JP4812025B2 - Probe card with surface light source - Google Patents

Probe card with surface light source Download PDF

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JP4812025B2
JP4812025B2 JP2007014238A JP2007014238A JP4812025B2 JP 4812025 B2 JP4812025 B2 JP 4812025B2 JP 2007014238 A JP2007014238 A JP 2007014238A JP 2007014238 A JP2007014238 A JP 2007014238A JP 4812025 B2 JP4812025 B2 JP 4812025B2
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light source
probe card
surface light
semiconductor integrated
probe
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JP2008066690A (en
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修一 横田
栄一 鈴木
功造 飯島
敏一 石井
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Seiko Instruments Inc
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Seiko Instruments Inc
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本発明は、プローブカードに係り、特に、ウェハ状態の半導体集積回路の電気的特性を検査する際に使用されるプローブカードに関するものである。   The present invention relates to a probe card, and more particularly to a probe card used for inspecting electrical characteristics of a semiconductor integrated circuit in a wafer state.

一般的にイメージセンサやサーマルドライバ等の半導体集積回路の電気的特性は外部からの光の照射によって変化する。この種の電気的特性に関しては、外部から意図的に検査対象の半導体集積回路に光を照射し、プローバにより特性検査を行うことがある。   In general, the electrical characteristics of a semiconductor integrated circuit such as an image sensor or a thermal driver are changed by external light irradiation. With respect to this type of electrical characteristics, there are cases where the semiconductor integrated circuit to be inspected is intentionally irradiated with light from the outside and the characteristics are inspected by a prober.

プローバに使用される従来のプローブカードは円盤形状のプローブカード基板を有し、このプローブカード基板の中央には円柱状の穴が設けられている。この穴近傍のプローブカード基板の下面には複数のプローブ針が取り付けられており。これらプローブ針の先端は穴の下方に向かって延びている。また、プローブカード基板の上面には発光ダイオードが実装されている。この発光ダイオードは、そのリード（足）がプローブカード基板の上面に半田付けされることにより装着されている。そして、発光ダイオードの発光部は上記穴の上方に配置する構造が知られている。また、複数のプローブカード毎に照度差が生じてしまうという課題解消のために、プローブカードの中央にある穴の内側面に点光源を配置するという構造も知られている。（例えば、特許文献１参照）
特開２００１−４６６１号公報 A conventional probe card used for a prober has a disk-shaped probe card substrate, and a cylindrical hole is provided in the center of the probe card substrate. A plurality of probe needles are attached to the lower surface of the probe card substrate near the hole. The tips of these probe needles extend downward from the holes. A light emitting diode is mounted on the upper surface of the probe card substrate. This light emitting diode is mounted by soldering its leads (legs) to the upper surface of the probe card substrate. And the structure which arrange | positions the light emission part of a light emitting diode above the said hole is known. In addition, a structure in which a point light source is arranged on the inner surface of a hole in the center of the probe card is also known in order to solve the problem that an illuminance difference occurs for each of the plurality of probe cards. (For example, see Patent Document 1)
JP 20014661 A

しかしながら、従来の光源付プローブカードでは、使用する光源に発光ダイオード等の点光源を使用しているため、検査対象の半導体集積回路への光の当たり方にはムラが生じる。すなわち、点光源に近い領域には比較的強い光が照射され、点光源がから離れた領域には比較的弱い光が照射される。このように、半導体集積回路上の各受光素子に対して均一な光量で照射する事が困難であった。   However, since the conventional probe card with a light source uses a point light source such as a light emitting diode as a light source to be used, unevenness occurs in the way the light strikes the semiconductor integrated circuit to be inspected. That is, relatively strong light is irradiated to a region near the point light source, and relatively weak light is irradiated to a region far from the point light source. Thus, it has been difficult to irradiate each light receiving element on the semiconductor integrated circuit with a uniform amount of light.

また、検査対象であるイメージセンサやサーマルドライバ等の受光素子は、一般的に入射光の角度に対して指向性を持つため、素子毎の受光特性を光の照度の面内分布から計算により補正する必要があった。   In addition, light receiving elements such as image sensors and thermal drivers to be inspected generally have directivity with respect to the angle of incident light, so the light receiving characteristics of each element are corrected by calculation from the in-plane distribution of light illuminance. There was a need to do.

プローブカード基板と、前記プローブカードの中心部分に設けられ、検査対象より大きな面積を有する面光源と、前記プローブカード基板下面に取り付けられるプローブ針であって、その先端が前記面光源の下方に延び、検査の際に前記プローブ針の先端を前記検査対象に接触させるためのプローブ針と、を具備することを特徴とする。   A probe card substrate, a surface light source provided in a central portion of the probe card and having a larger area than an inspection target, and a probe needle attached to the lower surface of the probe card substrate, the tip of which extends below the surface light source And a probe needle for bringing the tip of the probe needle into contact with the inspection object at the time of inspection.

また、本発明に係る面光源付プローブカードは、前記面光源が前記プローブカード下面に設けられていることを特徴とする。   Moreover, the probe card with a surface light source according to the present invention is characterized in that the surface light source is provided on the lower surface of the probe card.

また、本発明に係る面光源付プローブカードは、前記面光源が前記プローブカードに埋め込まれ、前記面光源の下面と前記プローブカード基板の下面が同一高さであることを特徴とする。   The probe card with a surface light source according to the present invention is characterized in that the surface light source is embedded in the probe card, and the lower surface of the surface light source and the lower surface of the probe card substrate have the same height.

また、本発明に係る面光源付プローブカードは、前記面光源が前記プローブカード上面に設けられており、前記面光源からの光を前記検査対象に照射するための窓となる貫通孔が前記プローブカード基板に開口されていることを特徴とする。   In the probe card with a surface light source according to the present invention, the surface light source is provided on an upper surface of the probe card, and a through hole serving as a window for irradiating the inspection object with light from the surface light source is provided in the probe card. It is characterized by being opened in the card substrate.

また、本発明に係る面光源付プローブカードは、前記貫通孔が前記検査対象の面積よりも大きく開口されていることを特徴とする。   The probe card with a surface light source according to the present invention is characterized in that the through hole is opened larger than the area of the inspection object.

また、本発明に係る面光源付プローブカードは、前記面光源が複数の光源からなることを特徴とする。   In the probe card with a surface light source according to the present invention, the surface light source includes a plurality of light sources.

また、本発明に係る面光源付プローブカードは、前記検査対象を複数同時測定できるように前記プローブ針が配置されていることを特徴とする。   The probe card with a surface light source according to the present invention is characterized in that the probe needle is arranged so that a plurality of the inspection objects can be simultaneously measured.

また、本発明に係る面光源付プローブカードは、前記面光源がＬＣＤ用バックライトであることを特徴とする。   The probe card with a surface light source according to the present invention is characterized in that the surface light source is a backlight for LCD.

さらには、本発明に係る面光源付プローブカードは、前記面光源が有機ＥＬ発光素子であることを特徴とする。   Furthermore, the probe card with a surface light source according to the present invention is characterized in that the surface light source is an organic EL light emitting element.

以上、説明したように本発明による面光源付プローブカードを用いることで、従来では困難であった検査対象である半導体集積回路への均一な光の照射が可能となる。さらには検査対象が複数であっても半導体集積回路への均一な光の照射が可能である。これにより、半導体集積回路の電気的特性を安定して測定できることになる。   As described above, by using the probe card with a surface light source according to the present invention, it is possible to uniformly irradiate a semiconductor integrated circuit which is an inspection target, which has been difficult in the past. Furthermore, even if there are a plurality of inspection objects, the semiconductor integrated circuit can be irradiated with uniform light. As a result, the electrical characteristics of the semiconductor integrated circuit can be stably measured.

以下、本発明の実施形態を図１および図２に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2.

図１は本発明の第一の実施形態による面光源付プローブカードを示す断面図である。   FIG. 1 is a sectional view showing a probe card with a surface light source according to a first embodiment of the present invention.

この面光源付プローブカードは、円盤形状のプローブカード基板１を有し、プローブカード基板１中央部の下面には、面光源２が配置され、その面光源２の近傍のプローブカード基板１の下面には複数のプローブ針３が取り付けられている。これらプローブ針３は、その先端が面光源２の下方に向かって延びており、電気特性検査の際に、図示しない検査対象の半導体集積回路に接触させるものである。プローブ針３は、面光源２の周囲に沿って取り付けられている場合もあれば、面光源２の外周の一部に沿って取り付けられている場合もある。面光源２は検査対象の半導体集積回路よりも十分大きいものとし、光の照射範囲が、検査対象の半導体集積回路よりも広くなるように配置されている。また、面光源２の平面的な形状は、検査対象の半導体集積回路の形に合わせた方形であるのが好適であるが、検査対象領域よりも大きくて、検査対象への光照射が均一であれば如何なる形状でも良い。   This probe card with a surface light source has a disk-shaped probe card substrate 1, and a surface light source 2 is disposed on the lower surface of the center portion of the probe card substrate 1, and the lower surface of the probe card substrate 1 in the vicinity of the surface light source 2. A plurality of probe needles 3 are attached to the. The tips of these probe needles 3 extend downward from the surface light source 2, and are brought into contact with a semiconductor integrated circuit to be inspected (not shown) during an electrical characteristic inspection. The probe needle 3 may be attached along the periphery of the surface light source 2 or may be attached along a part of the outer periphery of the surface light source 2. The surface light source 2 is sufficiently larger than the semiconductor integrated circuit to be inspected, and is arranged so that the light irradiation range is wider than the semiconductor integrated circuit to be inspected. The planar shape of the surface light source 2 is preferably a square shape that matches the shape of the semiconductor integrated circuit to be inspected, but is larger than the area to be inspected and the light irradiation to the inspection object is uniform. Any shape is acceptable.

面光源２は貫通孔７を介して、信号線Ａ（４）によりプローブカード基板１上面に設置されている制御回路５に接続されている。制御回路５は信号線Ｂ（６）により、図示しない半導体検査装置に接続できるようになっており、面光源２の点灯や消灯及び光量が制御可能となっている。   The surface light source 2 is connected through a through hole 7 to a control circuit 5 installed on the upper surface of the probe card substrate 1 by a signal line A (4). The control circuit 5 can be connected to a semiconductor inspection apparatus (not shown) through a signal line B (6), and the lighting and extinction of the surface light source 2 and the amount of light can be controlled.

上記プローブカードは、図示しないプローバに装着され、上記プローブカード基板１の下面に接着された面光源２とプローブ針３の下方に検査対象の半導体集積回路を有する半導体ウェハ（図示せず）を配置し、この半導体集積回路上のパッド（図示せず）にプローブ針３を接針させ、この半導体集積回路に面光源２による光を略垂直に照射し半導体集積回路の電気的特性を検査するものである。   The probe card is mounted on a prober (not shown), and a surface light source 2 bonded to the lower surface of the probe card substrate 1 and a semiconductor wafer (not shown) having a semiconductor integrated circuit to be inspected are disposed below the probe needle 3. The probe needle 3 is brought into contact with a pad (not shown) on the semiconductor integrated circuit, and the semiconductor integrated circuit is irradiated with light from the surface light source 2 substantially vertically to inspect the electrical characteristics of the semiconductor integrated circuit. It is.

図２は本発明の第二の実施形態による面光源付プローブカードを示す断面図である。   FIG. 2 is a sectional view showing a probe card with a surface light source according to the second embodiment of the present invention.

第一の実施形態と異なる点は、面光源２とプローブカード基板１の位置関係である。本実施形態においては、面光源２の下面位置高さとプローブカード基板１の下面位置高さが同じになっており、面光源２の周囲に配置されているプローブ針３を取り付ける上で邪魔とならないという利点がある。   The difference from the first embodiment is the positional relationship between the surface light source 2 and the probe card substrate 1. In the present embodiment, the lower surface position height of the surface light source 2 and the lower surface position height of the probe card substrate 1 are the same, and do not interfere with the attachment of the probe needles 3 arranged around the surface light source 2. There is an advantage.

図３は本発明の第三の実施形態による面光源付プローブカードを示す断面図である。
面光源２は基板１上に設けられており、面光源２から発せられた光は貫通孔７を通して検査対象である半導体集積回路８に照射される。第一、第二の実施形態と異なる点は、ひとつの面光源２に対し検査対象である半導体集積回路８が複数であり、プローブ針３、および、貫通孔７が半導体集積回路毎に設けられている点である。従って、貫通孔７は半導体集積回路８の平面積よりも大きく開口されている。面光源２と基板１との位置関係は第一の実施形態のように基板１下面に取り付けても良いし、第二の実施形態の様に、基板１と面光源２の下面位置高さが同じであるように取り付けても良い。本実施形態においては、検査対象である半導体集積回路が複数であっても、半導体集積回路内における光量分布のない均一な光が同時に照射可能であり、複数の半導体集積回路を同時に安定して検査可能となる。複数の半導体集積回路を同時に安定して検査可能であるので、検査にかかる時間を短縮できるという利点がある。 FIG. 3 is a cross-sectional view showing a probe card with a surface light source according to a third embodiment of the present invention.
The surface light source 2 is provided on the substrate 1, and light emitted from the surface light source 2 is irradiated to the semiconductor integrated circuit 8 to be inspected through the through hole 7. A difference from the first and second embodiments is that a plurality of semiconductor integrated circuits 8 to be inspected with respect to one surface light source 2 are provided, and a probe needle 3 and a through hole 7 are provided for each semiconductor integrated circuit. It is a point. Therefore, the through hole 7 is opened larger than the plane area of the semiconductor integrated circuit 8. The positional relationship between the surface light source 2 and the substrate 1 may be attached to the lower surface of the substrate 1 as in the first embodiment, or the lower surface position height of the substrate 1 and the surface light source 2 may be as in the second embodiment. You may attach so that it may be the same. In this embodiment, even when there are a plurality of semiconductor integrated circuits to be inspected, uniform light without a light amount distribution in the semiconductor integrated circuit can be irradiated simultaneously, and a plurality of semiconductor integrated circuits can be inspected stably at the same time. It becomes possible. Since a plurality of semiconductor integrated circuits can be simultaneously and stably inspected, there is an advantage that the time required for the inspection can be shortened.

図４は本発明の第四の実施形態による面光源付プローブカードを示す断面図である。
第三の実施形態と異なる点は、面光源２が検査対象である半導体集積回路毎に設けられている点である。面光源２は制御回路５に接続されており、制御回路５は図示しない半導体検査装置等に接続され、面光源２の光照射が均一となるように制御される。本実施形態においては、検査対象の半導体集積回路が大面積であったり、半導体集積回路間の距離が離れていたりなど、単一の面光源で複数の半導体集積回路に均一の光を照射することが難しい場合においても、半導体集積回路内における光量分布のない均一な光が同時に照射可能であり、複数の半導体集積回路を同時に安定して検査可能であるので、検査にかかる時間を短縮できるという利点がある。 FIG. 4 is a sectional view showing a probe card with a surface light source according to the fourth embodiment of the present invention.
The difference from the third embodiment is that the surface light source 2 is provided for each semiconductor integrated circuit to be inspected. The surface light source 2 is connected to a control circuit 5, and the control circuit 5 is connected to a semiconductor inspection device (not shown) and the like, and is controlled so that light irradiation of the surface light source 2 is uniform. In this embodiment, uniform light is irradiated to a plurality of semiconductor integrated circuits with a single surface light source such as a semiconductor integrated circuit to be inspected having a large area or a distance between the semiconductor integrated circuits being separated. Even when it is difficult, uniform light with no light distribution in the semiconductor integrated circuit can be irradiated simultaneously, and a plurality of semiconductor integrated circuits can be simultaneously and stably inspected. There is.

前述の面光源２には、発光面から光が均一に照射されるものが利用される。例えば、ＬＣＤパネル用のバックライトが好適である。また、自発光する有機ＥＬ発光素子でも良い。また、検査対象の半導体集積回路が大面積である場合には、複数の光源からなる面光源とすることで検査対象への均一な光照射が可能となる。   As the surface light source 2 described above, a light source that is uniformly irradiated with light from the light emitting surface is used. For example, a backlight for an LCD panel is suitable. Further, an organic EL light emitting element that emits light may be used. Further, when the semiconductor integrated circuit to be inspected has a large area, it is possible to irradiate the inspection object uniformly with a surface light source composed of a plurality of light sources.

以上述べたようにプローブカードに面光源を用いることで、半導体集積回路内における光量分布のない均一な光が容易に照射可能となり、安定した検査が可能となる。また、検査対象である半導体集積回路が複数である場合にも、同様に安定した検査が可能である。   As described above, by using a surface light source for the probe card, uniform light without a light amount distribution in the semiconductor integrated circuit can be easily irradiated, and stable inspection can be performed. In addition, even when there are a plurality of semiconductor integrated circuits to be inspected, the same stable inspection is possible.

本発明の第一の実施形態である面光源付プローブカードの断面図Sectional drawing of the probe card with a surface light source which is 1st embodiment of this invention 本発明の第二の実施形態である面光源付プローブカードの断面図Sectional drawing of the probe card with a surface light source which is 2nd embodiment of this invention 本発明の第三の実施形態である面光源付プローブカードの断面図Sectional drawing of the probe card with a surface light source which is 3rd embodiment of this invention 本発明の第四の実施形態である面光源付プローブカードの断面図Sectional drawing of the probe card with a surface light source which is 4th embodiment of this invention

符号の説明Explanation of symbols

１ プローブカード基板
２ 面光源
３ プローブ針
４ 信号線A
５ 制御回路
６ 信号線B
７ 貫通孔
８ 半導体集積回路 1 Probe card board 2 Surface light source 3 Probe needle 4 Signal line A
5 Control circuit 6 Signal line B
7 Through hole 8 Semiconductor integrated circuit

Claims (5)

プローブカード基板と、
前記プローブカード基板の下面の中心部分に設けられ、検査対象より大きな面積を有する面光源と、
前記プローブカード基板の下面に取り付けられ、その先端が前記面光源の下方に延び、検査の際にその先端を前記検査対象に接触させるためのプローブ針と、
を具備することを特徴とする面光源付プローブカード。 A probe card substrate;
A surface light source provided in a central portion of the lower surface of the probe card substrate and having a larger area than an inspection object;
A probe needle attached to the lower surface of the probe card substrate, the tip of the probe card substrate extending below the surface light source, and for contacting the tip of the probe card with the inspection object during inspection;
A probe card with a surface light source. 前記面光源が複数の光源からなることを特徴とする請求項１に記載の面光源付プローブカード。 The probe card with a surface light source according to claim 1, wherein the surface light source includes a plurality of light sources. 前記検査対象を複数同時測定できるように前記プローブ針が配置されていることを特徴とする請求項１に記載の面光源付プローブカード。 Probe card with surface light source according to claim 1, characterized in that the probe needles are arranged so that said object can multiple simultaneous measurements. 前記面光源がＬＣＤ用バックライトであることを特徴とする請求項１に記載の面光源付プローブカード。 The probe card with a surface light source according to claim 1, wherein the surface light source is a backlight for LCD. 前記面光源が有機ＥＬ発光素子であることを特徴とする請求項１に記載の面光源付プローブカード。 The probe card with a surface light source according to claim 1, wherein the surface light source is an organic EL light emitting element.
JP2007014238A 2006-08-11 2007-01-24 Probe card with surface light source Expired - Fee Related JP4812025B2 (en)

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