TW200721204A - Laminated coil component - Google Patents

Laminated coil component

Info

Publication number
TW200721204A
TW200721204A TW095129218A TW95129218A TW200721204A TW 200721204 A TW200721204 A TW 200721204A TW 095129218 A TW095129218 A TW 095129218A TW 95129218 A TW95129218 A TW 95129218A TW 200721204 A TW200721204 A TW 200721204A
Authority
TW
Taiwan
Prior art keywords
coil
coil component
conductors
via hole
laminated
Prior art date
Application number
TW095129218A
Other languages
English (en)
Other versions
TWI309423B (en
Inventor
Mitsuru Odahara
Tomoyuki Maeda
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of TW200721204A publication Critical patent/TW200721204A/zh
Application granted granted Critical
Publication of TWI309423B publication Critical patent/TWI309423B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
TW095129218A 2005-09-29 2006-08-09 Laminated coil component TWI309423B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005284560 2005-09-29

Publications (2)

Publication Number Publication Date
TW200721204A true TW200721204A (en) 2007-06-01
TWI309423B TWI309423B (en) 2009-05-01

Family

ID=37899528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129218A TWI309423B (en) 2005-09-29 2006-08-09 Laminated coil component

Country Status (7)

Country Link
US (1) US7378931B2 (zh)
EP (1) EP1930917A4 (zh)
JP (1) JP4530045B2 (zh)
KR (1) KR100899561B1 (zh)
CN (1) CN101147213B (zh)
TW (1) TWI309423B (zh)
WO (1) WO2007037097A1 (zh)

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JP5065603B2 (ja) * 2005-03-29 2012-11-07 京セラ株式会社 コイル内蔵基板および電子装置
US7907043B2 (en) * 2005-11-30 2011-03-15 Ryutaro Mori Planar inductor
US7610101B2 (en) 2006-11-30 2009-10-27 Cardiac Pacemakers, Inc. RF rejecting lead
WO2009076163A2 (en) 2007-12-06 2009-06-18 Cardiac Pacemakers, Inc. Implantable lead having a variable coil conductor pitch
AU2009212697B2 (en) 2008-02-06 2011-12-01 Cardiac Pacemakers, Inc. Lead with MRI compatible design features
KR100982639B1 (ko) * 2008-03-11 2010-09-16 (주)창성 연자성 금속분말이 충전된 시트를 이용한 적층형 파워인덕터
US8103360B2 (en) 2008-05-09 2012-01-24 Foster Arthur J Medical lead coil conductor with spacer element
WO2010010799A1 (ja) * 2008-07-22 2010-01-28 株式会社村田製作所 電子部品及びその製造方法
US20100052837A1 (en) * 2008-09-03 2010-03-04 Siqi Fan Integrated Circuit Multilevel Inductor
US9084883B2 (en) 2009-03-12 2015-07-21 Cardiac Pacemakers, Inc. Thin profile conductor assembly for medical device leads
JP4893773B2 (ja) * 2009-04-02 2012-03-07 株式会社村田製作所 電子部品及びその製造方法
US20100315161A1 (en) * 2009-06-16 2010-12-16 Advanced Energy Industries, Inc. Power Inductor
WO2010151376A1 (en) 2009-06-26 2010-12-29 Cardiac Pacemakers, Inc. Medical device lead including a unifilar coil with improved torque transmission capacity and reduced mri heating
JP5365420B2 (ja) * 2009-08-28 2013-12-11 Ｔｄｋ株式会社 積層型電子部品
US9254380B2 (en) 2009-10-19 2016-02-09 Cardiac Pacemakers, Inc. MRI compatible tachycardia lead
EP2519311A1 (en) 2009-12-30 2012-11-07 Cardiac Pacemakers, Inc. Mri-conditionally safe medical device lead
US8391994B2 (en) 2009-12-31 2013-03-05 Cardiac Pacemakers, Inc. MRI conditionally safe lead with low-profile multi-layer conductor for longitudinal expansion
WO2011081713A1 (en) 2009-12-31 2011-07-07 Cardiac Pacemakers, Inc. Mri conditionally safe lead with multi-layer conductor
US8299883B2 (en) * 2010-03-25 2012-10-30 Hamilton Sundstrand Corporation Laminated inductive device
US8825181B2 (en) 2010-08-30 2014-09-02 Cardiac Pacemakers, Inc. Lead conductor with pitch and torque control for MRI conditionally safe use
KR101153656B1 (ko) * 2010-11-04 2012-06-18 삼성전기주식회사 적층형 인덕터
JP5673478B2 (ja) * 2011-10-12 2015-02-18 Tdk株式会社 積層コイル部品
WO2013066505A1 (en) 2011-11-04 2013-05-10 Cardiac Pacemakers, Inc. Implantable medical device lead including inner coil reverse-wound relative to shocking coil
JP5459327B2 (ja) * 2012-01-24 2014-04-02 株式会社村田製作所 電子部品
KR101339486B1 (ko) * 2012-03-29 2013-12-10 삼성전기주식회사 박막 코일 및 이를 구비하는 전자 기기
AU2013249088B2 (en) 2012-04-20 2015-12-03 Cardiac Pacemakers, Inc. Implantable medical device lead including a unifilar coiled cable
US8954168B2 (en) 2012-06-01 2015-02-10 Cardiac Pacemakers, Inc. Implantable device lead including a distal electrode assembly with a coiled component
EP2890446B1 (en) 2012-08-31 2016-12-07 Cardiac Pacemakers, Inc. Mri compatible lead coil
AU2013331142B2 (en) 2012-10-18 2016-07-28 Cardiac Pacemakers, Inc. Inductive element for providing MRI compatibility in an implantable medical device lead
JP5741615B2 (ja) * 2013-03-14 2015-07-01 Tdk株式会社 電子部品及びその製造方法
WO2014181755A1 (ja) * 2013-05-08 2014-11-13 株式会社村田製作所 電子部品
AU2015223154B2 (en) 2014-02-26 2017-04-13 Cardiac Pacemakers, Inc Construction of an MRI-safe tachycardia lead
KR101892689B1 (ko) 2014-10-14 2018-08-28 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
JP6432531B2 (ja) * 2015-03-27 2018-12-05 株式会社村田製作所 積層コイル部品
CN106024327B (zh) * 2015-03-27 2019-07-19 株式会社村田制作所 层叠线圈部件
KR101813342B1 (ko) * 2015-12-29 2017-12-28 삼성전기주식회사 적층 인덕터
US10923259B2 (en) 2016-07-07 2021-02-16 Samsung Electro-Mechanics Co., Ltd. Coil component
CN106548852B (zh) * 2016-09-21 2019-06-21 广东风华高新科技股份有限公司 叠层电感及电子设备
JP6780589B2 (ja) * 2017-06-02 2020-11-04 株式会社村田製作所 電子部品
JP6955376B2 (ja) * 2017-06-16 2021-10-27 太陽誘電株式会社 コイル部品及びコイル部品の製造方法
JP7015650B2 (ja) 2017-07-03 2022-02-03 太陽誘電株式会社 コイル部品
KR102438500B1 (ko) * 2021-04-30 2022-08-31 삼화콘덴서공업 주식회사 대전류용 적층 칩 부품
JP7452507B2 (ja) 2021-09-25 2024-03-19 株式会社村田製作所 インダクタ

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US3543194A (en) * 1967-10-24 1970-11-24 Gen Electric Information Syste Electromagnetic delay line having superimposed elements
JP2723620B2 (ja) * 1989-07-05 1998-03-09 住友林業株式会社 木造建築物の建築工法
JPH0653044A (ja) * 1992-07-31 1994-02-25 Nippon Steel Corp 薄形インダクタまたは薄形トランス、およびこれらの製造方法
JPH08138940A (ja) * 1994-11-04 1996-05-31 Murata Mfg Co Ltd 積層型コイル
JP3610191B2 (ja) * 1997-06-03 2005-01-12 Ｔｄｋ株式会社 非磁性セラミックおよびセラミック積層部品
JP3039538B1 (ja) * 1998-11-02 2000-05-08 株式会社村田製作所 積層型インダクタ
JP3259717B2 (ja) * 1999-08-20 2002-02-25 株式会社村田製作所 積層型インダクタ
JP2001093735A (ja) * 1999-09-27 2001-04-06 Koa Corp 積層インダクタ及びその製造方法
JP2001176725A (ja) * 1999-12-15 2001-06-29 Tdk Corp 積層電子部品
JP2001210522A (ja) * 2000-01-28 2001-08-03 Fdk Corp 積層インダクタ
JP2002134322A (ja) * 2000-10-24 2002-05-10 Tdk Corp 高ｑ高周波コイル及びその製造方法
US6847282B2 (en) * 2001-10-19 2005-01-25 Broadcom Corporation Multiple layer inductor and method of making the same
JP3835381B2 (ja) * 2002-09-04 2006-10-18 株式会社村田製作所 積層型電子部品
JP2005191191A (ja) * 2003-12-25 2005-07-14 Tdk Corp 積層型チップインダクタ

Also Published As

Publication number Publication date
JPWO2007037097A1 (ja) 2009-04-02
US20070296536A1 (en) 2007-12-27
KR100899561B1 (ko) 2009-05-27
JP4530045B2 (ja) 2010-08-25
US7378931B2 (en) 2008-05-27
CN101147213B (zh) 2012-02-01
KR20070110388A (ko) 2007-11-16
EP1930917A1 (en) 2008-06-11
EP1930917A4 (en) 2011-10-26
TWI309423B (en) 2009-05-01
CN101147213A (zh) 2008-03-19
WO2007037097A1 (ja) 2007-04-05

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