TWI595245B - ESD test equipment and ESD test inspection methods - Google Patents

Description

ESD test inspection device and ESD test inspection method

The present invention relates to an ESD test inspection apparatus and an ESD test inspection method using the same, which is to diagnose whether or not a component such as LSI (Large-scale integration), LED (Light Emitting) has been applied. A device to be inspected, such as a Diode, a light-emitting diode element, or a light-emitting device such as a laser device, for inspecting a high voltage of a high voltage application device of ESD (Electro Static Discharge) resistance, or a specific high voltage from a high voltage application device Is it suitable for the specified value?

In the LSI device, a protective diode is connected to the input circuit side to check the ESD resistance of the protective diode. Among the light-emitting elements such as LED elements and laser elements, the light-emitting elements themselves have a diode structure. Since the diode structure is constituted by the pn junction of the p-type diffusion layer and the n-type diffusion layer, the ESD resistance differs depending on the formation state of the p-type diffusion layer and the n-type diffusion layer, and therefore, it is necessary to inspect the entire ESD tolerance.

The basic ESD circuit required for the previous ESD application includes a high voltage power supply and a high voltage capacitor according to the ESD standard (Human Body Model, MM (Machine Model), etc.), the applied resistance, and the use of mercury. Pressure relay.

The application output portion of the ESD circuit energizes the device to be inspected by fixing the probe card mounted on the substrate with a contact probe for connecting the terminals of the device, or by fixing the contact probe to a manipulator of the robot arm or the like. .

The magnitude of the supply voltage of the device to be inspected is a representative ESD test (electrostatic discharge reliability test) in the reliability inspection, and the like, and the level is about 1 to 10 kV. The high voltage is the object. The durability in the case where static electricity from a human body or a machine flows into a device to be inspected such as an LSI wafer is tested.

Fig. 10 is a circuit diagram showing an example of the configuration of a main part of a prior ESD test apparatus disclosed in Patent Document 1.

In FIG. 10, the previous ESD test apparatus 100 first turns on the charging high withstand voltage relay 102 by the timing controller 107, and accumulates the current from the high voltage power supply 101 in the high voltage capacitor 106. Then, after the high-voltage relay 102 for charging is turned off by the timing controller 107, the high-voltage relay 103 for conduction and discharge is turned on, whereby the high voltage stored in the high-voltage capacitor 106 is applied from the high-withstand voltage relay 103 via the application resistor 104. To one of the terminals of the device 105 to be inspected.

In this manner, the high-voltage capacitors 102 and 103 for charging are controlled by the timing controller 107 to charge or discharge the high-voltage capacitor 106, and a specific high voltage can be applied to the device 105 to be inspected. The switching operation of the charging high-voltage relays 102 and 103 is performed by the timing controller 107 at a predetermined timing. If there are several application modes in the ESD test, standards are separately formulated to determine the suitability or not based on the current waveform (or voltage waveform) of the device 105 applied to the inspection object.

Fig. 11 is a view showing a state in which it is checked whether the waveform of the applied current from the ESD test apparatus of Fig. 10 is correct.

As shown in FIG. 11, the capacitor 106 is charged or discharged by the switching operation of the high-voltage relays 102 and 103, whereby a specific high-voltage current waveform is applied to the inspection target device 105 indicated by the broken line portion via the contact probe. At this time, in addition to the magnitude of the current value observed by the oscilloscope, the current waveform (or voltage waveform) of the high voltage passing through the probe is also observed for the convergence time and the like.

In the ESD test, a standard is set for each ESD application mode, and based on the observation of the oscilloscope, it is judged whether the applied current waveform (or voltage waveform) is suitable or not.

Prior technical literature

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-329818

In the above-described prior art ESD test method, in order to maintain the production quality of the product and maintain the production, it is necessary to periodically check the standard of the high voltage waveform satisfying each of the above several ESD application modes as the operation of the ESD test device. Further, as a previous stage, it is necessary to diagnose whether or not a high voltage waveform is applied to the device to be inspected and energized. However, it is necessary to determine the standard of each ESD application mode by the observation of the oscilloscope, which requires a large amount of time, and the more the number of inspections, the more likely the accuracy of the ESD test is more problematic.

In the ESD test, the present inventors have proposed a plurality of unified processes in the ESD test of a plurality of inspection target devices in the ESD test, but if it is used for a plurality of unified processes, the inventors of the present invention have proposed in Japanese Patent Application Laid-Open No. 2011-100230. Each of the plurality of ESD circuits is subjected to the high voltage suitable for inspection or high voltage power-on inspection of the previous ESD test by using the current probe of the oscilloscope, and the more the number of unified processes, the more the number of unified processes is required. Check the time.

The present invention is directed to solving the above-mentioned prior problems, and an object thereof is to provide an ESD test inspection apparatus capable of promptly and correctly performing an ESD test inspection in a high voltage suitable inspection or high voltage energization inspection of an ESD test and an ESD test inspection using the same. method.

The ESD test inspection device of the present invention is connected to each of the high voltage output terminals of the ESD test device which is applied to one or a plurality of test object devices to uniformly check the ESD tolerance, and the diagnosis mechanism can be diagnosed by the diagnostic mechanism. The ESD test apparatus applies the respective high voltages, or whether the respective high voltages are suitable for a predetermined high voltage value, thereby achieving the above object.

Moreover, it is preferable that the diagnosis by the diagnostic means in the ESD test and inspection apparatus of the present invention is performed based on the presence or absence of light emission by the light-emitting means.

Furthermore, it is preferable that the light-emitting means in the ESD test and inspection apparatus of the present invention is an LED for light-emitting confirmation.

Further, it is preferable that the illuminating color of the LED for illuminating confirmation in the ESD test apparatus of the present invention is green.

Furthermore, it is preferable that the diagnostic mechanism in the ESD test and inspection apparatus of the present invention has a series circuit of a variable resistor and a voltage dividing resistor connected between the respective high voltage output terminals of the ESD test apparatus, and is connected in the forward direction. An illuminating mechanism between the two ends of the resistor.

Furthermore, it is preferable that the diagnostic mechanism in the ESD test and inspection apparatus of the present invention has an illuminating mechanism connected between the respective high voltage output ends of the ESD test apparatus.

Further, preferably, the diagnosis by the diagnosis means in the ESD test and inspection apparatus of the present invention has a detection means for detecting the presence or absence of light emission as the light-emitting means of the determination means or the high voltage applied to the diagnosis means. Whether a certain threshold voltage is exceeded.

Furthermore, it is preferable that the light-emitting threshold voltage of the light-emitting means in the ESD test apparatus of the present invention is a voltage across the voltage-dividing resistor when a predetermined high voltage of the ESD test apparatus is applied to a voltage across the series circuit. .

Furthermore, it is preferable that the light-emitting means in the ESD test and inspection apparatus of the present invention is a light-emitting element having a light-emission response characteristic of 100 nsec or less.

Further, it is preferable that the light-emitting means in the ESD test and inspection apparatus of the present invention emit light by the respective high voltages from the ESD test apparatus.

Furthermore, it is preferable that the light-emitting means in the ESD test apparatus of the present invention is connected to any one of a plurality of voltage dividing resistors including a variable resistor.

Further, it is preferable that the diagnostic mechanism or the light-emitting means is connected to each of the ESD circuits by using one or a plurality of ESD circuits of the high-voltage power source and the output high voltages in the ESD test and inspection apparatus of the present invention.

Further, preferably, in the diagnosis of the ESD test and inspection device of the present invention, The above-described high-voltage discharge period is repeated for a predetermined period of time by visualizing the above-described luminescence by the afterimage effect, and the light emission of the illuminating means is continued.

Further, it is preferable that the discharge period of the high voltage in the ESD test inspection apparatus of the present invention is set in accordance with the charging ability of the high voltage power source.

Further, it is preferable that the discharge period of the high voltage in the ESD test apparatus of the present invention is 30 msec.

Furthermore, in the case where there are a plurality of ESD circuits in the ESD test and inspection apparatus of the present invention, at least a plurality of the light-emitting means are arranged on the circuit board.

Furthermore, it is preferable that the connection means of one of the circuit boards in the ESD test and inspection apparatus of the present invention is connected to another connection means connected to the high voltage output end of the ESD circuit, and the above-mentioned ESD circuit is connected to the above. Illumination mechanism.

Further, it is preferable to have an ESD controller that controls the high voltage output period of the ESD circuit from the ESD test inspection apparatus of the present invention in the ESD test mode and the ESD test check mode.

The ESD test inspection method of the present invention has the following diagnostic steps: the diagnostic mechanism connected between the high voltage output terminals connected to the ESD test device can diagnose whether or not the ESD tolerance is uniformly applied from the application of one or a plurality of inspection target devices. The respective high voltages of the ESD test device, or whether the respective high voltages are suitable for a prescribed high voltage value; thereby achieving the above object.

According to the above configuration, the action of the present invention will be described below.

In the present invention, a diagnostic mechanism is connected between each of the high voltage output terminals of the ESD test apparatus which is applied to one or a plurality of inspection target devices to uniformly check the ESD tolerance, and the diagnostic mechanism can diagnose whether the ESD test apparatus has been applied. Whether each high voltage, or each of the high voltages, is suitable for a prescribed high voltage value. The judgment by the above-described diagnostic mechanism is performed based on the presence or absence of light emission by the light-emitting means.

Thereby, due to the use of the diagnostic mechanism and according to, for example, the illumination of the illumination mechanism The diagnosis of the energization or voltage level of each high voltage from the ESD test device is performed, so that the ESD test can be quickly and correctly performed in the high voltage suitable inspection or high voltage energization check of the ESD test.

According to the present invention, according to the present invention, since the diagnosis of the energization or voltage level of each high voltage from the ESD test apparatus is performed by the use of the diagnostic mechanism and the presence or absence of the illumination of the illumination means, it is suitable for the high voltage of the ESD test. ESD test checks are performed quickly and correctly during inspection or high voltage energization checks.

1‧‧‧ESD test suitable for inspection device

1A‧‧‧ESD test suitable for inspection equipment

2‧‧‧Variable resistor

3‧‧‧voltage resistor

4‧‧‧Lighting confirmation LED

5‧‧‧Diagnostic circuit

6‧‧‧Diagnostic circuit substrate

6a‧‧‧ circuit board

7‧‧‧Resistor Arrangement Area

8a‧‧‧Bumping pin socket

8b‧‧‧Recessed socket

10‧‧‧ESD test device

10A‧‧‧ESD test device

11‧‧‧Probe

12‧‧‧High voltage power supply

13‧‧‧High withstand voltage relay

14‧‧‧High withstand voltage relay

15‧‧‧Applying resistance

16‧‧‧High voltage capacitor

17‧‧‧ESD controller

18‧‧‧High withstand voltage relay

19‧‧‧Check device

19a‧‧‧ Terminal

19b‧‧‧terminal

20‧‧‧Semiconductor wafer

21‧‧‧ESD substrate box

21a‧‧‧Wiring output

22‧‧‧ Probe Card

22A‧‧‧ probe card

23‧‧‧ wiring

24‧‧‧Connector

30‧‧‧ Wafer Stage

31‧‧‧ detector

32‧‧‧Personal Computer

100‧‧‧ESD test device

101‧‧‧High voltage power supply

102‧‧‧High-voltage relay for charging

103‧‧‧High-voltage relay for discharge

104‧‧‧Applying resistance

105‧‧‧Inspection device

106‧‧‧High voltage capacitor

107‧‧‧Timing controller

Fig. 1 is a circuit diagram showing an example of a configuration of a diagnostic circuit in which an ESD test apparatus is connected to an ESD test apparatus according to a first embodiment of the present invention.

Fig. 2 is a circuit diagram showing a configuration example in the case where an ESD test apparatus having eight ESD circuits is used in the ESD test inspection apparatus of Fig. 1.

Fig. 3 is a circuit diagram showing a configuration example of an ESD test apparatus having eight ESD circuits.

4 is a perspective view schematically showing an enlarged image of a contact state of the device in the ESD test apparatus of FIG. 3.

Fig. 5 is a perspective view schematically showing an example of a constituent image when ESD is applied in the ESD test apparatus of Fig. 3.

Fig. 6(a) is a perspective view showing an ESD substrate case, and (b) is a waveform diagram of an ESD applied voltage waveform.

Fig. 7 is a block diagram showing a wafer map and detection control mainly based on a personal computer PC.

Fig. 8 is a plan view showing a diagnostic circuit substrate on which 36 diagnostic circuits of Fig. 1 are arranged on a circuit board.

Fig. 9 is a side view for explaining a method of connecting the diagnostic circuit board and the probe card of Fig. 8.

Fig. 10 is a view showing the main part of the prior ESD test apparatus disclosed in Patent Document 1. A circuit diagram of a case.

Fig. 11 is a view showing a state in which it is checked whether the waveform of the applied current from the ESD test apparatus of Fig. 10 is correct.

Hereinafter, the first embodiment of the ESD test and inspection apparatus and the ESD test inspection method using the same according to the present invention will be described in detail with reference to the drawings. Further, from the viewpoint of the production of the drawings, the thickness, length, and the like of each of the constituent members of the respective drawings are not limited to the configuration shown in the drawings.

(Embodiment 1)

Fig. 1 is a circuit diagram showing an example of a configuration of a diagnostic circuit in which an ESD test apparatus is connected to an ESD test apparatus according to a first embodiment of the present invention.

In the first embodiment, the ESD test apparatus 1 of the first embodiment has a diagnostic mechanism for diagnosing whether or not the ESD test apparatus 10 from which one or a plurality of inspection target devices are separately applied to uniformly check the ESD tolerance is applied. Whether the voltage, or each high voltage, is suitable for the specified high voltage value.

The ESD test inspection method according to the first embodiment has a diagnosis step of diagnosing whether or not the respective high voltages from the ESD test apparatus 10 for uniformly inspecting the ESD tolerance applied to one or a plurality of inspection target devices have been applied, or each Whether the high voltage is suitable for the specified high voltage value.

The ESD test apparatus 1 of the first embodiment includes an ESD test apparatus 10 for performing an ESD application test for checking ESD tolerance of one or a plurality of inspection target devices, and a diagnostic circuit 5 as a diagnostic mechanism for diagnosis. Whether the ESD applies a voltage waveform or not.

The diagnostic circuit 5 has a series circuit of a variable resistor 2 and a voltage dividing resistor 3 connected between a high voltage output terminal (probe 11) of the ESD testing device 10, and a connection between the two ends of the voltage dividing resistor 3 The LED 4 for light emission confirmation of the light-emitting mechanism. Furthermore, LED 4 for illuminating confirmation Connected to any of a plurality of voltage dividing resistors including the variable resistor 2. Therefore, the light-emitting confirmation LED 4 can be connected to both ends of the variable resistor 2, and when two voltage-dividing resistors 3 are provided in addition to the variable resistor 2, one of the voltage-dividing resistors 3 can be connected to both ends of the voltage-dividing resistor 3 LED 4 for illuminating confirmation.

Alternatively, as a diagnostic mechanism for diagnosing whether or not each of the high voltages from the ESD test apparatus 10 is applied, it is possible to have a light-emitting mechanism as a light-emitting mechanism that is connected to the high-voltage output terminal (probe 11) without being connected via a voltage dividing resistor. Confirm that LED4 is used.

Here, the case where the diagnostic circuit 5 or the light-emitting confirmation LED 4 is connected between the high-voltage output terminals (probes 11) of one ESD circuit other than the high-voltage power supply 12 described below is shown as a unit configuration example, but A plurality of ESD circuits may be juxtaposed with respect to one high voltage power supply 12, and in this case, a diagnostic circuit 5 or a light emission confirmation may be respectively connected between the high voltage output terminals (probes 11) of one or a plurality of ESD circuits. Use LED4.

In the ESD test apparatus 10, one terminal of the high voltage power supply 12 is connected to one end of the applied resistor 15 via the high withstand voltage relays 13, 14. The other end of the applied resistor 15 is connected to one of the terminals of the device to be inspected via a probe 11. Another probe 11 is connected to the other end of the high voltage power source 12. The connection point of the high withstand voltage relays 13, 14 is connected to the connection point of the other probe 11 connected via the high voltage capacitor 16 and the other terminal of the high voltage power supply 12, and the connection point is grounded. An ESD controller 17 that controls the on/off of the high withstand voltage relays 13, 14 is provided. The power supply for driving the high-voltage relays 13, 14 needs to be separately set.

Here, the ESD circuit connected to the high voltage power source 12 has high withstand voltage relays 13, 14, an applied resistor 15, a high voltage capacitor 16, and a high voltage output terminal (a pair of probes). The ESD application high voltage (high voltage waveform) including the line length and specified by the same circuit condition needs to reach the pair of probes 11. In the ESD test, the pair of probes 11 are brought into contact with both terminals of the inspection target device to check the resistance of the device to be inspected. On the other hand, when the ESD test is suitable for inspection, the two terminals of the device to be inspected are not brought into contact with the pair of probes 11, but are tied In the state in which the pair of probes 11 are opened, the diagnostic circuit 5 is connected to the inspection target device to perform an ESD test suitable for inspection.

According to the above configuration, the ESD test using the ESD test apparatus 10 first turns on the charging high withstand voltage relay 13 by the ESD controller 17, and accumulates the current from the high voltage power supply 12 in the high voltage capacitor 16. At this time, the discharge high-voltage relay 14 is turned off by the ESD controller 17.

Then, the high-voltage relay 13 for charging is turned off by the ESD controller 17, and then the high-voltage relay 14 for conduction and discharge is controlled. Thereby, the high voltage stored in the high voltage capacitor 16 is applied from the high withstand voltage relay 14 to the probe 11 via the applied resistor 15.

This high voltage is applied to a series circuit including the variable resistor 2 and the voltage dividing resistor 3. A specific voltage is generated between both ends of the voltage dividing resistor 3, and a specific voltage is applied to the light-emitting confirmation LED 4. When the specific voltage exceeds the light-emitting threshold of the light-emitting confirmation LED 4 (about 0.7 V to 5.0 V), the specific voltage causes the light-emitting confirmation LED 4 to emit light. In short, as long as the light-emission threshold voltage Vth of the light-emitting confirmation LED 4 is a voltage across the voltage-dividing resistor when a high voltage specified by the ESD test device is applied to the voltage across the series circuit, the voltage of the ESD test device is high. When the voltage is higher than the voltage, the light-emitting threshold voltage of the LED 4 for light-emitting confirmation is equal to or higher than that of the light-emitting confirmation LED 4, and the light-emitting confirmation LED 4 emits light. By this light emission, it is possible to diagnose that a high voltage level corresponding to a predetermined voltage waveform has been applied between the respective probes 11 connected to the device to be inspected.

Regarding the setting of the resistance values of the variable resistor 2 and the voltage dividing resistor 3 in the diagnostic circuit 5, the voltage dividing resistor ratio is set such that the voltage of the light-emitting threshold voltage Vth is applied to the light-emitting confirmation LED 4. In this case, when a voltage equal to or higher than the predetermined light-emission threshold voltage Vth is applied to the light-emitting confirmation LED 4, the light can be set. Therefore, when the light-emitting confirmation LED 4 emits light, the light-emitting confirmation LED 4 is applied with a voltage equal to or higher than the light-emission threshold voltage Vth defined by the light-emitting confirmation LED 4, and thus the both ends of the series circuit of the variable resistor 2 and the voltage dividing resistor 3 are applied. There is a high voltage waveform above a specific applied voltage level. Furthermore, When only the energization confirmation is performed, only the light-emitting confirmation LED 4 can be directly connected between the probes 11 without passing through the voltage dividing resistor.

The high-voltage capacitors 13 and 14 for charging are electrically turned on/off controlled by the ESD controller 17, and the high-voltage capacitor 16 is charged or discharged, and a specific high voltage can be applied between the probes 11. The switching operation of the charging high-voltage relays 13 and 14 is performed by the ESD controller 17 at a predetermined timing. If there are several application modes in the ESD test, standards are separately established, and it is judged whether it is suitable or not based on the current waveform (or voltage waveform) of the device applied from the probe 11 to the inspection target. Here, it is possible to diagnose whether or not a high voltage level conforming to a predetermined voltage waveform has been applied, based on the presence or absence of light emission of the LED 4 for light emission confirmation.

Further, whether or not the diagnosis of each high voltage from the ESD test apparatus 10 is applied can be diagnosed based on the presence or absence of light emission of the light-emitting confirmation LED 4 connected between the pair of probes 11.

The ESD test according to the first embodiment is suitable for the inspection apparatus 1 in which the high-voltage power source 12 of the ESD test apparatus 10 and other ESD circuits are used, and a series circuit having a variable resistor 2 and a voltage dividing resistor 3 and a light-emitting resistor are connected to each ESD circuit. It is confirmed that the diagnostic circuit 5 suitable for inspection using the LED 4 activates the confirmation mode by the ESD controller 17, and uniformly studies the circuit operation and the applied voltage level (voltage value or one or more ESD circuits) based on the presence or absence of the illumination of the LED 4 for confirmation. The magnitude of the current value can be diagnosed as being suitable for the specified applied voltage level. Regarding whether or not the diagnosis of each high voltage from the ESD test apparatus 10 has been applied, the diagnosis can be performed based on the presence or absence of the light emission of the light-emitting confirmation LED 4 directly connected between the pair of probes 11 as described above.

In this case, the ESD test inspection (confirmation mode) is performed in the open state in which the probes 11 that apply the high voltage of the ESD test apparatus 10 are not connected to the inspection target device, and the test apparatus 10 is applied by the usual ESD. The diagnostic mechanism performs ESD high voltage application. The difference between the confirmation mode and the actual application mode is that the inspection target device is not connected between the respective probes 11. In summary, as described below, a high withstand voltage for charging via the ESD controller 17 can be synchronized with the system by receiving a control signal from a detector or a control PC (personal computer). The relays 13 and 14 perform SW control, and apply a predetermined high voltage waveform between the probes 11.

In the confirmation mode ESD circuit diagnosis, according to the charging capability of the high voltage power source 12 to the high voltage capacitor 16, the ESD controller 17 self-oscillates in a period as short as possible, for example, 30 msec period (120 msec in the actual application mode of the ESD application test) In the above, the charging high-voltage relays 13 and 14 are turned ON/OFF only for a specific period (about 2 or 3 seconds). As described above, by shortening the discharge period, it is possible to easily visualize the light emission of the light-emitting confirmation LED 4 in which single emission is difficult to observe by the afterimage effect. It is possible to confirm the presence or absence of the light emission of the LED 4 for confirmation in a short period of time without using a specific measuring instrument for detecting the presence or absence of light emission.

The light-emitting confirmation LED 4 is connected in a positive polarity with respect to the ESD. The reason why the light-emitting confirmation LED 4 is used as a light-emitting confirmation element is that the light-emitting responsiveness is fast, the weak current sensitivity is also good, the size is small, the brightness is high, and the resistance is high.

The luminescence responsiveness in this case will be described. In the case of a bulb (incandescent bulb), it is known that it takes about 0.15 to 0.25 seconds from the moment of access to the normal brightness. The case of the fluorescent tube is slower and takes 1 to 2 seconds. In the case of HID (High Intensity Discharge), it is slower, and it takes several minutes before stable illumination. However, in the case of an LED, the current is first-bright, and the light is brightly emitted, and if the current is stopped, it is immediately darkened at an instant, and the luminosity is excellent. It is known that the response speed in the LED element unit is 50 to 100 nsec. Therefore, the LED 4 for illuminating confirmation selects an element having a fast illuminance response characteristic of 100 nsec or less, and more preferably, the illuminance response characteristic of the illuminating confirmation LED 4 is as fast as possible, and may be 50 to 75 nsec.

The amount of charge (current amount) applied from the ESD circuit to the device to be inspected via the probe 11 is determined by the applied voltage, and the higher the applied voltage is, the easier the light emission confirmation for diagnosis is. For example, although the charge discharge continues while the HBM standard 1000V is hundreds of nsec and 2000V is several hundred nsec, the LED response speed is required. Since the above discharge time is obtained, the light emission confirmation LED 4 can be visually confirmed. Further, as a mechanism for easily detecting the light emission by the human eye, the above-described actual mode of application in the ESD controller 17 is described above in the confirmation mode. However, the LED 4 for the light-emitting confirmation can be used with the afterimage effect. The light emission can be easily visualized, and the application operation can be repeated in a short cycle, for example, a cycle of 30 msec. In short, in the ESD circuit diagnosis, by repeating the discharge period of the ESD high voltage for a specific period in which the luminescence is visualized by the afterimage effect, the light emission confirmation LED 4 can be continuously illuminated.

Further, the tolerance with respect to the application of the high voltage to the LED will be described. In actual use, there is no problem with respect to the durability of the LED, but in practice, even if a forward voltage Vf of 1000 V or more is applied, there is no problem at all. The reason for this is that the amount of charge (current amount) applied from the ESD circuit to the inspection target device via the probe 11 is limited to a predetermined amount; or the discharge time (current energization time) of the charge is as short as several hundred nsec as damage The main reason for this is that the amount of heat is small.

In addition, the forward voltage Vf of the red LED is 2.1-2.6V, the forward voltage Vf of the green LED is 3.3-3.9V, the forward voltage Vf of the blue LED is 3.2-4.0V, and the forward voltage Vf of the white LED is 3.1-4.0V. As the light-emitting confirmation LED 4, it is advantageous to use a green LED that is highly sensitive to the human eye in terms of visibility.

In FIG. 1, as the ESD test inspection apparatus 1, a high-voltage power source 12 and one or a plurality of ESD circuits using the ESD test apparatus 10 are connected to each ESD circuit with a variable resistor 2 and a voltage dividing resistor 3 The case where the series circuit and the LED 4 for illuminating confirmation are suitable for the diagnostic circuit 5 for inspection or the case where the LED 4 for illuminating confirmation is directly connected to each ESD circuit will be described, which is to uniformly integrate one or a plurality of ESD circuits. The case where the voltage of the light-emitting confirmation LED 4 is used to diagnose the applied voltage level has been described. However, in FIG. 2, specifically, eight high-voltage power sources 12 and eight SED circuits connected in parallel are used. The case where the unified ESD is applied and the ESD test is performed will be described.

Fig. 2 is a circuit diagram showing a configuration example in the case where an ESD test apparatus having eight ESD circuits is used in the ESD test inspection apparatus of Fig. 1. Fig. 3 is a circuit diagram showing a configuration example of an ESD test apparatus having eight ESD circuits.

In Fig. 2, the ESD test apparatus 1A of the first embodiment has a high voltage power supply 2 that outputs a specific high voltage, and a plurality of (here, eight) ESD circuits that unify the plurality of pairs of probes 11 simultaneously. A specific high voltage from the high voltage power source 2 is applied; the diagnostic circuit 5 is connected to each pair of probes 11 to check whether the specific high voltage level is good or not based on the presence or absence of the light emission confirmation LED 4.

The ESD circuit has a plurality of high voltage capacitors 16 as a high voltage capacitor mechanism that accumulate a specific high voltage from the high voltage power source 12; a plurality of high withstand voltage relays 18 as switching mechanisms for coming from the high voltage power source The specific high voltage of 12 is connected to the high voltage capacitor 16 side or the specific high voltage from the high voltage capacitor 16 is connected to the high voltage output side; and the complex pair (here, 8 pairs) high voltage output unit, The specific high voltage from the plurality of high voltage capacitors 16 is simultaneously outputted from the high withstand voltage relay 18 to the plurality of pairs of probes 11 via the applied resistors 15; as the same circuit configuration, the high voltage capacitors 16 are further passed through the high withstand voltage relays 18 Eight ESD circuits that reach the probe 11 via the application of the resistor 15 are independently arranged in parallel.

The diagnostic circuit 5 is connected to each pair of probes 11 of the high voltage output portion. A plurality of (here, eight) diagnostic circuits 5 are used to diagnose whether or not the uniformly applied high voltage waveform level is suitable for a predetermined level or whether the high voltage is energized via the probe 11 based on the presence or absence of the light emission confirmation LED 4. .

In the ESD test apparatus 10A, one of the terminals of the high-voltage power source 12 is connected to a plurality of (here, eight) high-voltage capacitors via respective contacts of the high-voltage relay 18 of the multi-contact (here, the 8-contact). Each of the electrodes of 16 and a plurality of (here, eight) high voltage capacitors 16 are respectively connected to the other terminal of the high voltage power source 12 and grounded. a plurality of (here, eight) high voltage capacitors 16 each of which has a high withstand voltage relay 3 from multiple contacts (here, 8 contacts) Each of the contacts is connected to the diagnostic circuit 5 from each of the probes 11 of the high voltage output portion via the respective application resistors 15.

The ESD test apparatus 10A includes a high voltage power supply 12 and eight parallel ESD circuits, and the diagnostic circuit 5 is connected to each ESD circuit to constitute the ESD test inspection apparatus 1A of the first embodiment. Further, in the ESD test, each of the diagnostic circuits 5 is connected to the probe 11 in place of the plurality of ESD test devices 10A, and the plurality of probes 11 are connected to the ESD test device 10A as shown in FIG. Each of the inspection target devices 19 performs an ESD test.

One of the terminals of each of the inspection target devices 19 is connected to the probe 11 from the high voltage output portion via the application resistor 15, the high withstand voltage relay 18, and further to each of the independent ESD circuits of one of the terminals of the high voltage capacitor 16. Further, the other terminals of the respective inspection target devices 19 are respectively connected to the other terminal of the high voltage capacitor 16 from the probe 11 of the GND voltage output portion and grounded. Although not shown here, the above-described ESD controller 17 for switching the high-withstand voltage relay 18 that controls a plurality of contacts (here, eight contacts) at a specific timing is connected.

The high-voltage power source 12 is selected and has a suitable charging processing capability according to the capacitance of the number of high-voltage capacitors 16 to be uniformly processed.

The high withstand voltage relay 18 uses a mercury relay with a directionality, which can be 8 contacts, but can also be 2 4 contacts or 4 2 contacts. It is also possible to provide eight high-voltage relays 3 with one contact instead of the high-voltage relay 3 of the 8-contact. The high-voltage-resistance relay 18 is connected to the high-voltage capacitor 16 via the ESD controllers 17 and 8 (not shown) on the high-voltage power source 12 side and the inspection target device 19 or the diagnostic circuit 5 side. Switch between. The control signal to the high withstand voltage relay 18 is set to a single simultaneous control with respect to the uniform application of the high voltages of the eight high voltage capacitors 16 to the eight devices 19 or the diagnostic circuit 5. When the high withstand voltage relays 18 are placed one on top of the other, since they are components that operate using the coil magnetic field, malfunction may occur and the operation may be poor.

Here, eight high-voltage capacitors 16 are used, and those with appropriate tolerance to the test voltage are selected. For the selection of the capacitors, each test is selected in accordance with the standard of the ESD test. Authenticated by the mode. For example, it is 100 pF for the HBM standard and 200 pF for the MM standard.

Here, eight applied resistors 15 are used, which is 1.5 KΩ for the HBM standard and 0 KΩ for the MM standard (no resistance). The high-voltage capacitors 16 and the applied resistors 15 are mounted in a state in which the number of the devices 19 or the diagnostic circuits 5 to be collectively processed is electrically independent.

The device 19 is, for example, an LSI element, a light-emitting element such as an LED element or a laser element, or the like.

According to the above configuration, first, the eight contacts of the high withstand voltage relay 18 are turned on at the high voltage power source 12 side and branched from the high voltage power source 12 to eight by the ESD controller 17 (not shown), and current flows into the respective high voltages. The capacitor 16 is equally accumulated in the high voltage of the high voltage power source 12. At this time, the eight contacts on the device 6 side of the high withstand voltage relay 18 are turned off by the ESD controller 17.

Next, the ESD controller 17 controls the eight contacts on the high voltage power supply 12 side of the high withstand voltage relay 18 to turn on the eight contacts on the diagnostic circuit 5 side of the high withstand voltage relay 18. Thereby, the high voltage stored in the high voltage capacitor 16 from the eight contacts of the high withstand voltage relay 18 is applied to the diagnostic circuit 5 via the respective probes 11 from the respective application resistors 15 respectively. In this case, each of the high-voltage capacitors 16 and the diagnostic circuit 5 are associated with each other in a one-to-one manner, and the diagnosis of the clear and correct ESD applied voltage level can be performed efficiently and efficiently. In addition, when the energization confirmation is performed, the light-emitting confirmation LED 4 can be directly connected between the probes 11 without passing through the voltage dividing resistor, and the light-emitting confirmation can be performed based on the presence or absence of the light emission of the light-emitting confirmation LED 4.

In this manner, the eight contacts of the high voltage relays 18 are switched from the high voltage power supply 12 side to the diagnostic circuit 5 side by the ESD controller 17, and the eight high voltage capacitors 16 are charged or discharged, and the diagnostic circuit 5 can be respectively From the eight high voltage capacitors 16, a specific high and specific high voltage is applied from the probes 11 of the respective high voltage output portions. The switching operation of the eight contacts of the high withstand voltage relay 18 is simultaneously performed by the ESD controller 17 at a predetermined timing. If the ESD test is a plurality of application modes, standards are respectively set according to the devices applied to the inspection object. The ESD current waveform (or the ESD voltage waveform) of the device 6 is quickly diagnosed as appropriate or unsuitable according to the presence or absence of the light emission of the LED for the illumination of the diagnostic circuit 5.

Fig. 4 is a perspective view schematically showing an enlarged image of the contact state of the device 19 in the ESD test apparatus 10A of Fig. 3. Fig. 5 is a perspective view schematically showing an example of a configuration image when ESD is applied in the ESD test apparatus 10A of Fig. 3.

In FIG. 4 and FIG. 5, the ESD test apparatus 10A of FIG. 3 is provided with an 8-inch ESD substrate box 21, which is a high-voltage relay 18 that connects one high-voltage power source 12, 8 for safety. Eight high-voltage capacitors 16, eight applied resistors 15, and an ESD substrate (not shown) on which other additional circuits are mounted are housed in the casing, and have a resistance from the junction of the high-voltage capacitor 16 via the high withstand voltage relay 18 to the applied resistor. a wiring output portion 21a of eight circuits (eight ESD circuits) of a series circuit of 15; and a probe card 22 for connecting the respective wirings 23 from the wiring output portion 21a of the ESD substrate box 21 to the upper surface thereof. The connector 24 is connected to each of the eight sets of the probes 11 on the lower surface side, so that the eight sets of the pair of probes 11 are in a one-to-one correspondence with the two terminals 19a and 19b of the respective devices 19 from the lower surface. Each of the terminals 19a and 19b of each of the plurality of devices 19 having a plurality of inspection objects arranged in a matrix on the semiconductor wafer 20 on the wafer stage 30 is connected to each of the high voltage capacitors 16 respectively. The eight sets of the probes 11 are arranged in a one-to-one correspondence.

As shown in FIG. 4, the ESD applied voltage waveform changes by changing the length of the wiring from the ESD substrate in the ESD substrate box 21 to the probe card 22. Therefore, the wiring lengths from the high voltage capacitor 16 to the terminals 19a, 19b of the device 19 are made to be the same wiring length, and the ESD voltage waveforms applied to the respective terminals 19a, 19b of the device 19 or the diagnostic circuit 5 are the same. The ESD substrate may also have a socket portion for replacement of parts.

The wiring length from the wiring output portion 21a of the ESD substrate case 21 to the device 19 or the diagnostic circuit 5 in Fig. 6(a) is preferably 20 cm or less as the standard of the ESD applied voltage waveform of Fig. 6(b). The wiring lengths from the respective ESD substrates to the terminals of the eight devices 19 or the diagnostic circuit 5 are the same wiring lengths, and are applied to the respective terminals of the device 19 or the diagnostic circuit 5. The ESD voltage waveform of Figure 6(b) is the same. Thereby, the ESD test becomes uniform, and the diagnostic circuit 5 can quickly and accurately diagnose the suitability or unsuitability of the ESD applied voltage waveform used in the ESD test based on the presence or absence of the light emission of the light-emitting confirmation LED 4.

The wiring length from the wiring output portion 21a of the 8h ESD substrate box 21 to the device 19 or the diagnostic circuit 5 is preferably 20 cm or less as the standard of the ESD applied voltage waveform of Fig. 6(b). The wiring lengths of the terminals 19a and 19b or the diagnostic circuits 5 of the respective device 19 of each of the wiring output portions 21a to the respective ESD substrate boxes 21 are the same wiring lengths, and are applied to the respective terminals of the respective devices 19 or diagnosed. The ESD voltage waveform of Figure 6(b) of circuit 5 is the same. Thereby, the ESD test becomes uniform. A suitable diagnosis of the ESD applied voltage waveform at this time can be performed.

Fig. 7 is a block diagram showing a wafer map and detection control mainly based on a personal computer PC.

In Fig. 7, the ESD test apparatus 1A of the first embodiment switches the 8 contacts of the high voltage relay 18 to the high level in accordance with the confirmation mode of the ESD controller 17 that receives the instruction from the personal computer 32 that performs the probe control. The high voltage from the high voltage power source 12 is accumulated in the eight high voltage capacitors 16 on the side of the voltage source 12, and then the ESD applied voltage level is applied from the ESD circuit to the diagnostic circuit 5 between the probe pairs 11 of the pair of pairs, respectively. The ESD circuit is composed of eight parallel circuits in which the 8 contacts of the high voltage relay 18 are simultaneously switched to the eight applied resistors 15 side at a specific timing. It is possible to confirm the ESD test such as the high voltage suitable inspection or the high voltage energization check for the ESD test by visually and accurately performing the light emission of the LED 4 by the light emission of the diagnostic circuit 5.

When it is an automatic diagnostic test other than the visual inspection, the presence or absence of the light emission confirmation LED of the light-emitting means can be detected by a photocoupler or the like as a detecting means, or can be detected by a detecting means such as an electronic circuit including a comparison circuit. The high voltage of 5 or exceeds the corresponding threshold voltage corresponding to it.

In the case where the ESD test apparatus 10A performs an ESD test on a large number of wafers of 100,000 semiconductor wafers 20 in sequence (actual application mode), automatic transfer using the detector 31 or the like is performed. The device drives the wafer stage 30 in a three-axis direction for continuous detection. The detection control may be based on a personal computer PC, and a wafer map on the semiconductor wafer 20, that is, a large number (for example, 100,000) of semiconductor wafers arranged in a matrix on the semiconductor wafer 20 as a semiconductor wafer to be inspected. The address, the ESD test is performed on the semiconductor wafers of all the address ranges, and the semiconductor wafer of which address is memorized is the ESD withstand voltage. When the leakage current caused by the reverse voltage of the diode structure of the semiconductor wafer exceeds a certain value or more, the ESD withstand voltage is determined to be defective by the measuring device, and the address of the semiconductor wafer is stored in the personal computer PC. .

In the case of a diagnostic check, an ESD test can be performed on the ESD circuits of all address ranges for the address indicating the position of a large number of ESD circuits, and the ESD circuit of which address is memorized is poorly applied to the ESD. When the ESD is badly applied, the address of the ESD circuit is memorized in the personal computer PC.

The ESD controller 17 not only performs the operation control of the high withstand voltage relay 18 of the ESD circuit, but also operates in the order of the setting or the number of application of the voltage level to be applied or the polarity condition to be applied in advance by a program or the like. The ESD controller 17 has an ESD test mode (actual application mode) and an acknowledge mode (ESD test check mode).

Next, the miniaturization of the diagnostic circuit 5 of the ESD test and inspection device 1 or 1A will be described. When the LED is a point light source and the ESD circuit is a plurality of circuits (hereinafter, 36 circuits are shown), the substrate of the diagnostic circuit 5 is miniaturized.

In other words, when there are a plurality of ESD circuits, at least a plurality of light-emitting means (light-emitting confirmation LEDs 4) are arranged on the circuit board, and one of the circuit board connection mechanisms (the protruding pin sockets 8a described below) is connected to The other connection mechanism (between the probe pins 8b of the probe card 22A) between the high voltage output terminals of the ESD circuit is connected to each other, and the diagnostic circuit 5 as a diagnostic mechanism is connected to each ESD circuit. . This will be specifically described with reference to FIGS. 8 and 9.

Fig. 8 is a plan view showing a diagnostic circuit board in which 36 diagnostic circuits 5 of Fig. 1 are disposed on a circuit board. 9 is a diagram for explaining the use of the one-touch type of the diagnostic circuit substrate and the probe card of FIG. Side view of the connection method.

As shown in FIGS. 8 and 9, 36 diagnostic circuits 5 are arranged on the diagnostic circuit board 6. The diagnostic circuit board 6 has 36 light-emitting confirmation LEDs 4 arranged in a matrix in nine rows and four rows on the right side region of the circuit board 6a. Further, the diagnostic circuit board 6 has a resistor array region 7 in which 36 circuits are arranged in a series circuit of the variable resistor 2 and the voltage dividing resistor 3 in the left side region of the circuit board 6a. Each of the series circuits of the variable resistor 2 and the voltage dividing resistor 3 is connected between the both ends of the voltage dividing resistor 3 by the wiring of the circuit board 6a.

36 pairs of probes 11 are disposed on the lower surface side of the probe card 22A, and a pair of female sockets 8b are disposed on each pair of probes 11 on the side of the probe card 22A. On the side of the diagnostic circuit board 6, a pair of protruding pin sockets 8a are respectively disposed so as to correspond to both end sides of the series circuit of the variable resistor 2 and the voltage dividing resistor 3. The male pin socket 8a and the female socket 8b are detachably attached to the upper and lower ends. The male socket 8a is inserted into the female socket 8b by a single contact, and the variable resistor is connected to each pair of probes 11. 2 and both ends of the series circuit of the voltage dividing resistor 3. Thereby, the diagnostic circuit 5 can be connected to each pair of probes 11, and the presence or absence of the light emission confirmation LED 4 can be diagnosed whether or not the voltage level of the high voltage waveform applied to the ESD is equal to or higher than a predetermined voltage level.

According to the first embodiment, the ESD test apparatus 1 includes an ESD test apparatus 10 for performing an ESD application test for checking ESD tolerance of one or a plurality of inspection target devices, and a diagnostic circuit 5 for use. The suitability of the voltage waveform applied to the ESD is diagnosed. The diagnostic circuit 5 has a series circuit of a variable resistor 2 and a voltage dividing resistor 3 connected between a high voltage output terminal (probe 11) of the ESD testing device 10, and a connection between the two ends of the voltage dividing resistor 3 The LED 4 for light emission confirmation of the light-emitting mechanism. In addition, when only the energization confirmation is performed, the light-emitting confirmation LED 4 can be directly connected between the probes 11 without passing through the voltage dividing resistor.

Thereby, the diagnostic mechanism is used, for example, by the light-emitting means (light-emitting confirmation LED 4). The presence or absence of illumination is diagnosed by the energization or voltage level of each of the high voltages of the ESD test apparatus 10 or 10A, so that the ESD test can be performed extremely quickly and accurately than before. For example, if an oscilloscope is used to check the high voltage application level of 32 ESD circuits, one circuit of the ESD circuit takes 3 minutes, and 32 circuits take 96 minutes. However, according to the first embodiment, it is not dependent on The number of circuits of the ESD circuit is only checked for the presence or absence of the illumination of the LED 4 for illuminating confirmation, so that it is still possible to perform inspection at most within one minute. Therefore, the more the number of ESD circuits that uniformly check ESD tolerance, the higher the efficiency.

Further, in the first embodiment, although not specifically described, the high-voltage power source 12 may be provided with a positive power source and a negative power source with respect to the GND potential, and may be configured to switch between a positive power source and a negative power source, or may be configured. The forward bias and the reverse bias are switchable with respect to the plurality of inspection target devices 6. The connection direction of the diagnostic circuit 5 is reversed by the forward bias and the reverse bias.

As described above, the present invention has been exemplified by the preferred embodiment 1 of the present invention, but the present invention is not limited to the first embodiment. It is to be understood that the scope of the invention should be construed only by the scope of the patent application. The description of the preferred embodiment of the present invention and the technical knowledge are to be construed as being within the scope of equivalents. It is to be understood that the patents, patent applications, and documents cited in the specification are equivalent to the contents of the specification, and the contents thereof are hereby incorporated by reference.

[Industrial availability]

The present invention is in the field of an ESD test suitable for an inspection device and an ESD test using the same, and the use of a diagnostic mechanism for performing energization or voltage level of each high voltage from the ESD test device according to, for example, the presence or absence of illumination of the illumination device. Because of the diagnosis, the ESD test can be performed quickly and accurately, and the ESD test is suitable for the inspection device to check the high voltage application device for checking the ESD resistance from the inspection target device such as the LSI element, the LED element, and the laser element. Is the current waveform correct?

1‧‧‧ESD test inspection device

2‧‧‧Variable resistor

3‧‧‧voltage resistor

4‧‧‧Lighting confirmation LED

5‧‧‧Diagnostic circuit

10‧‧‧ESD test device

11‧‧‧Probe

12‧‧‧High voltage power supply

13‧‧‧High withstand voltage relay

14‧‧‧High withstand voltage relay

15‧‧‧Applying resistance

16‧‧‧High voltage capacitor

17‧‧‧ESD controller

Claims (18)

An ESD test inspection device that connects a diagnostic mechanism to each of the high voltage outputs of an ESD test device that is separately applied to one or more test object devices for collectively checking ESD tolerance, by which the diagnostic mechanism can diagnose whether or not the ESD has been diagnosed. The test device applies a high voltage or whether the high voltages are suitable for a predetermined high voltage value; and the diagnostic mechanism has a series circuit of a variable resistor and a voltage dividing resistor connected between the high voltage output ends of the ESD test device, And an illuminating mechanism connected in the forward direction between the two ends of the voltage dividing resistor. An ESD test inspection device that connects a diagnostic mechanism to each of the high voltage outputs of an ESD test device that is separately applied to one or more test object devices for collectively checking ESD tolerance, by which the diagnostic mechanism can diagnose whether or not the ESD has been diagnosed. The test device applies a respective high voltage or whether the respective high voltages are suitable for a predetermined high voltage value; and the diagnostic mechanism has an illumination mechanism connected between the respective high voltage output terminals of the ESD test device. The ESD test and test apparatus according to claim 1 or 2, wherein the diagnosis by the diagnostic means is performed based on the presence or absence of light emission of the light-emitting means. The ESD test inspection apparatus of claim 3, wherein the illumination means is an LED for illumination confirmation. The ESD test inspection apparatus of claim 4, wherein the illuminating color of the illuminating confirmation LED is green. The ESD test inspection apparatus according to claim 1 or 2, wherein the diagnosis by the diagnosis means has a detection means for detecting whether or not the light-emitting means as the diagnosis means emits light or a high voltage applied to the diagnosis means Exceeded a certain threshold voltage. The ESD test inspection device of claim 1, wherein the illumination threshold of the illumination unit is The voltage is a voltage across the voltage dividing resistor when a predetermined high voltage of the ESD test device is applied to the voltage across the series circuit. The ESD test and inspection apparatus according to claim 1 or 2, wherein the light-emitting means is a light-emitting element having a light-emission response speed of 100 nsec or less. The ESD test inspection apparatus of claim 1 or 2, wherein the illumination means emits light by respective high voltages from the ESD test apparatus. The ESD test inspection apparatus of claim 1, wherein the illumination means is connected to any one of a plurality of voltage dividing resistors including a variable resistor. The ESD test inspection apparatus of claim 3, wherein the diagnostic mechanism or the above-mentioned diagnostic mechanism is connected to each of the ESD circuits by using one or a plurality of ESD circuits of the high voltage power source and the output high voltages in the above ESD test device Illumination mechanism. The ESD test apparatus according to claim 3, wherein, in the diagnosis, the discharge period of the high voltage is repeated for a predetermined period of time in which the luminescence is visualized by the afterimage effect, whereby the light emission of the illuminating means is continued. The ESD test inspection apparatus of claim 12, wherein the discharge period of the high voltage is set according to a charging capability of the high voltage power source. The ESD test inspection apparatus of claim 12, wherein the discharge period of the high voltage is 30 msec. The ESD test apparatus according to claim 11, wherein when the plurality of ESD circuits are plural, at least the plurality of light-emitting mechanisms are arranged on the circuit board. An ESD test apparatus according to claim 15, wherein one of said circuit board connection means is connected to another connection means connected to said high voltage output terminal of said ESD circuit, and said light-emitting means is connected to each of said ESD circuits. The ESD test inspection apparatus of claim 11 having an ESD controller that controls the high voltage output period from the ESD circuit in an ESD test mode and an ESD test check mode. An ESD test inspection method using the ESD test inspection device according to any one of claims 1, 2, 7, and 10; having the following diagnostic steps: each high voltage output connected to the ESD test inspection device The diagnostic mechanism between the ends diagnoses whether or not the respective high voltages from the ESD test inspection devices applied to one or a plurality of inspection target devices and uniformly check the ESD tolerance are applied or whether the respective high voltages are suitable for the prescribed high voltage value.