TW200746869A - Condenser microphone - Google Patents

Condenser microphone

Info

Publication number
TW200746869A
TW200746869A TW096110553A TW96110553A TW200746869A TW 200746869 A TW200746869 A TW 200746869A TW 096110553 A TW096110553 A TW 096110553A TW 96110553 A TW96110553 A TW 96110553A TW 200746869 A TW200746869 A TW 200746869A
Authority
TW
Taiwan
Prior art keywords
diaphragm
back plate
arms
center portion
substrate
Prior art date
Application number
TW096110553A
Other languages
English (en)
Inventor
Seiji Hirade
Tamito Suzuki
Yukitoshi Suzuki
Masayoshi Omura
Yuusaku Ebihara
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006092076A external-priority patent/JP4605544B2/ja
Priority claimed from JP2006278246A external-priority patent/JP4770687B2/ja
Priority claimed from JP2006281902A external-priority patent/JP4770692B2/ja
Application filed by Yamaha Corp filed Critical Yamaha Corp
Publication of TW200746869A publication Critical patent/TW200746869A/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
TW096110553A 2006-03-29 2007-03-27 Condenser microphone TW200746869A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006092039 2006-03-29
JP2006092063 2006-03-29
JP2006092076A JP4605544B2 (ja) 2006-03-29 2006-03-29 コンデンサマイクロホン
JP2006278246A JP4770687B2 (ja) 2006-03-29 2006-10-12 コンデンサマイクロホン
JP2006281902A JP4770692B2 (ja) 2006-03-29 2006-10-16 コンデンサマイクロホン

Publications (1)

Publication Number Publication Date
TW200746869A true TW200746869A (en) 2007-12-16

Family

ID=38609347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096110553A TW200746869A (en) 2006-03-29 2007-03-27 Condenser microphone

Country Status (6)

Country Link
US (1) US8126167B2 (zh)
EP (1) EP2001262A4 (zh)
KR (1) KR20080098672A (zh)
BR (1) BRPI0708934A2 (zh)
TW (1) TW200746869A (zh)
WO (1) WO2007119570A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI689021B (zh) * 2018-09-14 2020-03-21 日商東芝記憶體股份有限公司 半導體裝置

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TWI358235B (en) * 2007-12-14 2012-02-11 Ind Tech Res Inst Sensing membrane and micro-electro-mechanical syst
JP5218432B2 (ja) * 2008-02-20 2013-06-26 オムロン株式会社 静電容量型振動センサ
WO2009157122A1 (ja) 2008-06-24 2009-12-30 パナソニック株式会社 Ｍｅｍｓデバイス、ｍｅｍｓデバイスモジュール及び音響トランスデューサ
TWI449439B (zh) * 2008-09-02 2014-08-11 Ind Tech Res Inst 音訊感測元件及其製造方法
TWI374514B (en) 2008-12-12 2012-10-11 Ind Tech Res Inst Truss structure and manufacturing method thereof
JP2010155306A (ja) 2008-12-26 2010-07-15 Panasonic Corp Ｍｅｍｓデバイス及びその製造方法
GB2466776A (en) * 2008-12-30 2010-07-07 Wolfson Microelectronics Plc Bootstrapping to reduce the effect of bond pad parasitic capacitance in a MEMS microphone circuit
CN201383872Y (zh) * 2009-01-19 2010-01-13 歌尔声学股份有限公司 电容式麦克风的隔离片
DE102009000416A1 (de) * 2009-01-27 2010-07-29 Robert Bosch Gmbh Mikromechanischer Drucksensor mit vertikaler Membranaufhängung
US8363860B2 (en) * 2009-03-26 2013-01-29 Analog Devices, Inc. MEMS microphone with spring suspended backplate
JP5454345B2 (ja) * 2010-05-11 2014-03-26 オムロン株式会社 音響センサ及びその製造方法
JP5402823B2 (ja) * 2010-05-13 2014-01-29 オムロン株式会社 音響センサ
US8811635B2 (en) 2011-07-06 2014-08-19 Robert Bosch Gmbh Apparatus and method for driving parasitic capacitances using diffusion regions under a MEMS structure
TWI461657B (zh) * 2011-12-26 2014-11-21 Ind Tech Res Inst 電容傳感器、其製造方法以及具此種電容傳感器的多功能元件
US9409763B2 (en) * 2012-04-04 2016-08-09 Infineon Technologies Ag MEMS device and method of making a MEMS device
US9143870B2 (en) * 2012-11-09 2015-09-22 Invensense, Inc. Microphone system with mechanically-coupled diaphragms
ITTO20130225A1 (it) 2013-03-21 2014-09-22 St Microelectronics Srl Struttura sensibile microelettromeccanica per un trasduttore acustico capacitivo includente un elemento di limitazione delle oscillazioni di una membrana, e relativo processo di fabbricazione
ITTO20130441A1 (it) * 2013-05-30 2014-12-01 St Microelectronics Srl Struttura di rilevamento per un trasduttore acustico mems con migliorata resistenza alle deformazioni
ITTO20130540A1 (it) 2013-06-28 2014-12-29 St Microelectronics Srl Dispositivo mems dotato di membrana sospesa e relativo procedimento di fabbricazione
US9628886B2 (en) 2013-08-26 2017-04-18 Infineon Technologies Ag MEMS device
KR102056287B1 (ko) * 2013-11-27 2019-12-16 한국전자통신연구원 마이크로폰
JP6264969B2 (ja) * 2014-03-14 2018-01-24 オムロン株式会社 音響トランスデューサ
CN107105377B (zh) * 2017-05-15 2021-01-22 潍坊歌尔微电子有限公司 一种mems麦克风
KR102488122B1 (ko) * 2018-06-15 2023-01-12 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
WO2020184206A1 (ja) * 2019-03-13 2020-09-17 株式会社村田製作所 圧力センサ
CN113678472B (zh) * 2019-05-31 2024-04-12 共达电声股份有限公司 Mems电容传感器及其制备方法、电子设备
US11119532B2 (en) * 2019-06-28 2021-09-14 Intel Corporation Methods and apparatus to implement microphones in thin form factor electronic devices
US11490186B2 (en) * 2020-08-31 2022-11-01 Invensense, Inc. Edge patterns of microelectromechanical systems (MEMS) microphone backplate holes
JP2022125545A (ja) * 2021-02-17 2022-08-29 株式会社リコー 音響変換器
CN114513731B (zh) * 2022-04-20 2022-06-21 苏州敏芯微电子技术股份有限公司 一种麦克风组件及电子设备
CN114520947B (zh) * 2022-04-20 2022-07-08 苏州敏芯微电子技术股份有限公司 一种麦克风组件及电子设备
CN115159439A (zh) * 2022-05-26 2022-10-11 歌尔微电子股份有限公司 Mems装置和电子设备

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JPH0726887B2 (ja) 1986-05-31 1995-03-29 株式会社堀場製作所 コンデンサマイクロフオン型検出器用ダイアフラム
FR2695787B1 (fr) 1992-09-11 1994-11-10 Suisse Electro Microtech Centr Transducteur capacitif intégré.
US5452268A (en) 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
US6535460B2 (en) * 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
ATE392790T1 (de) 2000-08-11 2008-05-15 Knowles Electronics Llc Erhobene mikrostrukturen
JP2003102097A (ja) * 2001-09-25 2003-04-04 Nippon Hoso Kyokai <Nhk> 音処理装置
US7023066B2 (en) 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone
JP2004356708A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構及びその製造方法
JP2006092039A (ja) 2004-09-21 2006-04-06 Fuji Xerox Co Ltd サービス利用システム
JP2006092076A (ja) 2004-09-22 2006-04-06 Fuji Xerox Co Ltd 定電圧供給電源
JP4742551B2 (ja) 2004-09-22 2011-08-10 株式会社明電舎 プロセッシングラインおよびその工程時間管理方法
JP4886203B2 (ja) 2005-03-30 2012-02-29 本田技研工業株式会社 燃料電池スタックの制御方法
JP2006281902A (ja) 2005-03-31 2006-10-19 Denso Corp 車両用空調装置
US8059842B2 (en) * 2005-09-09 2011-11-15 Yamaha Corporation Capacitor microphone

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI689021B (zh) * 2018-09-14 2020-03-21 日商東芝記憶體股份有限公司 半導體裝置

Also Published As

Publication number Publication date
US8126167B2 (en) 2012-02-28
EP2001262A9 (en) 2009-04-08
EP2001262A2 (en) 2008-12-10
EP2001262A4 (en) 2013-01-02
KR20080098672A (ko) 2008-11-11
BRPI0708934A2 (pt) 2011-06-14
US20070286438A1 (en) 2007-12-13
WO2007119570A1 (ja) 2007-10-25

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