TW200745567A - Probe assembly - Google Patents
Probe assemblyInfo
- Publication number
- TW200745567A TW200745567A TW096112792A TW96112792A TW200745567A TW 200745567 A TW200745567 A TW 200745567A TW 096112792 A TW096112792 A TW 096112792A TW 96112792 A TW96112792 A TW 96112792A TW 200745567 A TW200745567 A TW 200745567A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- support
- slit
- supported
- bar
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006129333A JP4916763B2 (ja) | 2006-05-08 | 2006-05-08 | プローブ組立体 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200745567A true TW200745567A (en) | 2007-12-16 |
TWI325963B TWI325963B (ja) | 2010-06-11 |
Family
ID=38837893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096112792A TW200745567A (en) | 2006-05-08 | 2007-04-12 | Probe assembly |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4916763B2 (ja) |
KR (1) | KR100863987B1 (ja) |
TW (1) | TW200745567A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116908500A (zh) * | 2023-09-12 | 2023-10-20 | 上海泽丰半导体科技有限公司 | 一种通用测试平台探针塔的拆装方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5396104B2 (ja) * | 2009-03-05 | 2014-01-22 | 株式会社日本マイクロニクス | プローブ組立体 |
JP5690105B2 (ja) * | 2009-11-26 | 2015-03-25 | 株式会社日本マイクロニクス | プローブ装置 |
JP5588892B2 (ja) * | 2010-12-03 | 2014-09-10 | 株式会社日本マイクロニクス | プローブ組立体 |
KR102265960B1 (ko) * | 2020-12-29 | 2021-06-17 | 주식회사 프로이천 | 프로브 블록 |
KR102477553B1 (ko) * | 2021-01-22 | 2022-12-15 | 주식회사 디앤에스시스템 | 디스플레이 패널 검사용 프로브 핀 블록 |
KR102294168B1 (ko) * | 2021-06-18 | 2021-08-25 | 이시훈 | 블레이드형 프로브 블록 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3750831B2 (ja) * | 1996-10-28 | 2006-03-01 | 株式会社日本マイクロニクス | プローブ組立体 |
JP2000111574A (ja) * | 1998-10-01 | 2000-04-21 | Mitsubishi Electric Corp | プローブカード |
JP2004069485A (ja) * | 2002-08-06 | 2004-03-04 | Yamaha Corp | プローブユニットおよびその製造方法、プローブカードおよびその製造方法 |
JP2006098278A (ja) * | 2004-09-30 | 2006-04-13 | Micronics Japan Co Ltd | プローブ及びプローブ組立体 |
KR100615907B1 (ko) | 2005-12-12 | 2006-08-28 | (주)엠씨티코리아 | 평판표시패널 검사용 프로브 장치 |
-
2006
- 2006-05-08 JP JP2006129333A patent/JP4916763B2/ja active Active
-
2007
- 2007-04-12 TW TW096112792A patent/TW200745567A/zh unknown
- 2007-05-08 KR KR1020070044361A patent/KR100863987B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116908500A (zh) * | 2023-09-12 | 2023-10-20 | 上海泽丰半导体科技有限公司 | 一种通用测试平台探针塔的拆装方法 |
CN116908500B (zh) * | 2023-09-12 | 2023-12-01 | 上海泽丰半导体科技有限公司 | 一种通用测试平台探针塔的拆装方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4916763B2 (ja) | 2012-04-18 |
TWI325963B (ja) | 2010-06-11 |
KR100863987B1 (ko) | 2008-10-16 |
JP2007303834A (ja) | 2007-11-22 |
KR20070108824A (ko) | 2007-11-13 |
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