之構成,為一般 所周知。TCP係在表面形成有配線構造之可撓性薄膜基材 上裝載半導體晶片,將所裝載之半導體晶片以樹脂封固而 形成。 具有如此構造之TCP,係在同一薄膜上形成對應於複 數個封裝體之配線構造’在各個之封裝體裝載半導體晶片 等後,分離成各個封裝體而製成。所以,與習知在事先準 備之各個基板上形成配線構造,然後在各個基板上裝載半 導體晶片之習知封裝體相比較時’具有在生產效率佳之優 點。由於構成TCP之薄膜基材,與習知半導體基板相比較, 材料厚度非常小,且富於柔軟性,所以使用於液晶顯示哭 等時,具有可使裝置整體小型化之優點。 製造如此之TCP時,與其他半導體積體電路之情形同 (修正本)317611 6 1292828 -樣a k測不良等之目的而施行電性特性相關之檢查。 例如,形成於薄膜基材上之配線構造有無^路 或斷線專之檢查,或於裝载半導體晶片後,藉由配線構造, 進行將預定之檢查信號輪出輪入於半導體晶片的動作特性 檢查等。 -於實施電氣特性檢查時,為了將檢查信號正確地輸出 輸入,必須進行檢查裝置所具備之輪出入端子與形成在薄 膜基材上之配線構造之間的對位。為此,習知之檢查I置 中,通常設有用以視認輸出入端子與配線構造間之接 分之機構。 用以視認接觸部分之單純之機才籌,已头口有一種藉由形 成由接觸部分至外部直線延伸之貫穿孔,經由貫穿^由^ 部可視認接觸部分之位置關係之檢查裝置。如此之直線貫 穿孔係在某些檢查裝置之構造上難以形成,所以,亦已知 有一種形成由途中折曲之貫穿孔之同時,在貫穿孔之折曲 籲部分配置鏡子等光學構件,而採用將接觸部分之影像導出 外部之機構的檢查裝置(例如,參照專利文獻1 )。 專利文獻1 ··日本特開2000-9753號公報。 【發明内容】 [發明所欲解決之課題] 然而,藉由視認檢查裝置所具備之輸出入端子、.與形 成於薄膜基材上之配線構造間之位置關係以進行對位之習 知檢查裝置,不但構造複雜化,而且恐有對位精密度低落 之課題存在。以下,依序說明此等課題。 (修正本)317611 7 1292828 、 首先,採用視認位置關係之構成時,如上所述,必須 形成預定之貫穿孔及依所需安裝鏡子等。因而,檢查裝置 必須事先確保形成貫穿孔用之區域,而實現預定之物理強 度等,而採用視認位置關係之檢查系統,具有與檢查對象 •直接接觸之接觸單元之構造複雜化或大型化之課題。而 •且,依檢查對象或接觸單元之構造,有難以將用以配置貫 穿孔及鏡子等光學構件配置在適當場所者,在此情形下, 必須採用其他之構造。 _ 而且,採用視認接觸部分以進行對位之方式時,有對 位精密度降低之虞。亦即,藉由檢查者之感官以進行對位 時,難於客觀判定檢查結果是否已達到所要求之對位精確 度。而且,檢查者換人等情形時,由於熟練度之不同,對 值精岔度會不同,因此並不妥當。 本發明乃有鑑於上述課題而研創者,其目的在於提供 -種具有簡易之構成,且在與檢查對象之間可進行正確對 •位之接觸單元及使用接觸單元之檢查系統。 [用以解決課題之手段] 為解決上述課題以達成目的,申請專利範圍第丨項之 接觸單元,係關於表面上形成有包含用於電氣信號之輸入 或輸出之配線構造之複數導電區域之檢查對象,用以對上 述配線構造進行電性連接之接觸單元,此接觸單元包括: 對應於上述配線構造之配置圖案而配置而與相對應之上述 轉構造電性連接’以對於上述配線構造進行狀之電氣 5號之輸人或輸出之至少—方之輪出人端子;由對應於預 (修正本)317611 8 1292828 定之上述導電區域而配置之複數個端子所形成,且依據經 由對應之上述導電區域的上述複數個端子間之導通之有 無’而檢測出該接觸單元與上述檢查對象之位置關係之檢 測端子群;及用以支撐上述輸出入端子及上述檢測端子群 之支撐基板。 • 根據申請專利範圍第1項之發明,則因對應於檢查對 象所具備之導電區域以設置檢測端子群,所以,可根據檢 測端子群與導電區域之間之導通之有無,以檢測出檢查對 象與接觸單元之間是否產生位置偏差。而且,因構成檢測 端子群之端子係與輸出入端子為同樣之構成即可形成,所 以,即使重新配置檢測端子群時,仍不致於使接觸單元之 構造複雜化,而以簡易之構成即可進行位置偏差之檢測。 、根據申請專利範圍第2項之發明之接觸單元,係於上 述發月中上述檢測端子群係對應於複數個上述導電區域 配置複數個’複數個上述檢測端子群係配置在對應於上述 鲁私查對象中與上述接觸單元接觸之區域不同之端部附近之 付署。 二元:於上述發明〃, /、上这接觸早兀電性連接之部分具有 配置複數個上述導電區域 上述長方形狀之對船极配置在對應於 復呈圍第4項之接觸單元係於上述發明之令, 复具備.與μ上述檢測端子群之魏個端子電性連接,BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection guide comprising a plurality of conductive regions for use in a wiring structure of a turn-in or output of an electrical signal, which is formed on a surface for the wiring A contact unit (c〇n-d unit) electrically connected and an inspection system using the contact unit are constructed. [Prior Art] Conventionally, for example, a driving circuit that constitutes a liquid crystal display panel of a liquid crystal display (LCD), etc., using TAB (Tape Automated Bonding), C0F (Chip On) The structure of a Tcp (Tape Carrier Package) such as a film or a die bond film is generally known. In the TCP system, a semiconductor wafer is mounted on a flexible film substrate having a wiring structure formed thereon, and the mounted semiconductor wafer is sealed with a resin. The TCP having such a configuration is formed by forming a wiring structure corresponding to a plurality of packages on the same film, and after each semiconductor package is loaded with a semiconductor wafer or the like, it is separated into individual packages. Therefore, it is advantageous in that the wiring structure is formed on each of the substrates prepared in advance, and then the conventional package in which the semiconductor wafer is mounted on each substrate is compared. Since the film substrate constituting the TCP has a very small material thickness and is soft in comparison with the conventional semiconductor substrate, it is advantageous in that the entire device can be miniaturized when used for liquid crystal display or the like. When such a TCP is manufactured, the inspection relating to the electrical characteristics is performed for the purpose of the other semiconductor integrated circuit (Revised) 317611 6 1292828 - for example, for the purpose of measuring the defect. For example, the wiring structure formed on the film substrate is inspected for no-circuit or disconnection, or after the semiconductor wafer is mounted, the wiring structure is used to perform the rotation of the predetermined inspection signal into the semiconductor wafer. Check and so on. - When performing electrical characteristic inspection, in order to correctly output the inspection signal, it is necessary to align the wheel-in and out terminals of the inspection device with the wiring structure formed on the film substrate. For this reason, the conventional inspection I is usually provided with a mechanism for visually recognizing the connection between the input and output terminals and the wiring structure. The simple machine for visually recognizing the contact portion has a check device for visually recognizing the positional relationship of the contact portion through the through portion through the through portion through which the contact portion extends to the outside. Such a linear through-hole is difficult to form in the structure of some inspection apparatuses. Therefore, it is also known to form an optical member such as a mirror in a bent portion of the through-hole while forming a through-hole which is bent in the middle. An inspection apparatus that directs the image of the contact portion to the outside is used (for example, refer to Patent Document 1). Patent Document 1: Japanese Laid-Open Patent Publication No. 2000-9753. [Problem to be Solved by the Invention] However, a conventional inspection device for performing alignment by a positional relationship between an input/output terminal provided in an inspection device and a wiring structure formed on a film substrate Not only is the structure complicated, but there is a fear that the problem of low precision is present. Hereinafter, these problems will be described in order. (Revised) 317611 7 1292828 First, when the configuration of the positional relationship is recognized, as described above, it is necessary to form a predetermined through hole and a mirror to be mounted as needed. Therefore, the inspection apparatus must ensure that the area for the through hole is formed in advance, and the predetermined physical strength and the like are realized, and the inspection system that recognizes the positional relationship has a problem that the structure of the contact unit that is in direct contact with the inspection object is complicated or enlarged. . Further, depending on the structure of the inspection object or the contact unit, it is difficult to arrange an optical member such as a through hole and a mirror in an appropriate place. In this case, other structures must be employed. _ Moreover, when the contact portion is visually recognized to perform the alignment, there is a problem that the alignment precision is lowered. That is, when the examiner's sense is used to perform the alignment, it is difficult to objectively determine whether the inspection result has reached the required alignment accuracy. Moreover, when the examiner changes the situation, the degree of precision of the value will be different due to the difference in proficiency, and therefore it is not appropriate. The present invention has been made in view of the above problems, and an object of the present invention is to provide an inspection system having a simple configuration and capable of accurately contacting a contact unit and a contact unit with an inspection target. [Means for Solving the Problem] In order to achieve the above object, the contact unit of the third aspect of the patent application relates to the inspection of a plurality of conductive regions on the surface including a wiring structure for input or output of electrical signals. a contact unit for electrically connecting the wiring structure, wherein the contact unit includes: is disposed in accordance with an arrangement pattern of the wiring structure, and is electrically connected to the corresponding rotating structure to perform the wiring structure At least one of the input or output of the electric No. 5 is formed by a plurality of terminals arranged corresponding to the above-mentioned conductive region defined by the pre-corrected reference 31 611 8 1292828, and according to the corresponding conductive a detection terminal group that detects a positional relationship between the contact unit and the inspection target, and a support substrate for supporting the input/output terminal and the detection terminal group. According to the invention of the first aspect of the patent application, since the detection terminal group is provided corresponding to the conductive region included in the inspection target, the inspection target can be detected based on the presence or absence of conduction between the detection terminal group and the conductive region. Whether a positional deviation occurs between the contact unit and the contact unit. Further, since the terminal system constituting the detection terminal group can be formed in the same configuration as the input/output terminal, even when the detection terminal group is rearranged, the structure of the contact unit is not complicated, and the configuration can be simplified. Perform position detection. The contact unit according to the invention of claim 2, wherein the detecting terminal group is configured to correspond to the plurality of conductive regions, and the plurality of the plurality of detecting terminal groups are arranged corresponding to the foregoing In the case of the object in the vicinity of the end where the contact unit is in contact with the above contact unit, the payment is made. Binary: in the above invention, /, the portion of the contact early electrical connection has a plurality of the conductive regions, and the rectangular pair of ship poles are disposed in the contact unit corresponding to the fourth item of the replenishing enclosure. According to the invention, the device is electrically connected to the Wei terminal of the detection terminal group of the above,
(修正本)31761 J 9 1292828 依據經由對應於上述檢測端子群之上述導電區域之上述複 數個端子間之導通之有無,以檢測出該接觸單元與上述檢 查對象之間之位置關係之位置關係檢測手段。 申請專利範圍帛5項之接觸單元係於上述發明之中, 上述位置關係檢測手段係具備:用以供給預定之電壓之電 屢源;與上述電Μ源串聯連接,當上述複數個端子經由: 述導電區域導通時與上述電壓源之間形成閉路,根據上述 電壓源所供給之電位進行財之作用之被動元件(卿_ elements)。 申請專利範圍第6項之接觸單元係於上述發明之中, 上述被動元件為發光二極體。 申請專利範圍第7項之接觸單元係於上述發明之中, 上述檢測端子群係於上述導電區域巾,對應於與上述配線 構造電性絕緣之虛設墊(dummy pad)而配置者。(Revised) 31761 J 9 1292828 Detecting the positional relationship of the positional relationship between the contact unit and the inspection object based on the presence or absence of conduction between the plurality of terminals corresponding to the conductive region of the detection terminal group means. The contact unit of claim 5 is in the above invention, wherein the positional relationship detecting means includes: an electric power source for supplying a predetermined voltage; and is connected in series with the electric power source, wherein the plurality of terminals pass through: When the conductive region is turned on, a closed circuit is formed between the voltage source and the voltage source, and a passive component (clear element) that performs a function according to the potential supplied from the voltage source. The contact unit of claim 6 is in the above invention, and the passive element is a light-emitting diode. The contact unit of claim 7 is the invention according to the invention, wherein the detection terminal group is disposed in the conductive region towel, and is disposed corresponding to a dummy pad electrically insulated from the wiring structure.
申請專利範圍第8項之接觸單元係於上述發明之中, ^述檢測端子群係對應於上料電區域中之配線構造而配 /上述位置關係檢測手段復㈣:對於所對應之配線構 ⑽由上述輸“端子而輸人或輸出電氣信號時,可停止 對於上述被動元件之電壓供給之開關手段。 申睛專利範圍第9項之檢查“,係關於表面上形成 =用於電氣信號之輸人或輸出之至少―方之配線構造 個導電區域之檢查對象,經由對於上述配線構造之 =接進行電氣信號之輸出入以進行檢查之檢查系統, 仏查线包括:接觸單元’具備對應於上述配線構造而 (修正本)317611 10 配置,且與對應之上述配線構造 •鎳構造進行預定之電氣芦號之鈐連接’以對於上述配 出入端子,二或輪出之至少-方之輪 個端子所形成,且:據導電區域而配置之複數 .數個端子間之導通應之上述導電區域的上述複 對象之位置關:::::子述檢查 =述檢:端子群之支輸反;信號心= 戶上述檢查對象之電氣信號’以分析由上述檢查對象 二 信號之;及連接基板,用以電性連接上述信 號處理裝置與上述接觸單元。 [發明之效果] 本發明之接觸單元及檢查系統,係對應於檢查對象所 區域而設置檢測端子群,所以可發揮根據該檢 導電區域之間之導通之有無,而檢測出檢查對 象與接觸單元之間是否產生位置偏差之效果。而且,因構 成檢測端子群之端子係藉由與輸出入端子同樣之構成即可 形,H即使线配置檢測料群時,仍不致於使接 觸早兀之構造複雜化,可發揮以簡易之構成即可進行位置 偏差之檢測之效果。 【實施方式】 以下,就本發明之接觸單元及檢查系統,參照圖面詳 細說明。圖式係模式性者,所以,各部分之厚度與寬度等 之關係、各部分之厚m率#,與5見實者有所不同之點 應予留意,當然,圖式彼此間之相互之尺寸關係或比率亦 (修正本)3Π611 11 =‘同二部::。關於圖式中之符號,具有同-構化 例如%為發先一極體12a ”、“ 要統稱為“發光二極體12”。先-極體12b #,而依需 (實施形態1) 二先Γ:二施:態1之檢查系統。第1圖為實施形態 = 整體構成之模式圖。如第I圖所示,本實 :遠二m糸統係由,用以實現對於檢查對象1之電 元2、用以對於檢查對象進行輸入之電氣 =2= 之信號處理裝置3、及用以電性連接信號處 裝置3與接觸早70 2之連接基板4所構成。 =查對^係本實施形態1之檢查系統進行檢查之對 *向配置複數個預薄膜基材上之長度 固且在見度方向之端部附近於長度方向以 心鏈孔广長尺之捲帶狀構造,於檢查時 巴=輪孔5b由處理機推送往長度方向移動。在電路形成 。-域5a上,形成有包括配線構造6之導電區域,具體而心 =成有複數個配線構造6及虛設塾(d_y响)7之㈣, 裝載有半導體晶片8之構成。 各個之配線構造6係分別由,與半導體晶片8電性連 ,之内V線9、及與内導線9電性連接而於裝置時用以盥 :部機器電性連接之外導線1G、及與外導線電性連接而於 f查時用以輸出入電氣信號之測試塾u所構成。如此之配 線構造6係對應於半導體晶片所具備之連接端子而設置複 數個’藉此實現半導體晶片8與外部機器之間的電性連接。 (修正本)317611 12 ’能。墊:係具有申請專利範圍之導電區域之-例之功 b 而§,虛設墊7係由對於複數個配線構造6巾# -:,性絕緣之導電區域所形成,而對 •發揮任接本料檢查時所用之電氣信號之輸出入未 •用二:广。本貫施形態1中’如後所述,藉由有效活 ^號/二^檢查對象1與接觸單S 2之位置關係。 Γ ^、3係除了具有產生檢查時所使用之電 ^之^之外,尚有將所產生之電氣信號輸出給檢杳對 檢杳對析對於所輸人之電4信號之響應錢,以分析 之電氣特性之功能。具體而言,由信號處理褒 生之電我#號’係依序經由連接基板 元2而輸入檢查對W,由檢查對象^斤輸出之響及庫接^早 ::依序,觸單元2及連接基板4輸入於信號處理裝置 號處Γ裝置3與連接基板4之間之電性連接,實 :糸以多數條配線進行,但其連接態樣與本發明之 要部分無關係,所以,第J圖中對於兩 僅止於模式性之顯示。 軍性連接 連接基板4係用以電性連接接觸單元2與信號處理裝 =者。理論上,將接觸端子2側之連接端子與信號處理 裝置3側之連接端子之間,以預定之配線直接連接而省略 連接基板4之構成亦可。但是,實際上則因接觸單元2側 之連接端子為對應於檢查對象1所具備之檢測探針之配 置’所以連接端子間之間隔微小,與信號處理裝置3之直 接連接不容易。因而,本實施形態1中,追加例如隨延伸 (修正本)317611 13 1292828 .形成彼此狀間隔愈寬闊之形成錢數個配線構造之連接 基板4,經由此連接基板4以與信號處理裝置3與接觸單 元2電性連接。 …其次說明接觸單元2。接觸單元2係於使用本實施形 態1之檢查系統進行檢查時,用以對檢查對象丨進行電性 •連接者。具體而言’接觸單元2係具有·用以顯示位置關 係之檢查結果之發光二極體123至12d;對應於檢查對象i 所具備之複數個測試墊1i所配置之複數個接觸探針1 3 ; 對應於1個以上之虛設墊7所配置之檢測探針群i乜至 14d ;及用以支撐接觸探針13及檢測探針群i4a至1切之 支撐基板15之構成。其中,支撐基板15係由複數個基板 所構成,此等複數個基板係由螺栓構件丨6所互相固定。而 且,支撐基板15係以螺栓構件17固定於連接基板4。 發光二極體12a至12d係具有申請專利範圍中之被動 元件之一例之功能。具體而言,發光二極體12a至12d為 鲁構成後述之位置關係檢測部22a至22d之一部分,具有隨 接觸單元2與檢查對象1之間之位置偏差而使發光狀態變 化之功能。 茲將檢測探針群14a至Hd及接觸探針13所配置之位 置、及包括檢測探針群14a至14d之位置關係檢測部22a 至22d之構成說明如下。第2圖係接觸單元2之由檢查對 象1側所俯視之俯視構造及顯示對應於檢測探針群1h至 14d之位置關係檢測部22a至22d之構造之概念性模式 圖。第2圖中,為容易了解檢查時之與檢查對象丨之位置 (修正本)317611 14 置以虛線顯 關係’將理想對位時之⑯查對11之構件之位 不 如第2圖所示,接觸探針13係依對應於檢查對象i •:具備之測試塾11之排列形態而配置,藉由依此形態配 置’而可在檢查時將電氣信號輸出入於檢查對象i。另— -方面,㈣騎群14a至14d騎應於位在電路形成區域 :二44個:隅之虛設塾7而配置。具體而言,構成檢測探 f⑷之各探針19a至咖、20a至20d,於接觸 象1之間進行正確對位時,則分別配置於 /、虛δ又墊7a至7d重疊之位置。 接觸探針13係具有申請專利範圍中之輸出入端子之 -例之功能。具體而言,接觸探針13係對應於檢查對象] 所具備之測試塾11之酉,己置圖案而配置,藉由盘各測試墊 ^物理性接觸’而發揮對於檢查對象1輸人或輸出預定電 氣佗號之至少一方之功能。 一檢测探,群14係具有申請專利範圍中之檢測端子群 一 力月b於铋查時,用以檢測檢查對象1與接觸單 元2之間之位置關係之良否為目的。具體而言,檢測探針 群14a至14d係分別各由具有申請專利範圍之端子之一例 ^功能之2個探針19a至!9d、2Ga至2Gd所構成,於本實 1令’則利用該2個探針與預定之導電區域(虛設墊 7a至7d)接觸時經由導電區域而使2個探針導通之構成, 以檢測位置關係之良否。 接觸早7L 2係對應於檢測探針群14a幻4d而具備位 (修正本)317611 15 1292828 * 置關係檢測部22a至22d。位置關係檢測部 所示,分別具有發光-杨俨19 '、如第2圖 成。且體而愿源21串聯連接之構 成體而吕,例如位置關係檢測部22a具有, .位置關係檢測部22係具有與構成檢 針:9及探針2。電性連接之構成。具體而言,Γ如= 與探針2〇a電性連接之配線 預定之配線舆探針19a電性連接之極則具有經由 實施二大ΓΓ:探針13及探針19、20之具體構造。本 :::二中’接觸探針13及探㈣,分別具有同:The contact unit of claim 8 is in the above invention, and the detection terminal group corresponds to the wiring structure in the charging region, and the positional relationship detecting means is repeated (4): for the corresponding wiring structure (10) When the electric signal is input or outputted by the above-mentioned terminal, the switching means for the voltage supply of the passive element can be stopped. The inspection of the ninth item of the patent scope is "on the surface formation = for the electrical signal transmission" An inspection system for inspecting a conductive area of at least one of the wirings of the person or the output, and an inspection system for performing an inspection by inputting an electrical signal to the wiring structure, wherein the inspection line includes: the contact unit has a corresponding Wiring structure (Revised) 317611 10 configuration, and the corresponding wiring structure and nickel structure are connected to the predetermined electric reed number 'for the above-mentioned distribution terminal, the second or the wheel is at least the square wheel terminal Formed, and: a plurality of terminals arranged according to the conductive region. The conduction between the plurality of terminals corresponds to the position of the complex object of the conductive region:::: : sub-examination check = description: the terminal group is reversed; the signal heart = the electrical signal of the object to be inspected to analyze the two signals from the inspection object; and the connection substrate is used to electrically connect the signal processing device with The above contact unit. [Effects of the Invention] The contact unit and the inspection system of the present invention provide the detection terminal group in accordance with the region to be inspected. Therefore, it is possible to detect the presence of the conduction between the detection conductive regions and detect the inspection target and the contact unit. Whether there is a difference in position between them. Further, since the terminals constituting the detection terminal group can be formed by the same configuration as the input/output terminal, even if the line is arranged to detect the material group, the structure of the contact early is not complicated, and the configuration can be simplified. The effect of detecting the positional deviation can be performed. [Embodiment] Hereinafter, the contact unit and the inspection system of the present invention will be described in detail with reference to the drawings. The schema is model, so the relationship between the thickness and the width of each part, the thickness m of each part, and the difference between the five and the actual ones should be noted. Of course, the patterns are mutually The dimensional relationship or ratio is also (corrected) 3Π611 11 = '同同部::. Regarding the symbols in the drawings, there are homo-structures, for example, % is the first-polar body 12a", and "to be collectively referred to as "light-emitting diode 12". First-pole body 12b #, and on demand (Embodiment 1) Two-in-one: Two-in-one: State 1 inspection system. Figure 1 is a schematic diagram of the overall configuration. As shown in FIG. 1, the present embodiment: the signal processing device 3 for realizing the input of the object 2 for the inspection object 1 and the electrical input for the inspection object = 2 = The device 3 is electrically connected to the signal and is connected to the connection substrate 4 which contacts the early 70 2 . Checking the inspection system of the first embodiment is performed on a plurality of pre-film substrates, and the length of the pre-film substrate is fixed in the vicinity of the end portion in the visibility direction. The structure is such that the bar = wheel hole 5b is pushed by the processor to move in the longitudinal direction during inspection. In the circuit formation. In the field 5a, a conductive region including the wiring structure 6 is formed, and specifically, a plurality of wiring structures 6 and dummy dies (d_y) 7 are formed, and the semiconductor wafer 8 is mounted. Each of the wiring structures 6 is electrically connected to the semiconductor wafer 8, and the V line 9 and the inner lead 9 are electrically connected to each other for use in the device: the wire 1G is electrically connected to the device, and It is composed of a test 塾u for electrically connecting to an external wire and for inputting an electrical signal during the check. Such a wiring structure 6 is provided in plural numbers corresponding to the connection terminals of the semiconductor wafer, thereby achieving electrical connection between the semiconductor wafer 8 and an external device. (Revised) 317611 12 ‘Can. Pad: It is a function of the patented area of the conductive area - §, the dummy pad 7 is formed by a plurality of wiring structures 6 -:, electrically conductive conductive areas, and the The output of the electrical signal used in the material inspection is not used. In the present embodiment, as described later, the positional relationship between the object 1 and the contact sheet S 2 is checked by the effective activity number/two. Γ ^, 3 series in addition to the electricity used in the inspection, there is still the output of the electrical signal to the inspection of the response to the input of the electricity 4 signal response to the input, to The function of analyzing the electrical characteristics. Specifically, the signal No. of the signal processing is generated by inputting the inspection pair W via the connection substrate element 2, and the output of the inspection object is output and the library is connected early:: in sequence, the touch unit 2 And the connection substrate 4 is input to the signal processing device No., and the electrical connection between the device 3 and the connection substrate 4 is performed. Actually, the connection is performed by a plurality of wires, but the connection state thereof has nothing to do with the essential part of the present invention. In the J diagram, the display of the two is only for the mode. Military connection The connection substrate 4 is used to electrically connect the contact unit 2 with the signal processing device. Theoretically, the connection terminal between the contact terminal 2 side and the connection terminal on the signal processing device 3 side may be directly connected by a predetermined wiring, and the connection substrate 4 may be omitted. However, in practice, since the connection terminal on the side of the contact unit 2 corresponds to the configuration of the detection probe provided in the inspection object 1, the interval between the connection terminals is small, and the direct connection with the signal processing device 3 is not easy. Therefore, in the first embodiment, for example, the connection substrate 4 having a plurality of wiring structures having a wide gap between each other is formed by extending (correction) 317611 13 1292828, and the connection substrate 4 is connected to the signal processing device 3 via the substrate The contact unit 2 is electrically connected. ...the second description of the contact unit 2. The contact unit 2 is used to electrically connect the object to be inspected when it is inspected using the inspection system of the first embodiment. Specifically, the contact unit 2 has the light-emitting diodes 123 to 12d for displaying the inspection results of the positional relationship, and the plurality of contact probes 1 3 corresponding to the plurality of test pads 1i provided in the inspection object i. A detection probe group i乜 to 14d disposed corresponding to one or more dummy pads 7 and a support substrate 15 for supporting the contact probe 13 and the detection probe group i4a to 1 are cut. Here, the support substrate 15 is composed of a plurality of substrates, and the plurality of substrates are fixed to each other by the bolt member 丨6. Further, the support substrate 15 is fixed to the connection substrate 4 by a bolt member 17. The light-emitting diodes 12a to 12d have a function as an example of a passive component in the patent application. Specifically, the light-emitting diodes 12a to 12d function as one of the positional relationship detecting sections 22a to 22d which will be described later, and have a function of changing the light-emitting state in accordance with the positional deviation between the contact unit 2 and the inspection object 1. The configuration in which the detection probe groups 14a to Hd and the contact probes 13 are disposed and the positional relationship detecting portions 22a to 22d including the detection probe groups 14a to 14d will be described below. Fig. 2 is a conceptual schematic diagram showing the structure of the contact unit 2 in a plan view from the side of the inspection object 1 and the structure of the positional relationship detecting portions 22a to 22d corresponding to the detection probe groups 1h to 14d. In Fig. 2, in order to make it easy to understand the position of the inspection object at the time of inspection (Revised) 317611 14 is shown in a dotted line. The position of the 16-pair 11 in the ideal alignment is not as shown in Fig. 2, The contact probe 13 is disposed in accordance with the arrangement of the test object i: the test 塾 11 provided, and by arranging in this manner, an electrical signal can be output to the inspection object i during the inspection. On the other hand, (4) riding group 14a to 14d should be placed in the circuit formation area: two 44: 隅 虚 塾 而 7 configuration. Specifically, when the probes 19a to 20a to 20d constituting the detecting probe (4) are correctly aligned between the contact images 1, they are disposed at positions where the /, δ and pads 7a to 7d overlap each other. The contact probe 13 has the function of an example of an input/output terminal in the patent application. Specifically, the contact probe 13 is disposed corresponding to the test file 11 provided in the inspection object, and is placed in a pattern, and is input or outputted to the inspection object 1 by the physical contact of the test pads of the disk. The function of at least one of the predetermined electrical nicknames. For the detection, the group 14 has the detection terminal group in the patent application scope. The force month b is used for detecting the positional relationship between the inspection object 1 and the contact unit 2 when the inspection is performed. Specifically, the detection probe groups 14a to 14d are each composed of two probes 19a having functions of one of the terminals of the patent application range. 9d, 2Ga to 2Gd, in the case of the present invention, when the two probes are in contact with a predetermined conductive region (dummy pads 7a to 7d), the two probes are turned on via the conductive region to detect Whether the positional relationship is good or not. The contact early 7L 2 system has a bit (correction) 317611 15 1292828 corresponding to the detection probe group 14a phantom 4d. The relationship detecting sections 22a to 22d. As shown in the positional relationship detecting unit, each of them has illuminating - Yang 俨 19 ', as shown in Fig. 2. Further, the positional relationship detecting unit 22a has a configuration in which the body source 21 is connected in series, and the positional relationship detecting unit 22 has a configuration of a probe 9 and a probe 2. The composition of electrical connections. Specifically, for example, the wiring of the wiring electrically connected to the probe 2A is electrically connected to the probe 19a, and the pole of the probe 19a is electrically connected. The specific configuration of the probe 13 and the probes 19 and 20 is implemented. . This :::2] contact probe 13 and probe (4) have the same:
之構’所以,以下wJ '十9為例說明具體之構造。 弟3圖為採針1 9之槿生 且古叮模式性剖視圖。探針19俦 檢==單元2之支樓基板15之上面(檢查時= “:象!相對向之面)之法線 :; 言,探針19係如第s^ 再以具體而 24、25,在針狀構件24、^;^:在兩端配置有針狀構件 造。針狀構件24、251彈置有彈簧構件%之構 電性封斜所裕士 .彈育構件26係分別由金屬等之導 ’ /成,藉由將針狀構件2 簧構件26與針狀 彈貫構件26、彈 成一體化且電性連接之構相固接,而具有物理上形 平行具有相對於上述上面舆垂直方向 σ 27’精由在開口部27收容探針19, (修正本)317611 16 丄292828 探2 19即由支撑基板15所支撲。另一方面探針19係藉由 收谷於開口部27 ’而具有往與開口部27之中心軸平行曰之 方向伸縮之功此,於檢查時,一邊施加來自彈黃構件Μ 之彈壓力,一邊接觸於測試墊1 1。 ’ :容於開口部27之構件,除了探針19之外尚有導線 ¥線28係收容於開口部27内,相對於探針而位在 二、檢查對象i相反側之位置,在開口部27_ 端與針《件25互相接觸之狀態。導線28係與探 2?欢2〇接觸% ’具有用以分別連接構成位置關係檢測部 斜^ L光一極體12、電壓源21之配線之功能’與接觸探 •十13接觸時,❹有性連接設於連接基板4之預定 之配線構造與針狀構件25之配線之功能。 u其次說明,本實施形態1之檢查.系統中,檢測探針群 =及位置關係檢測部22所發揮之功能。第4圖及第^ ^用以說明檢測探針群14及位置關係檢測部22之功能之 t式圖’其中’第4圖顯示檢查對象1與接觸單元2之間 、行正確之對位之狀禮,第5圖顯示檢查對象】盘接觸單 元2相對平行移動而導致位置偏差時之狀態。第:圖及第 :中’僅顯不位置關係檢測部仏及配置於位置關係檢 ==二圍m件,但以下所說明之功能,關於 位置關係&測部22b至22d亦同樣成立,當無庸費言。 t第4圖所不’進订正碎對位時,探針19a、20a與虛 汉a相接觸,於是經由虛設塾7a將探針19a、施間予 以電性連接。因而,於位置關係檢測部22a中,發光二極 (修正本)3176]1 】7 12a及包C源2ia形成閉路,於是根據電壓源所供 給之電位’發光二極體12a會依預定之亮度發光。’、 另一方面如第5圖所示,接觸單元2與檢查對象!之 間未能進行正確對位,位置僅偏差預定距離時,發光二極 體心則不發光。亦即,由於接觸單元2與檢查對象;·之 間&生位置偏差’則導致探針19&、與虛設塾h之間 亦發生位置偏差’如第5圖所示,形成探針20a U 7a接觸’但探針19a與虛設墊〜未接觸之狀態。 由第5圖可得知,於此時探針19心服間並未電性連 接,位置關係檢測部22a中,發光二極體12 棒因此,電壓源仏對於發光二極體心 並未供電’且發光二極體12a不會發光。 认未亦即本貝施形態1之檢查系統中,當接觸單元2與 /-對象1之間進行正確對位時,位置關係檢測部22“ 2㈣具備之各發光二極體12ai12d會發光, =差時:則發光二極體12a幻至少有!個不發光。 、口之3特性係指發光二極體12a至⑼ =差發光二極體一有任一個不發先= 極體,檢查系統之使用者係藉由確認發光二 _ 之發光狀態,而可判定對位是否正確。 本貫施形態1中,今法难敕料 如第4圄所精確度。具體而言, "不,在進行正確對位時,各探針I 9a、20a之各 長度方向之中心以第4圖中為表示探針⑽、恤之圓之 中心)與虛設墊7a之周緣部之距離,預先設定為預定之長Therefore, the following structure is explained by taking the following wJ '10' as an example. The younger brother 3 is a schematic cross-sectional view of the picking needle 1 9 and the ancient 叮. The probe 19 is inspected == the upper surface of the support base plate 15 of the unit 2 (the normal line at the time of inspection = ": like! relative to the surface":;, the probe 19 is as follows, s^ 25, in the needle-like member 24, ^; ^: at the two ends are arranged with a needle-shaped member. The needle-shaped members 24, 251 are elastically placed with a spring member% of the electrical sealing angle of the Yushi. The elastic member 26 is respectively The guide member of the metal or the like has a physical shape parallel to the above by the needle member 2 spring member 26 and the needle-shaped elastic member 26, and the elastically integrated and electrically connected structure are fixed. The upper surface σ 27' of the upper surface is accommodated by the probe 19 in the opening portion 27, (corrected) 317611 16 丄 292828, and the probe 19 is supported by the support substrate 15. On the other hand, the probe 19 is closed by the valley. The opening 27' has a function of expanding and contracting in a direction parallel to the central axis of the opening 27, and contacts the test pad 1 1 while applying an elastic pressure from the elastic member 于 during the inspection. In addition to the probe 19, the member of the opening portion 27 is housed in the opening portion 27 in the opening portion 27, and is positioned in the second portion with respect to the probe. The position on the opposite side of the inspection object i is in a state in which the opening portion 27_ ends and the needle "piece 25 are in contact with each other. The wire 28 is in contact with the probe 2", and the contact portion is detected to be connected to each other to form a positional relationship detecting portion. When the function of the wiring of the photo-integrator 12 and the voltage source 21 is in contact with the contact probe 10, the function of the predetermined wiring structure of the connection substrate 4 and the wiring of the needle-shaped member 25 is electrically connected. In the system of the first embodiment, the function of the detection probe group = and the positional relationship detecting unit 22 is detected. The fourth figure and the second embodiment illustrate the functions of the detection probe group 14 and the positional relationship detecting unit 22. T-figure 'where 'the 4th figure shows the alignment between the inspection object 1 and the contact unit 2, and the correct alignment of the line, and the fifth figure shows the state of the inspection object] when the disc contact unit 2 moves relative to the parallel to cause a positional deviation In the figure: the figure and the middle: the only position-independent relationship detecting unit and the positional relationship check == two squares, but the functions described below are also true for the positional relationship & measuring units 22b to 22d. When there is no need to say anything. When the alignment is in the alignment, the probes 19a and 20a are in contact with the imaginary a, and the probe 19a and the application are electrically connected via the dummy 塾7a. Therefore, in the positional relationship detecting unit 22a, the illuminating diode (corrected) This) 3176]1] 7 12a and the package C source 2ia form a closed circuit, so that the light-emitting diode 12a emits light according to a predetermined brightness according to the potential supplied from the voltage source. On the other hand, as shown in Fig. 5, the contact When the correct alignment is not performed between the unit 2 and the inspection object!, the position of the light-emitting diode does not illuminate when the position is only shifted by a predetermined distance. That is, due to the position difference between the contact unit 2 and the inspection object; 'There is also a positional deviation between the probe 19& and the dummy 塾h'. As shown in Fig. 5, the probe 20a U 7a is contacted 'but the probe 19a and the dummy pad are not in contact with each other. As can be seen from Fig. 5, at this time, the probe 19 is not electrically connected between the convictions, and in the positional relationship detecting portion 22a, the light-emitting diode 12 is so that the voltage source 并未 does not supply power to the light-emitting diode core. And the light-emitting diode 12a does not emit light. In the inspection system of the first embodiment, when the contact unit 2 and the /-object 1 are correctly aligned, the positional relationship detecting unit 22 "2 (4) each of the light-emitting diodes 12ai12d emits light, = When the difference is low: the illuminating diode 12a has at least one illusion! The singularity of the mouth is the illuminating diode 12a to (9) = the difference illuminating diode has any one without first = polar body, inspection system The user can determine whether the alignment is correct by confirming the illuminating state of the illuminating light _. In the present embodiment 1, the current method is difficult to predict the accuracy of the fourth 。. Specifically, " When the correct alignment is performed, the distance between the center of each of the probes I 9a and 20a in the longitudinal direction is the distance between the probe (10) and the center of the dummy pad 7a in Fig. 4, and is set in advance as Scheduled length
1S (修正本)317611 丄292828 度。具體而言,如第4圖所示,當對位正確時,相對於長 方形狀之虛設墊7a,探針19a之中心軸係配在虛設墊7a 之周緣部之中最靠近兩邊之間之距離為di、心之位置,探 針20a之中心軸則配置在與最靠近之兩邊之距離為心、心 之位置。 第4圖中,將探針198、2〇&之外徑放大顯示,但實際 之探針19 a、2 0 a之外徑通常為極小值。所以,於本實施 形態1之檢查系統中,例如相對於檢查對象丨,接觸單元2 在y方向發生位置偏差dz時,探針19a會從虛設墊以脫 落,於是,發光二極體12a不會發光,因而可檢測為位置 偏差發生。另一方面,即使由第4圖所示之狀態發生位置 偏差時,例如相對於檢查對象U觸單元2往y方向位置 偏差=(<d2)時,探針19a、2〇a仍然維持與虛設墊以接觸 之狀態,所以發光二極體12a會發光。 ”意指於判定位置偏差之有無時,可設定某程 谷許範圍亦即,無需由第4圖所示之狀態即使稍為 位置偏差亦全部檢測為位置偏差,即使發生位置偏差,對 =檢查無甚大影響之輕微程度者,不會檢測為位置偏差, 貫用上較佳。所以,本實施形態1係對於探針i 9a、20a 之配置位置’設法在發生檢查上不致於成為問題程度之位 ^偏差時,仍使發光二極體12a發光,亦即不會將此情形 t測為位置偏差。dl至d4之具體數值,係依檢查對象1之 ,荨而定’但較佳為2〇㈣至5〇以m,更佳為― ㈣’即在-般檢查中,肢輕微之位置偏差則不予檢測 (修正本)317611 19 1292828 對於松查上可錯生問題之位 以檢測出。當銬,今後由於婵4 ^ 只』』碩只予 蚪…装後由於微細加工技術之進步等而檢查 對象之構逅更為微細化時,則以小於3。“為佳,而d!至 d4之具,數值,則以例如1()至為佳。 本A施形態1之檢查系統係於接觸單元2中,且 ,數個位置關係檢測部22。所以,於本實施形態i中二在第 4圖中之與又方向、y方向平行之方向相關之位置偏差,亦 ,即’不但因接觸單元2與檢查對象1相對平行移動所發生 之位置偏差’而且即使在檢查對象!以支樓基板15之上面 之法,方向為中心、轴相對旋轉時,亦均可檢測出位置偏差。 、第6圖為在接觸單元2與檢查對象i之間,檢查對象 ^以支禮基板15之上面之法線方向為中,相對旋轉時之 模式圖。如第6圖所示,以虛設塾7a及探針—、他之 附近為中心相對旋轉而發生位置偏差時,探針、罚& 與虛設墊7a之間之電性連接仍維持,所以,僅以位置關係 檢測部22a ’無法檢測出接觸單元2與檢查對象工之間所 發生之位置關係之異常。 心然而,本實施形態i中,接觸單元2係除了位置關係 私測。卩22a之外,尚具備位置關係檢測部2別至。當 接觸單元2與檢查對象丨之間發生相對旋轉時,如第6圖 中亦有所示,旋轉中心以外之部分將發生位置偏差。所以, 各個位置關係檢測部22b至22d中之探針丨肋至19d、2〇b 至20d與所對應之虛設墊几至7d不接觸,且各發光二極 體12b至12d不發光,而可檢測出位置偏差。因此,本實 (修正本)317611 20 1292828 4 施形態1之檢查系統,因具備複數個位置關係檢測部22, 所以二即使接觸單元2與檢查對象!之間發生旋轉時,仍 可確實檢測出位置關係之異常。 • 而且,本實施形態之檢查系統係對於面内方向,亦即 第4圖令所不之χ方向及乂方向相關之位置偏差進行檢測 -之外,對於檢查對象丨與接觸單元2之_發生之傾斜亦 可檢測出。如第3圖所示,在支撐基板15之上面,有對應 •於位置關係檢測部22aS 22d之檢測探針群14a至Ud,〜 配置在對應於檢查對象1所具備之電路形成區域53之4 個角隅之位置。因而,檢查對象1與接觸單元2之間發生 傾斜時,位置關係檢測部22a至22d中之至少丨個之探 =舍所對應之虛設塾7不發生接觸,於是發光二極體 不會發光。 ^ 7圖顯示檢查對象i與接觸單元2之間發生傾斜時 杳對=接Γ7圖所示’以彼此發生傾斜之狀態,使檢 觸觸單元2 4,例如檢測探針群14b係接 觸於虛設塾7b,但檢測探針群14c則不接觸於虛設塾 =此恭對應於檢測探針群14b之位置關係檢測部22b所且 ::發光二極體12b會發光,但對應於檢測探針群14c: 發先二極體12c則不發光。檢查系統之 形態,即可察覺異常。 有由此發先 f本實施形態i之檢查系統之優點。首先,本 Λ 二之檢查系統係根據上述之構成可檢測出接觸單 疋2糾查對象!之間之位置偏差之發生。以檢測位置偏 (修正本)317611 21 差之觀點而言,最簡易之構成為藉 •群Η及位置關係檢測部22即可實現::;二 =罙針群Η及位置__22 ‘ ^卩’”㈣及第”所示’對於檢查對象^接 觸早凡2之間因相對旋轉或傾斜所發生之位置偏差,藉由 设置複數個檢測探針群14及位置關係檢測苦…,則可更 檢測出位置偏差。由確實檢測位置偏差之觀點而 S,取好將複數個檢測探針群14間之距離儘量增加。亦 即,例如因發生旋轉運動而位置偏差時,位置偏差之程度 係離旋轉中心愈遠愈大。因而,複數個檢測探針群中,有 部分與旋轉巾心致時(例如第6时之檢測探針群 14a),就位置偏差檢測精度之提升觀點而言,其他之檢測 探針群14’最好儘量配置在遠離與旋轉中心一致之檢測探 針群14之位置。基於如此之觀點,本實施形態丨係將複數 個檢測探針群14a至I4d配置在互相遠離最大距離之位 置’具體而言’係配置在檢查對象i(本實施形態i中為構 成k查對象1之電路形成區域5a)之端部附近。更具體而 §,由於電路形成區域5a為長方形狀,所以對應其各頂點 附近’亦即,藉由配置在電路形成區域“之4個角隅之位 置,以構成檢測探針群14a至14d間之距離為最大。本實 施形態1中,因電路形成區域5a為長方形狀,所以,檢測 探針群14a至14d係分別配置在電路形成區域5&之長方形 狀之端部附近之區域中’長方形狀之對角線上。藉由配置 22 (修正本)3】7611 1292828 因而 在此位置,使複數個檢測探針群可確保充分之間隔 可獲得更精確之對位。 而且 不貝她形恕1之檢查系統係即可利用簡易之構 成貫施對位。具體而言,本實施形態!之檢查系統,係對 於支撐基板15無需如習知形成視認用之貫穿孔等,僅設置 對於檢查對象電性連接所需之與接觸探針13同一構造之 由探針19、20所形成之檢測探針群14。由於接觸探針 本來即對應於測試塾U而設置多數個,所以,即使追加支 撐與接觸探針13同一構造之探針19、20,也不致於使支 撐基板15之構造複雜化,而可實現簡易之構成。 而且,與探針19、20連接之位置關係檢測部22,亦 僅由電壓源21及發光二極體12所構成之簡易者。而且, 電壓源21及發光二極體12與探針19、2〇之電性連接,亦 如苐3圖所示,可使用與接觸探針13相同之構造(導線28) 者。由於如上所述’本實施形態i中追加設置檢測探針群 14及位置關係檢測部22,並未使接觸單元2之構造複雜 化,亦即,本實施形態之檢查系統,係可利用簡易之構成 進行對位。 並且,本實施形態i之檢查系統,.係因採用位置關係 檢測部22以檢測位置偏差之構成,所以具有可正確對位之 優點。亦即,位置關係檢測部22係僅於探針19、2〇中經 由虛設墊7而導通時,發光二極體12才發光之客觀判定標 準。因而,於判定位置偏差之有無時,不致於因檢查系統 之使用者之熟練度等導致判定結果有所差別,可客觀且正 (修正本)317611 23 1292828 確地檢測出位置偏差之有無。 (實施形態2) 用 時 圖 /、人-兄明施形態2之檢查系統。本實施形態2係採 於檢查未具傷相當於虚設塾之導電區域之檢查對象 可進行正確對位之構成。 第^圖為本實施形態2之檢查系統之整體構成之模式 如第8圖所示,本實施形態2之檢查系統係除了呈有 與貫施形態i同樣之信號處理裝置3及連接基板4之構成 之外’復具有對應於未具備虛㈣之檢查對象31而追加施 以檢測探針群14之配置圖案之接觸單元32的構成。本實 施形態2中,對於具有與實施形们賦予同樣之符號^ 稱之構件’除非另有說明,否則視為與實施形態工中之構 件具有同樣之構造·功能。 第9圖為接觸單& 32之上面之檢測探針群14之配置 圖案及包括檢測探針群14之位置關係檢測部之構成之模 式圖。如第9圖所示,在本實施形態2中,配置於接觸單 兀32之上面之接觸探針13,係對應於檢查對象^之測試 墊11<配置圖案而配置。 另一方面,本實施形態2中,因檢查對象31未形成有 «無法㈣實轉態i之純赌針群14對應 “ 11 Γ置之構成。因而’本實施形態2中,係採用 測塾11作為中請專利範圍之導電區域,以對於由多數存 在之測試墊11中選擇預定者(於第9圖中,以測試塾… 至lid表示。以下之說财㈣)之方式,配置檢測探針群 (修正本)317611 24 1292828 14a至14d。第9圖中之測試墊11 e至〗〗厂則與實施形態 1中之測試墊11同樣,具有經由所對應之接觸探針丨3進 行電氣说之輸出入之功.能。 對應於檢測探針群14a至14d之配置態樣之變更,位 置關係檢出部33a至33d之構成,亦與實施形態i中之位 置關係才欢測部22之構成不@。具體而f,位置關係檢測部 33之構成係除了實施形態i本來之構成,在探針19與發 ,二極H 12之陽極之間追加開關34之構成,採用僅於判 定對位是否正確時使開關34導通之構成。 其次說明本實施形態2之檢查系統中,位置關係檢測 f 33a至33d所發揮之功能及優點。以下之位置關係檢測 邛33a至33d中’係以位置關係檢測部33a為例予以說明, 但位置關係檢測部33b至33d亦與位置關係檢測部咖相 同,當無庸贅言。 第10圖為關於位置檢測部33a,判定檢查對象31與 _接觸早70 32之間之對位是否正確時之動作之模式圖。如第 圖所示,於對位判定時,開關34a可控制為導通狀離。 當測試塾Ua與探針19a、20a接觸時,位置關係檢測部 33a係形成閉路,根據電壓源所供給之電位,發光二極體 12a會發光。因此,檢查系統之使用者,可與實施^丨 之情形同樣,藉由檢測發光二極體12a之發光之有益,得 判定檢查對象31與接觸單元32之間之對位是否正確。而 且’本實施形態2中,亦可藉由設定預定之容許範圍,及 具備複數個位置關係檢測部33,而可進行檢測對象^與 (修正本)3】76】1 25 接觸單元32相對旋轉時之檢測,及檢查對象31與接觸單 元32之互相傾斜時之檢測。 /其次說明使用本實施形態2之檢查系統對檢查對象“ .進打預定之檢查時,位置關係檢測部33a至33d所發揮之 功能及優點。帛11圖為檢查時有關位置關係檢測部咖 ‘之模式圖。如第11圖所示,以檢查系統進行檢查時,由信 號處理裝置所產生之電氣信號等,經由接觸探針13而輪出° 入於測試塾Ua。因而,於檢查之際,位置關係檢測部咖 構成閉路時’經由接觸探針13所輸出入之電氣信號恐影響 到位置關係檢測部33a。例如所輸入之電氣信號為高電位 時,測試墊lla之電位亦上#,如此之電位有可能損及構 成位置關係檢測部33a之電壓源21a或發光二極體12&之 功能等。 因而,於本實施形態2中,在位置關係檢測部33a追 加設置開關34a,於檢查時,使開關34a變化為切斷(〇ff) _狀態’以防止所輸出入之電氣信號影響及構成位置關係檢 測部33a之發光二極體12a。檢查時,藉由將開關3乜變 化為切斷狀態’構成位置關係檢測部33a之電壓源等, 亦有可能影響到檢查結果。亦即,檢查之際,將開關3“ 維持於導通(on)狀態時,在位置關係檢測部3如所產生之 雜訊等恐輸入於測試塾lla。如此,檢查之際,位置關係 檢測部33a形成閉路時,由於雜訊信號混入檢查用電氣信 號之狀態下會輸入於測試塾,使檢查結果受到影響,所以, 本實施形態2中於檢查之際,藉由將開關3“切換成切斷 (修正本)317611 26 狀心以防止如此之弊害之發生。 (變形例) ^人說明實施形態2之檢查系 之檢查系统係於形成在檢查對=:本= .公配線構造之一部分,,具有非經由η區: 電性連接複數個測試塾間之配線構造時==, 造,而可進行正销位。 利用此配線構1S (Revised) 317611 丄292828 degrees. Specifically, as shown in Fig. 4, when the alignment is correct, the central axis of the probe 19a is fitted to the distance between the two sides of the peripheral portion of the dummy pad 7a with respect to the rectangular dummy pad 7a. For the position of di and the heart, the central axis of the probe 20a is disposed at the position of the heart and the heart at the distance from the closest two sides. In Fig. 4, the outer diameters of the probes 198, 2A &amp; are enlarged, but the outer diameters of the actual probes 19a, 20a are usually extremely small. Therefore, in the inspection system according to the first embodiment, for example, when the positional deviation dz occurs in the y direction with respect to the inspection target 丨, the probe 19a is detached from the dummy pad, and thus the light-emitting diode 12a does not. Luminescence, and thus can be detected as a positional deviation. On the other hand, even if the positional deviation occurs in the state shown in Fig. 4, for example, when the positional deviation in the y direction with respect to the inspection target U touch unit 2 = (<d2), the probes 19a and 2a remain maintained. Since the dummy pad is in contact with each other, the light-emitting diode 12a emits light. "When the position deviation is determined, the range of the range can be set, that is, the position shown in Fig. 4 is not required to be detected as a positional deviation even if the position is slightly shifted. Even if a positional deviation occurs, check = no If the degree of slight influence is too small, it will not be detected as a positional deviation, and it is preferably used. Therefore, in the first embodiment, the position of the probes i 9a and 20a is determined to be in a position where the inspection does not become a problem. When the deviation occurs, the light-emitting diode 12a is still illuminated, that is, the position t is not measured as the positional deviation. The specific value of dl to d4 is determined according to the object 1 of the inspection object, but preferably 2 (d) to 5 〇 in m, more preferably ― (d) 'that is, in the general examination, the positional deviation of the limb is not detected (Revised) 317611 19 1292828 The position of the problem that can be wrongly detected is checked.铐 铐 铐 铐 ^ ^ ^ ^ ^ ^ ^ ^ ^ 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕 硕For d4, the value is preferably, for example, 1 (). The inspection system of the first embodiment of the present invention is in the contact unit 2, and a plurality of positional relationship detecting units 22. Therefore, in the present embodiment i, the positional deviation in the direction parallel to the direction of the y direction and the y direction in Fig. 4, that is, the positional deviation due to the relative parallel movement of the contact unit 2 and the inspection object 1 'And even checking the object! The positional deviation can also be detected when the direction is centered and the axis is relatively rotated by the method of the upper surface of the support substrate 15. Fig. 6 is a view showing the relationship between the contact unit 2 and the inspection object i in the normal direction of the upper surface of the support substrate 15 and the relative rotation. As shown in Fig. 6, when the positional deviation occurs due to the relative rotation of the dummy 塾7a and the probe--the vicinity thereof, the electrical connection between the probe, the penalty & and the dummy pad 7a is maintained, so Only the positional relationship detecting unit 22a' cannot detect the abnormality of the positional relationship between the contact unit 2 and the inspection target worker. However, in the present embodiment i, the contact unit 2 is in addition to the positional relationship. In addition to the 卩22a, the positional relationship detecting unit 2 is not provided. When relative rotation occurs between the contact unit 2 and the inspection target ,, as shown in Fig. 6, a positional deviation occurs in a portion other than the rotation center. Therefore, the probe ribs 19d, 2〇b to 20d in the respective positional relationship detecting portions 22b to 22d are not in contact with the corresponding dummy pads several to 7d, and the respective light emitting diodes 12b to 12d are not illuminated, but may be A positional deviation was detected. Therefore, the present invention (Revised) 317611 20 1292828 4 The inspection system of the first embodiment has a plurality of positional relationship detecting units 22, so that the contact unit 2 and the inspection target are even two! When a rotation occurs between them, the abnormality of the positional relationship can still be detected. • In addition, the inspection system of the present embodiment detects the in-plane direction, that is, the positional deviation associated with the χ direction and the 乂 direction of the fourth figure, and the occurrence of the inspection target 丨 and the contact unit 2 The tilt can also be detected. As shown in Fig. 3, the detection probe groups 14a to Ud corresponding to the positional relationship detecting portions 22a and 22d are disposed on the upper surface of the support substrate 15, and are disposed in the circuit forming region 53 corresponding to the inspection object 1. The location of the corners. Therefore, when the tilt between the inspection object 1 and the contact unit 2 occurs, at least one of the positional relationship detecting portions 22a to 22d does not contact the dummy 塾7 corresponding to the ground, so that the light-emitting diode does not emit light. ^7 shows a state in which the tilt between the inspection object i and the contact unit 2 is 杳 pair = the state shown in Fig. 7 is inclined with respect to each other, so that the touch contact unit 24, for example, the detection probe group 14b is in contact with the dummy塾7b, but the detection probe group 14c is not in contact with the dummy 塾=this corresponds to the positional relationship detecting unit 22b of the detection probe group 14b: the light-emitting diode 12b emits light, but corresponds to the detection probe group 14c: The first diode 12c does not emit light. Check the shape of the system to detect anomalies. There is an advantage of the inspection system of the present embodiment i. First of all, the inspection system of this 可2 can detect the contact 纠2 check object according to the above configuration! The occurrence of a positional deviation between them. From the viewpoint of detecting the positional deviation (corrected version) 317611 21 difference, the simplest configuration is realized by the group and positional relationship detecting unit 22::; 2 = pin group and position __22 ' ^卩''(4) and the first 'shown' for the positional deviation of the inspection object ^ contact between the two due to relative rotation or tilt, by setting a plurality of detection probe groups 14 and positional relationship detection bitterness... A positional deviation was detected. From the viewpoint of accurately detecting the positional deviation, S is taken as much as possible to increase the distance between the plurality of detection probe groups 14. That is, for example, when the positional deviation occurs due to the rotational motion, the degree of the positional deviation is larger as it is away from the center of rotation. Therefore, when a part of the plurality of detection probe groups is caused by the rotation of the towel (for example, the detection probe group 14a at the sixth time), the detection probe group 14' is used in view of the improvement of the positional deviation detection accuracy. It is preferable to arrange as far as possible from the position of the detection probe group 14 that coincides with the center of rotation. In view of the above, in the present embodiment, a plurality of detection probe groups 14a to 14d are disposed at positions far from each other at a maximum distance, and are specifically arranged in the inspection target i (in the present embodiment, i is a k-check object). The circuit of 1 is formed near the end of the region 5a). More specifically, §, since the circuit formation region 5a has a rectangular shape, it corresponds to the vicinity of each vertex, that is, by being disposed at four corners of the circuit formation region to constitute the detection probe group 14a to 14d. In the first embodiment, since the circuit formation region 5a has a rectangular shape, the detection probe groups 14a to 14d are disposed in the vicinity of the rectangular end portion of the circuit formation region 5& On the diagonal of the shape. By configuring 22 (Revised) 3] 7611 1292828, in this position, a plurality of detection probe groups can ensure sufficient spacing to obtain a more accurate alignment. The inspection system can be aligned with a simple configuration. Specifically, the inspection system of the present embodiment is such that the support substrate 15 does not need to be formed into a through hole such as a conventional one, and only the inspection target is provided. The detection probe group 14 formed by the probes 19 and 20 having the same configuration as the contact probe 13 required for the sexual connection is provided. Since the contact probes are originally provided corresponding to the test 塾U, a plurality of them are provided. Even if the probes 19 and 20 having the same structure as that of the contact probe 13 are additionally added, the structure of the support substrate 15 is not complicated, and a simple configuration can be realized. Moreover, the positional relationship between the probes 19 and 20 is detected. The portion 22 is also composed of only the voltage source 21 and the light-emitting diode 12. The voltage source 21 and the light-emitting diode 12 are electrically connected to the probes 19 and 2, as shown in FIG. It is to be noted that the same structure (wire 28) as that of the contact probe 13 can be used. As described above, the detection probe group 14 and the positional relationship detecting unit 22 are additionally provided in the present embodiment i, and the configuration of the contact unit 2 is not made. In addition, the inspection system of the present embodiment can be aligned with a simple configuration. The inspection system of the first embodiment uses the positional relationship detecting unit 22 to detect the positional deviation. The positional relationship detecting unit 22 is an objective determination criterion for the light-emitting diode 12 to emit light only when the probes 19 and 2 are turned on via the dummy pad 7. Therefore, the determination is made. Whether there is a positional deviation When there is no difference in the judgment result due to the proficiency of the user of the inspection system, the presence or absence of the positional deviation can be confirmed objectively and positively (Revised) 317611 23 1292828. (Embodiment 2) Time chart / In the second embodiment of the present invention, the inspection object of the conductive region which is not damaged and corresponding to the dummy ridge is inspected, and the correct alignment can be performed. The mode of the overall configuration of the inspection system is as shown in Fig. 8. The inspection system of the second embodiment has a configuration corresponding to the signal processing device 3 and the connection substrate 4 similar to the configuration i. The configuration of the contact unit 32 for detecting the arrangement pattern of the probe group 14 is additionally provided without the inspection object 31 of the virtual (four). In the second embodiment, the members having the same reference numerals as those of the embodiment are assumed to have the same structure and function as those of the members of the embodiment unless otherwise stated. Fig. 9 is a schematic view showing the arrangement pattern of the detection probe group 14 on the contact sheet & 32 and the configuration of the positional relationship detecting portion including the detection probe group 14. As shown in Fig. 9, in the second embodiment, the contact probes 13 disposed on the upper surface of the contact unit 32 are disposed corresponding to the test pads 11 < On the other hand, in the second embodiment, since the inspection object 31 is not formed with the "unable (four) real-state i, the pure stake group 14 corresponds to the "11" configuration. Therefore, in the second embodiment, the measurement is performed. 11 as the conductive area of the patent application range, in order to select a predetermined one from the majority of the test pads 11 (in the figure 9, in the test 塾 ... to lid (hereinafter referred to as the financial (4)), configure the detection Needle group (amendment) 317611 24 1292828 14a to 14d. The test pad 11 e to 〗 〖 factory in Fig. 9 is the same as the test pad 11 in the first embodiment, and has electrical contact via the corresponding contact probe 丨3. The configuration of the positional relationship detecting units 33a to 33d corresponding to the change of the arrangement of the detecting probe groups 14a to 14d is also the positional relationship in the embodiment i. Specifically, the configuration of the positional relationship detecting unit 33 is a configuration in which the switch 34 is added between the probe 19 and the anode of the diode H12, and the configuration is adopted only. The configuration of turning on the switch 34 when the alignment is correct. The functions and advantages of the positional relationship detection f 33a to 33d in the inspection system according to the second embodiment will be described. The following positional relationship detections a33a to 33d are described by taking the positional relationship detecting unit 33a as an example, but the positional relationship is described. The detecting units 33b to 33d are also the same as the positional relationship detecting unit, and it is needless to say that the tenth figure is a mode in which the position detecting unit 33a determines whether the alignment between the inspection target 31 and the _contact early 70 32 is correct. As shown in the figure, the switch 34a can be controlled to be turned on when the alignment is determined. When the test 塾Ua is in contact with the probes 19a, 20a, the positional relationship detecting portion 33a forms a closed circuit, which is supplied according to the voltage source. At the potential, the light-emitting diode 12a emits light. Therefore, the user of the inspection system can determine the inspection object 31 and the contact unit 32 by detecting the benefit of the light emission of the light-emitting diode 12a as in the case of the implementation. In the second embodiment, it is also possible to set a predetermined allowable range and to provide a plurality of positional relationship detecting units 33, thereby enabling detection of the target and ( Original] 3] 76] 1 25 Detection when the contact unit 32 is relatively rotated, and when the inspection object 31 and the contact unit 32 are inclined to each other. / Next, the inspection object of the second embodiment is used to check the object ". The functions and advantages exhibited by the positional relationship detecting sections 33a to 33d at the time of the scheduled inspection. The figure 11 is a pattern diagram of the positional relationship detecting unit during the inspection. As shown in Fig. 11, when an inspection is performed by the inspection system, an electric signal generated by the signal processing device or the like is rotated through the contact probe 13 to enter the test port Ua. Therefore, when the positional relationship detecting unit is configured to be closed, the electrical signal input via the contact probe 13 may affect the positional relationship detecting unit 33a. For example, when the input electrical signal is at a high potential, the potential of the test pad 11a is also #, and such potential may impair the function of the voltage source 21a or the light-emitting diode 12& which constitutes the positional relationship detecting portion 33a. Therefore, in the second embodiment, the switch 34a is additionally provided in the positional relationship detecting unit 33a, and the switch 34a is changed to the cut-off (〇ff)_state during the inspection to prevent the influence of the input electrical signal and the position of the switch. The light-emitting diode 12a of the relationship detecting unit 33a. At the time of inspection, by changing the switch 3乜 to the cut-off state constituting the voltage source of the positional relationship detecting unit 33a, the inspection result may be affected. In other words, when the switch 3 is maintained in the on state, the noise generated by the positional relationship detecting unit 3 is input to the test port 11a. Thus, the positional relationship detecting unit is inspected. When the closed circuit is formed in the state in which the noise signal is mixed into the test signal, the test result is affected. Therefore, in the second embodiment, the switch 3 is switched to the cut. Broken (revision) 317611 26 shape to prevent such abuses. (Modification) It is to be noted that the inspection system of the inspection system of the second embodiment is formed in the inspection pair =: this = part of the public wiring structure, and has a non-n-zone: electrical connection of a plurality of test turns When constructing ==, make, and can make a positive position. Use this wiring structure
元35第之示本變形例之檢查系統所具傷之在接觸單 群之探㈣、2。::==觸, -置〜松之杈式圖。第12圖中,盥第 圖署相同’為了使於檢查時之接觸單元35與檢查對幻之 關係谷易理解,將進行理想對位時 形成區域⑹之構造,以纽表卜 —Ml(電路 如第12圖所示,在電路形成區域36上,具有經 導線9及外導線1G而與半導體晶片8電性連接之測試塾 另一方面’位於電路形成區域36之4個角隅之測試塾 3Ja至37d,則未與半導體晶片8電性連接,而彼此之間以 貫穿配線38a、38b直接連接。 對應於如此之電路形成區域36之構造,本變形例中, 構成檢測探針群14a之探針19&係對應於測試墊37d而配 置,而探針20a則對應於測試墊37a而配置。再者,構成 檢測探針群14b之探針19b係對應於測試墊37c而配置, 而探針20b則對應於測試墊37b而配置。 採用如此之構成時,亦與實施形態2同樣,於檢查時, (修正本)317611 1292828 可獲得正確對位。以下係以檢測探針群14a(探針19a、2〇a) 2例說明之。具體而言’檢查之際,探針19a接觸於測試 37d,探針2〇a接觸於測試墊37a時,亦即進行正確對 =時’經由測試墊37a、咖及由貫穿配線恤戶斤構成之導 電區域而使探針19a、20a間導通。因而,與實施形態2 同樣’=要位置關係檢測部33a所具備之開關%維持導 通之狀態’則位置關係檢測部33a形成閉路,發光二極體 12a會發光,可測測為進行正確之對位。 如此,構成同一檢測探針群之探針19、2〇。亦可採用 與不同之測試塾或虛設墊接觸之構成。亦即,即使為不同 =測試塾等,只要不同之測試墊等維持於同一電位之構成 時’則可視為整體上形成申培直 成申°月專利乾圍之導電區域,根據 貝施形態1、2同樣之構成,可進行正確之對位。 (實施形態3) 其次說明實施形態3之檢查系統。本實施形態3之檢 =統係具村一次對於複數個電路形成區域進行檢查之 構成,並且貫現可正確對位之檢查系統。 第13圖為本實施形態3之檢查系統中,配置於支標基 之接觸探針13及檢測探針群14之配置圖荦之模式 =係第=圖中’與第2圖及第9圖同樣,為容易理解位置 ^劈將理想對位時之檢查對象1之構成元件之位置,以 2顯不。圖中雖然予以省略,但本實施形態3之檢杳李 乃具備有信號處理裝置3及連接基板4,而且,賦 予”貫施形態卜2中之構成元件為同樣之名稱·符號者, (修正本)317611 28 1292828 :下未特別提示時,視為與實施形態卜2中之構成元件且 有相同之構造•功能。 八 如第13圖所示,本實施形態3係採用—次之檢查 =複數個電路形成區域5&進行檢查之構成。對應;如此 之構成,接觸單元41所具備之支縣板42係採用放大上 =面積之構成,以使可與複數個電路形成區域5a接觸之 =’如第則所示’對應於複數個電路形成區域⑽ 具備之測試墊11而配置接觸探針13。 要而且,本實施形態3中,檢測探針群14a Sl4d亦配 置於對應在複數個電路形成區域5a之位置。具體而言,檢 測才木針群14a、14b係與實施形態i同樣地,配置在對岸於 虛設塾7a、7b之位置之另一方面,檢測探針群uc、⑷ 並非對應於虛設墊7c、7d,而配置在對應於鄰接之另一電 路形成區域5a所具備之虛設墊7g、7h之位置。 本實施形態3中,由於虛設塾7之個數較檢測探針群 至Ud之個數更多,所以檢測探針群Ua至i4d可有 複數個配置圖案(pattern)。此時,採用任意之配置圖案亦 可,但本實施形態3中,採用檢測探針群…至⑷互相 隔離最遠之配置圖案。如第6圖及第7圖令亦有所示,其 在於採用複數個檢測探針群! 4時,彼此之距離愈 大’對位之檢測精密度愈高。 如本λ %形態3 ’虛设墊之個數較檢測探針群14之個 數更多時,根據面積選擇對應於檢測探針群之虛設墊7亦 可。例如’做為檢查對象!所用之Tcp,做為液晶面板之 (修正本)317611 29 1292828 動1C(液晶面板中所配置之像素電極 電位之1C)使用時,通常具有由 控制供給 用之輪入端子比連接於液日面“:輸人影像信號等所使 且h之輪出端子更大的面積。 具體而έ,將虛設墊7a、7b、7e 檟 叹墊7c、7d、7g、7h做為輸出端子昧曰 1 ,, 崎于¥ ’最好以檢測掇斜哉 a至14d對應於面積大之虛設塾 配置。 蛩h ?b、7e、7f之方式 以上所述,係以實施形態i至3 =非受限於上述實施形態,只要為相關業者t = =='變形例。例如在實施形態令,使心 2為 範圍中之輸出人端子,並使用檢測探針群 作為檢測端子群,但未必受限於如此之構成,只要為可電 1*導通者貞丨可將任思之構造者做為輸丨人端子及檢測端 子群使用。再者,作為被動元件之—例,係採用發光二極 體,但採用其他之構成亦為有效。例如使用聲音產生機構 做為被動元件,以聲音資訊告知使用者有否位置偏差之構 成亦為有效。並a,關於檢查對象,亦未必受限於所謂 TCP’對於以積體電路全般做為檢查對象所使用之檢查系 統,皆可適用本發明。 [產業上利用之可能性] 如上所述,本發明之接觸單元及檢查系統係關於表面 上形成有包括用於電氣信號之輸入或輸出之配線構造之複 數個導電區域之檢查對象,對於該配線構造進行電性連接 時有效,尤其,對於表面形成有配線構造之可撓性之薄膜 (修正本)3176] 1 30 基材上裝載半導體晶片tTCP等,進行動作特性檢查時更 為適當。 【圖式簡單說明】 第1圖係顯不~β~施形離1夕; 只|貝犯❿L i之才双查糸統之整體構成之模 式圖。 、 式圖 第2圖係顯示檢查系統所具備之接觸單元之構成之模 視圖 第3圖係—關單元所具叙探針之構造之模式剖 〇 第4圖係顯示由於平行移動而發生位置偏差時之檢測 探針,及位置關係檢測部之功能之模式圖。 =5圖係顯示由於平行移動而發生位置偏差時之檢測 木、’及位置關係檢測部之功能之模式圖。 ,第6圖係顯示由於旋轉而發生位置偏差時之檢測探針 群及位置關係檢測部之功能之模式圖。 \ ㈤系'員示核查對象與接觸單元相對傾斜時之檢測 探針群及位置關係檢測部之魏之模式圖。 第8圖係顯示實施形態2之檢查系統之整體構 式圖。 第_係,„'員不檢查系統所具備之接觸單元之構成 式圖。 ^檢^測出位置偏差時之檢測探針群及位 置關係HP之功能之模式圖。 第11圖係顯;仏太〇士 .',、、不心查4之檢測探針群及位置關係檢測 (修正本)317611 3] 1292828 部之功能之模式圖。 第12圖係實施形態2之檢查系統之變形例之模式田 第13圖係實施形態3之檢查系統所具備之接圖。 構成之模式圖。 70之In the third embodiment, the inspection system of the present modification is shown in the contact group (4) and 2. ::==Touch, - Set ~ Song Zhiyi. In Fig. 12, the same figure is used to make the relationship between the contact unit 35 and the inspection and the illusion in the inspection, and the configuration of the region (6) is formed when the ideal alignment is performed. As shown in Fig. 12, on the circuit forming region 36, there is a test which is electrically connected to the semiconductor wafer 8 via the wires 9 and the outer wires 1G, and on the other hand, a test of the four corners of the circuit forming region 36. 3Ja to 37d are not electrically connected to the semiconductor wafer 8, but are directly connected to each other by the through wirings 38a and 38b. Corresponding to the structure of such a circuit formation region 36, in the present modification, the detection probe group 14a is constructed. The probe 19& is disposed corresponding to the test pad 37d, and the probe 20a is disposed corresponding to the test pad 37a. Further, the probe 19b constituting the detection probe group 14b is disposed corresponding to the test pad 37c, and is probed. The needle 20b is disposed corresponding to the test pad 37b. In the same manner as in the second embodiment, in the same manner as in the second embodiment, the correct alignment can be obtained (corrected) 317611 1292828. The following is the detection probe group 14a (probing) Needle 19a, 2〇a) 2 cases Specifically, when the inspection is performed, the probe 19a is in contact with the test 37d, and the probe 2〇a is in contact with the test pad 37a, that is, when the correct pair = when passing through the test pad 37a, the coffee and the through-wired household In the same manner as in the second embodiment, the positional relationship detecting unit 33a is closed and illuminates. The diode 12a emits light and can be measured to perform correct alignment. Thus, the probes 19 and 2 constituting the same detection probe group can also be configured to be in contact with different test cartridges or dummy pads. Even if it is different = test 塾, etc., as long as different test pads are maintained at the same potential, it can be regarded as a conductive area that is formed as a whole by Shen Peicheng. In the same manner, the correct alignment can be performed. (Embodiment 3) Next, the inspection system of the third embodiment will be described. The inspection of the third embodiment is a configuration in which a plurality of circuit formation regions are inspected at a time, and The inspection system can be correctly aligned. Fig. 13 is a diagram showing the arrangement of the contact probe 13 and the detection probe group 14 disposed on the support base in the inspection system of the third embodiment. In the same manner as in the second and ninth drawings, the position of the constituent elements of the inspection object 1 when the position is ideally aligned is easily indicated by two. Although not shown in the figure, the inspection of the third embodiment is omitted.杳 乃 具备 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 信号 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 317 It has the same structure and function as the constituent elements in the embodiment 2. 8. As shown in Fig. 13, in the third embodiment, the inspection is performed in the following manner: the configuration in which a plurality of circuit formation regions 5 & Correspondingly, in such a configuration, the branch plate 42 of the contact unit 41 is configured to enlarge the area=area so that it can be in contact with the plurality of circuit forming regions 5a='as shown in the figure' corresponds to a plurality of circuits. The contact probe 13 is disposed to form the test pad 11 provided in the region (10). Further, in the third embodiment, the detection probe groups 14a to 7d are also disposed at positions corresponding to the plurality of circuit formation regions 5a. Specifically, the detection clusters 14a and 14b are disposed on the other side of the dummy 塾7a and 7b in the same manner as the embodiment i, and the detection probe groups uc and (4) do not correspond to the dummy pad 7c. 7d is disposed at a position corresponding to the dummy pads 7g, 7h provided in the adjacent other circuit formation region 5a. In the third embodiment, since the number of dummy cells 7 is larger than the number of detection probe groups to Ud, the detection probe groups Ua to i4d may have a plurality of arrangement patterns. In this case, an arbitrary arrangement pattern may be employed. However, in the third embodiment, the arrangement pattern in which the detection probe groups ... to (4) are separated from each other is used. As shown in Figure 6 and Figure 7, it is based on a plurality of detection probe groups! At 4 o'clock, the greater the distance between each other, the higher the precision of the detection of the alignment. If the number of the λ%-form 3' dummy pads is larger than the number of the detection probe groups 14, the dummy pads 7 corresponding to the detection probe group may be selected depending on the area. For example, 'as an inspection object! The Tcp used is used as a liquid crystal panel (Revised) 317611 29 1292828. When 1C (1C of the pixel electrode potential arranged in the liquid crystal panel) is used, it is usually connected to the liquid surface by the wheel terminal of the control supply. ": The area where the input signal of the h is made and the terminal of the wheel of h is larger. Specifically, the dummy pads 7a, 7b, 7e are used as the output terminals 昧曰1, sigh pads 7c, 7d, 7g, 7h. , 崎崎 ¥ ' It is best to detect the 哉 至 a to 14d corresponding to the large area of the virtual 塾 configuration. 蛩h bb, 7e, 7f way as described above, with the implementation of i to 3 = not limited by The above embodiment is a modification of the related company t = =='. For example, in the embodiment, the core 2 is the output terminal in the range, and the detection probe group is used as the detection terminal group, but it is not necessarily limited to this. The configuration is as long as it is a chargeable one*, and the structure of the Rensi can be used as a transmission terminal and a detection terminal group. Further, as a passive component, a light-emitting diode is used, but It is also effective to use other components, such as using a sound generating mechanism as The dynamic component notifies the user whether or not there is a positional deviation by sound information. And a, the object to be inspected is not necessarily limited to the so-called TCP's inspection system used for the inspection of the integrated circuit. The present invention can be applied. [Industrial Applicability] As described above, the contact unit and the inspection system of the present invention are related to a plurality of conductive regions on the surface in which a wiring structure including an input or an output for an electric signal is formed. When the object to be inspected is electrically connected to the wiring structure, in particular, a film having a flexible wiring structure is formed on the surface (revision) 3176] 1 30 When a semiconductor wafer tTCP or the like is mounted on the substrate, the operation characteristic inspection is performed. More appropriate. [Simple description of the diagram] The first picture shows that the system is not ~β~ Shi shape away from the 1st eve; only | Bei ❿ ❿ i i 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双 双The system shows the configuration of the contact unit of the inspection system. Figure 3 shows the mode of the structure of the probe. The fourth figure shows the position due to the parallel movement. Schematic diagram of the function of the detection probe and the positional relationship detection unit when the deviation is set. The =5 diagram shows the pattern of the function of the detection wood and the positional relationship detection unit when the positional deviation occurs due to the parallel movement. Fig. 6 is a schematic diagram showing the function of the detection probe group and the positional relationship detection unit when positional deviation occurs due to rotation. (5) Detection of the detection probe group and positional relationship when the verification object and the contact unit are tilted relatively Fig. 8 is a diagram showing the overall configuration of the inspection system of the second embodiment. The _ system, „'s member does not check the structural diagram of the contact unit of the system. ^ Detecting the mode map of the function of the detection probe group and the position relationship HP when the position deviation is detected. Figure 11 shows the system; ,太〇士. ',,, 不心查4 detection probe group and positional relationship detection (Revised) 317611 3] 1292828 Part of the function diagram. Fig. 12 is a schematic view showing a modification of the inspection system of the second embodiment. Fig. 13 is a view showing the inspection system of the third embodiment. The pattern diagram of the composition. 70
35a 6 8 10 主要元件符號說明】 31 檢查對象 信號處理裝置 電路形成區域 配線構造 半導體晶片 外導線 36 2、32、35、41接觸單元 4 .連接基板 5b 鏈輪孔 7、7a至7h虛設墊 9 内導線 11、11a 至 ill、37a 至 37d 測試墊 U、12a至I2d發光二極體13 接觸探針 14、14a至I4d檢測探針群15、42支撐基板 16、17 螺栓構件 鲁 19、19a 至 I9d、20、20a 至 20d 探針 21、 21a至21d電壓源 22、 22a至22d、33、33a至33d位置關係檢測部 24、25針狀構件 26 彈簧構件 27 開口部 28 導線 34、34a至34d開關 38a、38b貫穿配線 (修正本)317611 3235a 6 8 10 Description of main component symbols] 31 Check object signal processing device Circuit formation area Wiring structure Semiconductor wafer outer lead 36 2, 32, 35, 41 Contact unit 4. Connection substrate 5b Sprocket hole 7, 7a to 7h dummy pad 9 Inner leads 11, 11a to ill, 37a to 37d Test pads U, 12a to I2d Light-emitting diodes 13 Contact probes 14, 14a to I4d Detection probe groups 15, 42 Support substrates 16, 17 Bolt members Lu 19, 19a to I9d, 20, 20a to 20d probes 21, 21a to 21d voltage source 22, 22a to 22d, 33, 33a to 33d positional relationship detecting portion 24, 25 needle member 26 spring member 27 opening portion 28 wires 34, 34a to 34d Switch 38a, 38b through wiring (revision) 317611 32