TW200745790A - Exposure device and exposure method - Google Patents

Exposure device and exposure method

Info

Publication number
TW200745790A
TW200745790A TW096111046A TW96111046A TW200745790A TW 200745790 A TW200745790 A TW 200745790A TW 096111046 A TW096111046 A TW 096111046A TW 96111046 A TW96111046 A TW 96111046A TW 200745790 A TW200745790 A TW 200745790A
Authority
TW
Taiwan
Prior art keywords
substrate
exposure
stage
tranfer
alignment unit
Prior art date
Application number
TW096111046A
Other languages
English (en)
Other versions
TWI338201B (zh
Inventor
Masahiro Miyashita
Takumi Togashi
Original Assignee
Nsk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nsk Ltd filed Critical Nsk Ltd
Publication of TW200745790A publication Critical patent/TW200745790A/zh
Application granted granted Critical
Publication of TWI338201B publication Critical patent/TWI338201B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096111046A 2006-04-24 2007-03-29 Exposure device and exposure method TW200745790A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006119412A JP2007294594A (ja) 2006-04-24 2006-04-24 露光装置及び露光方法

Publications (2)

Publication Number Publication Date
TW200745790A true TW200745790A (en) 2007-12-16
TWI338201B TWI338201B (zh) 2011-03-01

Family

ID=38764931

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111046A TW200745790A (en) 2006-04-24 2007-03-29 Exposure device and exposure method

Country Status (4)

Country Link
JP (1) JP2007294594A (zh)
KR (1) KR100839398B1 (zh)
CN (1) CN100526996C (zh)
TW (1) TW200745790A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398639B (zh) * 2010-01-08 2013-06-11 Nat Univ Kaohsiung The carrier of the package
TWI596449B (zh) * 2016-05-30 2017-08-21 志聖工業股份有限公司 工件曝光方法、曝光設備及其置件機構

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4726814B2 (ja) * 2007-01-16 2011-07-20 株式会社日立ハイテクノロジーズ 基板の位置決め装置及び位置決め方法
KR101005582B1 (ko) * 2009-07-13 2011-01-05 한국기계연구원 기판 정렬 모듈 및 이를 구비하는 리소그래피 장치
US8379186B2 (en) * 2009-07-17 2013-02-19 Nikon Corporation Pattern formation apparatus, pattern formation method, and device manufacturing method
KR20110136833A (ko) * 2010-03-12 2011-12-21 파나소닉 주식회사 얼라인먼트 방법 및 플랫 패널 디스플레이의 제조 방법
JP5843161B2 (ja) * 2011-05-13 2016-01-13 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
TWI499872B (zh) 2013-06-18 2015-09-11 Innolux Corp 曝光系統與曝光製程
CN104238272B (zh) * 2013-06-18 2017-02-01 群创光电股份有限公司 曝光系统与曝光方法
CN112015054B (zh) * 2019-05-31 2021-10-01 上海微电子装备（集团）股份有限公司 传输装置、传输方法及光刻机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3203719B2 (ja) * 1991-12-26 2001-08-27 株式会社ニコン 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法
JP2001308003A (ja) * 2000-02-15 2001-11-02 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP2002305140A (ja) * 2001-04-06 2002-10-18 Nikon Corp 露光装置及び基板処理システム
JP4458322B2 (ja) * 2003-01-14 2010-04-28 キヤノン株式会社 露光装置およびデバイス製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398639B (zh) * 2010-01-08 2013-06-11 Nat Univ Kaohsiung The carrier of the package
TWI596449B (zh) * 2016-05-30 2017-08-21 志聖工業股份有限公司 工件曝光方法、曝光設備及其置件機構

Also Published As

Publication number Publication date
JP2007294594A (ja) 2007-11-08
CN101063824A (zh) 2007-10-31
TWI338201B (zh) 2011-03-01
CN100526996C (zh) 2009-08-12
KR100839398B1 (ko) 2008-06-20
KR20070104827A (ko) 2007-10-29

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