TWI588499B - Method and apparatus for testing light-emitting device - Google Patents
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Description
本發明係關於一種測試發光裝置之方法與設備。 The present invention relates to a method and apparatus for testing a light emitting device.
隨著發光二極體(LED)技術的發展,發光二極體的應用愈發廣泛。現今發光二極體的發光裝置通常包括一個以上的發光二極體。例如,常使用於顯示器、交通號誌、及燈具等等的高壓發光二極體(HVLED)、交流發光二極體(ACLED)、或是陣列等發光裝置即包含了複數個發光二極體。以高壓發光二極體為例,因單個發光二極體在低電壓下運作,串聯連接複數個發光二極體可形成高壓發光二極體。第1圖所示為一個高壓發光二極體。外部提供的交流電壓11經由轉換器12降低電壓並轉換為相對應的直流電壓。然後轉換後的直流電壓供給複數個發光二極體。如第1圖所示,為了形成高壓發光二極體,一發光二極體與另一發光二極體串聯。而後每一串聯單元與另一串聯單元並聯。此種聯結方式可以於晶粒端於單一晶粒上透過佈局(layout)方式形成複數個發光二極體,或是於封裝端於單個封裝體封入複數個發光二極體。然而,一些因製造流程或材質缺陷所造成的失效,例如局部漏電流或表面應力/損害所造成的光損失,在習知的電性測試中無法被檢測出。而對包含複數個發光二極體的發光二極體裝置來說,當以串聯及/或並聯連接時,如果只有少數發光二極體失效,以習知的電性測試亦很難被檢測出。此外,複數個發光二極體若其在應用端所重視的發光強度不一致,於習知的電性測試也無法偵測出。 With the development of light-emitting diode (LED) technology, the application of light-emitting diodes has become more widespread. Light-emitting devices of today's light-emitting diodes typically include more than one light-emitting diode. For example, a high-voltage light-emitting diode (HVLED), an alternating current light-emitting diode (ACLED), or an array of light-emitting devices, which are commonly used in displays, traffic signs, and lamps, etc., include a plurality of light-emitting diodes. Taking a high-voltage light-emitting diode as an example, a single light-emitting diode operates at a low voltage, and a plurality of light-emitting diodes are connected in series to form a high-voltage light-emitting diode. Figure 1 shows a high voltage LED. The externally supplied AC voltage 11 is reduced in voltage via the converter 12 and converted to a corresponding DC voltage. The converted DC voltage is then supplied to a plurality of light emitting diodes. As shown in FIG. 1, in order to form a high voltage light emitting diode, one light emitting diode is connected in series with another light emitting diode. Each series unit is then connected in parallel with another series unit. The bonding method can form a plurality of light emitting diodes through a layout on a single die, or enclose a plurality of light emitting diodes in a single package at the package end. However, some of the failures caused by manufacturing processes or material defects, such as local leakage current or surface stress/damage, cannot be detected in conventional electrical tests. For a light-emitting diode device including a plurality of light-emitting diodes, when connected in series and/or in parallel, if only a few light-emitting diodes fail, it is difficult to detect by conventional electrical tests. . In addition, if a plurality of light-emitting diodes have inconsistent luminous intensity at the application end, they cannot be detected by a conventional electrical test.
本發明揭露一種測試發光裝置之方法,包含步驟:提供一積分球,包含一進入口及一第一出口;擺置發光裝置接近積分球之進入口;提供一電流源,可驅動該發光裝置於驅動狀態下形成一影像;提供一影像接收裝置,可接收發光裝置之影像,其中影像接收裝置與積分球之第一出口連接;以及依據影像決定發光裝置之發光強度。本發明也揭露一種測試發光裝置之設備,包含:一積分球,包含一進入口及一第一出口,其中發光裝置接近於積分球之進入口;一影像接收裝置,與積分球之第一出口連接,並可接收發光裝置之影像;以及一處理單元,與影像接收裝置連接以確定發光裝置之發光強度。 The invention discloses a method for testing a light-emitting device, comprising the steps of: providing an integrating sphere comprising an inlet port and a first outlet; arranging the light-emitting device close to the inlet of the integrating sphere; providing a current source for driving the light-emitting device An image is formed in a driving state; an image receiving device is provided to receive an image of the light emitting device, wherein the image receiving device is connected to the first outlet of the integrating sphere; and the light emitting intensity of the light emitting device is determined according to the image. The invention also discloses an apparatus for testing a light-emitting device, comprising: an integrating sphere comprising an inlet port and a first outlet, wherein the light-emitting device is close to the inlet of the integrating sphere; an image receiving device, and the first outlet of the integrating sphere Connecting and receiving an image of the light emitting device; and a processing unit coupled to the image receiving device to determine the luminous intensity of the light emitting device.
11‧‧‧外部提供的交流電壓 11‧‧‧External AC voltage
12‧‧‧轉換器 12‧‧‧ converter
200‧‧‧設備 200‧‧‧ equipment
201、501‧‧‧待測物 201, 501‧‧‧Test objects
210、510‧‧‧電流源 210, 510‧‧‧ current source
220、520‧‧‧影像接收裝置 220, 520‧‧‧ image receiving device
221、521‧‧‧影像感應器 221, 521‧‧‧ image sensor
222‧‧‧接目鏡 222‧‧‧ Eyepiece
223‧‧‧濾鏡 223‧‧‧filter
230、530‧‧‧影像處理單元 230, 530‧‧‧Image Processing Unit
231、531‧‧‧比較單元 231, 531‧‧‧ comparison unit
240、540‧‧‧自動化設備 240, 540‧‧‧Automation equipment
511a、511b‧‧‧探針 511a, 511b‧‧ ‧ probe
550‧‧‧積分球 550‧‧ Score the ball
550e1‧‧‧第一出口 550e1‧‧‧ first exit
550e2‧‧‧第二出口 550e2‧‧‧ second exit
550i‧‧‧進入口 550i‧‧‧ entrance
551‧‧‧擋光板 551‧‧‧Light barrier
552‧‧‧光纖 552‧‧‧ fiber optic
560‧‧‧偵測器 560‧‧‧Detector
561、561’‧‧‧訊號處理器 561, 561'‧‧‧ signal processor
第1圖所示為習知高壓發光二極體之電路圖;第2圖所示為依據本發明一實施例之可測試包含複數個發光二極體之發光裝置之測試設備;第3圖所示為依據本發明一實施例以CCD截取發光裝置之實際影像;第4A圖所示為依據本發明另一實施例測試包含複數個發光二極體之發光裝置之方法;第4B圖所示為如第4A圖所述之依據本發明另一實施例測試包含複數個發光二極體之測試發光裝置之方法之步驟;第5圖所示為依據本發明另一實施例測試包含複數個發光二級體之發光裝置之測試設備。 1 is a circuit diagram of a conventional high-voltage light-emitting diode; and FIG. 2 is a test device capable of testing a light-emitting device including a plurality of light-emitting diodes according to an embodiment of the present invention; In order to capture an actual image of a light-emitting device by a CCD according to an embodiment of the present invention; FIG. 4A is a view showing a method of testing a light-emitting device including a plurality of light-emitting diodes according to another embodiment of the present invention; FIG. 4B is as shown in FIG. Figure 4A illustrates the steps of a method for testing a test light-emitting device comprising a plurality of light-emitting diodes in accordance with another embodiment of the present invention; and Figure 5 illustrates a test comprising a plurality of light-emitting levels in accordance with another embodiment of the present invention. Test equipment for the body of the light-emitting device.
本發明中待測之發光裝置包含複數個發光二極體。複數個發光二極體可以串聯、並聯、或串並聯連接。發光裝置可為多種形式。例如,待測發光裝置可以是晶粒形式(或晶圓形式)或封裝形式。以晶粒形式之發光 裝置而言,發光裝置可為一晶粒具有一發光二極體,或一晶粒具有整體一起形成之複數發光二極體。以晶圓形式之發光裝置而言,發光裝置為一晶圓有複數個發光二極體,而此晶圓後續可以切割分離方式,形成多數個包含一個或多個發光二極體之晶粒。以封裝形式之發光裝置而言,發光裝置可為一封裝體包含一個或多個彼此電性連接之晶粒,或可為多數個個別封裝之晶粒電性連接後形成發光裝置。 The light-emitting device to be tested in the present invention comprises a plurality of light-emitting diodes. A plurality of light emitting diodes may be connected in series, in parallel, or in series and in parallel. The illuminating device can take a variety of forms. For example, the light emitting device to be tested may be in the form of a die (or wafer) or a package. Luminescence in the form of grains In the device, the light-emitting device may have a light-emitting diode of a crystal grain, or a plurality of light-emitting diodes integrally formed by a single crystal grain. In the case of a light-emitting device in the form of a wafer, the light-emitting device has a plurality of light-emitting diodes on a wafer, and the wafer can be subsequently cut and separated to form a plurality of crystal grains including one or more light-emitting diodes. In the case of a packaged light-emitting device, the light-emitting device may comprise one or more die electrically connected to each other, or may be electrically connected to a plurality of individual packages to form a light-emitting device.
第2圖所示為依據本發明一實施例之可測試包含複數個發光二極體之發光裝置之測試設備。設備200包含有電流源210、影像接收裝置220、及影像處理單元230。待測之發光裝置(以下稱為待測物201)放置於影像接收裝置220下方,電流源210提供待測物201電流以驅動複數個發光二極體。每一個複數個發光二極體可於驅動狀態下發出光線。影像接收裝置220接收一待測物201於驅動狀態下之影像,影像處理單元230會依據影像接收裝置220接收到之影像確認每一發光二極體之發光強度。 2 is a test apparatus capable of testing a light-emitting device including a plurality of light-emitting diodes according to an embodiment of the present invention. The device 200 includes a current source 210, a video receiving device 220, and an image processing unit 230. The illuminating device to be tested (hereinafter referred to as the object to be tested 201) is placed under the image receiving device 220, and the current source 210 supplies the current of the object to be tested 201 to drive a plurality of illuminating diodes. Each of the plurality of light-emitting diodes emits light in a driving state. The image receiving device 220 receives an image of the object to be tested 201 in a driving state, and the image processing unit 230 confirms the luminous intensity of each of the light emitting diodes according to the image received by the image receiving device 220.
影像接收裝置220可包含一顯微鏡,於接收到待測物201之影像時可放大影像。影像接收裝置220更可以包含影像感應器221,像是電荷偶合裝置(CCD)或CMOS影像感應器,可擷取待測物201之影像。影像感應器221可與影像接收裝置220之接目鏡222並排放置,如此操作者可以眼睛透過影像接收裝置220之接目鏡222觀察影像,以及/或同時由影像感應器221擷取影像,影像之訊號被傳送至影像處理單元230作進一步處理或確認。當操作者以眼睛透過影像接收裝置220之接目鏡222觀察到影像時,操作者可確認發光二極體之發光強度。當影像感應器221擷取到影像時,影像訊號被傳送到影像處理器230。經過影像處理單元230進一步處理,例如 以影像處理單元230進行類比數位轉換(ADC),可得到每一發光二極體代表發光強度之灰階值以決定每一發光二極體之發光強度。灰階值通常為一階層數字且為2n。一般來說,256(=28)階通常用來表示灰階。設備200更包含比較單元231,可比較每一發光二極體以之灰階值表示之發光強度與預先決定之發光強度,以決定發光二極體是否有缺陷。其中預先決定之發光強度可以某些統計資料,如良好的發光二極體其由灰階值所表示的發光強度之平均值來預先確認。影像接收裝置220更包含了濾鏡(filter)223,可濾掉光線中特定範圍之波長。當缺陷的發光二極體之發光強度與良好的發光二極體之發光強度之差異很微小或無法辨別時,使用濾鏡223濾除光線特定範圍之波長,可使偵測的發光二極體之發光強度與良好的發光二極體之發光強度之差異變大而利於辨別。濾鏡223可置於待測物201與影像接收裝置220之間,或是介於影像接收裝置220、影像感應器221與接目鏡222之間。此外,影像處理單元230與比較單元231可一同組裝於像是電腦的自動化設備240中。再者,電流源210可以組合於同一個自動化設備240中,故影像處理單元230、比較單元231與電流源210可透過如電腦程式來控制或協調以進行操作。 The image receiving device 220 can include a microscope that can magnify the image when receiving the image of the object to be tested 201. The image receiving device 220 further includes an image sensor 221, such as a charge coupled device (CCD) or a CMOS image sensor, for capturing an image of the object to be tested 201. The image sensor 221 can be placed side by side with the eyepiece 222 of the image receiving device 220, so that the operator can view the image through the eyepiece 222 of the image receiving device 220, and/or simultaneously capture the image by the image sensor 221, and the image signal It is transmitted to the image processing unit 230 for further processing or confirmation. When the operator observes the image through the eyepiece 222 of the image receiving device 220, the operator can confirm the luminous intensity of the light-emitting diode. When the image sensor 221 captures the image, the image signal is transmitted to the image processor 230. After the image processing unit 230 performs further processing, for example, the image processing unit 230 performs analog-to-digital conversion (ADC), and the gray scale value of the luminous intensity of each of the light-emitting diodes is obtained to determine the luminous intensity of each of the light-emitting diodes. The grayscale value is usually a hierarchical number and is 2 n . In general, 256 (= 2 8 ) orders are usually used to represent gray scales. The device 200 further includes a comparing unit 231, which can compare the luminous intensity represented by the grayscale value of each of the light emitting diodes with a predetermined luminous intensity to determine whether the light emitting diode is defective. The predetermined illuminance can be pre-confirmed by certain statistics, such as the average of the illuminance of the good LED, which is represented by the gray scale value. The image receiving device 220 further includes a filter 223 that filters out a specific range of wavelengths in the light. When the difference between the illuminating intensity of the defective illuminating diode and the illuminating intensity of the good illuminating diode is small or indistinguishable, the filter 223 is used to filter out the wavelength of the specific range of the light, so that the detected illuminating diode can be detected. The difference between the luminous intensity and the luminous intensity of a good light-emitting diode is large to facilitate discrimination. The filter 223 can be placed between the object to be tested 201 and the image receiving device 220 or between the image receiving device 220, the image sensor 221 and the eyepiece 222. In addition, the image processing unit 230 and the comparison unit 231 can be assembled together in an automation device 240 such as a computer. Moreover, the current source 210 can be combined in the same automation device 240, so the image processing unit 230, the comparison unit 231, and the current source 210 can be controlled or coordinated by a computer program to operate.
電流源210提供一電流至待測物201,以驅動複數個發光二極體,且提供的電流大小可為一恆定值或變動值。每一複數個發光二極體可於驅動狀態下發光。第3圖所示為待測物201為發光裝置時,影像感應器221截取之實際影像。在這個例子中,待測物201包含16個發光二極體,擺置為兩行,每一行有8個發光二極體。這16個發光二極體全部為串聯連接。在一實施例中,電流源210供給之電流大小隨著時間由較小值增為較 大值,例如,從1mA到15mA。如圖中所示,當供給電流增加時,每一發光二極體之發光強度變大。需注意的是,左行中由底部數來第二個(以橢圓標示)發光二極體之發光強度相較於其它發光二極體之發光強度較弱,尤其當電流大約為6mA至11mA時。這顯示了較暗的發光二極體因為漏電流而為有缺陷的發光二極體。然而,當電流大於11mA,像是12mA至15mA,有缺陷的發光二極體之發光強度與其它發光二極體之發光強度的差異則並未明顯至足以區分。這是因為局部漏電流導致。當供給電流增加,漏電流與操作電流亦增加,但漏電流的增加率較操作電流的增加率小。舉例來說,當供給電流夠大,電流從12mA至15mA,漏電流僅佔操作電流一小比例,因此有缺陷的發光二極體與其他發光二極體之發光強度的差異變小且不易辨別。在以上的實施例中,足以辨別出有缺陷發光二極體之電流約為6mA至10mA。以10mA為例,如果待測物201之面積約為1mm2,此發光裝置中之每一發光二極體之電流密度約為160mA/mm2(即10mA/(1mm2/16))。對大多數發光二極體來說,電流密度小於或等於約300mA/mm2時即已小至足以區分出有缺陷的發光二極體。在其他實施例中,電流可大致為一恆定值,且電流密度係小於或等於約300mA/mm2,足以篩選出缺陷。在習知電性測試中,供給發光裝置之電流通常為發光二極體之操作電流,且漏電流通常不會被檢測出。此外,即使在習知電性測試中將供給至發光裝置之供給電流設定為小電流使每一發光二極體之電流密度小於操作電流密度,因為漏電流通常發生在局部區域不會導致斷路,因此一般仍不易測出如漏電流等缺陷。對比之下,有了每一發光二極體之發光強度之影像,漏電流便容易被檢測出來。 The current source 210 provides a current to the object to be tested 201 to drive a plurality of light emitting diodes, and the magnitude of the current supplied may be a constant value or a variable value. Each of the plurality of light emitting diodes can emit light in a driving state. FIG. 3 is a view showing an actual image taken by the image sensor 221 when the object 201 is a light-emitting device. In this example, the object to be tested 201 includes 16 light-emitting diodes arranged in two rows, each row having eight light-emitting diodes. These 16 light-emitting diodes are all connected in series. In one embodiment, the magnitude of the current supplied by current source 210 increases from a small value to a larger value over time, for example, from 1 mA to 15 mA. As shown in the figure, as the supply current increases, the luminous intensity of each of the light-emitting diodes becomes large. It should be noted that the second (indicated by ellipse) light-emitting diode in the left row has a lower luminous intensity than other LEDs, especially when the current is about 6 mA to 11 mA. . This shows that the darker light-emitting diode is a defective light-emitting diode due to leakage current. However, when the current is greater than 11 mA, such as 12 mA to 15 mA, the difference between the luminous intensity of the defective light-emitting diode and the luminous intensity of the other light-emitting diodes is not sufficiently distinguishable. This is due to local leakage current. When the supply current increases, the leakage current and the operating current also increase, but the rate of increase of the leakage current is smaller than the rate of increase of the operating current. For example, when the supply current is large enough, the current is from 12 mA to 15 mA, and the leakage current is only a small proportion of the operating current, so the difference between the luminous intensity of the defective light-emitting diode and the other light-emitting diodes becomes small and difficult to distinguish. . In the above embodiments, the current sufficient to discern the defective light-emitting diode is about 6 mA to 10 mA. Taking 10 mA as an example, if the area of the object to be tested 201 is about 1 mm 2 , the current density of each of the light-emitting diodes in the light-emitting device is about 160 mA/mm 2 (that is, 10 mA/(1 mm 2 /16)). For most light-emitting diodes, a current density of less than or equal to about 300 mA/mm 2 is small enough to distinguish between defective light-emitting diodes. In other embodiments, the current can be substantially a constant value and the current density is less than or equal to about 300 mA/mm 2 sufficient to screen for defects. In the conventional electrical test, the current supplied to the light-emitting device is usually the operating current of the light-emitting diode, and the leakage current is usually not detected. In addition, even in the conventional electrical test, the supply current supplied to the light-emitting device is set to a small current so that the current density of each of the light-emitting diodes is smaller than the operating current density, because the leakage current usually occurs in a local region without causing an open circuit. Therefore, defects such as leakage current are generally not easily detected. In contrast, with the image of the luminous intensity of each of the light-emitting diodes, the leakage current is easily detected.
第4A圖所示為依據本發明另一實施例測試包含複數個發光二極體之發光裝置之方法。待測之發光裝置包含複數個發光二極體,如上所述所說明。 Figure 4A is a diagram showing a method of testing a light-emitting device comprising a plurality of light-emitting diodes in accordance with another embodiment of the present invention. The illuminating device to be tested comprises a plurality of illuminating diodes as described above.
此方法可經由如前述之設備進行。此方法包含:提供一電流以驅動複數個發光二極體(步驟401);提供一影像接收裝置(步驟402);影像接收裝置接收一發光裝置於驅動狀態下之影像(步驟403);依據影像決定每一發光二極體之發光強度(步驟404)。在步驟401中,電流供給至發光裝置以驅動複數個發光二極體,其中電流大小可為一恆定值或變動值。每一複數個發光二極體可於驅動狀態下發出光線。在一實施例中,供給電流為一變動值,且電流隨著時間增加。在其他可選擇的實施例中,電流為一恆定值,電流隨著時間增加。前述兩實施例中,每一發光二極體之電流密度小於或等於約300mA/mm2。 This method can be carried out via a device as described above. The method includes: providing a current to drive a plurality of light emitting diodes (step 401); providing an image receiving device (step 402); the image receiving device receiving an image of the light emitting device in a driving state (step 403); The luminous intensity of each of the light-emitting diodes is determined (step 404). In step 401, a current is supplied to the light emitting device to drive a plurality of light emitting diodes, wherein the current magnitude may be a constant value or a varying value. Each of the plurality of light-emitting diodes emits light in a driving state. In one embodiment, the supply current is a varying value and the current increases over time. In other alternative embodiments, the current is a constant value and the current increases with time. In the foregoing two embodiments, the current density of each of the light emitting diodes is less than or equal to about 300 mA/mm 2 .
在步驟402中,影像處理裝置可以為一顯微鏡,更可以包含一可濾掉光線特定波長範圍之濾鏡。在步驟403中,影像接收裝置可接收發光裝置於驅動狀態下之影像。在步驟404中,發光裝置中每一發光二極體之發光強度可依據影像由例如操作者自影像接收裝置之接目鏡以眼睛觀察來決定。在一實施例中,影像接收裝置更包含一影像感應器,像是CCD或CMOS影像感應器,可擷取發光裝置之影像。影像感應器可以與影像接收裝置之接目鏡並排,如此一來影像感應器可以同時擷取影像,且影像之訊號被傳送至一影像處理器,以作進一步處理或決定。亦即,影像處理單元可以組合於自動化設備中,像是個人電腦,且在步驟404中,依據影像決定每一發光二極體之發光強度也以自動化設備進行。經過影像處理單元進一步處理影像,例如類比數位轉換(ADC),可以得到代表每一發光二極體發光強度之灰階值以決定每一發光二極體之發光強度。以自動化設備實施此方法,易於提供隨時間由小增大具變化值之電流給發光裝置,以確認發光強度。此方法容易以由具有包含迴圈電腦程式之自動化設備操作,因在不同的迴圈可執行控制電流具有不同的電流值。 In step 402, the image processing device may be a microscope, and may further include a filter that filters out a specific wavelength range of the light. In step 403, the image receiving device can receive the image of the light emitting device in the driving state. In step 404, the intensity of illumination of each of the light-emitting diodes in the illumination device can be determined by eye observation, for example, by an operator from an eyepiece of the image receiving device. In an embodiment, the image receiving device further includes an image sensor, such as a CCD or CMOS image sensor, for capturing an image of the light emitting device. The image sensor can be arranged side by side with the eyepiece of the image receiving device, so that the image sensor can capture the image at the same time, and the image signal is transmitted to an image processor for further processing or decision. That is, the image processing unit can be combined in an automated device, such as a personal computer, and in step 404, the illumination intensity of each of the light-emitting diodes is determined based on the image and is also performed by an automated device. The image processing unit further processes the image, such as an analog digital conversion (ADC), to obtain a gray scale value representative of the luminous intensity of each of the light emitting diodes to determine the luminous intensity of each of the light emitting diodes. By implementing this method with an automated device, it is easy to provide a current with a varying value from a small increase over time to confirm the luminous intensity. This method is easy to operate with an automated device that has a computer program that includes loops, since the control currents can have different current values at different loops.
如第4B圖所示,此方法可包含其他步驟。舉例來說,每一發光二極體之灰階值可以選擇性地運用來產生強度分佈圖,以顯示每一發 光二極體之位置與相對應的發光強度,如步驟405所示。強度分佈圖亦可以由電腦螢幕輸出使操作者得以比較以灰階值顯示出之發光強度與與預先決定之發光強度,發光二極體是否為一有缺陷之發光二極體,如步驟406中所示。或是另一可選擇性的方法為,在步驟406中,自動化設備更包含一比較單元,可比較每一發光二極體表示發光強度之灰階值與預先決定之灰階值,以決定一發光二極體是否為一有缺陷之發光二極體。預先決定之發光強度可以由如良好發光二極體其以灰階值顯示發光強度之平均值等統計資料蒐集而得。 As shown in Figure 4B, this method can include additional steps. For example, the grayscale value of each light-emitting diode can be selectively applied to generate an intensity profile to display each hair The position of the photodiode and the corresponding luminous intensity are as shown in step 405. The intensity map can also be output by the computer screen to enable the operator to compare the luminous intensity displayed by the grayscale value with the predetermined luminous intensity, and whether the LED is a defective LED, as in step 406. Shown. Alternatively, in another optional method, in step 406, the automation device further includes a comparing unit, and comparing each of the light-emitting diodes with a grayscale value indicating a luminous intensity and a predetermined grayscale value to determine a Whether the light-emitting diode is a defective light-emitting diode. The predetermined luminous intensity can be obtained by collecting statistics such as the average value of the luminous intensity displayed by the gray scale value of the good light emitting diode.
然後,此方法可以進一步包含步驟407,將有缺陷之發光二極體之數量與一預先決定之數量比較以確認是否合格。舉例來說,一般在一發光裝置中有一個或兩個缺陷的發光二極體是可以被接受的。在此情形下,預先決定的數量係設定為3。同樣地,步驟407可由操作者或以自動化設備運用電腦程式進行。當發光裝置在晶圓形式時,整個晶圓可以被裝載以檢測。檢測過後,此方法更包含一可供選擇的步驟408以產生驗證狀態圖,以顯示晶圓受測試之區域與相對應的驗證狀態,其中驗證狀態包含合格與不合格狀態。 The method can then further include the step 407 of comparing the number of defective light-emitting diodes with a predetermined amount to confirm compliance. For example, a light-emitting diode having one or two defects in a light-emitting device is generally acceptable. In this case, the predetermined number is set to 3. Similarly, step 407 can be performed by an operator or by using a computer program with an automated device. When the light emitting device is in the form of a wafer, the entire wafer can be loaded for inspection. After the test, the method further includes an optional step 408 to generate a verification state map to display the area under test of the wafer and the corresponding verification status, wherein the verification status includes a pass and fail status.
此方法進一步包含步驟409,用來標示不合格之發光裝置。當發光強度於步驟404、步驟406及步驟407中由自動化設備自動進行確認,操作者可由影像接收裝置之接目鏡以目視進行再確認的程序。再確認程序也可與自動化設備偵測時同時進行,當自動化設備偵測出不合格之發光裝置時,自動化設備會發出警示並中止運作,等待操作者的指示,或者待整個晶圓完成偵測時,再進行再確認。同樣地,在步驟406中,當自動化設備(比較單元)進行比較程序時,缺陷之發光二極體被檢測出,操作者可如上所述進行再確認程序。此外,在步驟405中產生之強度分佈圖及在步驟408中產生之驗證狀態圖可以儲存於自動化設備中,以作為未來品質控制或工程分析使用。此外,一般應用上常考量複數個發光二極體發光強度之均勻性,但於習知電性測試無法測量出,而此方法可以得到此資料。步驟405中產生之強度分佈圖清楚顯示出每一發光二極體位置與其以灰階值表示之相對應發光強度,根據此資料可計算出均勻性並加以監控。 The method further includes a step 409 for indicating a failed illumination device. When the luminous intensity is automatically confirmed by the automation device in steps 404, 406, and 407, the operator can visually reconfirm the program by the eyepiece of the image receiving device. The reconfirmation procedure can also be performed simultaneously with the detection of the automated device. When the automated device detects an unqualified illumination device, the automation device will issue a warning and suspend operation, wait for the operator's instruction, or wait for the entire wafer to complete the detection. Then, confirm again. Similarly, in step 406, when the automation device (comparison unit) performs the comparison procedure, the defective light-emitting diode is detected, and the operator can perform the re-confirmation procedure as described above. Additionally, the intensity profile generated in step 405 and the verification state map generated in step 408 can be stored in an automated device for use in future quality control or engineering analysis. In addition, the uniformity of the luminous intensity of a plurality of light-emitting diodes is generally considered in general applications, but can not be measured by conventional electrical tests, and this method can obtain this data. The intensity profile generated in step 405 clearly shows the position of each of the light-emitting diodes and its corresponding luminous intensity expressed in grayscale values, from which uniformity can be calculated and monitored.
第5圖所示為依據本發明另一實施例測試包含複數個發光二級體之發光裝置之測試設備,須注意第5圖中一些元件大致與第2圖元件相同。第5圖與第2圖相同之相對應元件標示為相同元件編號,但第一碼由2變為5。舉例來說,第5圖中之元件510為一與第2圖中電流源210相對應之電流源。此設備包含了電流源510、影像接收裝置520、影像處理單元530及一積分球550。積分球550包含一進入口550i;一第一出口550e1及一第二出口550e2。待測之發光裝置(以下稱為待測物501)置於積分球550之進入口550i附近,且待測物501放射出之光線進入積分球550並被其所蒐集。影像接收裝置520與積分球550之第一出口550e1連接,用以接收當待測物501被電流源510驅動時之待測物501之影像。如圖中所示,電流源510透過探針(probe)511a與511b與待測物501之電極接觸以提供一電流至待測物501。如第2圖所說明,影像接收裝置520可包含一顯微鏡用以放大待測物501之影像。影像接收裝置520可進一步與一影像感應器521連接,像是電荷偶合裝置(CCD)或一CMOS影像感應器,以擷取待測物501之影像。影像之訊號被傳送至影像處理單元530,以更進一步處理或決定。經過影像處理單元530進一步處理後,例如數位類比轉換(ADC),可取得一待測物501之影像之灰階值以表示並決定待測物501之發光強度。此設備更包含一比較單元531,藉以將由灰階值表示之待測物501之發光強度與預先決定之發光強度做比較,以決定待測物501是否為一具缺陷之發光二極體。舉例來說,預先決定之發光強度可以經由例如多個良好發光二極體其以灰階值之發光強度之平均值等統計資料而預先決定。如第2圖所示,影像接收裝置520更包含一濾鏡(圖未示),用來濾除待測物501所發射出之某些特定範圍波長之光線。濾鏡可以設置在積分球550之第一出氣口550e1之上方或下方,或介於影像接收裝置520與影像感應器521之間。進一步地,在某些實施例中,影像處理單元530以及比較單元531連同偵測器560(後面將予以說明)之訊號處理器561’可一起組合於例如電腦之自動化設備540中。此外,電流源510也可以被組合於此同一自動化設備540中,以使影像處理單元530、比較單元531與電流源510得透過例如一電腦程式來加以控制及協調以進行操作。 Figure 5 is a diagram showing a test apparatus for testing a light-emitting device comprising a plurality of light-emitting diodes in accordance with another embodiment of the present invention. It should be noted that some of the elements in Figure 5 are substantially identical to those of Figure 2. The corresponding elements in Fig. 5 and Fig. 2 are denoted by the same component number, but the first code is changed from 2 to 5. For example, element 510 in FIG. 5 is a current source corresponding to current source 210 in FIG. The device includes a current source 510, an image receiving device 520, an image processing unit 530, and an integrating sphere 550. The integrating sphere 550 includes an inlet port 550i; a first outlet 550e1 and a second outlet 550e2. The light-emitting device to be tested (hereinafter referred to as the object to be tested 501) is placed near the entrance port 550i of the integrating sphere 550, and the light emitted from the object to be tested 501 enters and is collected by the integrating sphere 550. The image receiving device 520 is connected to the first outlet 550e1 of the integrating sphere 550 for receiving an image of the object to be tested 501 when the object to be tested 501 is driven by the current source 510. As shown in the figure, the current source 510 is in contact with the electrodes of the object to be tested 501 through probes 511a and 511b to provide a current to the object to be tested 501. As illustrated in FIG. 2, the image receiving device 520 can include a microscope for magnifying the image of the object 501 to be tested. The image receiving device 520 can be further connected to an image sensor 521, such as a charge coupled device (CCD) or a CMOS image sensor, to capture an image of the object to be tested 501. The image signal is transmitted to image processing unit 530 for further processing or decision. After further processing by the image processing unit 530, for example, a digital analog conversion (ADC), a grayscale value of an image of the object 501 can be obtained to represent and determine the luminous intensity of the object 501. The device further includes a comparing unit 531 for comparing the luminous intensity of the object 501 represented by the grayscale value with a predetermined luminous intensity to determine whether the object to be tested 501 is a defective LED. For example, the predetermined luminous intensity can be determined in advance by, for example, a plurality of good light-emitting diodes, such as an average value of the luminous intensity of the grayscale value. As shown in FIG. 2, the image receiving device 520 further includes a filter (not shown) for filtering out light of a certain range of wavelengths emitted by the object 501. The filter may be disposed above or below the first air outlet 550e1 of the integrating sphere 550 or between the image receiving device 520 and the image sensor 521. Further, in some embodiments, the image processing unit 530 and the comparison unit 531 together with the signal processor 561' of the detector 560 (described later) can be combined together in an automation device 540 such as a computer. In addition, the current source 510 can also be combined in the same automation device 540 to enable the image processing unit 530, the comparison unit 531, and the current source 510 to be controlled and coordinated for operation by, for example, a computer program.
由待測物501發射出之光線入射在積分球550之內表面上之一點,且於多次散射反射後均勻分布到其他全部的點上。藉由此特性,偵測器560可被連接到積分球550之第二出口550e2以測量待測物501之光學特性。擋光板(baffle)551可以用來避免進入積分球550之光線直接照射於第二出口550e2上。換句話說,擋光板551可用來避免光線直接照射在偵測器560上。在這個實施例中,偵測器560透過光纖552與積分球550之第二出口550e2連接。舉例來說,偵測器560可為一光度計、一幅射計、一分光輻射計或一色度計。光度計可測量人類眼睛感知之光線之能量。輻射計為一可測量光線能量之裝置。分光輻射計為一可測量當能量表示為波長之函數時,每波長間隔之能量之裝置。色度計可測量且量化光線之顏色。偵測器560更包含一訊號處理器561,可用來計算或進一步處理偵測器560偵測到之訊號。以色度計為例,色度計為由三個或四個經濾光的偵測元件之所組成。這些偵測元件用來模擬、及CIE函數。來自這些偵測元件之訊號被訊號處理器561所使用以計算色度座標-x與y。如圖中顯示及如上所述,在某些實施例中,在偵測器560內部之訊號處理器561可設置或組合於自動化設備540內,例如訊號處理器561’所示。 The light emitted from the object to be tested 501 is incident on one point on the inner surface of the integrating sphere 550, and is evenly distributed to all other points after multiple scattering reflections. With this feature, the detector 560 can be coupled to the second outlet 550e2 of the integrating sphere 550 to measure the optical characteristics of the object 501 to be tested. A baffle 551 can be used to prevent light entering the integrating sphere 550 from directly illuminating the second outlet 550e2. In other words, the light barrier 551 can be used to prevent light from directly illuminating the detector 560. In this embodiment, detector 560 is coupled to second outlet 550e2 of integrating sphere 550 via fiber 552. For example, the detector 560 can be a photometer, a radiometer, a spectroradiometer, or a colorimeter. The photometer measures the energy of the light perceived by the human eye. A radiometer is a device that measures the energy of light. A spectroradiometer is a device that measures the energy per wavelength interval as the energy is expressed as a function of wavelength. The colorimeter measures and quantifies the color of the light. The detector 560 further includes a signal processor 561 for calculating or further processing the signal detected by the detector 560. Taking a colorimeter as an example, the colorimeter consists of three or four filtered detection elements. These detection components are used to simulate , and CIE function. Signals from these detection elements are used by signal processor 561 to calculate chromaticity coordinates -x and y. As shown in the figure and as described above, in some embodiments, the signal processor 561 internal to the detector 560 can be arranged or combined within the automation device 540, such as the signal processor 561'.
須注意的是雖然待測物501於圖中顯示為一具有一發光二極體之單一晶粒,待測物501可以多種形式呈現。舉例來說,待測物501可為晶粒形式(晶圓形式)或封裝形式。以晶粒形式的待測物501來說,待測物501也可以為單一晶粒具有整體一起形成之複數發光二極體。也須注意的是,藉由上述之設備,接收待測物501之影像與測量待測物501之光學特性係可大致同時進行。也就是說,當待測物501放置接近於積分球550之進入口550i時,由待測物501發射出之光線進入積分球550,且影像接收裝置520接收待測物501之影像。同時,積分球550蒐集由待測物501發射出之光線且均勻分布於積分球550內部表面上所有點,以使連接積分球550之第二出口550e2之偵測器560得用以測量待測物501之光學特性。如此一來,運用本實施例之設備來決定待測物501缺陷與否及測量待測物501之光學特性之測試得以大致同時完成。 It should be noted that although the object to be tested 501 is shown as a single crystal having a light-emitting diode in the figure, the object to be tested 501 can be presented in various forms. For example, the object to be tested 501 may be in the form of a crystal (in the form of a wafer) or a package. In the case of the object 501 in the form of a crystal grain, the object to be tested 501 may also be a plurality of light-emitting diodes in which a single crystal grain is integrally formed. It should also be noted that, by the above apparatus, the optical characteristics of the image to be tested 501 and the measurement object 501 can be performed substantially simultaneously. That is, when the object to be tested 501 is placed close to the inlet port 550i of the integrating sphere 550, the light emitted by the object to be tested 501 enters the integrating sphere 550, and the image receiving device 520 receives the image of the object to be tested 501. At the same time, the integrating sphere 550 collects the light emitted by the object 501 and uniformly distributes all the points on the inner surface of the integrating sphere 550, so that the detector 560 connected to the second outlet 550e2 of the integrating sphere 550 is used to measure the measured Optical properties of object 501. As a result, the test for determining the defect of the object to be tested 501 and the optical characteristic of the object to be tested 501 by using the apparatus of the embodiment can be completed substantially simultaneously.
本發明所列舉之各實施例僅用以說明本發明,並非用以限制 本發明之範圍。任何人對本發明所作之任何顯而易知之修飾或變更皆不脫離本發明之精神與範圍。 The embodiments of the invention are merely illustrative of the invention and are not intended to be limiting The scope of the invention. Any changes or modifications of the present invention to those skilled in the art will be made without departing from the spirit and scope of the invention.
200‧‧‧設備 200‧‧‧ equipment
201‧‧‧待測物 201‧‧‧Test object
210‧‧‧電流源 210‧‧‧current source
220‧‧‧影像接收裝置 220‧‧‧Image receiving device
221‧‧‧影像感應器 221‧‧‧Image sensor
222‧‧‧接目鏡 222‧‧‧ Eyepiece
223‧‧‧濾鏡 223‧‧‧filter
230‧‧‧影像處理單元 230‧‧‧Image Processing Unit
231‧‧‧比較單元 231‧‧‧Comparative unit
240‧‧‧自動化設備 240‧‧‧Automation equipment
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