TW200745727A - Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system - Google Patents

Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system

Info

Publication number
TW200745727A
TW200745727A TW096111016A TW96111016A TW200745727A TW 200745727 A TW200745727 A TW 200745727A TW 096111016 A TW096111016 A TW 096111016A TW 96111016 A TW96111016 A TW 96111016A TW 200745727 A TW200745727 A TW 200745727A
Authority
TW
Taiwan
Prior art keywords
purge gas
gas mixture
supply system
lithographic projection
projection apparatus
Prior art date
Application number
TW096111016A
Other languages
English (en)
Chinese (zh)
Inventor
Bipin S Parekh
Robert S Zeller
Russell J Holmes
Jeffrey J Spiegelman
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of TW200745727A publication Critical patent/TW200745727A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096111016A 2006-04-03 2007-03-29 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system TW200745727A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/396,823 US20060285091A1 (en) 2003-07-21 2006-04-03 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system related application

Publications (1)

Publication Number Publication Date
TW200745727A true TW200745727A (en) 2007-12-16

Family

ID=38326249

Family Applications (2)

Application Number Title Priority Date Filing Date
TW096111016A TW200745727A (en) 2006-04-03 2007-03-29 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system
TW100123486A TW201202869A (en) 2006-04-03 2007-03-29 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100123486A TW201202869A (en) 2006-04-03 2007-03-29 Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system

Country Status (8)

Country Link
US (2) US20060285091A1 (enExample)
EP (1) EP2002309A1 (enExample)
JP (1) JP2009532901A (enExample)
KR (1) KR20080109813A (enExample)
CN (2) CN102298270A (enExample)
SG (1) SG173318A1 (enExample)
TW (2) TW200745727A (enExample)
WO (1) WO2007120451A1 (enExample)

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TWI798656B (zh) * 2021-01-15 2023-04-11 台灣積體電路製造股份有限公司 微影製程的系統及方法
TWI807089B (zh) * 2018-08-27 2023-07-01 美商科磊股份有限公司 蒸氣作為光學系統中之保護劑及生命延長劑

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US20110151590A1 (en) * 2009-08-05 2011-06-23 Applied Materials, Inc. Apparatus and method for low-k dielectric repair
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EP2515170B1 (en) * 2011-04-20 2020-02-19 ASML Netherlands BV Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method
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US9116445B2 (en) * 2012-11-29 2015-08-25 Kla-Tencor Corporation Resonant cavity conditioning for improved nonlinear crystal performance
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US10307803B2 (en) * 2016-07-20 2019-06-04 The United States Of America As Represented By Secretary Of The Navy Transmission window cleanliness for directed energy devices
US10274847B2 (en) * 2017-09-19 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Humidity control in EUV lithography
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US10871722B2 (en) * 2018-07-16 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Photomask purging system and method
US10990026B2 (en) * 2018-08-14 2021-04-27 Taiwan Semiconductor Manufacturing Co., Ltd. Lithography apparatus and cleaning method thereof
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US10877378B2 (en) * 2018-09-28 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Vessel for extreme ultraviolet radiation source
WO2020146398A1 (en) * 2019-01-07 2020-07-16 Strata Skin Sciences, Inc. Excimer laser system with long service intervals
CN113457318B (zh) * 2020-03-31 2022-08-30 上海微电子装备（集团）股份有限公司 一种超洁净湿空气制备装置及光刻设备
EP4356194A1 (en) * 2021-06-14 2024-04-24 ASML Netherlands B.V. An illumination source and associated method apparatus
TWI892035B (zh) * 2021-08-24 2025-08-01 南韓商三星電子股份有限公司 基板處理設備
DE102021214981A1 (de) * 2021-12-23 2023-06-29 Carl Zeiss Smt Gmbh Verfahren und trockenvorrichtung
DE102023200132A1 (de) 2022-05-04 2023-11-09 Carl Zeiss Smt Gmbh Einrichtung zur Entfernung von gasförmigen Kontaminationen und Vorrichtung, insbesondere Lithographiesystem, mit einer solchen Einrichtung
CN119404138A (zh) * 2022-07-26 2025-02-07 Asml荷兰有限公司 用于向光刻系统供应气体的设备和方法
CN117405479B (zh) * 2023-08-11 2025-04-18 陕西裕隆气体有限公司 一种微量多组分混合气配制工艺方法
CN117234032B (zh) * 2023-11-13 2024-02-06 睿晶半导体(宁波)有限公司 掩模版上污染物的去除方法及吹扫装置
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Publication number Priority date Publication date Assignee Title
CN108873601A (zh) * 2017-05-10 2018-11-23 台湾积体电路制造股份有限公司 护膜
TWI731114B (zh) * 2017-05-10 2021-06-21 台灣積體電路製造股份有限公司 護膜以及使用護膜的方法
US11868041B2 (en) 2017-05-10 2024-01-09 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle and method of using the same
TWI807089B (zh) * 2018-08-27 2023-07-01 美商科磊股份有限公司 蒸氣作為光學系統中之保護劑及生命延長劑
TWI798656B (zh) * 2021-01-15 2023-04-11 台灣積體電路製造股份有限公司 微影製程的系統及方法
US12085860B2 (en) 2021-01-15 2024-09-10 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for monitoring and controlling extreme ultraviolet photolithography processes

Also Published As

Publication number Publication date
US20090231559A1 (en) 2009-09-17
WO2007120451A1 (en) 2007-10-25
CN102298270A (zh) 2011-12-28
SG173318A1 (en) 2011-08-29
CN101410760A (zh) 2009-04-15
KR20080109813A (ko) 2008-12-17
CN101410760B (zh) 2011-09-21
JP2009532901A (ja) 2009-09-10
US20060285091A1 (en) 2006-12-21
EP2002309A1 (en) 2008-12-17
TW201202869A (en) 2012-01-16

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