CN102298270A - 微影投射设备、气体洗涤方法、装置制造方法及洗涤气体的供应系统 - Google Patents
微影投射设备、气体洗涤方法、装置制造方法及洗涤气体的供应系统 Download PDFInfo
- Publication number
- CN102298270A CN102298270A CN2011102111005A CN201110211100A CN102298270A CN 102298270 A CN102298270 A CN 102298270A CN 2011102111005 A CN2011102111005 A CN 2011102111005A CN 201110211100 A CN201110211100 A CN 201110211100A CN 102298270 A CN102298270 A CN 102298270A
- Authority
- CN
- China
- Prior art keywords
- washing gas
- evaporator
- potpourri
- washing
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 54
- 238000010926 purge Methods 0.000 title abstract description 14
- 238000004519 manufacturing process Methods 0.000 title description 8
- 239000000203 mixture Substances 0.000 claims abstract description 43
- 238000005406 washing Methods 0.000 claims description 459
- 239000007788 liquid Substances 0.000 claims description 157
- 238000010276 construction Methods 0.000 claims description 40
- 239000012528 membrane Substances 0.000 claims description 40
- 230000003287 optical effect Effects 0.000 claims description 37
- 239000003344 environmental pollutant Substances 0.000 claims description 34
- 231100000719 pollutant Toxicity 0.000 claims description 34
- 230000008859 change Effects 0.000 claims description 33
- 239000012530 fluid Substances 0.000 claims description 26
- 230000001105 regulatory effect Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 12
- 238000012423 maintenance Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 230000002829 reductive effect Effects 0.000 claims description 8
- 230000009471 action Effects 0.000 claims description 5
- 230000006866 deterioration Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000000446 fuel Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 229920000554 ionomer Polymers 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 41
- 238000000059 patterning Methods 0.000 abstract description 13
- 239000004909 Moisturizer Substances 0.000 abstract 1
- 230000001333 moisturizer Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 530
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 89
- 239000010408 film Substances 0.000 description 45
- 239000012510 hollow fiber Substances 0.000 description 43
- 230000005855 radiation Effects 0.000 description 36
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 23
- 230000000694 effects Effects 0.000 description 23
- 239000000835 fiber Substances 0.000 description 18
- 239000010410 layer Substances 0.000 description 18
- 239000000126 substance Substances 0.000 description 15
- 238000010790 dilution Methods 0.000 description 14
- 239000012895 dilution Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 238000011144 upstream manufacturing Methods 0.000 description 14
- 229930195733 hydrocarbon Natural products 0.000 description 13
- 239000004215 Carbon black (E152) Substances 0.000 description 11
- 239000003570 air Substances 0.000 description 11
- 150000002430 hydrocarbons Chemical class 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 10
- 238000000429 assembly Methods 0.000 description 10
- 230000000712 assembly Effects 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 238000002474 experimental method Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 230000002411 adverse Effects 0.000 description 8
- 239000002585 base Substances 0.000 description 8
- 229920001169 thermoplastic Polymers 0.000 description 8
- 241000209094 Oryza Species 0.000 description 7
- 235000007164 Oryza sativa Nutrition 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 235000009566 rice Nutrition 0.000 description 7
- 239000004416 thermosoftening plastic Substances 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000004382 potting Methods 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 238000000769 gas chromatography-flame ionisation detection Methods 0.000 description 5
- 238000000746 purification Methods 0.000 description 5
- 229920006395 saturated elastomer Polymers 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 230000036961 partial effect Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004587 chromatography analysis Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000004817 gas chromatography Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- -1 methane hydro carbons Chemical class 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000005201 scrubbing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000005574 cross-species transmission Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 230000005381 magnetic domain Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001393 microlithography Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005373 pervaporation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000003039 volatile agent Substances 0.000 description 2
- 206010015535 Euphoric mood Diseases 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- FHNFHKCVQCLJFQ-NJFSPNSNSA-N Xenon-133 Chemical compound [133Xe] FHNFHKCVQCLJFQ-NJFSPNSNSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000008246 gaseous mixture Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000001819 mass spectrum Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000012982 microporous membrane Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
- 238000004375 physisorption Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 235000020004 porter Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229940106670 xenon-133 Drugs 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/396,823 US20060285091A1 (en) | 2003-07-21 | 2006-04-03 | Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system related application |
| US11/396,823 | 2006-04-03 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800115338A Division CN101410760B (zh) | 2006-04-03 | 2007-03-28 | 微影投射设备、气体洗涤方法、装置制造方法及洗涤气体的供应系统 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102298270A true CN102298270A (zh) | 2011-12-28 |
Family
ID=38326249
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102111005A Pending CN102298270A (zh) | 2006-04-03 | 2007-03-28 | 微影投射设备、气体洗涤方法、装置制造方法及洗涤气体的供应系统 |
| CN2007800115338A Expired - Fee Related CN101410760B (zh) | 2006-04-03 | 2007-03-28 | 微影投射设备、气体洗涤方法、装置制造方法及洗涤气体的供应系统 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800115338A Expired - Fee Related CN101410760B (zh) | 2006-04-03 | 2007-03-28 | 微影投射设备、气体洗涤方法、装置制造方法及洗涤气体的供应系统 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20060285091A1 (enExample) |
| EP (1) | EP2002309A1 (enExample) |
| JP (1) | JP2009532901A (enExample) |
| KR (1) | KR20080109813A (enExample) |
| CN (2) | CN102298270A (enExample) |
| SG (1) | SG173318A1 (enExample) |
| TW (2) | TW200745727A (enExample) |
| WO (1) | WO2007120451A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI707194B (zh) * | 2018-09-28 | 2020-10-11 | 台灣積體電路製造股份有限公司 | 操作極紫外光產生裝置之方法及極紫外輻射產生裝置 |
| CN117405479A (zh) * | 2023-08-11 | 2024-01-16 | 陕西裕隆气体有限公司 | 一种微量多组分混合气配制工艺方法 |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913654B2 (en) * | 2003-06-02 | 2005-07-05 | Mykrolis Corporation | Method for the removal of airborne molecular contaminants using water gas mixtures |
| US7384149B2 (en) * | 2003-07-21 | 2008-06-10 | Asml Netherlands B.V. | Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system |
| US20060285091A1 (en) * | 2003-07-21 | 2006-12-21 | Parekh Bipin S | Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system related application |
| KR20080034492A (ko) * | 2005-08-03 | 2008-04-21 | 엔테그리스, 아이엔씨. | 이송 용기 |
| US7420194B2 (en) | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
| US20080073596A1 (en) * | 2006-08-24 | 2008-03-27 | Asml Netherlands B.V. | Lithographic apparatus and method |
| US7866637B2 (en) * | 2007-01-26 | 2011-01-11 | Asml Netherlands B.V. | Humidifying apparatus, lithographic apparatus and humidifying method |
| JP2008263173A (ja) * | 2007-03-16 | 2008-10-30 | Canon Inc | 露光装置 |
| US8514365B2 (en) * | 2007-06-01 | 2013-08-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7856737B2 (en) * | 2007-08-28 | 2010-12-28 | Mathews Company | Apparatus and method for reducing a moisture content of an agricultural product |
| NL1036510A1 (nl) * | 2008-02-21 | 2009-08-24 | Asml Netherlands Bv | Lithographic apparatus with temperature sensor and device manufacturing method. |
| JP2009212313A (ja) * | 2008-03-04 | 2009-09-17 | Canon Inc | 露光装置およびデバイス製造方法 |
| US20110151590A1 (en) * | 2009-08-05 | 2011-06-23 | Applied Materials, Inc. | Apparatus and method for low-k dielectric repair |
| JP5574799B2 (ja) * | 2010-04-23 | 2014-08-20 | キヤノン株式会社 | 露光装置、それを用いたデバイスの製造方法、並びに気体供給装置 |
| EP2515170B1 (en) * | 2011-04-20 | 2020-02-19 | ASML Netherlands BV | Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method |
| WO2013029957A2 (en) * | 2011-08-31 | 2013-03-07 | Asml Netherlands B.V. | A method of determining focus corrections, lithographic processing cell and device manufacturing method |
| NL2009378A (en) * | 2011-10-07 | 2013-04-09 | Asml Netherlands Bv | Lithographic apparatus and method of cooling a component in a lithographic apparatus. |
| US9116445B2 (en) * | 2012-11-29 | 2015-08-25 | Kla-Tencor Corporation | Resonant cavity conditioning for improved nonlinear crystal performance |
| DE102015011228B4 (de) * | 2015-08-27 | 2017-06-14 | Süss Microtec Photomask Equipment Gmbh & Co. Kg | Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat |
| US10307803B2 (en) * | 2016-07-20 | 2019-06-04 | The United States Of America As Represented By Secretary Of The Navy | Transmission window cleanliness for directed energy devices |
| US10670959B2 (en) * | 2017-05-10 | 2020-06-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle and method of using the same |
| US10274847B2 (en) | 2017-09-19 | 2019-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Humidity control in EUV lithography |
| KR102482421B1 (ko) | 2018-02-15 | 2022-12-27 | 사이머 엘엘씨 | 가스 관리 시스템 |
| WO2019160627A1 (en) * | 2018-02-15 | 2019-08-22 | Cymer, Llc | Gas management system |
| US10871722B2 (en) * | 2018-07-16 | 2020-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photomask purging system and method |
| US10990026B2 (en) * | 2018-08-14 | 2021-04-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithography apparatus and cleaning method thereof |
| US11624904B2 (en) | 2019-08-06 | 2023-04-11 | Kla Corporation | Vapor as a protectant and lifetime extender in optical systems |
| EP3811141A4 (en) | 2018-08-27 | 2022-03-23 | KLA Corporation | STEAM AS A PROTECTIVE AND LIFE EXTENDED IN OPTICAL SYSTEMS |
| US12160080B2 (en) * | 2019-01-07 | 2024-12-03 | Strata Skin Sciences, Inc. | Excimer laser system with long service intervals |
| CN113457318B (zh) * | 2020-03-31 | 2022-08-30 | 上海微电子装备(集团)股份有限公司 | 一种超洁净湿空气制备装置及光刻设备 |
| US12085860B2 (en) * | 2021-01-15 | 2024-09-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for monitoring and controlling extreme ultraviolet photolithography processes |
| EP4356194A1 (en) * | 2021-06-14 | 2024-04-24 | ASML Netherlands B.V. | An illumination source and associated method apparatus |
| TWI892035B (zh) | 2021-08-24 | 2025-08-01 | 南韓商三星電子股份有限公司 | 基板處理設備 |
| DE102021214981A1 (de) * | 2021-12-23 | 2023-06-29 | Carl Zeiss Smt Gmbh | Verfahren und trockenvorrichtung |
| DE102023200132A1 (de) | 2022-05-04 | 2023-11-09 | Carl Zeiss Smt Gmbh | Einrichtung zur Entfernung von gasförmigen Kontaminationen und Vorrichtung, insbesondere Lithographiesystem, mit einer solchen Einrichtung |
| WO2024022796A1 (en) * | 2022-07-26 | 2024-02-01 | Asml Netherlands B.V. | Apparatus for and method of supplying gas to a lithography system |
| CN117234032B (zh) * | 2023-11-13 | 2024-02-06 | 睿晶半导体(宁波)有限公司 | 掩模版上污染物的去除方法及吹扫装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6582496B1 (en) * | 2000-01-28 | 2003-06-24 | Mykrolis Corporation | Hollow fiber membrane contactor |
| US20040023490A1 (en) * | 2002-07-31 | 2004-02-05 | Dirk Wollstein | Method of controlling the chemical mechanical polishing of stacked layers having a surface topology |
| WO2005010619A2 (en) * | 2003-07-21 | 2005-02-03 | Entegris, Inc. | Lithographic projection apparatus, purge gas supply system and gas purging |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19910441C1 (de) * | 1999-03-10 | 2000-06-21 | Fraunhofer Ges Forschung | Luftbefeuchtung |
| EP0009543B1 (en) * | 1978-07-12 | 1982-12-08 | Richard R. Dr. Jackson | Nested hollow fiber humidifier |
| DD160756A3 (de) * | 1981-04-24 | 1984-02-29 | Gudrun Dietz | Anordnung zur verbesserung fotochemischer umsetzungsprozesse in fotoresistschichten |
| JPH0636993A (ja) * | 1992-05-21 | 1994-02-10 | Canon Inc | 露光装置及び半導体素子の製造方法 |
| US5240472A (en) * | 1992-05-29 | 1993-08-31 | Air Products And Chemicls, Inc. | Moisture removal from a wet gas |
| JP2753930B2 (ja) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
| US5348691A (en) * | 1993-06-11 | 1994-09-20 | United Technologies Corporation | Atmosphere membrane humidifier and method and system for producing humidified air |
| US5996976A (en) * | 1993-07-13 | 1999-12-07 | Lynntech, Inc. | Gas humidification system using water permeable membranes |
| JP3500619B2 (ja) * | 1993-10-28 | 2004-02-23 | 株式会社ニコン | 投影露光装置 |
| JPH08266631A (ja) * | 1995-03-31 | 1996-10-15 | Asahi Glass Co Ltd | 呼吸用気体の加湿装置 |
| US6297871B1 (en) * | 1995-09-12 | 2001-10-02 | Nikon Corporation | Exposure apparatus |
| KR100542414B1 (ko) * | 1996-03-27 | 2006-05-10 | 가부시키가이샤 니콘 | 노광장치및공조장치 |
| US5910292A (en) * | 1997-08-19 | 1999-06-08 | Aeronex, Inc. | Method for water removal from corrosive gas streams |
| US6059859A (en) * | 1997-09-19 | 2000-05-09 | Aeronex, Inc. | Method, composition and apparatus for water removal from non-corrosive gas streams |
| US6089282A (en) * | 1998-05-08 | 2000-07-18 | Aeronex, Inc. | Method for recovery and reuse of gas |
| AU6138199A (en) * | 1998-09-09 | 2000-03-27 | Pall Corporation | Fluid treatment elements, methods for cleaning fluid treatment elements and methods for treating fluids |
| US6254936B1 (en) * | 1998-09-14 | 2001-07-03 | Silicon Valley Group, Inc. | Environment exchange control for material on a wafer surface |
| US6802972B1 (en) * | 1999-01-29 | 2004-10-12 | Mykrolis Corporation | Microporous hollow fiber membranes from perfluorinated thermoplastic polymers |
| JP4514959B2 (ja) * | 1999-01-29 | 2010-07-28 | マイクロリス・コーポレイション | 中空繊維膜の製造方法 |
| US6394109B1 (en) * | 1999-04-13 | 2002-05-28 | Applied Materials, Inc. | Method and apparatus for removing carbon contamination in a sub-atmospheric charged particle beam lithography system |
| KR20020036951A (ko) * | 1999-05-28 | 2002-05-17 | 시마무라 테루오 | 노광방법 및 장치 |
| JP3927344B2 (ja) * | 2000-01-19 | 2007-06-06 | 本田技研工業株式会社 | 加湿装置 |
| JP3869999B2 (ja) * | 2000-03-30 | 2007-01-17 | キヤノン株式会社 | 露光装置および半導体デバイス製造方法 |
| JP2002158170A (ja) * | 2000-09-08 | 2002-05-31 | Nikon Corp | 露光装置及びデバイス製造方法 |
| DE10054473A1 (de) * | 2000-11-03 | 2002-05-08 | Siemens Ag | Verfahren zum Austausch von Datenpaketen zwischen zwei Diensteerbringern eines Funkübertragungssystems |
| JP2002158154A (ja) * | 2000-11-16 | 2002-05-31 | Canon Inc | 露光装置 |
| DE10059910C2 (de) * | 2000-12-01 | 2003-01-16 | Daimler Chrysler Ag | Vorrichtung zur kontinuierlichen Befeuchtung und Entfeuchtung der Zuluft von Fertigungsprozessen oder Raumlufttechnik-Anlagen |
| US6842998B2 (en) * | 2001-04-06 | 2005-01-18 | Akrion Llc | Membrane dryer |
| US6514313B1 (en) * | 2001-06-22 | 2003-02-04 | Aeronex, Inc. | Gas purification system and method |
| US6828569B2 (en) * | 2001-11-19 | 2004-12-07 | Asml Netherlands B.V. | Lithographic projection apparatus, device manufacturing method and device manufactured thereby |
| US6724460B2 (en) * | 2001-11-19 | 2004-04-20 | Asml Netherlands B.V. | Lithographic projection apparatus, device manufacturing method, device manufactured thereby, cleaning unit and method of cleaning contaminated objects |
| US20030162305A1 (en) * | 2002-02-25 | 2003-08-28 | Daniel Alvarez | Gas contaminant detection and quantification method |
| US6638341B1 (en) * | 2002-06-14 | 2003-10-28 | Aeronex, Inc. | Method for rapid activation or preconditioning of porous gas purification substrates |
| EP1527492A2 (de) * | 2002-07-18 | 2005-05-04 | DaimlerChrysler AG | Vorrichtung und verfahren zur befeuchtung eines gasstroms |
| EP1595132B1 (en) * | 2003-02-21 | 2007-01-17 | Entegris, Inc. | Method for analysis of contaminants in a process fluid stream |
| US6913654B2 (en) * | 2003-06-02 | 2005-07-05 | Mykrolis Corporation | Method for the removal of airborne molecular contaminants using water gas mixtures |
| US20060285091A1 (en) * | 2003-07-21 | 2006-12-21 | Parekh Bipin S | Lithographic projection apparatus, gas purging method, device manufacturing method and purge gas supply system related application |
-
2006
- 2006-04-03 US US11/396,823 patent/US20060285091A1/en not_active Abandoned
-
2007
- 2007-03-28 EP EP07754421A patent/EP2002309A1/en not_active Ceased
- 2007-03-28 CN CN2011102111005A patent/CN102298270A/zh active Pending
- 2007-03-28 WO PCT/US2007/007901 patent/WO2007120451A1/en not_active Ceased
- 2007-03-28 KR KR1020087024264A patent/KR20080109813A/ko not_active Withdrawn
- 2007-03-28 CN CN2007800115338A patent/CN101410760B/zh not_active Expired - Fee Related
- 2007-03-28 JP JP2009504215A patent/JP2009532901A/ja active Pending
- 2007-03-28 SG SG2011046695A patent/SG173318A1/en unknown
- 2007-03-29 TW TW096111016A patent/TW200745727A/zh unknown
- 2007-03-29 TW TW100123486A patent/TW201202869A/zh unknown
-
2008
- 2008-07-11 US US12/218,091 patent/US20090231559A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6582496B1 (en) * | 2000-01-28 | 2003-06-24 | Mykrolis Corporation | Hollow fiber membrane contactor |
| US20040023490A1 (en) * | 2002-07-31 | 2004-02-05 | Dirk Wollstein | Method of controlling the chemical mechanical polishing of stacked layers having a surface topology |
| WO2005010619A2 (en) * | 2003-07-21 | 2005-02-03 | Entegris, Inc. | Lithographic projection apparatus, purge gas supply system and gas purging |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI707194B (zh) * | 2018-09-28 | 2020-10-11 | 台灣積體電路製造股份有限公司 | 操作極紫外光產生裝置之方法及極紫外輻射產生裝置 |
| US10877378B2 (en) | 2018-09-28 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Vessel for extreme ultraviolet radiation source |
| CN117405479A (zh) * | 2023-08-11 | 2024-01-16 | 陕西裕隆气体有限公司 | 一种微量多组分混合气配制工艺方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200745727A (en) | 2007-12-16 |
| TW201202869A (en) | 2012-01-16 |
| SG173318A1 (en) | 2011-08-29 |
| CN101410760A (zh) | 2009-04-15 |
| US20060285091A1 (en) | 2006-12-21 |
| JP2009532901A (ja) | 2009-09-10 |
| CN101410760B (zh) | 2011-09-21 |
| EP2002309A1 (en) | 2008-12-17 |
| US20090231559A1 (en) | 2009-09-17 |
| WO2007120451A1 (en) | 2007-10-25 |
| KR20080109813A (ko) | 2008-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102298270A (zh) | 微影投射设备、气体洗涤方法、装置制造方法及洗涤气体的供应系统 | |
| US7879137B2 (en) | Lithographic projection apparatus, purge gas supply system and gas purging method | |
| US7866637B2 (en) | Humidifying apparatus, lithographic apparatus and humidifying method | |
| JP5574799B2 (ja) | 露光装置、それを用いたデバイスの製造方法、並びに気体供給装置 | |
| WO2011146432A2 (en) | Controlled vaporization system and method for surface priming in semiconductor manufacturing | |
| WO2008024263A1 (en) | System and method for vortex condensation trapping in purge gas humidification |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111228 |