TW200719780A - Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board - Google Patents

Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board

Info

Publication number
TW200719780A
TW200719780A TW095116951A TW95116951A TW200719780A TW 200719780 A TW200719780 A TW 200719780A TW 095116951 A TW095116951 A TW 095116951A TW 95116951 A TW95116951 A TW 95116951A TW 200719780 A TW200719780 A TW 200719780A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
shielded
manufacturing
shielding film
Prior art date
Application number
TW095116951A
Other languages
Chinese (zh)
Other versions
TWI400015B (en
Inventor
Kazuhiro Hashimoto
Syohei Morimoto
Yoshinori Kawakami
Kenji Kamino
Satoshi Ebihara
Hideaki Tanaka
Takahisa Akatsuka
Original Assignee
Tatsuta System Electronics Co Ltd
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta System Electronics Co Ltd, Nippon Mektron Kk filed Critical Tatsuta System Electronics Co Ltd
Publication of TW200719780A publication Critical patent/TW200719780A/en
Application granted granted Critical
Publication of TWI400015B publication Critical patent/TWI400015B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/24983—Hardness

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The invention includes a cover film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.
TW095116951A 2005-05-13 2006-05-12 Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board TWI400015B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005141872A JP4319167B2 (en) 2005-05-13 2005-05-13 Shield film, shield printed wiring board, shield flexible printed wiring board, shield film manufacturing method, and shield printed wiring board manufacturing method

Publications (2)

Publication Number Publication Date
TW200719780A true TW200719780A (en) 2007-05-16
TWI400015B TWI400015B (en) 2013-06-21

Family

ID=36778058

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116951A TWI400015B (en) 2005-05-13 2006-05-12 Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board

Country Status (8)

Country Link
US (1) US7709750B2 (en)
EP (1) EP1886543B1 (en)
JP (1) JP4319167B2 (en)
KR (1) KR101243030B1 (en)
CN (1) CN101176388B (en)
DK (1) DK1886543T3 (en)
TW (1) TWI400015B (en)
WO (1) WO2006121194A1 (en)

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US9949360B2 (en) 2011-03-10 2018-04-17 Mediatek Inc. Printed circuit board design for high speed application
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TWI669037B (en) * 2017-06-30 2019-08-11 大陸商宏啟勝精密電子（秦皇島）有限公司 Transparent flexible printed circuit board and method for manufacturing the same
TWI700984B (en) * 2007-08-03 2020-08-01 日商大自達電線股份有限公司 Shielding film for printed wiring board and printed wiring board

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TWI700983B (en) * 2007-08-03 2020-08-01 日商大自達電線股份有限公司 Shielding film for printed wiring board and printed wiring board
US9949360B2 (en) 2011-03-10 2018-04-17 Mediatek Inc. Printed circuit board design for high speed application
TWI627883B (en) * 2012-12-20 2018-06-21 Tatsuta Electric Wire & Cable Co Ltd Manufacturing method of shielded printed wiring board, shielding film, and shielded printed wiring board
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CN101176388A (en) 2008-05-07
KR101243030B1 (en) 2013-03-20
JP2006319216A (en) 2006-11-24
KR20080015447A (en) 2008-02-19
CN101176388B (en) 2012-02-01
WO2006121194A1 (en) 2006-11-16
TWI400015B (en) 2013-06-21
US20090038839A1 (en) 2009-02-12
DK1886543T3 (en) 2013-10-07
JP4319167B2 (en) 2009-08-26
EP1886543A1 (en) 2008-02-13
US7709750B2 (en) 2010-05-04
EP1886543B1 (en) 2013-07-10

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