TW200726559A - Cutting off processing system for brittle material and method for the same - Google Patents

Cutting off processing system for brittle material and method for the same

Info

Publication number
TW200726559A
TW200726559A TW095129475A TW95129475A TW200726559A TW 200726559 A TW200726559 A TW 200726559A TW 095129475 A TW095129475 A TW 095129475A TW 95129475 A TW95129475 A TW 95129475A TW 200726559 A TW200726559 A TW 200726559A
Authority
TW
Taiwan
Prior art keywords
substrate
retaining
cutting line
processing system
stripes
Prior art date
Application number
TW095129475A
Other languages
English (en)
Other versions
TWI340054B (zh
Inventor
Masakazu Hayashi
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200726559A publication Critical patent/TW200726559A/zh
Application granted granted Critical
Publication of TWI340054B publication Critical patent/TWI340054B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW095129475A 2005-08-12 2006-08-11 Cutting off processing system for brittle material and method for the same TW200726559A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005234431 2005-08-12

Publications (2)

Publication Number Publication Date
TW200726559A true TW200726559A (en) 2007-07-16
TWI340054B TWI340054B (zh) 2011-04-11

Family

ID=37757497

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129475A TW200726559A (en) 2005-08-12 2006-08-11 Cutting off processing system for brittle material and method for the same

Country Status (4)

Country Link
JP (1) JP4815444B2 (zh)
KR (1) KR100971042B1 (zh)
TW (1) TW200726559A (zh)
WO (1) WO2007020835A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588106B (zh) * 2011-05-13 2017-06-21 日本電氣硝子股份有限公司 脆性板狀物的切斷裝置與切斷方法
TWI651280B (zh) * 2013-05-28 2019-02-21 日商Ａｇｃ股份有限公司 玻璃基板之切斷方法及玻璃基板之製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007055000A (ja) * 2005-08-23 2007-03-08 Japan Steel Works Ltd:The 非金属材料製の被加工物の切断方法及びその装置
JP5221560B2 (ja) * 2007-11-27 2013-06-26 三星ダイヤモンド工業株式会社 レーザ加工装置
WO2009084276A1 (ja) * 2007-12-27 2009-07-09 Mitsuboshi Diamond Industrial Co., Ltd. レーザ加工装置
WO2009084489A1 (ja) * 2007-12-28 2009-07-09 Mitsuboshi Diamond Industrial Co., Ltd. レーザ加工装置およびレーザ加工方法
JP5590642B2 (ja) * 2009-02-02 2014-09-17 独立行政法人国立高等専門学校機構 スクライブ加工装置及びスクライブ加工方法
JP2011131229A (ja) * 2009-12-24 2011-07-07 Hitachi High-Technologies Corp レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法
CN105171938B (zh) * 2015-09-19 2017-07-11 哈尔滨奥瑞德光电技术有限公司 c向蓝宝石晶棒a向平边的快速确定与加工方法
CN105328353B (zh) * 2015-10-30 2017-03-22 安徽江淮汽车集团股份有限公司 激光切割机的切割平台
CN105512400A (zh) * 2015-12-09 2016-04-20 大连理工大学 一种脆性材料切削过程仿真方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03489A (ja) * 1989-05-24 1991-01-07 Nippon Sekigaisen Kogyo Kk 被加工材料に発生する集中熱応力を用いたレーザーを熱源とする脆性材料の割断加工方法及び割断加工装置
JP2700136B2 (ja) * 1994-06-02 1998-01-19 双栄通商株式会社 脆性材料の割断方法
JPH10116801A (ja) * 1996-10-09 1998-05-06 Rohm Co Ltd 基板分割方法及びその基板分割を用いた発光素子製造 方法
JP2000247671A (ja) * 1999-03-04 2000-09-12 Takatori Corp ガラスの分断方法
US6489588B1 (en) * 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
JP2002100590A (ja) * 2000-09-22 2002-04-05 Sony Corp 割断装置及びその方法
JP2002178179A (ja) * 2000-12-12 2002-06-25 Sony Corp 割断装置及びその方法
JP2003002676A (ja) * 2001-06-19 2003-01-08 Seiko Epson Corp 基板の分割方法及び液晶装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588106B (zh) * 2011-05-13 2017-06-21 日本電氣硝子股份有限公司 脆性板狀物的切斷裝置與切斷方法
US10279568B2 (en) 2011-05-13 2019-05-07 Nippon Electric Glass Co., Ltd. Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
TWI651280B (zh) * 2013-05-28 2019-02-21 日商Ａｇｃ股份有限公司 玻璃基板之切斷方法及玻璃基板之製造方法

Also Published As

Publication number Publication date
KR20080023265A (ko) 2008-03-12
JPWO2007020835A1 (ja) 2009-02-26
TWI340054B (zh) 2011-04-11
WO2007020835A1 (ja) 2007-02-22
KR100971042B1 (ko) 2010-07-16
JP4815444B2 (ja) 2011-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees