TW200728729A - Probing apparatus - Google Patents

Probing apparatus

Info

Publication number
TW200728729A
TW200728729A TW095141825A TW95141825A TW200728729A TW 200728729 A TW200728729 A TW 200728729A TW 095141825 A TW095141825 A TW 095141825A TW 95141825 A TW95141825 A TW 95141825A TW 200728729 A TW200728729 A TW 200728729A
Authority
TW
Taiwan
Prior art keywords
screws
circuit board
printed circuit
outer circumferential
retainer plate
Prior art date
Application number
TW095141825A
Other languages
English (en)
Other versions
TWI317019B (zh
Inventor
Takashi Amemiya
Syuichi Tsukada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200728729A publication Critical patent/TW200728729A/zh
Application granted granted Critical
Publication of TWI317019B publication Critical patent/TWI317019B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
TW095141825A 2005-11-11 2006-11-10 Probing apparatus TW200728729A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005327462A JP4860242B2 (ja) 2005-11-11 2005-11-11 プローブ装置

Publications (2)

Publication Number Publication Date
TW200728729A true TW200728729A (en) 2007-08-01
TWI317019B TWI317019B (zh) 2009-11-11

Family

ID=37716047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095141825A TW200728729A (en) 2005-11-11 2006-11-10 Probing apparatus

Country Status (5)

Country Link
US (1) US8063652B2 (zh)
EP (1) EP1785733A1 (zh)
JP (1) JP4860242B2 (zh)
KR (1) KR101337843B1 (zh)
TW (1) TW200728729A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105102990A (zh) * 2013-04-09 2015-11-25 泰克诺探头公司 电子器件的测试头

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* Cited by examiner, † Cited by third party
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WO2008123076A1 (ja) * 2007-03-26 2008-10-16 Advantest Corporation 接続用ボード、プローブカード及びそれを備えた電子部品試験装置
DE102007027380A1 (de) * 2007-06-11 2008-12-18 Micronas Gmbh Nadelkartenanordnung
JP5046764B2 (ja) * 2007-07-09 2012-10-10 株式会社日本マイクロニクス プローブ組立体
KR100911660B1 (ko) * 2007-07-11 2009-08-10 (주)엠투엔 프로브 카드의 기판 조립체 및 이를 포함하는 프로브 카드
KR101328082B1 (ko) 2007-08-07 2013-11-08 (주) 미코에스앤피 프로브 카드
US7791361B2 (en) 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
KR101045671B1 (ko) * 2008-02-05 2011-07-01 윌테크놀러지(주) 공간 변환기를 포함하는 프로브 카드
JP5406464B2 (ja) * 2008-04-17 2014-02-05 日本電子材料株式会社 プローブカード
US20090277670A1 (en) * 2008-05-10 2009-11-12 Booth Jr Roger A High Density Printed Circuit Board Interconnect and Method of Assembly
DE102008034918B4 (de) * 2008-07-26 2012-09-27 Feinmetall Gmbh Elektrische Prüfeinrichtung für die Prüfung eines elektrischen Prüflings sowie elektrisches Prüfverfahren
KR101016383B1 (ko) * 2008-12-19 2011-02-21 주식회사 에이엠에스티 평탄화 모듈을 구비한 프로브 카드
KR101583000B1 (ko) 2009-03-09 2016-01-19 삼성전자주식회사 반도체 디바이스 테스트 장치 및 방법
JP5826466B2 (ja) * 2010-06-25 2015-12-02 東京エレクトロン株式会社 プローブカードの平行調整機構及び検査装置
KR101270036B1 (ko) * 2011-06-08 2013-06-10 수도 겐조 칩 검사용 프로브 장치
KR101703688B1 (ko) * 2012-05-02 2017-02-07 리노공업주식회사 테스트 소켓
JP2014027020A (ja) * 2012-07-24 2014-02-06 Toshiba Corp 回路基板、電子機器、および回路基板の製造方法
TWI484191B (zh) * 2012-09-28 2015-05-11 Hermes Epitek Corp 電路測試探針卡
TWI479158B (zh) * 2013-01-28 2015-04-01 Mpi Corp 晶圓測試探針卡
CN110573888B (zh) * 2017-04-12 2021-11-23 凯觅科技股份有限公司 低插入力连接器组件及半导体部件试验装置
KR101922848B1 (ko) 2018-11-05 2018-11-27 김재길 탄성체가 설치된 프로브카드
KR102388033B1 (ko) * 2020-07-15 2022-04-20 (주)엠투엔 프로브 카드
CN114389122B (zh) * 2022-01-28 2023-05-26 强一半导体（苏州）有限公司 一种垂直式弯形mems探针插针装置及其插针方法

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JPH05264589A (ja) 1991-12-17 1993-10-12 Matsushita Electron Corp 半導体集積回路の検査装置
JPH06124982A (ja) * 1992-01-14 1994-05-06 Mitsubishi Electric Corp 半導体試験装置
JP3135378B2 (ja) * 1992-08-10 2001-02-13 ローム株式会社 半導体試験装置
JPH06163656A (ja) 1992-11-26 1994-06-10 Sony Corp 半導体測定装置
US5640100A (en) 1994-10-22 1997-06-17 Tokyo Electron Limited Probe apparatus having probe card exchanging mechanism
KR100324059B1 (ko) 1994-11-15 2002-04-17 이고르 와이. 칸드로스 초소형 전자 부품용 상호 접속 요소
JP2834076B2 (ja) 1996-05-30 1998-12-09 九州日本電気株式会社 ウェハプローバ
JPH1026635A (ja) 1996-07-11 1998-01-27 Advantest Corp プローブカード
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP2002184823A (ja) 2000-12-13 2002-06-28 Sony Corp プローブ装置
KR100863114B1 (ko) * 2001-06-18 2008-10-13 가부시키가이샤 어드밴티스트 평면 조정 기구를 갖는 프로우브 콘택트 시스템
US6762612B2 (en) * 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
JP4123408B2 (ja) * 2001-12-13 2008-07-23 東京エレクトロン株式会社 プローブカード交換装置
JP3621938B2 (ja) * 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
JP2004205487A (ja) * 2002-11-01 2004-07-22 Tokyo Electron Ltd プローブカードの固定機構
TWI232938B (en) * 2004-02-11 2005-05-21 Star Techn Inc Probe card
US7230437B2 (en) * 2004-06-15 2007-06-12 Formfactor, Inc. Mechanically reconfigurable vertical tester interface for IC probing
JP2006010629A (ja) * 2004-06-29 2006-01-12 Tokyo Electron Ltd 平行調整機構を備えたプローブカード
TWI294523B (en) * 2004-07-28 2008-03-11 Microelectonics Technology Inc Integrated circuit probe card
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105102990A (zh) * 2013-04-09 2015-11-25 泰克诺探头公司 电子器件的测试头

Also Published As

Publication number Publication date
US8063652B2 (en) 2011-11-22
KR20070050841A (ko) 2007-05-16
EP1785733A1 (en) 2007-05-16
JP4860242B2 (ja) 2012-01-25
KR101337843B1 (ko) 2013-12-06
JP2007132846A (ja) 2007-05-31
TWI317019B (zh) 2009-11-11
US20070108996A1 (en) 2007-05-17

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