TW200737551A - Semiconductor device and method for manufacturing the same - Google Patents

Semiconductor device and method for manufacturing the same

Info

Publication number
TW200737551A
TW200737551A TW095149150A TW95149150A TW200737551A TW 200737551 A TW200737551 A TW 200737551A TW 095149150 A TW095149150 A TW 095149150A TW 95149150 A TW95149150 A TW 95149150A TW 200737551 A TW200737551 A TW 200737551A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting element
semiconductor device
substrate
sealing structure
Prior art date
Application number
TW095149150A
Other languages
English (en)
Inventor
Masahiro Sunohara
Mitsutoshi Higashi
Yuichi Taguchi
Hideaki Sakaguchi
Akinori Shiraishi
Koizumi Naoyuki
Murayama Kei
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200737551A publication Critical patent/TW200737551A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW095149150A 2005-12-27 2006-12-27 Semiconductor device and method for manufacturing the same TW200737551A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005375901A JP5073946B2 (ja) 2005-12-27 2005-12-27 半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW200737551A true TW200737551A (en) 2007-10-01

Family

ID=37856605

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149150A TW200737551A (en) 2005-12-27 2006-12-27 Semiconductor device and method for manufacturing the same

Country Status (5)

Country Link
US (1) US7655956B2 (zh)
EP (1) EP1804302B1 (zh)
JP (1) JP5073946B2 (zh)
KR (1) KR20070069056A (zh)
TW (1) TW200737551A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8791549B2 (en) 2009-09-22 2014-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer backside interconnect structure connected to TSVs
US8900994B2 (en) 2011-06-09 2014-12-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method for producing a protective structure
US10163756B2 (en) 2009-01-05 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Isolation structure for stacked dies

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080169480A1 (en) * 2007-01-11 2008-07-17 Visera Technologies Company Limited Optoelectronic device package and packaging method thereof
US8647517B2 (en) 2007-07-09 2014-02-11 Nitto Denko Corporation Producing method of suspension board with circuit
DE102008006757A1 (de) * 2008-01-30 2009-08-06 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Bauelement
JP5359045B2 (ja) * 2008-06-18 2013-12-04 日亜化学工業株式会社 半導体装置およびその製造方法
US9252336B2 (en) 2008-09-26 2016-02-02 Bridgelux, Inc. Multi-cup LED assembly
US8058664B2 (en) * 2008-09-26 2011-11-15 Bridgelux, Inc. Transparent solder mask LED assembly
TWI456798B (zh) * 2010-04-23 2014-10-11 Formosa Epitaxy Inc 發光裝置之製造方法
KR101143473B1 (ko) * 2010-05-06 2012-05-08 (주) 이피웍스 웨이퍼 레벨 엘이디 인터포저
CN102376848A (zh) * 2010-08-27 2012-03-14 璨圆光电股份有限公司 发光装置的制造方法
JP5887638B2 (ja) 2011-05-30 2016-03-16 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオード
US8952402B2 (en) 2011-08-26 2015-02-10 Micron Technology, Inc. Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
CN104241499A (zh) * 2014-06-25 2014-12-24 中国科学院微电子研究所 一种倒装芯片塑封结构及制造方法
US9595642B2 (en) 2015-06-29 2017-03-14 Point Engineering Co., Ltd. Chip substrate comprising a plated layer and chip package using the same
DE102015111910A1 (de) * 2015-07-22 2017-01-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verbund von optoelektronischen Bauelementen und Verfahren zur Herstellung eines optoelektronischen Bauelements
WO2018113922A1 (en) * 2016-12-20 2018-06-28 Osram Opto Semiconductors Gmbh Light emitting element with an optoelectronic semiconductor chip

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3329716B2 (ja) 1997-12-15 2002-09-30 日亜化学工業株式会社 チップタイプｌｅｄ
JP2001296310A (ja) * 2000-04-18 2001-10-26 Koji Ono 光センサおよびその製造方法
JP3614776B2 (ja) * 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法
US7075112B2 (en) * 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
TW546800B (en) * 2002-06-27 2003-08-11 Via Tech Inc Integrated moduled board embedded with IC chip and passive device and its manufacturing method
JP4182783B2 (ja) * 2003-03-14 2008-11-19 豊田合成株式会社 Ｌｅｄパッケージ
JP4238681B2 (ja) * 2003-09-17 2009-03-18 豊田合成株式会社 発光装置
US20080025030A9 (en) * 2003-09-23 2008-01-31 Lee Kong W Ceramic packaging for high brightness LED devices
WO2005031882A1 (ja) * 2003-09-30 2005-04-07 Kabushiki Kaisha Toshiba 発光装置
KR100586944B1 (ko) * 2003-12-26 2006-06-07 삼성전기주식회사 고출력 발광다이오드 패키지 및 제조방법
JP2007123438A (ja) * 2005-10-26 2007-05-17 Toyoda Gosei Co Ltd 蛍光体板及びこれを備えた発光装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10163756B2 (en) 2009-01-05 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Isolation structure for stacked dies
US8791549B2 (en) 2009-09-22 2014-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer backside interconnect structure connected to TSVs
TWI453879B (zh) * 2009-09-22 2014-09-21 Taiwan Semiconductor Mfg 積體電路結構
US9716074B2 (en) 2009-09-22 2017-07-25 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer backside interconnect structure connected to TSVs
US9978708B2 (en) 2009-09-22 2018-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer backside interconnect structure connected to TSVs
US8900994B2 (en) 2011-06-09 2014-12-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method for producing a protective structure
US9633900B2 (en) 2011-06-09 2017-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method for through silicon via structure
US9997497B2 (en) 2011-06-09 2018-06-12 Taiwan Semiconductor Manufacturing Company, Ltd. Through silicon via structure

Also Published As

Publication number Publication date
JP5073946B2 (ja) 2012-11-14
EP1804302B1 (en) 2016-03-09
KR20070069056A (ko) 2007-07-02
JP2007180204A (ja) 2007-07-12
EP1804302A2 (en) 2007-07-04
US7655956B2 (en) 2010-02-02
US20070145400A1 (en) 2007-06-28
EP1804302A3 (en) 2011-06-29

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