JP2010098209A - Broken light emitting element detection system - Google Patents

Broken light emitting element detection system Download PDF

Info

Publication number
JP2010098209A
JP2010098209A JP2008269404A JP2008269404A JP2010098209A JP 2010098209 A JP2010098209 A JP 2010098209A JP 2008269404 A JP2008269404 A JP 2008269404A JP 2008269404 A JP2008269404 A JP 2008269404A JP 2010098209 A JP2010098209 A JP 2010098209A
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
terminal
led
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008269404A
Other languages
Japanese (ja)
Inventor
Takafumi Matsumoto
貴文 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Funai Electric Co Ltd
Original Assignee
Funai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Funai Electric Co Ltd filed Critical Funai Electric Co Ltd
Priority to JP2008269404A priority Critical patent/JP2010098209A/en
Publication of JP2010098209A publication Critical patent/JP2010098209A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Led Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a broken light emitting element detection system which promptly discriminates which light emitting element is broken among a plurality of light emitting elements arranged on a light emitting element substrate and does not apply a load such as internal heat to a device with the light emitting element substrate. <P>SOLUTION: The broken light emitting element detection system is provided with a resistor part 10 formed by serially connecting m-pieces of resistors R which are the same number as the number of LED elements 110 serially connected to an i-column LED substrate 100i, and connected to the i-column LED substrate 100i by a substrate connection part 130 and a detector connection part 20. Then, when a prescribed voltage is applied from a power supply 120, since a prescribed current flows to each LED element 110 provided at the i-column LED substrate 100i by each resistor R, the broken LED element 110 is detected by checking the LED element 110 which does not emit light. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、破損発光素子検出システムに関し、特に、複数の発光素子を基板上に配置しそれぞれの発光素子を直列に接続して各列を構成し、前記各列を並列に接続した発光素子基板に対して、所定の電圧を印加して破損している発光素子を検出する検出器による破損発光素子検出システムに関する。   The present invention relates to a damaged light-emitting element detection system, and in particular, a light-emitting element substrate in which a plurality of light-emitting elements are arranged on a substrate and the respective light-emitting elements are connected in series to form each row, and the rows are connected in parallel. In contrast, the present invention relates to a damaged light emitting element detection system using a detector that detects a damaged light emitting element by applying a predetermined voltage.

近年、複数のLED素子を直列接続し、その直列接続されたLED素子を並列に複数列配置して平面状の回路を備えるLED基板を形成し、そのLED基板に配置された各LED素子を発光させることでモニタ等のバックライトとして機能する、いわゆるLEDバックライトを備えたデジタルテレビ等が普及し始めている。そのLEDバックライトにおけるLED素子のうちの何れかが過電流等によって破損している場合、LED素子ごとに電流を流して、破損している(発光しない)LED素子を検出し交換する方法が従来より用いられてきた。ただし、上記方法では、LED素子ごとに個別検出を行わなければならないため、各列に備えられたLED素子の数が数百個程度となれば、破損しているLED素子を検出するには相当の時間を要していた。   In recent years, a plurality of LED elements are connected in series, a plurality of the LED elements connected in series are arranged in parallel to form an LED substrate having a planar circuit, and each LED element arranged on the LED substrate emits light. Thus, digital televisions equipped with so-called LED backlights that function as backlights for monitors and the like have begun to spread. Conventionally, when any of the LED elements in the LED backlight is damaged by an overcurrent or the like, a method of detecting and replacing the damaged (non-light-emitting) LED element by passing a current for each LED element is known. Have been used more. However, in the above method, individual detection must be performed for each LED element. Therefore, if the number of LED elements provided in each column is about several hundred, it is appropriate to detect a broken LED element. Took time.

そこで、上述のようにLED素子を平面状に配置した基板上において、各列に検知素子を接続し、その各列に接続された検知素子からの出力に基づいて、何れの列のLEDが破損しているかを判別する機構を備えた断線検知装置が知られている(例えば、特許文献1参照)。また、上記特許文献1と同様の検出機構を備えたLED破壊検出装置が知られている(例えば、特許文献2参照)。
特開平7−287024号公報 特開2008−64477号公報
Therefore, on the substrate on which the LED elements are arranged in a planar manner as described above, the detection elements are connected to the respective rows, and any row of LEDs is damaged based on the output from the detection elements connected to the respective rows. A disconnection detection device having a mechanism for determining whether or not a device is operating is known (for example, see Patent Document 1). Further, an LED breakage detection apparatus having a detection mechanism similar to that of Patent Document 1 is known (see, for example, Patent Document 2).
JP-A-7-287024 JP 2008-64477 A

しかしながら、上記特許文献1及び2に開示された発明では、破損したLED素子がどの列に属しているかが判別できるだけであり、その列における何れのLED素子であるかは判別できない。さらに、当該発明では、複数のLED素子を配置した基板上に検知素子が備えられ、さらに、何れの列のLED素子が破損しているかを判別する機構が断線検知装置やLED破壊検出装置の内部に備えられているため、基板や装置の筐体が大型化するとともに、検知を行う度に装置に内部発熱などの負荷をもたらすという問題があった。   However, in the inventions disclosed in Patent Documents 1 and 2, it is only possible to determine which column the damaged LED element belongs to, and it is not possible to determine which LED element is in that column. Further, in the present invention, the detection element is provided on the substrate on which the plurality of LED elements are arranged, and a mechanism for determining which row of the LED elements is broken is provided inside the disconnection detection device or the LED breakage detection device. Therefore, there is a problem that the substrate and the housing of the apparatus are enlarged, and a load such as internal heat generation is caused to the apparatus every time detection is performed.

本発明の課題は、発光素子基板に配置された複数の発光素子のうち、何れの発光素子が破損しているかを迅速に判別でき、かつ、発光素子基板を備える装置に内部発熱などの負荷を及ぼさない破損発光素子検出システムを提供することである。   An object of the present invention is to quickly determine which light emitting element is damaged among a plurality of light emitting elements arranged on a light emitting element substrate, and to load a device including the light emitting element substrate such as internal heat generation. It is an object of the present invention to provide a damaged light emitting element detection system that does not reach the target.

上記課題を解決するため、請求項1に記載の発明は、
複数の発光素子を基板上に配置しそれぞれの発光素子を直列に接続して各列を構成し、前記各列の両端部及び前記各列に配置された発光素子間に第1端子を設け、前記各列を並列に接続した発光素子基板に対して、所定の電圧を印加して破損している発光素子を検出する検出器による破損発光素子検出システムにおいて、
前記検出器は、
前記各列に配置された発光素子の数と同数以上の抵抗を直列に接続した抵抗部と、
前記発光素子基板の前記各列に設けられた第1端子と、前記抵抗部の両端部及びそれぞれの抵抗間に設けられた第2端子と、を接続する接続部と、を備え、
前記接続部により、前記発光素子基板の所定の列の前記第1端子と、前記第2端子と、が接続された状態で、前記発光素子基板の所定の列に所定の電圧を印加させるように構成したことを特徴とする。
In order to solve the above-mentioned problem, the invention described in claim 1
A plurality of light emitting elements are arranged on a substrate and each light emitting element is connected in series to form each row, and a first terminal is provided between both ends of each row and the light emitting devices arranged in each row, In the broken light emitting element detection system by a detector that detects a broken light emitting element by applying a predetermined voltage to the light emitting element substrates connected in parallel to each column,
The detector is
A resistance portion in which resistors equal to or more than the number of light emitting elements arranged in each row are connected in series;
A connection portion that connects a first terminal provided in each row of the light emitting element substrate and a second terminal provided between both ends of the resistor portion and each resistor;
A predetermined voltage is applied to the predetermined row of the light emitting element substrate in a state where the first terminal and the second terminal of the predetermined row of the light emitting element substrate are connected by the connecting portion. It is characterized by comprising.

請求項2に記載の発明は、請求項1に記載の破損発光素子検出システムにおいて、前記発光素子基板は、前記第1端子と接続されるスルーホールを備え、前記接続部は、各々の第2端子と接続され、前記スルーホールに挿入されるピンを備え、前記スルーホールに前記ピンが挿入されることにより、前記第1端子と前記第2端子とが接続されることを特徴とする。   According to a second aspect of the present invention, in the damaged light-emitting element detection system according to the first aspect, the light-emitting element substrate includes a through hole connected to the first terminal, and the connection portion includes the second holes. A pin is connected to a terminal and inserted into the through hole, and the first terminal and the second terminal are connected by inserting the pin into the through hole.

請求項3に記載の発明は、請求項1に記載の破損発光素子検出システムにおいて、前記発光素子基板は、一端が前記第1端子と接続され、他端に基板コネクタ端子を備えるとともに当該他端が前記発光素子基板の各列ごとに集約されて配線された第1コネクタ部を備え、前記接続部は、一端が前記第2端子と接続され、他端に検出器コネクタ端子を備えるとともに当該他端が集約されて配線された第2コネクタ部を備え、前記第1コネクタ部と前記第2コネクタ部とを接続することにより、前記第1端子と前記第2端子とが接続されることを特徴とする。   According to a third aspect of the present invention, in the damaged light emitting element detection system according to the first aspect, the light emitting element substrate has one end connected to the first terminal and the other end provided with a board connector terminal and the other end. Includes a first connector portion that is aggregated and wired for each column of the light emitting element substrate, and the connection portion includes one end connected to the second terminal and the other end including a detector connector terminal. A second connector portion that is wired with the ends being aggregated is provided, and the first terminal and the second terminal are connected by connecting the first connector portion and the second connector portion. And

請求項4に記載の発明は、
複数のLED素子を基板上に配置しそれぞれのLED素子を直列に接続して各列を構成し、前記各列の両端部及び前記各列に配置されたLED素子間に第1端子を設け、前記各列を並列に接続したLED基板に対して、所定の電圧を印加して破損しているLED素子を検出する検出器による破損発光素子検出システムにおいて、
前記検出器は、
前記各列に配置されたLED素子の数と同数以上の抵抗を直列に接続した抵抗部と、
前記LED基板の前記各列に設けられた第1端子と、前記抵抗部の両端部及びそれぞれの抵抗間に設けられた第2端子と、を接続する接続部と、を備え、
前記接続部により、前記LED基板の所定の列の前記第1端子と、前記第2端子と、が接続された状態で、前記LED基板の所定の列に所定の電圧を印加させるように構成し、
前記LED基板は、前記第1端子と接続されるスルーホールを備え、
前記接続部は、各々の第2端子と接続され、前記スルーホールに挿入されるピンを備え、
前記スルーホールに前記ピンが挿入されることにより、前記第1端子と前記第2端子とが接続されることを特徴とする。
The invention according to claim 4
A plurality of LED elements are arranged on a substrate, and each LED element is connected in series to form each row, and a first terminal is provided between both ends of each row and the LED devices arranged in each row, In a broken light emitting element detection system by a detector that detects a broken LED element by applying a predetermined voltage to the LED substrates connected in parallel to each row,
The detector is
A resistance portion in which resistors equal to or more than the number of LED elements arranged in each row are connected in series;
A connection portion for connecting a first terminal provided in each row of the LED substrate and a second terminal provided between both ends of the resistor portion and the respective resistors;
The connecting portion is configured to apply a predetermined voltage to the predetermined row of the LED substrate in a state where the first terminal and the second terminal of the predetermined row of the LED substrate are connected. ,
The LED substrate includes a through hole connected to the first terminal,
The connecting portion includes a pin connected to each second terminal and inserted into the through hole,
The first terminal and the second terminal are connected by inserting the pin into the through hole.

本発明に係る破損発光素子検出システムによれば、検出器は、発光素子基板の所定の列において直列接続された発光素子110の数と同数以上の抵抗を直列に接続した抵抗部を備え、接続部により発光素子基板の所定の列と接続可能になっている。
そのため、発光素子基板の所定の列に所定の電圧が印加されると、抵抗部の各抵抗により各発光素子に所定の電流が流れるので、発光していない発光素子を、ユーザが目視により確認することで、発光素子基板の所定の列に備えられた発光素子の中で、破損した発光素子を検出することが出来る。そして、上記検出を各列について実行することにより、発光素子基板に備えられた全ての発光素子の破損状態を検出することが出来る。
また、本発明に係る破損発光素子検出システムによると、検出器は、発光素子基板上に備えられたものではなく、接続部を介して発光素子基板と接続するものに過ぎないので、発光素子基板や発光素子基板を備える装置等を大型化させることは無く、検出を行う度に当該基板や装置に内部発熱などの負荷をもたらすこともない。
従って、本発明は、発光素子基板に配置された複数の発光素子のうち、何れの発光素子が破損しているかを迅速に判別でき、かつ、発光素子基板を備える装置に内部発熱などの負荷を及ぼさない破損発光素子検出システムであるといえる。
According to the damaged light emitting element detection system according to the present invention, the detector includes a resistance unit in which resistors equal to or more than the number of the light emitting elements 110 connected in series in a predetermined row of the light emitting element substrate are connected in series. The portion can be connected to a predetermined row of the light emitting element substrate.
Therefore, when a predetermined voltage is applied to a predetermined row of the light emitting element substrate, a predetermined current flows through each light emitting element due to each resistance of the resistance portion, so that the user visually checks the light emitting elements that are not emitting light. Thus, a damaged light emitting element can be detected among the light emitting elements provided in a predetermined row of the light emitting element substrate. Then, by executing the above detection for each column, it is possible to detect the damaged state of all the light emitting elements provided on the light emitting element substrate.
In addition, according to the damaged light emitting element detection system according to the present invention, the detector is not provided on the light emitting element substrate, but only connected to the light emitting element substrate through the connection portion. And a device including a light emitting element substrate is not enlarged, and a load such as internal heat generation is not caused to the substrate or the device every time detection is performed.
Therefore, the present invention can quickly determine which light emitting element is damaged among the plurality of light emitting elements arranged on the light emitting element substrate, and applies a load such as internal heat generation to the apparatus including the light emitting element substrate. It can be said that this is a damaged light-emitting element detection system that does not reach.

以下、図を参照して、本発明に係る破損発光素子検出システムの具体的な態様を詳細に説明する。ただし、発明の範囲は、図示例に限定されない。   Hereinafter, specific embodiments of the damaged light emitting element detection system according to the present invention will be described in detail with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples.

図1は、LED(Light Emitling Diode)バックライト200及びその内部に配置されたLED基板100を示す概略構成図であり、(A)がLEDバックライト200を、(B)がLED基板100を示しており、図2は、本発明を適用した破損発光素子検出システム1000を示す概略構成図である。   FIG. 1 is a schematic configuration diagram showing an LED (Light Emitting Diode) backlight 200 and an LED substrate 100 disposed therein, wherein (A) shows the LED backlight 200, and (B) shows the LED substrate 100. FIG. 2 is a schematic configuration diagram showing a damaged light emitting element detection system 1000 to which the present invention is applied.

本発明にかかる破損発光素子検出システム1000は、図1,2に示すように、例えば、LEDバックライト200内のLED基板(発光素子基板)100と、LED基板100に配置されたLED素子110の破損の有無を検出する検出器1とを備えて構成される。
図1(A)に示すように、LEDバックライト200は、例えば、デジタルテレビ等の液晶パネルの裏面側に配置されており、その液晶パネルを縦n個×横m個のマトリクス状に分割したサブ表示領域のそれぞれに対応するように、縦n個×横m個の光源L(n,m)を備え、光源L(n,m)がそれぞれ対応するサブ表示領域を照光することにより、液晶パネルのバックライトとして機能している。
As shown in FIGS. 1 and 2, the damaged light emitting element detection system 1000 according to the present invention includes, for example, an LED substrate (light emitting element substrate) 100 in the LED backlight 200 and LED elements 110 arranged on the LED substrate 100. And a detector 1 for detecting the presence or absence of breakage.
As shown in FIG. 1A, the LED backlight 200 is disposed on the back side of a liquid crystal panel such as a digital TV, for example, and the liquid crystal panel is divided into a matrix of n vertical x m horizontal. In order to correspond to each of the sub display areas, there are n vertical x m horizontal light sources L (n, m), and each of the light sources L (n, m) illuminates the corresponding sub display area, thereby liquid crystal. It functions as a panel backlight.

次いで、図1(B)に示すように、LEDバックライト200の内部に備えられたLED基板100は、光源L(n,m)それぞれに対応するように配置された発光源としてのLED素子110と、LED素子110に電圧を印加する電源120と、検出器1と接続するための基板接続部130と、等を備えて構成されている。   Next, as shown in FIG. 1B, the LED substrate 100 provided inside the LED backlight 200 is an LED element 110 as a light emitting source arranged to correspond to each of the light sources L (n, m). And a power source 120 for applying a voltage to the LED element 110, a substrate connecting portion 130 for connecting to the detector 1, and the like.

LED素子110(発光素子)は、発光ダイオードの素子であり流れた電流に応じて発光する性質を有する。
このLED素子110は、光源L(n,m)に対応するようにLED基板100上に縦n個×横m個配置され、電源120に対して各列に備えられたm個のLED素子110は直列に接続されている。また各列は、電源120に対して並列に接続されている。そのため、電源120より所定の電圧が印加され、LED素子110に所定の電流が流れると、LED素子110が発光し、光源L(n,m)がそれぞれ対応するサブ表示領域を照光するようになっている。
The LED element 110 (light emitting element) is a light emitting diode element and has a property of emitting light in accordance with a flowing current.
The LED elements 110 are arranged in vertical n × horizontal m on the LED substrate 100 so as to correspond to the light source L (n, m), and m LED elements 110 provided in each row with respect to the power source 120. Are connected in series. Each column is connected to the power source 120 in parallel. Therefore, when a predetermined voltage is applied from the power source 120 and a predetermined current flows through the LED element 110, the LED element 110 emits light, and the light sources L (n, m) illuminate the corresponding sub display areas. ing.

電源120は、LED素子110に所定の電圧(電圧値V)を印加する電圧源である。なお、電圧値Vは通常数ボルト程度の値である。
基板端子140(第1端子)は、各列の両端部及び各列に配置されたLED素子110間に設けられた端子である。
The power source 120 is a voltage source that applies a predetermined voltage (voltage value V) to the LED element 110. The voltage value V is usually a value of about several volts.
The board terminal 140 (first terminal) is a terminal provided between both ends of each row and the LED elements 110 arranged in each row.

基板接続部130は、スルーホール130aを備えており、後述の検出器1の検出器接続部20を介して検出器1と接続する。
スルーホール130aは、LED基板100に設けられ、一端部が基板端子140と接続された孔部であり、後述の検出器接続部20のピン20aが挿入されることにより、検出器1との接続を可能にしている。
The substrate connection unit 130 includes a through hole 130a and is connected to the detector 1 via a detector connection unit 20 of the detector 1 described later.
The through hole 130a is a hole provided in the LED substrate 100, and one end thereof is connected to the substrate terminal 140, and is connected to the detector 1 by inserting a pin 20a of the detector connecting portion 20 described later. Is possible.

検出器1は、図2に示すように、抵抗部10と、検出器接続部20と、を備えて構成されており、検出器接続部20を介してLED基板100の各列との接続を行い(例えば、図2においては、任意の整数をi(1<i<n)として、LED基板100のi列目に位置するi列LED基板100iと接続を行い)、電源120より印加される電圧により抵抗部10に電流が流れ、LED素子110が発光するか否かによりi列LED基板100iに含まれる破損したLED素子110を検出出来る。   As shown in FIG. 2, the detector 1 includes a resistance unit 10 and a detector connection unit 20, and connects to each row of the LED substrate 100 via the detector connection unit 20. Is performed (for example, in FIG. 2, an arbitrary integer is set to i (1 <i <n) and connected to the i-th row LED board 100i located in the i-th row of the LED board 100), and is applied from the power source 120. A damaged LED element 110 included in the i-row LED substrate 100i can be detected based on whether or not the current flows through the resistance portion 10 due to the voltage and the LED element 110 emits light.

抵抗部10は、図2に示すように、i列LED基板100iのLED素子110の個数mと同数の抵抗Rを備えて構成されており、各抵抗Rは同じ抵抗値を有し、直列に接続されている。この各抵抗Rの抵抗値は電源120より印加される電圧(電圧値V)によって決定されるが、一般的に各LED素子110に流れる電流が10mA程度となると断線(オープン破壊)することが知られているため、この電流値を示すような抵抗値、つまり、R=(V/m)/(10*10−3)[Ω](通常、数十Ω〜数百キロΩ程度)に設定されている。 As shown in FIG. 2, the resistance unit 10 is configured to include the same number of resistors R as the number m of the LED elements 110 of the i-row LED substrate 100i, and each resistor R has the same resistance value and is connected in series. It is connected. The resistance value of each resistor R is determined by the voltage (voltage value V) applied from the power source 120. Generally, it is known that when the current flowing through each LED element 110 is about 10 mA, the wire breaks (open breakdown). Therefore, the resistance value indicating this current value, that is, R = (V / m) / (10 * 10 −3 ) [Ω] (usually about several tens of Ω to several hundreds of kiloΩ) is set. Has been.

検出器端子30(第2端子)は、抵抗部10の両端部及びそれぞれの抵抗R間に設けられた端子である。   The detector terminal 30 (second terminal) is a terminal provided between both ends of the resistor 10 and each resistor R.

検出器接続部20(接続部)は、ピン20aを備えており、i列LED基板100iの基板接続部130を介してi列LED基板100iと接続する。
ピン20aは、一端が検出器端子30と接続され、先端部の形状が、先端にいくにつれて細くなるように、例えば、略円錐形状に形成された導電性部材であり、ピン20aをスルーホール130aに挿入することにより、i列LED基板100iとの接続を可能にしている。
The detector connection unit 20 (connection unit) includes pins 20a and is connected to the i-row LED substrate 100i via the substrate connection portion 130 of the i-row LED substrate 100i.
The pin 20a is, for example, a conductive member formed in a substantially conical shape so that one end of the pin 20a is connected to the detector terminal 30 and the shape of the tip becomes narrower toward the tip. The pin 20a is connected to the through hole 130a. Is inserted into the i-line LED substrate 100i.

次に、破損発光素子検出システム1000による破損したLED素子の検出動作を説明する。
まず、検出を実行するLED基板100の所定の列(例えば、i列LED基板100i)を決定する。
次いで、その列のスルーホール130aに検出器1の検出器接続部20のピン20aを挿入し、検出器1とi列LED基板100iを接続する。
次いで、この接続された状態で、電源120より電圧値Vの電圧を印加すると、各抵抗Rによりi列LED基板100iに備えられたm個の各LED素子110に所定の電流が流れる。この際に、発光していないLED素子110を、ユーザが目視により確認することで、i列LED基板100iに備えられたLED素子110の中で、破損したLED素子110を検出することが出来る。
そして、上記検出を各列について(つまり、合計n回)実行することにより、LED基板100に備えられた全てのLED素子110の破損状態を検出することが出来る。
Next, the detection operation of the damaged LED element by the damaged light emitting element detection system 1000 will be described.
First, a predetermined row (for example, i row LED substrate 100i) of the LED substrate 100 that performs detection is determined.
Next, the pin 20a of the detector connecting portion 20 of the detector 1 is inserted into the through-hole 130a of the row, and the detector 1 and the i-row LED substrate 100i are connected.
Next, when a voltage having a voltage value V is applied from the power source 120 in this connected state, a predetermined current flows through each of the m LED elements 110 provided on the i-row LED substrate 100i by each resistor R. At this time, the user can visually check the LED elements 110 that are not emitting light, so that the damaged LED elements 110 can be detected among the LED elements 110 provided on the i-row LED substrate 100i.
Then, by executing the above detection for each column (that is, a total of n times), it is possible to detect the damaged state of all the LED elements 110 provided on the LED substrate 100.

「変形例1」
図3に示す破損発光素子検出システム1000aは、図2に示す破損発光素子検出システム1000の変形例であり、図2と相違する点は、i列LED基板100iの基板接続部130におけるスルーホール130aに換えて基板コネクタ131aが設けられ、検出器1のピン20aに換えて検出器コネクタ21aが設けられていることである。
以下では、主に、その相違点について説明する。
"Modification 1"
A damaged light emitting element detection system 1000a shown in FIG. 3 is a modification of the damaged light emitting element detection system 1000 shown in FIG. 2, and is different from FIG. 2 in that a through hole 130a in the board connecting portion 130 of the i-row LED board 100i. In this case, a board connector 131a is provided, and a detector connector 21a is provided instead of the pin 20a of the detector 1.
Below, the difference is mainly demonstrated.

基板コネクタ131a(第1コネクタ部)は、例えば、図3に示すように、一端が基板端子140に接続された導線の本数と等しい数の基板コネクタ端子131bを備え、当該導線を集約するとともに、後述の検出器コネクタ21aと着脱自在に構成されている。
基板コネクタ端子131bは、例えば、雌型のコネクタ端子であり、基板端子140に接続された導線の他端とそれぞれ接続されている。
For example, as shown in FIG. 3, the board connector 131a (first connector part) includes a number of board connector terminals 131b whose one end is equal to the number of conductors connected to the board terminal 140, and aggregates the conductors. It is configured to be detachable from a later-described detector connector 21a.
The board connector terminal 131 b is, for example, a female connector terminal, and is connected to the other end of the conducting wire connected to the board terminal 140.

検出器コネクタ21a(第2コネクタ部)は、例えば、図3に示すように、一端が検出器端子30に接続された導線の本数と等しい数の検出器コネクタ端子21bを備え、当該導線を集約するとともに、基板コネクタ131aと着脱自在に構成されている。
検出器コネクタ端子21bは、例えば、雄型のコネクタ端子であり、検出器端子30に接続された導線の他端とそれぞれ接続されている。
For example, as shown in FIG. 3, the detector connector 21 a (second connector portion) includes detector connector terminals 21 b whose one end is equal to the number of conductive wires connected to the detector terminal 30, and collects the conductive wires. In addition, it is configured to be detachable from the board connector 131a.
The detector connector terminal 21 b is, for example, a male connector terminal, and is connected to the other end of the conducting wire connected to the detector terminal 30.

したがって、変形例1の破損発光素子検出システム1000aによると、基板コネクタ131aに検出器コネクタ21aを接続することにより、検出器1とi列LED基板100iを容易に接続出来、破損したLED素子110の検出を実行することが可能となる。   Therefore, according to the damaged light emitting element detection system 1000a of the modified example 1, by connecting the detector connector 21a to the board connector 131a, the detector 1 and the i-row LED board 100i can be easily connected. Detection can be performed.

このように、本発明に係る破損発光素子検出システムによると、i列LED基板100iにおいて直列接続されたLED素子110の数と同数であるm個の抵抗Rを直列に接続した抵抗部10を備え、基板接続部130と検出器接続部20により、i列LED基板100iと接続可能になっている。
そのため、電源120より所定の電圧が印加されると、各抵抗Rによりi列LED基板100iに備えられた各LED素子110に所定の電流が流れるので、発光していないLED素子110を、ユーザが目視により確認することで、i列LED基板100iに備えられたLED素子110の中で、破損したLED素子110を検出することが出来る。そして、上記検出を各列について実行することにより、LED基板100に備えられた全てのLED素子110の破損状態を検出することが出来る。
また、本発明に係る破損発光素子検出システムによると、検出器1は、LEDバックライト200の内部に備えられたものではなく、検出器接続部20及び基板接続部130を介してLED基板100と接続するものに過ぎないので、接続部LED基板100やLEDバックライト200を大型化させることは無く、検出を行う度にLEDバックライト200に内部発熱などの負荷をもたらすこともない。
従って、本発明は、発光素子基板に配置された複数の発光素子のうち、何れの発光素子が破損しているかを迅速に判別でき、かつ、発光素子基板を備える装置に内部発熱などの負荷を及ぼさない破損発光素子検出システムであるといえる。
As described above, according to the damaged light emitting element detection system of the present invention, the resistance unit 10 including m resistors R, which are the same number as the LED elements 110 connected in series in the i-row LED substrate 100i, is provided in series. The board connection part 130 and the detector connection part 20 can be connected to the i-row LED board 100i.
Therefore, when a predetermined voltage is applied from the power source 120, a predetermined current flows through each LED element 110 provided in the i-row LED substrate 100i by each resistor R. By visually confirming, the damaged LED element 110 can be detected among the LED elements 110 provided on the i-row LED substrate 100i. Then, by executing the above detection for each column, it is possible to detect the damage state of all the LED elements 110 provided on the LED substrate 100.
In addition, according to the damaged light emitting element detection system according to the present invention, the detector 1 is not provided inside the LED backlight 200 but is connected to the LED substrate 100 via the detector connection unit 20 and the substrate connection unit 130. Since it is only what is connected, the connection part LED substrate 100 and the LED backlight 200 are not enlarged, and a load such as internal heat generation is not caused to the LED backlight 200 each time detection is performed.
Therefore, the present invention can quickly determine which light emitting element is damaged among the plurality of light emitting elements arranged on the light emitting element substrate, and applies a load such as internal heat generation to the apparatus including the light emitting element substrate. It can be said that this is a damaged light-emitting element detection system that does not reach.

また、基板接続部130にはスルーホール130aが備えられ、検出器接続部20にはスルーホール130aに挿入されるピン20aが備えられている。
つまり、ピン20aをスルーホール130aに挿入することにより、検出器1とi列LED基板100iは容易に接続可能となっている。
In addition, the board connecting portion 130 is provided with a through hole 130a, and the detector connecting portion 20 is provided with a pin 20a to be inserted into the through hole 130a.
That is, the detector 1 and the i-row LED substrate 100i can be easily connected by inserting the pin 20a into the through hole 130a.

また、変形例1の破損発光素子検出システム1000aによれば、検出器1側にはピン20aに換えて検出器コネクタ21aを設け、LED基板100側には基板接続部130におけるスルーホール130aに換えて基板コネクタ131aが設けられている。
つまり、検出器コネクタ21aと基板コネクタ131aとを着脱することにより、検出器1とi列LED基板100iは一層容易に接続可能となっている。
なお、本発明に係る破損発光素子検出システムは、上記した実施形態のものに限られない。
例えば、抵抗部10に備えられる抵抗の数は、LED基板の各列に設けられたLED素子の個数と同数としたが、それ以上であってもよい。
また、抵抗器は、複数列のLED素子を同時に測定可能な構成であってもよい。
Further, according to the broken light emitting element detection system 1000a of the first modification, the detector connector 21a is provided on the detector 1 side instead of the pin 20a, and the through hole 130a in the board connecting portion 130 is changed on the LED board 100 side. A board connector 131a is provided.
That is, by attaching / detaching the detector connector 21a and the board connector 131a, the detector 1 and the i-row LED board 100i can be more easily connected.
The damaged light emitting element detection system according to the present invention is not limited to the above-described embodiment.
For example, the number of resistors provided in the resistor unit 10 is the same as the number of LED elements provided in each row of the LED substrate, but may be more than that.
In addition, the resistor may be configured to be able to simultaneously measure a plurality of rows of LED elements.

本発明に係るLEDバックライト200及びその内部に配置されたLED基板100を示す概略構成図であり、(A)がLEDバックライト200を、(B)がLED基板100を示している。It is a schematic block diagram which shows the LED backlight 200 which concerns on this invention, and the LED board | substrate 100 arrange | positioned in the inside, (A) has shown the LED backlight 200, (B) has shown the LED board 100. FIG. 本発明を適用した破損発光素子検出システムの概略構成図である。It is a schematic block diagram of the damage light emitting element detection system to which this invention is applied. 図2における破損発光素子検出システムの変形例を示す図である。It is a figure which shows the modification of the damaged light emitting element detection system in FIG.

符号の説明Explanation of symbols

1 検出器
10 抵抗部
R 抵抗
20 検出器接続部(接続部)
20a ピン
30 検出器端子(第2端子)
100 LED基板(発光素子基板)
100i i列LED基板
110 LED素子
120 電源
130 基板接続部
140 基板端子(第1端子)
130a スルーホール
200 LEDバックライト
21a 検出器コネクタ(第2コネクタ部)
21b 検出器コネクタ端子
131a 基板コネクタ(第1コネクタ部)
131b 基板コネクタ端子
1000 破損発光素子検出システム
1000a 破損発光素子検出システム
1 detector 10 resistor portion R resistor 20 detector connection portion (connection portion)
20a pin 30 detector terminal (second terminal)
100 LED substrate (light emitting device substrate)
100i i row LED board 110 LED element 120 power supply 130 board connection part 140 board terminal (first terminal)
130a Through hole 200 LED backlight 21a Detector connector (second connector part)
21b Detector connector terminal 131a Substrate connector (first connector part)
131b Substrate connector terminal 1000 Damaged light emitting element detection system 1000a Damaged light emitting element detection system

Claims (4)

複数の発光素子を基板上に配置しそれぞれの発光素子を直列に接続して各列を構成し、前記各列の両端部及び前記各列に配置された発光素子間に第1端子を設け、前記各列を並列に接続した発光素子基板に対して、所定の電圧を印加して破損している発光素子を検出する検出器による破損発光素子検出システムにおいて、
前記検出器は、
前記各列に配置された発光素子の数と同数以上の抵抗を直列に接続した抵抗部と、
前記発光素子基板の前記各列に設けられた第1端子と、前記抵抗部の両端部及びそれぞれの抵抗間に設けられた第2端子と、を接続する接続部と、を備え、
前記接続部により、前記発光素子基板の所定の列の前記第1端子と、前記第2端子と、が接続された状態で、前記発光素子基板の所定の列に所定の電圧を印加させるように構成したことを特徴とする破損発光素子検出システム。
A plurality of light emitting elements are arranged on a substrate and each light emitting element is connected in series to form each row, and a first terminal is provided between both ends of each row and the light emitting devices arranged in each row, In the broken light emitting element detection system by a detector that detects a broken light emitting element by applying a predetermined voltage to the light emitting element substrates connected in parallel to each column,
The detector is
A resistance portion in which resistors equal to or more than the number of light emitting elements arranged in each row are connected in series;
A connection portion that connects a first terminal provided in each row of the light emitting element substrate and a second terminal provided between both ends of the resistor portion and each resistor;
A predetermined voltage is applied to the predetermined row of the light emitting element substrate in a state where the first terminal and the second terminal of the predetermined row of the light emitting element substrate are connected by the connecting portion. A damaged light emitting element detection system characterized by comprising.
請求項1に記載の破損発光素子検出システムにおいて、
前記発光素子基板は、前記第1端子と接続されるスルーホールを備え、
前記接続部は、各々の第2端子と接続され、前記スルーホールに挿入されるピンを備え、
前記スルーホールに前記ピンが挿入されることにより、前記第1端子と前記第2端子とが接続されることを特徴とする破損発光素子検出システム。
The damaged light emitting element detection system according to claim 1,
The light emitting element substrate includes a through hole connected to the first terminal,
The connecting portion includes a pin connected to each second terminal and inserted into the through hole,
A damaged light emitting element detection system, wherein the first terminal and the second terminal are connected by inserting the pin into the through hole.
請求項1に記載の破損発光素子検出システムにおいて、
前記発光素子基板は、
一端が前記第1端子と接続され、他端に基板コネクタ端子を備えるとともに当該他端が前記発光素子基板の各列ごとに集約されて配線された第1コネクタ部を備え、
前記接続部は、
一端が前記第2端子と接続され、他端に検出器コネクタ端子を備えるとともに当該他端が集約されて配線された第2コネクタ部を備え、
前記第1コネクタ部と前記第2コネクタ部とを接続することにより、前記第1端子と前記第2端子とが接続されることを特徴とする破損発光素子検出システム。
The damaged light emitting element detection system according to claim 1,
The light emitting element substrate is
One end is connected to the first terminal, the other end is provided with a substrate connector terminal, and the other end is provided with a first connector portion wired for each row of the light emitting element substrate,
The connecting portion is
One end is connected to the second terminal, the other end is provided with a detector connector terminal, and the other end is provided with a second connector portion wired together.
The damaged light emitting element detection system, wherein the first terminal and the second terminal are connected by connecting the first connector part and the second connector part.
複数のLED素子を基板上に配置しそれぞれのLED素子を直列に接続して各列を構成し、前記各列の両端部及び前記各列に配置されたLED素子間に第1端子を設け、前記各列を並列に接続したLED基板に対して、所定の電圧を印加して破損しているLED素子を検出する検出器による破損発光素子検出システムにおいて、
前記検出器は、
前記各列に配置されたLED素子の数と同数以上の抵抗を直列に接続した抵抗部と、
前記LED基板の前記各列に設けられた第1端子と、前記抵抗部の両端部及びそれぞれの抵抗間に設けられた第2端子と、を接続する接続部と、を備え、
前記接続部により、前記LED基板の所定の列の前記第1端子と、前記第2端子と、が接続された状態で、前記LED基板の所定の列に所定の電圧を印加させるように構成し、
前記LED基板は、前記第1端子と接続されるスルーホールを備え、
前記接続部は、各々の第2端子と接続され、前記スルーホールに挿入されるピンを備え、
前記スルーホールに前記ピンが挿入されることにより、前記第1端子と前記第2端子とが接続されることを特徴とする破損発光素子検出システム。
A plurality of LED elements are arranged on a substrate, and each LED element is connected in series to form each row, and a first terminal is provided between both ends of each row and the LED devices arranged in each row, In a broken light emitting element detection system by a detector that detects a broken LED element by applying a predetermined voltage to the LED substrates connected in parallel to each row,
The detector is
A resistance portion in which resistors equal to or more than the number of LED elements arranged in each row are connected in series;
A connection portion for connecting a first terminal provided in each row of the LED substrate and a second terminal provided between both ends of the resistor portion and the respective resistors;
The connecting portion is configured to apply a predetermined voltage to the predetermined row of the LED substrate in a state where the first terminal and the second terminal of the predetermined row of the LED substrate are connected. ,
The LED substrate includes a through hole connected to the first terminal,
The connecting portion includes a pin connected to each second terminal and inserted into the through hole,
A damaged light emitting element detection system, wherein the first terminal and the second terminal are connected by inserting the pin into the through hole.
JP2008269404A 2008-10-20 2008-10-20 Broken light emitting element detection system Pending JP2010098209A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008269404A JP2010098209A (en) 2008-10-20 2008-10-20 Broken light emitting element detection system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008269404A JP2010098209A (en) 2008-10-20 2008-10-20 Broken light emitting element detection system

Publications (1)

Publication Number Publication Date
JP2010098209A true JP2010098209A (en) 2010-04-30

Family

ID=42259673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008269404A Pending JP2010098209A (en) 2008-10-20 2008-10-20 Broken light emitting element detection system

Country Status (1)

Country Link
JP (1) JP2010098209A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102692592A (en) * 2011-03-22 2012-09-26 展晶科技(深圳)有限公司 Method for testing light emitting diode (LED) and LED sectional material used in method
KR101294893B1 (en) 2010-07-26 2013-08-08 파나소닉 주식회사 Power source unit for led lamps, and led lamp system
KR101296518B1 (en) 2010-08-24 2013-08-13 가시오게산키 가부시키가이샤 Semiconductor light source device, semiconductor light source control method, and projection apparatus
WO2014188749A1 (en) * 2013-05-22 2014-11-27 シャープ株式会社 Light source substrate, display apparatus, and light source substrate inspection method
JP2019047117A (en) * 2017-08-31 2019-03-22 日亜化学工業株式会社 Method for manufacturing light-emitting device and light-emitting device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101294893B1 (en) 2010-07-26 2013-08-08 파나소닉 주식회사 Power source unit for led lamps, and led lamp system
KR101296518B1 (en) 2010-08-24 2013-08-13 가시오게산키 가부시키가이샤 Semiconductor light source device, semiconductor light source control method, and projection apparatus
CN102692592A (en) * 2011-03-22 2012-09-26 展晶科技(深圳)有限公司 Method for testing light emitting diode (LED) and LED sectional material used in method
WO2014188749A1 (en) * 2013-05-22 2014-11-27 シャープ株式会社 Light source substrate, display apparatus, and light source substrate inspection method
US9693419B2 (en) 2013-05-22 2017-06-27 Sharp Kabushiki Kaisha Light source substrate, display apparatus, and light source substrate inspection method
JP2019047117A (en) * 2017-08-31 2019-03-22 日亜化学工業株式会社 Method for manufacturing light-emitting device and light-emitting device

Similar Documents

Publication Publication Date Title
EP2637031A1 (en) Led lighting device and cable connection detection device
KR19990083648A (en) Fault detection circuit of all-optical display device and display state detection method using same
US9151805B2 (en) Test machine and the test method for light emitting diode backlight driver, and, manufacturing method for monitor power board
CN101118713A (en) Display panel inspection apparatus and method
JP2010098209A (en) Broken light emitting element detection system
JP5499071B2 (en) Relay connector and light source module including the same
US20190059145A1 (en) Method for testing led backlight
JP2015510676A (en) LED lighting system
CN204593001U (en) A kind of LED lamp bar and LED lamp bar test macro
AU2018248766B2 (en) Power supply redundancy device for a display system
US20150192613A1 (en) Electrical connector
KR101578221B1 (en) backlight unit
TW201044164A (en) Test board
CN114364573A (en) Electrical connection assembly and method for a lighting module of a motor vehicle
JP2012079657A (en) Planar light source device and display device
US8988889B2 (en) Connection wire structure of direct light bar and connection method thereof
KR200446263Y1 (en) Cable tester
CN201281739Y (en) Test fixture for electronic equipment loop
KR101474740B1 (en) Device for testing connection between PC card and printed cricuit board
US20210057391A1 (en) Optoelectronic Circuit Assembly and Method for Repairing an Optoelectronic Circuit Assembly
JP2009236566A (en) Optical cable inspection apparatus, metal cable inspection apparatus, and optical metal composite cable inspection apparatus
JP2012074377A (en) Coding system for lighting assembly
CN217034212U (en) Series battery group wiring harness detection device
JP2013057581A (en) Evaluation substrate
CN106501664B (en) Detection equipment and detection system for electrical equipment