JPWO2013150732A1 - ESD test inspection apparatus and ESD test inspection method - Google Patents

Abstract

An ESD test inspection is quickly and accurately performed in a high voltage conformance inspection and a high voltage energization inspection of an ESD test. An ESD test apparatus for performing an ESD application test for inspecting ESD resistance of one or a plurality of devices to be inspected as an ESD test inspection apparatus, and for diagnosing the suitability of an ESD applied voltage waveform And a diagnostic circuit 5. The diagnostic circuit 5 is a series circuit of a variable resistor 2 and a voltage dividing resistor 3 connected between the high voltage output terminals (probes 11) of the ESD test apparatus 10 and a light emission connected between both ends of the voltage dividing resistor 3. It has LED 4 for light emission check as a means.

Description

  In the present invention, for example, a high voltage is applied from a high voltage application device that inspects ESD (electrostatic discharge) resistance to an inspection target device such as a light emitting element such as an LSI element, an LED element, or a laser element. The present invention relates to an ESD test inspection apparatus for diagnosing whether or not a predetermined high voltage from a high voltage application apparatus conforms to a specified value, and an ESD test inspection method using the same.

  Conventionally, in an LSI element, a protection diode is connected to the input circuit side, and the ESD resistance of the protection diode is inspected. In light emitting elements such as LED elements and laser elements, the light emitting elements themselves have a diode structure. Since this diode structure is composed of a pn junction of a p-type diffusion layer and an n-type diffusion layer, the ESD resistance differs depending on the quality of the p-type diffusion layer and the n-type diffusion layer. Need to be inspected.

  The basic ESD circuit required for conventional ESD application is a high-voltage power supply and a high-voltage capacitor that uses ESD standards (HBM (Human Body Model), MM (Machine Model), etc.), applied resistance, and mercury. Consists of relays.

  The applied output portion of the ESD circuit energizes the device to be inspected by using a probe card in which a contact probe for connecting to the terminal of the device is fixedly mounted on the substrate, or a manipulator in which this contact probe is fixed to the arm. It is like that.

  The magnitude of the supply voltage to the device to be inspected is intended for a typical ESD test (electrostatic discharge reliability test) or the like in the reliability inspection, and is intended for a high voltage of about 1 to 10 KV level. This test is for durability when static electricity from a human body or machine flows to a device to be inspected such as an LSI chip.

  FIG. 10 is a circuit diagram showing a configuration example of a main part of a conventional ESD test apparatus disclosed in Patent Document 1.

  In FIG. 10, in the conventional ESD test apparatus 100, first, the charging high-voltage relay 102 is turned on by the timing controller 107 and the current from the high-voltage power supply 101 is accumulated in the high-voltage capacitor 106. Next, the charging high-voltage relay 103 is turned on after the charging high-voltage relay 102 is turned off by the timing controller 107, whereby the high voltage accumulated in the high-voltage capacitor 106 passes through the application resistor 104 from the high-voltage relay 103. It is applied to one terminal of the device 105 to be inspected.

  In this way, the high-voltage relays 102 and 103 for charging are turned on / off by the timing controller 107 to charge or discharge the high-voltage capacitor 106 and apply a predetermined high voltage to the device 105 to be inspected. Can do. The switching operation of the charging high-voltage relays 102 and 103 is performed by the timing controller 107 at a specified timing. In the ESD test, several types of application models and standards are defined for each, and the conformity is determined by the current waveform (or voltage waveform) applied to the device 105 to be inspected.

  FIG. 11 is a diagram showing a state in which it is inspected whether the applied current waveform from the ESD test apparatus of FIG. 10 is correct.

  As shown in FIG. 11, the capacitor 106 is charged or discharged by the switching operation of the high breakdown voltage relays 102 and 103, whereby a predetermined high voltage current waveform is applied to the inspection target device 105 indicated by the dotted line portion via the contact probe. Apply. At this time, the current waveform (or voltage waveform) of the high voltage passing through the contact probe is observed with an oscilloscope in addition to the magnitude of the current value and the convergence time thereof.

  In the ESD test, a standard is defined for each ESD application model, and suitability of an applied current waveform (or voltage waveform) is determined based on observation of an oscilloscope.

JP 2000-329818 A

  In the above-mentioned conventional ESD test inspection method, in order to ensure product shipment quality and continue production, the high voltage waveform standard for each of the above several types of ESD application models must be satisfied as the operation of the ESD test apparatus. It is necessary to check regularly. In addition, as a previous step, it is necessary to diagnose whether a high voltage waveform is applied to the device to be inspected and energized. However, it takes a lot of time to determine the conformity of the standard for each ESD application model by observing an oscilloscope, and as the number of inspections increases, the accuracy of the ESD test inspection also becomes problematic.

  The present inventor proposed in JP 2011-100230, filed last year, that a large number of batch processing is performed in the ESD test of a large number of devices to be inspected in the ESD test, but a plurality of ESD circuits for batch processing of a large number of devices. When the high voltage conformance inspection and the high voltage energization inspection of the conventional ESD test are performed by current probe observation with an oscilloscope for each circuit, it takes a very long inspection time as the number of batch processing increases. It had the problem of end.

  The present invention solves the above-described conventional problems, and an ESD test inspection apparatus capable of quickly and accurately performing an ESD test inspection in a high voltage conformance inspection and a high voltage energization inspection of an ESD test, and an ESD using the same The purpose is to provide a test inspection method.

  In the ESD test and inspection apparatus of the present invention, a diagnostic means is connected between each high-voltage output terminal of an ESD test apparatus that collectively applies ESD resistance to one or a plurality of devices to be inspected, and the diagnostic means It is possible to diagnose whether or not each high voltage is applied from the ESD test apparatus or whether each high voltage conforms to a specified high voltage value, thereby achieving the above object.

  Preferably, the diagnosis by the diagnosis means in the ESD test and inspection apparatus of the present invention is performed based on whether or not the light emission means emits light.

  Further preferably, the light emitting means in the ESD test and inspection apparatus of the present invention is an LED for light emission check.

  Further preferably, the light emission color of the light emission check LED in the ESD test inspection apparatus of the present invention is green.

  Further preferably, the diagnostic means in the ESD test and inspection apparatus according to the present invention includes a series circuit of a variable resistor and a voltage dividing resistor connected between the high voltage output terminals of the ESD test apparatus, and between the both ends of the voltage dividing resistor. And a light emitting means connected in the forward direction.

  Further preferably, the diagnostic means in the ESD test / inspection apparatus of the present invention includes a light emitting means connected between the high voltage output terminals of the ESD test apparatus.

  Further preferably, the diagnosis by the diagnostic means in the ESD test and inspection apparatus of the present invention is performed by detecting the presence or absence of light emission of the light emitting means as the diagnostic means or when the high voltage applied to the diagnostic means exceeds a predetermined threshold voltage. Detecting means for detecting whether or not

  Further preferably, the light emission threshold voltage of the light emitting means in the ESD test / inspection apparatus of the present invention is the voltage across the voltage dividing resistor when a prescribed high voltage of the ESD test apparatus is applied to the voltage across the series circuit. It is.

  Further preferably, the light emitting means in the ESD test and inspection apparatus of the present invention is a light emitting element having a light emission response characteristic of 100 nsec or less.

  Further preferably, the light emitting means in the ESD test / inspection apparatus of the present invention emits light by each high voltage from the ESD test apparatus.

  Further preferably, the light emitting means in the ESD test and inspection apparatus of the present invention is connected to one of a plurality of voltage dividing resistors including a variable resistor.

  Furthermore, it is preferable that a high voltage power supply in the ESD test apparatus and one or a plurality of ESD circuits for outputting other high voltages are used in the ESD test inspection apparatus of the present invention, and the diagnostic means or the light emission is provided for each ESD circuit. Means are connected.

  Further, preferably, at the time of diagnosis in the ESD test and inspection apparatus of the present invention, the light emission of the light emitting means is made continuous by repeating the high voltage discharge cycle for a predetermined period so that the light emission is visualized by an afterimage effect.

  Further, preferably, the high voltage discharge cycle in the ESD test and inspection apparatus of the present invention is set according to the charging capability of the high voltage power supply.

  More preferably, the high voltage discharge cycle in the ESD test and inspection apparatus of the present invention is 30 msec.

  Furthermore, preferably, when there are a large number of ESD circuits in the ESD test and inspection apparatus of the present invention, a large number of at least the light emitting means are arranged on the circuit board.

  Furthermore, it is preferable that one connection means of the circuit board in the ESD test and inspection apparatus of the present invention and the other connection means connected between the high voltage output terminals of the ESD circuit are connected, and the light emission is performed for each ESD circuit. Means are connected.

  Furthermore, it preferably has an ESD controller for controlling the high voltage output period from the ESD circuit in the ESD test and inspection apparatus of the present invention in the ESD test and ESD test and inspection modes.

  The ESD test inspection method according to the present invention includes an ESD test apparatus in which diagnosis means connected between the high voltage output terminals of the ESD test apparatus applies to one or a plurality of inspection target devices to collectively check the ESD resistance. The above-described object is achieved by having a diagnostic step that makes it possible to diagnose whether each high voltage is applied or whether each high voltage conforms to a specified high voltage value.

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, a diagnostic means is connected between each high voltage output terminal of an ESD test apparatus that collectively applies ESD resistance to one or a plurality of devices to be inspected, and the ESD test apparatus uses the diagnostic means. It is possible to diagnose whether each high voltage is applied or whether each high voltage conforms to a specified high voltage value. Diagnosis by the diagnostic means is performed based on whether or not the light emitting means emits light.

  As a result, each high voltage energization or voltage level diagnosis from the ESD test apparatus is performed by using the diagnostic means, for example, based on the presence or absence of light emission of the light emitting means. Inspection can be performed quickly and accurately.

  As described above, according to the present invention, each high voltage energization or voltage level diagnosis from the ESD test apparatus is performed using, for example, the presence or absence of light emission of the light emitting means using the diagnostic means. The ESD test inspection can be performed quickly and accurately in the voltage conduction inspection.

It is a circuit diagram which shows the unit structural example which connected the diagnostic circuit to the ESD test apparatus as an ESD test inspection apparatus in Embodiment 1 of this invention. It is a circuit diagram which shows the structural example at the time of using the ESD test apparatus which has eight ESD circuits in the ESD test inspection apparatus of FIG. It is a circuit diagram which shows the structural example of the ESD test apparatus which has eight ESD circuits. It is a perspective view which shows typically the enlarged image of the contact state to the device in the ESD test apparatus of FIG. It is a perspective view which shows typically the example of a structure image at the time of ESD application in the ESD test apparatus of FIG. (A) is a perspective view which shows an ESD substrate box, (b) is a wave form diagram of an ESD applied voltage waveform. FIG. 3 is a block diagram showing a wafer map and probing management mainly using a personal computer PC. It is a top view of the diagnostic circuit board by which 36 diagnostic circuits of FIG. 1 were arrange | positioned on the circuit board. It is a side view for demonstrating the connection method of the diagnostic circuit board of FIG. 8, and a probe card. It is a circuit diagram which shows the principal part structural example of the conventional ESD test apparatus currently disclosed by patent document 1. FIG. It is a figure which shows a mode that it is test | inspected whether the applied current waveform from the ESD test apparatus of FIG. 10 is correct.

1, 1A ESD test conformity inspection device 2 Variable resistance 3 Dividing resistance 4 LED for light emission check
DESCRIPTION OF SYMBOLS 5 Diagnostic circuit 6 Diagnostic circuit board 6a Circuit board 7 Resistance arrangement area 8a Convex pin socket 8b Concave pin socket 10, 10A ESD test apparatus 11 Probe 12 High voltage power supply 13, 14, 18 High voltage relay 15 Applied resistance 16 High voltage capacitor 17 ESD Controller 19 Device to be inspected 21 ESD board box 21a Wiring output part 23 Wiring 19a, 19b
24 connector 22, 22A probe card 20 semiconductor wafer 30 wafer stage 31 prober 32 personal computer

  Embodiment 1 of an ESD test inspection apparatus and an ESD test inspection method using the same according to the present invention will be described below in detail with reference to the drawings. In addition, each thickness, length, etc. of the structural member in each figure are not limited to the structure to illustrate from a viewpoint on drawing preparation.

(Embodiment 1)
FIG. 1 is a circuit diagram showing a unit configuration example in which a diagnostic circuit is connected to an ESD test apparatus as an ESD test inspection apparatus according to Embodiment 1 of the present invention.

  In FIG. 1, the ESD test / inspection apparatus 1 according to the first embodiment applies each high voltage from an ESD test apparatus 10 that applies to one or a plurality of devices to be inspected and collectively inspects ESD resistance, or Diagnostic means for diagnosing whether the high voltage conforms to a specified high voltage value.

  In the ESD test inspection method of the first embodiment, whether or not each high voltage is applied from the ESD test apparatus 10 in which the diagnostic unit applies each to one or a plurality of devices to be inspected to collectively check the ESD resistance or whether each high voltage is applied. A diagnostic step of diagnosing whether the voltage conforms to a prescribed high voltage value;

  The ESD test inspection apparatus 1 of the first embodiment is for diagnosing the suitability of an ESD test voltage waveform and an ESD test apparatus 10 for performing an ESD application test for inspecting the ESD resistance of one or a plurality of devices to be inspected. And a diagnostic circuit 5 as a diagnostic means.

  The diagnostic circuit 5 is a series circuit of a variable resistor 2 and a voltage dividing resistor 3 connected between the high voltage output terminals (probes 11) of the ESD test apparatus 10 and a light emission connected between both ends of the voltage dividing resistor 3. It has LED 4 for light emission check as a means. The light emission check LED 4 is connected to one of a plurality of voltage dividing resistors including the variable resistor 2. Therefore, the light emission check LEDs 4 may be connected to both ends of the variable resistor 2, or when there are two voltage dividing resistors 3 in addition to the variable resistor 2, the light emitting check LEDs 4 are connected to both ends of the one voltage dividing resistor 3. A light emission check LED 4 may be connected.

  Alternatively, as a diagnostic means for diagnosing whether or not each high voltage from the ESD test apparatus 10 has been applied, the light emission connected between the high voltage output terminals (probe 11) without passing through the voltage dividing resistor as the energization confirmation. You may have LED4 for the light emission check as a means.

  Here, the case where the diagnostic circuit 5 or the light emission check LED 4 is connected between the high voltage output terminals (probes 11) of one ESD circuit other than the high voltage power supply 12 described later is shown as a unit configuration example. A plurality of ESD circuits may exist in parallel with one high voltage power supply 12, and in this case, the diagnostic circuit 5 is provided between high voltage output terminals (probes 11) of one or a plurality of ESD circuits. Or what is necessary is just to connect LED4 for light emission check.

  In the ESD test apparatus 10, one terminal of the high voltage power supply 12 is connected to one end of the application resistor 15 through the high voltage relays 13 and 14. The other end of the applied resistor 15 is connected to one terminal of a device to be inspected via one probe 11. The other probe 11 is connected to the other terminal of the high voltage power supply 12. The connection point of these high voltage relays 13 and 14 is connected to the connection point between the other probe 11 connected through the high voltage capacitor 16 and the other terminal of the high voltage power supply 12, and this connection point is grounded. . An ESD controller 17 for controlling on / off of these high voltage relays 13 and 14 is provided. A power source for driving these high voltage relays 13 and 14 is required separately.

  Here, the ESD circuit connected to the high-voltage power supply 12 includes high-voltage relays 13 and 14, an application resistor 15, a high-voltage capacitor 16, and a high-voltage output terminal (a pair of probes 11). The prescribed ESD applied high voltage (high voltage waveform) needs to reach the pair of probes 11 under the same circuit conditions including the line length. During the ESD test, the pair of probes 11 contacts both terminals of the inspection target device to inspect the resistance of the inspection target device. On the other hand, at the time of conformity inspection of the ESD test, the diagnostic circuit 5 is connected in place of the inspection target device in a state where the pair of probes 11 are not in contact with the pair of probes 11 and the pair of probes 11 are opened. Perform ESD test conformity inspection.

  With the above configuration, in the ESD test inspection using the ESD test apparatus 10, the charging high-voltage relay 13 is first turned on by the ESD controller 17 and the current from the high-voltage power supply 12 is accumulated in the high-voltage capacitor 16. At this time, the discharge high-voltage relay 14 is turned off by the ESD controller 17.

  Next, after the high-voltage relay 13 for charging is turned off by the ESD controller 17, control is performed so that the high-voltage relay 14 for discharge is turned on. As a result, the high voltage accumulated in the high voltage capacitor 16 is applied from the high voltage relay 14 to the one probe 11 through the application resistor 15.

  This high voltage is applied to a series circuit composed of a variable resistor 2 and a voltage dividing resistor 3. A predetermined voltage is generated between both ends of the voltage dividing resistor 3 and the predetermined voltage is applied to the light emission check LED 4. If this predetermined voltage exceeds the light emission threshold value (about 0.7 V to 5.0 V) of the light emission check LED 4, the predetermined voltage causes the light emission check LED 4 to emit light. In short, if the light emission threshold voltage Vth of the light emission check LED 4 is a voltage across both ends of the voltage dividing resistor when a prescribed high voltage of the ESD test device is applied to a voltage across the series circuit, a prescribed high voltage of the ESD test device is obtained. When a voltage equal to or higher than the voltage is applied, the light emission check LED 4 emits light when the light emission threshold voltage exceeds the light emission threshold voltage. By this light emission, it can be diagnosed that a high voltage level having a voltage waveform conforming to the standard is applied between the probes 11 to be connected to the device to be inspected.

  Regarding the setting of the resistance values of the variable resistor 2 and the voltage dividing resistor 3 in the diagnostic circuit 5, the voltage dividing resistance ratio is set so that the light emission check LED 4 is applied with the light emission threshold voltage Vth limit voltage. Thus, the voltage is set so that light can be emitted when a voltage equal to or higher than the predetermined light emission threshold voltage Vth is applied to the light emission check LED 4. Therefore, when the light emission check LED 4 emits light, a voltage equal to or higher than a predetermined light emission threshold voltage Vth is applied to the light emission check LED 4, and therefore, both ends of the series circuit of the variable resistor 2 and the voltage dividing resistor 3. A high voltage waveform of a predetermined applied voltage level or higher is applied to. If only energization is confirmed, the light emission check LED 4 may be directly connected between the probes 11 without using a voltage dividing resistor.

  The high voltage relays 13 and 14 for charging are controlled to be turned on / off by the ESD controller 17 to charge or discharge the high voltage capacitor 16 so that a predetermined high voltage can be applied between the probes 11. The switching operation of the charging high-voltage relays 13 and 14 is performed by the ESD controller 17 at a prescribed timing. In the ESD test, several types of application models and standards are defined for each, and the conformity is determined by the current waveform (or voltage waveform) applied from the probe 11 to the device to be inspected. Here, it is possible to diagnose whether or not a high voltage level having a voltage waveform conforming to the regulations has been applied based on whether or not the light emission check LED 4 emits light.

  Further, whether or not each high voltage from the ESD test apparatus 10 has been applied can be diagnosed based on whether or not the light emission check LED 4 connected between the pair of probes 11 emits light.

  The ESD test conformity inspection apparatus 1 according to the first embodiment uses the high voltage power supply 12 of the ESD test apparatus 10 and other ESD circuits, and includes a variable resistor 2 and a voltage dividing resistor 3 for each ESD circuit. The diagnostic circuit 5 of the conformity inspection having the series circuit and the light emission check LED 4 is connected, the check mode is started by the ESD controller 17, and one or a plurality of ESD circuits are batched according to the presence or absence of light emission of the check LED 4. The circuit operation and the applied voltage level (the magnitude of the voltage value or current value) can be examined to diagnose whether the specified applied voltage level is met. Similarly, the diagnosis of whether or not each high voltage from the ESD test apparatus 10 is applied can be diagnosed by the presence or absence of light emission of the light emission check LED 4 directly connected between the pair of probes 11.

  In this case, at the time of the ESD test inspection (check mode), the diagnostic means using the normal ESD application test apparatus 10 is in an open state in which the probe 11 to which the high voltage of the ESD test apparatus 10 is applied is not connected to the inspection target device. An ESD high voltage is applied to. The difference between the check mode and the actual application mode is that no inspection target device is connected between the probes 11. In short, as will be described later, the control signal from a prober or a control PC (personal computer) is received, and the high voltage relays 13 and 14 for charging are SW controlled via the ESD controller 17 in synchronization with the system. A voltage waveform can be applied between each probe 11.

  At the time of ESD circuit diagnosis in the check mode, the ESD controller 17 self-oscillates in a shortest possible period, for example, 30 msec period (in the actual application mode of the ESD application test) according to the charging capability of the high voltage power supply 12 to the high voltage capacitor 16. The charging high-voltage relays 13 and 14 are repeatedly turned ON / OFF for a predetermined period (about 2 to 3 seconds) at 120 msec or more). In this way, by shortening the discharge cycle, it is possible to easily visualize the light emission of the light emission check LED 4 that is difficult to see with a single shot by the afterimage effect. Without using a predetermined measuring instrument for detecting the presence or absence of light emission, the presence or absence of light emission of the check LED 4 can be accurately checked in a short time by visual observation.

  The LED 4 for light emission check is connected in the forward direction with respect to the ESD application polarity. The reason why the light emission check LED 4 is used as a light emission check element is that the light emission response is fast, the weak current sensitivity is good, the size is small, the luminance is high, and the voltage resistance is high.

  The light emission response in this case will be described. In the case of a light bulb (incandescent light bulb), it is said that it takes about 0.15 to 0.25 seconds from when the switch is turned on until normal brightness is obtained. In the case of a fluorescent tube, it takes 1 to 2 seconds later. In the case of HID, it is slower and it takes several minutes until stable light emission. However, in the case of an LED, it shines brightly as soon as an electric current is applied, and when the electric current is stopped, it becomes darker in an instant and has excellent light emission response. The response speed of the LED element alone is said to be 50 to 100 nsec. Therefore, as the light emission check LED 4, an element having a fast light emission response characteristic of 100 nsec or less is selected. More preferably, the light emission check LED 4 has a faster light emission response characteristic, and may be 50 to 75 nsec.

The charge amount (current amount) applied from the ESD circuit to the device to be inspected via the probe 11 is determined by the applied voltage, and the higher the applied voltage, the easier the light emission confirmation for diagnosis. For example, although electric charge discharge continues for a period of several hundreds nsec at HBM standard 1000V and several hundreds nsec at 2000V, it takes a discharge time longer than the light emission response speed of the LED. it can. Further, as a means for facilitating the confirmation of light emission by human eyes, the ESD controller 17 has been described as a check mode in addition to the normal actual application mode, but the light emission of the light emission check LED 4 can be easily visualized by the afterimage effect. In addition, the application operation may be repeatedly performed with a short period, for example, a period of 30 msec. In short, during the ESD circuit diagnosis, the light emission of the LED 4 for light emission check is made continuous by repeating the discharge cycle of the ESD high voltage for a predetermined period so that the light emission is visualized by the afterimage effect.

  Moreover, the tolerance with respect to the high voltage application to LED is demonstrated. In actual use, there is no problem with the durability of the LED, but there is no problem even if a forward voltage Vf of 1000 V or higher is actually applied to the LED operating voltage. The reason is that the charge amount (current amount) applied from the ESD circuit to the device to be inspected via the probe 11 is limited to a specified amount, and the charge discharge time (current conduction time) is several hundreds nsec. And the amount of heat generated, which is a cause of destruction, is very small.

  Incidentally, the forward voltage Vf is 2.1-2.6V for the red LED, the forward voltage Vf is 3.3-3.9V for the green LED, the forward voltage Vf is 3.2-4.0V for the blue LED, In the white LED, the forward voltage Vf is 3.1-4.0V. It is advantageous in terms of visibility to use a high-sensitivity green LED as the light emission check LED 4.

  In FIG. 1, a variable resistor 2 and a voltage dividing resistor are used for each ESD circuit using the high voltage power supply 12 of the ESD test apparatus 10 and one or a plurality of other ESD circuits as the ESD test inspection apparatus 1. The case where the diagnostic circuit 5 for conformity inspection having the serial circuit 3 and the light emission check LED 4 is connected or the case where the light emission check LED 4 is directly connected in the forward direction for each ESD circuit will be described. Although the case where one or a plurality of ESD circuits are collectively diagnosed based on the presence or absence of light emission of the light emission check LED 4 has been described, FIG. 2 specifically shows one high voltage power supply 12 and A case will be described in which eight ESD circuits connected in parallel to each other are used to perform an ESD test using eight collective ESD applications.

  FIG. 2 is a circuit diagram showing a configuration example in the case where an ESD test apparatus having eight ESD circuits is used in the ESD test conformity inspection apparatus of FIG. FIG. 3 is a circuit diagram showing a configuration example of an ESD test apparatus having eight ESD circuits.

  In FIG. 2, the ESD test and inspection apparatus 1 </ b> A according to the first embodiment collects a high voltage power source 2 that outputs a predetermined high voltage and a predetermined high voltage from the high voltage power source 2 to a plurality of pairs of probes 11. A plurality of (eight in this case) ESD circuits are applied simultaneously, and a diagnostic circuit 5 is connected to each pair of probes 11 so that a predetermined high voltage level is checked for the presence or absence of light emission of the light emission check LED 4. To do.

  This ESD circuit connects a plurality of high voltage capacitors 16 as high voltage capacity means for storing a predetermined high voltage from the high voltage power supply 12 and the predetermined high voltage from the high voltage power supply 12 to the high voltage capacitor 16 side. Alternatively, a high withstand voltage relay 18 as a plurality of switching means for switching so as to connect a predetermined high voltage from the high voltage capacitor 16 to the high voltage output unit side, and each predetermined high voltage from the plurality of high voltage capacitors 16 with a high withstand voltage. The relay 18 has a plurality of pairs (eight pairs) of high-voltage output units that simultaneously output to the plurality of pairs of probes 11 through the applied resistors 15. Further, eight ESD circuits reaching the probe 11 through the application resistor 15 are arranged in parallel independently.

  The diagnostic circuit 5 is connected to each pair of probes 11 of the high voltage output unit. A plurality of (eight in this case) diagnosis circuits 5 are used to check whether the high voltage waveform level applied in a batch conforms to the specified level or whether the high voltage is energized via the probe 11. Diagnosis is made by the presence or absence of light emission of the LED 4 for use.

  In the ESD test apparatus 10A, one terminal of the high-voltage power supply 12 is connected to each electrode of a plurality of (here, eight) high-voltage capacitors 16 via each contact of a high-voltage relay 18 having multiple contacts (here, eight contacts). The other electrodes of the plurality (eight in this case) of the high-voltage capacitors 16 are connected to the other terminal of the high-voltage power supply 12 and grounded. Each one electrode of the plurality (eight in this case) of the high-voltage capacitors 16 is passed through each of the applied resistors 15 from each of the contacts of the multi-contact (here, eight contacts) high-voltage relay 3, and the probe of the high-voltage output section. 11 to the diagnostic circuit 5 respectively.

  The ESD test apparatus 10A includes a high voltage power supply 12 and eight ESD circuits in parallel, and a diagnostic circuit 5 is connected to each ESD circuit to configure the ESD test inspection apparatus 1A of the first embodiment. At the time of the ESD test, instead of connecting each diagnostic circuit 5 between a plurality of pairs of probes 11 of the ESD test apparatus 10A, each of the plurality of pairs of probes 11 of the ESD test apparatus 10A is connected to each other as shown in FIG. An ESD test is performed by connecting each device 19 to be inspected.

  One terminal of each device 19 to be inspected is connected to each independent ESD circuit from the probe 11 of the high voltage output unit to the applied resistor 15, the high voltage relay 18, and one terminal of the high voltage capacitor 16. The other terminal of each device 19 to be inspected is connected to the other terminal of the high-voltage capacitor 16 from the probe 11 of the GND voltage output section and grounded. Although not shown here, the above-described ESD controller 17 for controlling simultaneous connection switching of the multi-contact (here, 8 contacts) high-voltage relay 18 at a predetermined timing is provided.

  The high-voltage power supply 12 is selected and used in accordance with the capacity of the number of high-voltage capacitors 16 to be collectively processed.

  The high-voltage relay 18 is a mercury relay that has directionality in installation, and may be eight contacts here, but may be two four-contacts or four two-contacts. . Instead of the eight-contact high-voltage relay 3, eight one-contact high-voltage relays 3 may be provided. The high-voltage relay 18 has eight contacts with the high-voltage capacitor 16 by an ESD controller 17 (not shown) at the same time between the high-voltage power source 12 side and the device under test 19 or the diagnostic circuit 5 side, with the high-voltage capacitor 16 side as the center. Switch. The control signal to the high withstand voltage relay 18 is single simultaneous control with respect to the independent high-voltage collective application of the high voltage from the eight high voltage capacitors 16 to the eight devices 19 or the diagnostic circuit 5. If the high breakdown voltage relays 18 are stacked, the high voltage relay 18 is a component that operates by a coil magnetic field, which may cause a malfunction.

  Here, eight high-voltage capacitors 16 are used, and those having tolerances suitable for the test voltage are selected. In selecting the capacity, those determined for each test model so as to meet the ESD test standard are selected. Select. For example, 100 pF for the HBM standard and 200 pF for the MM standard.

  Eight applied resistors 15 are used here, for example, 1.5 KΩ for the HBM standard and 0 KΩ (no resistance) for the MM standard. These high-voltage capacitors 16 and applied resistors 15 are mounted in a state where the number of devices 19 or diagnostic circuits 5 to be collectively processed is electrically independent.

  The device 19 is, for example, a light emitting element such as an LSI element, an LED element, or a laser element.

  With the above configuration, first, eight contacts of the high-voltage relay 18 are turned on to the high-voltage power supply 12 side by the ESD controller 17 (not shown), branching from the high-voltage power supply 12 to eight, and current flows into each high-voltage capacitor 16. Thus, the high voltage of the high voltage power source 12 is uniformly accumulated. At this time, the eight contacts on the device 6 side of the high-voltage relay 18 are turned off by the ESD controller 17.

  Next, after the eight contacts on the high-voltage power supply 12 side of the high-voltage relay 18 are turned off by the ESD controller 17, control is performed so that the eight contacts on the diagnostic circuit 5 side of the high-voltage relay 18 are turned on. The As a result, the high voltage accumulated in the high voltage capacitor 16 is applied to the diagnostic circuit 5 from the eight contacts of the high voltage relay 18 through the probes 11 through the applied resistors 15. In this case, each high-voltage capacitor 16 and the diagnosis circuit 5 have a one-to-one correspondence, and a clear and accurate diagnosis of the ESD applied voltage level can be performed greatly efficiently. Note that if only energization confirmation is performed, it is possible to directly confirm the energization by checking whether or not the light emission check LED 4 emits light by directly connecting the light emission check LEDs 4 between the probes 11 without using a voltage dividing resistor.

  In this way, the eight contacts of these high voltage relays 18 are switched from the high voltage power supply 12 side to the diagnostic circuit 5 side by the ESD controller 17, and the eight high voltage capacitors 16 are charged or discharged, thereby providing a diagnostic circuit. 5, a predetermined clear and accurate high voltage can be applied from each of the eight high voltage capacitors 16 from the probes 11 of each high voltage output unit. The switching operation of the eight contacts of the high withstand voltage relay 18 is simultaneously performed by the ESD controller 17 at a specified timing. In the ESD test, several types of application models and standards are defined for each, and the light emission check of the diagnostic circuit 5 is performed based on the ESD current waveform (or ESD voltage waveform) applied to each device 6 to be inspected. Diagnosis is quickly made by the presence or absence of the LED 4 for use.

  FIG. 4 is a perspective view schematically showing an enlarged image of a contact state to the device 19 in the ESD test apparatus 10A of FIG. FIG. 5 is a perspective view schematically showing an example of a configuration image when ESD is applied in the ESD test apparatus 10A of FIG.

  4 and 5, in the ESD test apparatus 10A of FIG. 3, one high-voltage power supply 12, an eight-contact high-voltage relay 18, eight high-voltage capacitors 16, eight application resistors 15, and other additions. An ESD board (not shown) on which a circuit is mounted is housed in a housing for safety, and eight series circuits (eight ESD circuits) extending from the high-voltage capacitor 16 to the applied resistor 15 through the contact of the high-voltage relay 18. 8) of the ESD board box 21 for 8 channels having the wiring output part 21a, and each wiring 23 from the wiring output part 21a of the ESD board box 21 through the connector 24 provided on the upper surface, the 8 of each probe 11 on the lower surface side. Eight sets of a pair of probes 11 are provided to protrude from the lower surface so as to correspond to the two terminals 19a and 19b of each device 19 in a one-to-one correspondence. Each of the terminals 19a and 19b of each of the eight devices 19 to be inspected provided in a matrix on the semiconductor wafer 20 on the wafer stage 30 and the high-voltage capacitors 16 respectively. Eight sets of probes 11 are arranged so as to correspond one-to-one.

  As shown in FIG. 4, the ESD applied voltage waveform changes as the wiring length from the ESD board in the ESD board box 21 to the probe card 22 changes. Therefore, the wiring lengths from the high voltage capacitor 16 to the terminals 19a and 19b of the device 19 are all the same, and the ESD voltage waveforms applied to the terminals 19 and 19b of the device 19 or the diagnostic circuit 5 are the same. The ESD substrate may have a socket part for component replacement.

  The wiring length from the wiring output part 21a of the ESD board box 21 of FIG. 6A to the device 19 or the diagnostic circuit 5 is desirably 20 cm or less in order to maintain the standard of the ESD applied voltage waveform of FIG. 6B is applied to each terminal of the device 19 or the diagnostic circuit 5 with the same wiring length from each ESD substrate to each terminal of the eight devices 19 or to the diagnostic circuit 5. I have to. Thereby, the ESD test becomes uniform, and the appropriateness or inappropriateness of the ESD applied voltage waveform level used in the ESD test can be quickly and accurately diagnosed by the diagnosis circuit 5 based on the presence or absence of light emission of the light emission check LED 4.

  The wiring length from the wiring output portion 21a of the 8-channel ESD board box 21 to each device 19 or the diagnostic circuit 5 is preferably 20 cm or less in order to maintain the standard of the ESD applied voltage waveform in FIG. The wiring length from each wiring output portion 21a of each ESD board box 21 to each terminal 19a19b of each of the eight devices 19 or the diagnostic circuit 5 is set to the same wiring length and applied to each terminal or diagnostic circuit 5 of each device 19. The ESD voltage waveforms in FIG. 6B are the same. This makes the ESD test uniform. The conformity diagnosis of the ESD applied voltage waveform level at this time can be performed.

  FIG. 7 is a block diagram showing a wafer map and probing management mainly for the personal computer PC.

  In FIG. 7, the ESD test inspection apparatus 1A according to the first embodiment simultaneously applies the high voltage to the eight contacts of the high-voltage relay 18 by the check mode of the ESD controller 17 that is driven in response to an instruction from the personal computer 32 that performs probing management. Switching to the power supply 12 side, the high voltage from the high voltage power supply 12 is accumulated in the eight high voltage capacitors 16, and then the eight contacts of the high voltage relay 18 are simultaneously switched to the eight applied resistances 15 side at a predetermined timing. An ESD application voltage level is applied to the diagnostic circuit 5 between the eight pairs of probes 11 from the ESD circuit constituted by eight parallel circuits. It is possible to quickly and accurately perform an ESD test inspection such as a high voltage conformity inspection and a high voltage energization inspection of an ESD test visually by the presence or absence of light emission of the light emission check LED 4 of the diagnostic circuit 5.

  In the case of automatic diagnostic inspection in addition to visual inspection, the presence or absence of light emission of the light emission check LED as the light emission means is detected by a photocoupler or the like as detection means, or a high voltage applied to the diagnostic circuit 5 or the like. Whether or not a corresponding predetermined threshold voltage is exceeded may be detected by a detection means such as an electronic circuit including a comparison circuit.

  In the ESD test apparatus 10A, when a large number of 100,000 chips of the semiconductor wafer 20 are sequentially subjected to an ESD test (actual application mode), the wafer stage 30 is driven in three axes using an automatic transfer device such as a prober 31. Probing continuously. In the probing management, the position of the semiconductor chip as a plurality of (for example, 100,000) inspection target devices arranged in a matrix on the semiconductor wafer 20, that is, the wafer map on the semiconductor wafer 20, mainly the personal computer PC. It is possible to perform an ESD test on a semiconductor chip in which address range with respect to the indicated address, and to store which addressed semiconductor chip has an ESD withstand voltage defect. The ESD withstand voltage failure is measured by a measuring instrument when the leakage current due to the reverse voltage of the diode structure of the semiconductor chip exceeds a predetermined value, and is recognized as a failure, and the address of the semiconductor chip is stored in the personal computer PC. .

  In the case of a diagnostic test, it is possible to perform an ESD test test on an ESD circuit in which address range with respect to addresses indicating the positions of a number of ESD circuits, and to store which address of the ESD circuit is defective in ESD application. The ESD application failure stores the address of the ESD circuit in the personal computer PC.

  The ESD controller 17 not only controls the operation of the high-voltage relay 18 of the ESD circuit, but also operates according to a sequence in which the setting of the voltage level to be applied, the number of times of application, and the polarity condition to be applied are preset by a program or the like. The ESD controller 17 has an ESD test mode (actual application mode) and a check mode (ESD test inspection mode).

  Next, downsizing of the diagnostic circuit 5 of the ESD test inspection apparatus 1 or 1A will be described. The LED is a point light source, and when the ESD circuit is a large number of circuits (36 circuits are shown next), the board of the diagnostic circuit 5 can be downsized.

  That is, when there are a large number of ESD circuits, at least a large number of light emitting means (light emission check LEDs 4) are arranged on the circuit board, and one connection means (a convex pin socket 8a described later) of the circuit board and the ESD circuit are arranged. The other connection means (concave pin socket 8b to be described later) connected between the high voltage output terminals (between the probes 11 of the probe card 22A) is connected to each other, and a diagnostic circuit 5 as a diagnostic means is provided for each ESD circuit. Is connected. This will be specifically described with reference to FIGS.

  FIG. 8 is a plan view of a diagnostic circuit board in which 36 diagnostic circuits 5 of FIG. 1 are arranged on the circuit board. FIG. 9 is a side view for explaining a one-touch connection method between the diagnostic circuit board of FIG. 8 and the probe card.

  As shown in FIGS. 8 and 9, 36 diagnostic circuits 5 are arranged on the diagnostic circuit board 6. The diagnostic circuit board 6 has 36 light emission check LEDs 4 arranged in a matrix of 9 rows and 4 columns on the right side area of the circuit board 6a in plan view. Further, the diagnostic circuit board 6 has a resistance array region 7 in which 36 series circuits of the variable resistor 2 and the voltage dividing resistor 3 are arranged on the left side region of the circuit board 6a in plan view. For each series circuit of the variable resistor 2 and the voltage dividing resistor 3, a light emission check LED 4 is connected between both ends of the voltage dividing resistor 3 by wiring of a circuit board 6a.

  36 pairs of probes 11 are disposed on the lower surface side of the probe card 22A, and a pair of concave pin sockets 8b is disposed for each pair of probes 11 on the probe card 22A side. On the diagnostic circuit board 6 side, a pair of convex pin sockets 8a are arranged so as to correspond to both ends of the series circuit of the variable resistor 2 and the voltage dividing resistor 3, respectively. The convex pin socket 8a and the concave pin socket 8b are configured to be detachable up and down, and the convex pin socket 8a is inserted into the concave pin socket 8b with one touch, so that a variable resistor 2 and a voltage dividing resistor are provided for each pair of probes 11. 3 are connected at both ends. Thus, the diagnosis circuit 5 is connected to each pair of probes 11 to diagnose whether the voltage level of 36 pairs of ESD applied high voltage waveforms is equal to or higher than a specified voltage level depending on whether the light emission check LED 4 emits light. Can do.

  As described above, according to the first embodiment, as the ESD test inspection apparatus 1, the ESD test apparatus 10 for performing the ESD application test for inspecting the ESD resistance of one or a plurality of inspection target devices, and the ESD applied voltage waveform And a diagnostic circuit 5 for diagnosing the suitability of the system. The diagnostic circuit 5 is a series circuit of a variable resistor 2 and a voltage dividing resistor 3 connected between the high voltage output terminals (probes 11) of the ESD test apparatus 10 and a light emission connected between both ends of the voltage dividing resistor 3. It has LED 4 for light emission check as a means. If only energization is confirmed, the light emission check LED 4 may be directly connected between the probes 11 without using a voltage dividing resistor.

  Accordingly, since each high voltage from the ESD test apparatus 10 or 10A or a diagnosis of the voltage level is performed based on the presence or absence of light emission of the light emission means (light emission check LED 4) using the diagnosis means, the ESD test conformity inspection is conventionally performed. Can be done much faster and more accurately than. For example, when an inspection of a high voltage application level of a 32 ESD circuit is performed using an oscilloscope, it takes 3 minutes for one ESD circuit and 96 minutes for 32 circuits. According to the first embodiment, the number of ESD circuits is increased. Since it does not depend on it and only the presence / absence of lighting of the light emission check LED 4 is inspected, the inspection can be carried out collectively within one minute at the maximum. Therefore, the larger the number of ESD circuits for batch inspection of ESD tolerance, the more efficient.

  Although not particularly described in the first embodiment, the high-voltage power supply 12 includes a positive power supply and a negative power supply with respect to the GND potential, and can be switched between the positive power supply and the negative power supply. The target device 6 may be configured to be able to switch between a forward bias and a reverse bias. The connection direction of the diagnostic circuit 5 is reversed between the forward bias and the reverse bias.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1 of this invention, this invention should not be limited and limited to this Embodiment 1. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range from the description of the specific preferred embodiment 1 of the present invention based on the description of the present invention and the common general technical knowledge. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention relates to an ESD test conformity inspection for inspecting whether or not a current waveform from a high voltage application device for inspecting ESD tolerance is inspected for a device to be inspected such as an LSI element, a light emitting element such as an LED element and a laser element In the field of an apparatus and an ESD test conformity inspection method using the apparatus, an ESD test is performed because, for example, the diagnosis means is used to diagnose each of the high-voltage energization or voltage level from the ESD test apparatus based on the presence or absence of light emission from the light-emitting means. Conformity inspection can be performed quickly and accurately.

Claims (19)

  A diagnostic means is connected between each high voltage output terminal of an ESD test apparatus that collectively applies ESD resistance to one or a plurality of devices to be inspected, and each high voltage is applied from the ESD test apparatus by the diagnostic means. An ESD test and inspection device capable of diagnosing whether or not each of the high voltages conforms to a specified high voltage value.   The ESD test inspection apparatus according to claim 1, wherein the diagnosis by the diagnosis unit is performed based on the presence or absence of light emission of the light emitting unit.   The ESD test inspection apparatus according to claim 2, wherein the light emitting means is an LED for light emission check.   The ESD test inspection apparatus according to claim 3, wherein a light emission color of the light emission check LED is green.   The diagnostic means includes a series circuit of a variable resistor and a voltage dividing resistor connected between the high voltage output terminals of the ESD test apparatus, and a light emitting means connected in the forward direction between both ends of the voltage dividing resistor. The ESD test inspection apparatus according to claim 1.   The ESD test inspection apparatus according to claim 1, wherein the diagnosis unit includes a light emitting unit connected between the high voltage output terminals of the ESD test apparatus.   2. The diagnosis by the diagnostic means includes detecting means for detecting whether or not the light emitting means serving as the diagnostic means emits light or whether a high voltage applied to the diagnostic means exceeds a predetermined threshold voltage. Or the ESD test inspection apparatus of 2.   6. The ESD test inspection apparatus according to claim 5, wherein the light emission threshold voltage of the light emitting means is a voltage across the voltage dividing resistor when a predetermined high voltage of the ESD test apparatus is applied to a voltage across the series circuit. .   The ESD test and inspection apparatus according to claim 5 or 6, wherein the light emitting means is a light emitting element having a light emission response characteristic of 100 nsec or less.   The ESD test inspection apparatus according to claim 5 or 6, wherein the light emitting means emits light by each high voltage from the ESD test apparatus.   The ESD test and inspection apparatus according to claim 5, wherein the light emitting means is connected to one of a plurality of voltage dividing resistors including a variable resistor.   The high-voltage power supply in the ESD test apparatus and one or a plurality of ESD circuits that output each other high voltage are used, and the diagnostic unit or the light-emitting unit is connected to each ESD circuit. ESD test inspection equipment.   The ESD test and inspection apparatus according to claim 2, wherein the light emission of the light emitting means is made continuous by repeating the high-voltage discharge cycle for a predetermined period so that the light emission is visualized by an afterimage effect at the time of diagnosis.   The ESD test and inspection apparatus according to claim 13, wherein the high-voltage discharge cycle is set in accordance with a charging capability of a high-voltage power supply.   The ESD test and inspection apparatus according to claim 13 or 14, wherein the discharge cycle of the high voltage is 30 msec.   13. The ESD test and inspection apparatus according to claim 12, wherein when there are a large number of ESD circuits, a large number of at least the light emitting means are arranged on a circuit board.   17. The light emitting device according to claim 16, wherein one connection unit of the circuit board is connected to the other connection unit connected between high voltage output terminals of the ESD circuit, and the light emitting unit is connected to each ESD circuit. ESD test inspection equipment.   The ESD test inspection apparatus according to claim 12, further comprising an ESD controller that controls a high voltage output period from the ESD circuit in an ESD test mode and an ESD test inspection mode. An ESD test inspection method using the ESD test inspection apparatus according to claim 1, 8, 11, 14, 16 and 17,
Diagnostic means connected between the high voltage output terminals of the ESD test and inspection apparatus applies each high voltage from the ESD test and inspection apparatus that applies to one or a plurality of devices to be inspected and collectively tests the ESD resistance. An ESD test and inspection method comprising a diagnostic step that makes it possible to diagnose whether or not each of the high voltages conforms to a specified high voltage value.