TW200735990A - Method for cutting substrate and substrate cutting apparatus using the same - Google Patents

Method for cutting substrate and substrate cutting apparatus using the same

Info

Publication number
TW200735990A
TW200735990A TW095142894A TW95142894A TW200735990A TW 200735990 A TW200735990 A TW 200735990A TW 095142894 A TW095142894 A TW 095142894A TW 95142894 A TW95142894 A TW 95142894A TW 200735990 A TW200735990 A TW 200735990A
Authority
TW
Taiwan
Prior art keywords
substrate
cutting
mother substrate
same
mother
Prior art date
Application number
TW095142894A
Other languages
English (en)
Chinese (zh)
Inventor
Myung-Il Park
Kyung-Seop Kim
Yong-Eui Lee
Dong-Chin Lee
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200735990A publication Critical patent/TW200735990A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66D—CAPSTANS; WINCHES; TACKLES, e.g. PULLEY BLOCKS; HOISTS
    • B66D1/00—Rope, cable, or chain winding mechanisms; Capstans
    • B66D1/54—Safety gear
    • B66D1/58—Safety gear responsive to excess of load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66D—CAPSTANS; WINCHES; TACKLES, e.g. PULLEY BLOCKS; HOISTS
    • B66D1/00—Rope, cable, or chain winding mechanisms; Capstans
    • B66D1/28—Other constructional details
    • B66D1/40—Control devices
    • B66D1/48—Control devices automatic
    • B66D1/485—Control devices automatic electrical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66D—CAPSTANS; WINCHES; TACKLES, e.g. PULLEY BLOCKS; HOISTS
    • B66D2700/00—Capstans, winches or hoists
    • B66D2700/02—Hoists or accessories for hoists
    • B66D2700/023—Hoists
    • B66D2700/025—Hoists motor operated

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW095142894A 2006-03-28 2006-11-20 Method for cutting substrate and substrate cutting apparatus using the same TW200735990A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060028050A KR20070097189A (ko) 2006-03-28 2006-03-28 기판 절단 방법 및 이에 사용되는 기판 절단 장치

Publications (1)

Publication Number Publication Date
TW200735990A true TW200735990A (en) 2007-10-01

Family

ID=38574063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095142894A TW200735990A (en) 2006-03-28 2006-11-20 Method for cutting substrate and substrate cutting apparatus using the same

Country Status (5)

Country Link
US (1) US20070235418A1 (enrdf_load_stackoverflow)
JP (1) JP2007260773A (enrdf_load_stackoverflow)
KR (1) KR20070097189A (enrdf_load_stackoverflow)
CN (1) CN101046571B (enrdf_load_stackoverflow)
TW (1) TW200735990A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566870B (zh) * 2014-09-30 2017-01-21 國立交通大學 雷射加工方法及雷射加工物
TWI574767B (zh) * 2014-07-29 2017-03-21 Improved laser structure

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7626138B2 (en) * 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
JP2007142000A (ja) * 2005-11-16 2007-06-07 Denso Corp レーザ加工装置およびレーザ加工方法
JP5243098B2 (ja) * 2008-05-09 2013-07-24 株式会社ディスコ レーザー加工装置
KR101107859B1 (ko) * 2008-09-12 2012-01-31 오므론 가부시키가이샤 할단용 스크라이브선의 형성 방법 및 장치
JP5261168B2 (ja) * 2008-12-26 2013-08-14 Ｔｏｗａ株式会社 電子部品製造用の切断装置及び切断方法
KR101041140B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 방법
WO2012037468A1 (en) 2010-09-16 2012-03-22 Raydiance, Inc. Singulation of layered materials using selectively variable laser output
US8933367B2 (en) * 2011-02-09 2015-01-13 Sumitomo Electric Industries, Ltd. Laser processing method
US8735772B2 (en) * 2011-02-20 2014-05-27 Electro Scientific Industries, Inc. Method and apparatus for improved laser scribing of opto-electric devices
WO2013019204A1 (en) * 2011-08-01 2013-02-07 Ipg Photonics Corporation Method and apparatus for processing materials with composite structure
KR101355883B1 (ko) * 2012-02-08 2014-01-28 (주)정원기술 미세선폭을 갖는 바이오센서 제조를 위한 레이저 위치보정 장치 및 방법
CN102632335A (zh) * 2012-04-25 2012-08-15 肖和平 表层高反射率材料的激光加工方法
DE102013005137A1 (de) * 2013-03-26 2014-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Abtragen von sprödhartem Material mittels Laserstrahlung
JP2015062943A (ja) * 2013-09-26 2015-04-09 株式会社ディスコ レーザ加工装置、レーザ加工方法
KR102103502B1 (ko) 2013-10-21 2020-04-23 삼성디스플레이 주식회사 기판 절단 방법
US10239155B1 (en) * 2014-04-30 2019-03-26 The Boeing Company Multiple laser beam processing
LT6240B (lt) * 2014-05-16 2016-01-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Skaidrių terpių lazerinis pjovimo būdas ir įrenginys
CN106271111B (zh) * 2016-09-26 2019-11-22 华中科技大学 一种多焦点激光分离夹层玻璃方法及装置
JP7148513B2 (ja) * 2016-11-18 2022-10-05 アイピージー フォトニクス コーポレーション 物質のレーザー処理用のシステム及び方法
CN107243690A (zh) * 2017-07-13 2017-10-13 华中科技大学 一种激光多焦点动态加工方法及系统
KR102069718B1 (ko) 2018-02-28 2020-01-23 공주대학교 산학협력단 하이패스필터를 이용한 스핀들 감시 시스템
US11215552B2 (en) * 2018-06-14 2022-01-04 The Boeing Company Apparatus and method for bond inspection with limited access
TWI681241B (zh) * 2018-12-04 2020-01-01 友達光電股份有限公司 顯示裝置製作方法及使用該方法製作的顯示裝置
CN110293326B (zh) * 2019-07-30 2021-04-13 长沙理工大学 一种双光束激光切割厚板的方法
CN112935528B (zh) * 2021-01-29 2023-05-23 西安工业大学 一种针对厚度较大晶圆进行高质量切割的方法和装置
CN117340450A (zh) * 2023-12-06 2024-01-05 国科大杭州高等研究院 晶圆切割系统和方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5916344A (ja) * 1982-07-19 1984-01-27 Toshiba Corp ウエハのレ−ザスクライブ装置
US6192022B1 (en) * 1997-05-23 2001-02-20 U.S. Philips Corporation Focusing a light beam more than thirty focal depths from the aplanatic point with a plano-convex lens
US6188041B1 (en) * 1998-11-13 2001-02-13 Korea Atomic Energy Research Institute Method and apparatus for real-time weld process monitoring in a pulsed laser welding
US6562698B2 (en) * 1999-06-08 2003-05-13 Kulicke & Soffa Investments, Inc. Dual laser cutting of wafers
JP2002224871A (ja) * 2001-01-31 2002-08-13 Seiko Epson Corp レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置
JP4838531B2 (ja) * 2005-04-27 2011-12-14 サイバーレーザー株式会社 板状体切断方法並びにレーザ加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI574767B (zh) * 2014-07-29 2017-03-21 Improved laser structure
TWI566870B (zh) * 2014-09-30 2017-01-21 國立交通大學 雷射加工方法及雷射加工物

Also Published As

Publication number Publication date
CN101046571B (zh) 2011-10-12
KR20070097189A (ko) 2007-10-04
CN101046571A (zh) 2007-10-03
US20070235418A1 (en) 2007-10-11
JP2007260773A (ja) 2007-10-11

Similar Documents

Publication Publication Date Title
TW200735990A (en) Method for cutting substrate and substrate cutting apparatus using the same
WO2008114470A1 (ja) プラスチック基板の切断方法、及びプラスチック基板の切断装置
TW200628885A (en) Repairing device and repairing method for display device
WO2006114594A3 (en) Printing system
WO2009047990A1 (ja) 脆性材料基板、および、脆性材料基板のレーザスクライブ方法、レーザスクライブ装置
WO2009126907A3 (en) Laser-scribing platform and hybrid writing strategy
WO2012173770A3 (en) Multi-step and asymmetrically shaped laser beam scribing
JP2007260773A5 (enrdf_load_stackoverflow)
WO2008058671A3 (de) Projektions-vorrichtung mit verbesserter projektionseigenschaft
WO2008126742A4 (ja) レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
TW200733240A (en) Systems and methods for processing a film, and thin films
TW200721285A (en) Laser processing method for wafer
EP2353768A3 (en) Laser beam irradiation apparatus for substrate sealing, substrate sealing method, and method of manufacturing organic light emitting display device using the same
TW200600883A (en) Fine pattern modification device and modification method of the fine pattern defect
WO2008120102A3 (de) Methode zum laserritzen von solarzellen
TW200834247A (en) Lamination apparatus of liquid crystal panel and lamination method of lamination of a liquid crystal panel
WO2009104886A3 (ko) 레이저 가공장치
DE502007004829D1 (de) Vorrichtung und Verfahren zum Schweißen eines Werkstückes
TW200633229A (en) Laser apparatus and manufacturing method of thin film transistor using the same
TW200633809A (en) Method and device for separating products with a controlled cut edge, and separated product
WO2009027476A3 (en) A thin-film solar cell system and method and apparatus for manufacturing a thin-film solar cell
TWI265982B (en) Method of crystallizing silicon
GB201112285D0 (en) Method and apparatus for dividing thin film device into separate cells
JP2007290304A5 (ja) 脆性シート材分断方法及び脆性シート材分断装置
TW200705440A (en) Lens positioning method, cutting method, positioning method, and cutting apparatus