TW200732843A - Photosensitive resin composition and manufacturing method of semiconductor device using the same - Google Patents
Photosensitive resin composition and manufacturing method of semiconductor device using the sameInfo
- Publication number
- TW200732843A TW200732843A TW096102479A TW96102479A TW200732843A TW 200732843 A TW200732843 A TW 200732843A TW 096102479 A TW096102479 A TW 096102479A TW 96102479 A TW96102479 A TW 96102479A TW 200732843 A TW200732843 A TW 200732843A
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- semiconductor device
- resin composition
- photosensitive resin
- same
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F7/00—Signs, name or number plates, letters, numerals, or symbols; Panels or boards
- G09F7/02—Signs, plates, panels or boards using readily-detachable elements bearing or forming symbols
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/0413—Frames or casing structures therefor
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/0418—Constructional details
- G09F13/0445—Frames
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F7/00—Signs, name or number plates, letters, numerals, or symbols; Panels or boards
- G09F7/16—Letters, numerals, or other symbols adapted for permanent fixing to a support
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/18—Edge-illuminated signs
- G09F2013/1886—Special effects
- G09F2013/189—Three dimensional effects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
- Polyamides (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006015346A JP4625769B2 (ja) | 2006-01-24 | 2006-01-24 | 感光性樹脂組成物及びそれを用いた半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200732843A true TW200732843A (en) | 2007-09-01 |
TWI390351B TWI390351B (zh) | 2013-03-21 |
Family
ID=37812861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096102479A TWI390351B (zh) | 2006-01-24 | 2007-01-23 | 感光性樹脂組成物及使用它之半導體裝置之製法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7368216B2 (zh) |
EP (1) | EP1811340A3 (zh) |
JP (1) | JP4625769B2 (zh) |
KR (1) | KR20070077795A (zh) |
TW (1) | TWI390351B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI386436B (zh) * | 2007-12-26 | 2013-02-21 | Asahi Kasei Emd Corp | A heat-resistant resin precursor, and a photosensitive resin composition using the same |
TWI707889B (zh) * | 2017-08-01 | 2020-10-21 | 日商旭化成股份有限公司 | 半導體裝置及其製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007225942A (ja) * | 2006-02-24 | 2007-09-06 | Asahi Kasei Electronics Co Ltd | ポジ型感光性樹脂組成物 |
JP4911454B2 (ja) | 2006-09-19 | 2012-04-04 | 富士フイルム株式会社 | ポリベンゾオキサゾール前駆体、それを用いた感光性樹脂組成物及び半導体装置の製造方法 |
MY155853A (en) * | 2008-07-22 | 2015-12-15 | Sumitomo Bakelite Co | Positive photosensitive resin composition, cured film, protecting film, insulating film and semiconductor and display devices using the same. |
US8231785B2 (en) * | 2009-05-12 | 2012-07-31 | Uop Llc | Staged membrane system for gas, vapor, and liquid separations |
CN108558671A (zh) * | 2018-04-17 | 2018-09-21 | 广东医科大学 | 一种2,2’-二氨基-联苯二甲酸的制备方法 |
US11822237B2 (en) * | 2020-03-30 | 2023-11-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing a semiconductor device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3442049B2 (ja) * | 2000-03-29 | 2003-09-02 | 住友ベークライト株式会社 | 耐熱性樹脂前駆体、耐熱性樹脂及び絶縁膜並びに半導体装置 |
JP2003221444A (ja) * | 2001-11-26 | 2003-08-05 | Kansai Paint Co Ltd | ポリベンゾオキサゾール前駆体及びそれを用いた被覆用組成物 |
KR20030043702A (ko) * | 2001-11-26 | 2003-06-02 | 간사이 페인트 가부시키가이샤 | 폴리벤족사졸 전구체 및 그것을 이용하는 피복용 조성물 |
JP4556616B2 (ja) * | 2003-10-28 | 2010-10-06 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法 |
JP2005148111A (ja) | 2003-11-11 | 2005-06-09 | Toray Ind Inc | 感光性樹脂前駆体組成物 |
JP4327616B2 (ja) | 2004-01-26 | 2009-09-09 | 旭化成イーマテリアルズ株式会社 | 感光性コーティング樹脂組成物 |
JP2006018191A (ja) * | 2004-07-05 | 2006-01-19 | Sumitomo Bakelite Co Ltd | ポジ型感光性樹脂組成物の製造方法並びに半導体装置及び表示素子 |
US7803510B2 (en) * | 2005-08-17 | 2010-09-28 | Fujifilm Electronic Materials U.S.A., Inc. | Positive photosensitive polybenzoxazole precursor compositions |
-
2006
- 2006-01-24 JP JP2006015346A patent/JP4625769B2/ja active Active
-
2007
- 2007-01-22 US US11/655,905 patent/US7368216B2/en active Active
- 2007-01-23 TW TW096102479A patent/TWI390351B/zh not_active IP Right Cessation
- 2007-01-23 EP EP07001388.3A patent/EP1811340A3/en not_active Withdrawn
- 2007-01-24 KR KR1020070007646A patent/KR20070077795A/ko not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI386436B (zh) * | 2007-12-26 | 2013-02-21 | Asahi Kasei Emd Corp | A heat-resistant resin precursor, and a photosensitive resin composition using the same |
TWI707889B (zh) * | 2017-08-01 | 2020-10-21 | 日商旭化成股份有限公司 | 半導體裝置及其製造方法 |
TWI803315B (zh) * | 2017-08-01 | 2023-05-21 | 日商旭化成股份有限公司 | 半導體裝置及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4625769B2 (ja) | 2011-02-02 |
US7368216B2 (en) | 2008-05-06 |
KR20070077795A (ko) | 2007-07-27 |
TWI390351B (zh) | 2013-03-21 |
EP1811340A3 (en) | 2013-12-04 |
US20070172753A1 (en) | 2007-07-26 |
JP2007199187A (ja) | 2007-08-09 |
EP1811340A2 (en) | 2007-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |