TW200725946A - Photo semiconductor device and manufacturing method thereof - Google Patents

Photo semiconductor device and manufacturing method thereof

Info

Publication number
TW200725946A
TW200725946A TW095132380A TW95132380A TW200725946A TW 200725946 A TW200725946 A TW 200725946A TW 095132380 A TW095132380 A TW 095132380A TW 95132380 A TW95132380 A TW 95132380A TW 200725946 A TW200725946 A TW 200725946A
Authority
TW
Taiwan
Prior art keywords
die pad
disposed
bending portion
semiconductor device
lead
Prior art date
Application number
TW095132380A
Other languages
English (en)
Other versions
TWI350010B (zh
Inventor
Taizo Tomioka
Takahiro Suzuki
Hiroyuki Tokubo
Yukinori Aoki
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200725946A publication Critical patent/TW200725946A/zh
Application granted granted Critical
Publication of TWI350010B publication Critical patent/TWI350010B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
TW095132380A 2005-12-27 2006-09-01 Photo semiconductor device and manufacturing method thereof TW200725946A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005376253A JP5038623B2 (ja) 2005-12-27 2005-12-27 光半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
TW200725946A true TW200725946A (en) 2007-07-01
TWI350010B TWI350010B (zh) 2011-10-01

Family

ID=38192568

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132380A TW200725946A (en) 2005-12-27 2006-09-01 Photo semiconductor device and manufacturing method thereof

Country Status (4)

Country Link
US (1) US7947999B2 (zh)
JP (1) JP5038623B2 (zh)
CN (1) CN1992362B (zh)
TW (1) TW200725946A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511339B (zh) * 2013-02-06 2015-12-01 Lite On Electronics Guangzhou 發光二極體封裝件及其導線架

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JP5180690B2 (ja) * 2008-06-06 2013-04-10 アピックヤマダ株式会社 Ｌｅｄチップ実装用基板の製造方法、ｌｅｄチップ実装用基板のモールド金型、ｌｅｄチップ実装用基板、及び、ｌｅｄ
US8258526B2 (en) * 2008-07-03 2012-09-04 Samsung Led Co., Ltd. Light emitting diode package including a lead frame with a cavity
US9022632B2 (en) * 2008-07-03 2015-05-05 Samsung Electronics Co., Ltd. LED package and a backlight unit unit comprising said LED package
JP5227693B2 (ja) * 2008-08-11 2013-07-03 スタンレー電気株式会社 半導体発光装置
JP2010114218A (ja) * 2008-11-05 2010-05-20 Toshiba Corp 発光デバイス
DE102009004724A1 (de) * 2009-01-15 2010-07-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil
JP2010171073A (ja) * 2009-01-20 2010-08-05 Showa Denko Kk 発光装置、電気装置および表示装置
KR101574286B1 (ko) * 2009-01-21 2015-12-04 삼성전자 주식회사 발광 장치
KR101091504B1 (ko) * 2010-02-12 2011-12-08 엘지이노텍 주식회사 발광소자, 발광소자 패키지 및 발광소자 제조방법
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US8183578B2 (en) * 2010-03-02 2012-05-22 Taiwan Semiconductor Manufacturing Company, Ltd. Double flip-chip LED package components
JP5528900B2 (ja) * 2010-04-30 2014-06-25 ローム株式会社 発光素子モジュール
JP5533203B2 (ja) * 2010-04-30 2014-06-25 日亜化学工業株式会社 発光装置および発光装置の製造方法
KR101114719B1 (ko) * 2010-08-09 2012-02-29 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 시스템
DE102010045596A1 (de) * 2010-09-16 2012-03-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Halbleiterbauteil und Leiterrahmenvebund
JP5941249B2 (ja) * 2011-02-02 2016-06-29 日亜化学工業株式会社 発光装置
DE102011014584A1 (de) * 2011-03-21 2012-09-27 Osram Opto Semiconductors Gmbh Anschlussträger für Halbleiterchips und Halbleiterbauelement
DE102011101645A1 (de) * 2011-05-16 2012-11-22 Osram Opto Semiconductors Gmbh Mischlichtquelle
KR101823506B1 (ko) 2011-06-29 2018-01-30 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
CN102593339A (zh) * 2012-02-23 2012-07-18 日月光半导体制造股份有限公司 芯片构装
KR101908656B1 (ko) * 2012-04-09 2018-10-16 엘지이노텍 주식회사 발광 소자 패키지
CN103474565A (zh) * 2012-06-08 2013-12-25 赵依军 发光二极管单元与绝缘导热基板的连接
CN103579210B (zh) * 2012-07-31 2019-01-01 赵依军 发光二极管单元与散热基板的连接
USD759603S1 (en) * 2013-07-17 2016-06-21 Nuflare Technology, Inc. Chamber of charged particle beam drawing apparatus
JP6603982B2 (ja) 2013-07-31 2019-11-13 日亜化学工業株式会社 リードフレーム、樹脂付きリードフレーム、樹脂パッケージ、発光装置及び樹脂パッケージの製造方法
JP6252023B2 (ja) * 2013-08-05 2017-12-27 日亜化学工業株式会社 発光装置
JP6464697B2 (ja) * 2014-11-27 2019-02-06 東芝ライテック株式会社 車両用照明装置、および灯具
US10340433B2 (en) * 2015-01-19 2019-07-02 Lg Innotek Co., Ltd. Light emitting device
US9989223B1 (en) * 2015-03-09 2018-06-05 Automated Assembly Corporation LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive
KR20190074200A (ko) * 2017-12-19 2019-06-27 서울반도체 주식회사 발광 다이오드 패키지 및 이를 포함하는 발광 모듈
WO2019124730A1 (ko) * 2017-12-19 2019-06-27 서울반도체주식회사 발광 다이오드 패키지 및 이를 포함하는 발광 모듈
JP7116303B2 (ja) * 2018-06-25 2022-08-10 日亜化学工業株式会社 パッケージ及び発光装置

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Publication number Priority date Publication date Assignee Title
TWI511339B (zh) * 2013-02-06 2015-12-01 Lite On Electronics Guangzhou 發光二極體封裝件及其導線架

Also Published As

Publication number Publication date
US20070145403A1 (en) 2007-06-28
JP2007180227A (ja) 2007-07-12
US7947999B2 (en) 2011-05-24
JP5038623B2 (ja) 2012-10-03
CN1992362B (zh) 2010-12-08
CN1992362A (zh) 2007-07-04
TWI350010B (zh) 2011-10-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees