KR102197471B1 - Electromagnetic wave shield film, manufacturing method for printed circuit board and manufacturing method for electromagnetic wave shield film - Google Patents

Abstract

The present invention relates to an electromagnetic shielding film, a printed circuit board manufacturing method, and an electromagnetic shielding film manufacturing method, wherein the electromagnetic shielding film according to the present invention comprises a carrier film; And, a conductive metal layer formed on one surface of the carrier film; And, on the metal layer A conductive adhesive layer formed on; And a protective film formed on the conductive adhesive layer.

Description

Electromagnetic shielding film, printed circuit board manufacturing method, and electromagnetic shielding film manufacturing method {ELECTROMAGNETIC WAVE SHIELD FILM, MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR ELECTROMAGNETIC WAVE SHIELD FILM}

The present invention relates to an electromagnetic wave shielding film, a printed circuit board manufacturing method, and an electromagnetic wave shielding film manufacturing method, and more particularly, the ground film can be omitted because the ground area of the electromagnetic wave shielding film attached to the printed circuit board can be widened. And, it relates to an electromagnetic wave shielding film for high-speed transmission, a printed circuit board manufacturing method, and an electromagnetic wave shielding film manufacturing method that can provide excellent environmental reliability and heat resistance, and step characteristics.

It is reported that electromagnetic waves generated from internal elements of electronic devices such as mobile phones, digital cameras, notebook PCs, office equipment, and medical devices can affect various diseases such as headache, vision loss, brain tumors, and circulatory system abnormalities. The controversy over the harm to the human body is increasing. In addition, as the degree of integration of devices increases due to the trend of reducing the weight of electronic products, electromagnetic noise generated from each component may cause malfunctions of peripheral devices, resulting in device failure. Therefore, in recent years, regulations on EMI (electromagnetic interference) and RFI (Radio Frequency Interference) emission are reinforced along with reinforcement of shielding standards for electromagnetic waves generated from home, office, and industrial electronic products such as computers, mobile phones, medical devices, and multimedia players. Also, measures to shield electromagnetic waves of various electronic devices and parts are emerging as an important task.

Recently, in order to meet the demand for high performance and miniaturization of office equipment, communication equipment, mobile phones, etc., a flexible printed wiring board (hereinafter referred to as FPCB) having a narrow and complex structure has been widely used. FPCB is used with a shield film attached to block electromagnetic noise.

As a conventional shielding film, it is widely known that a base film and a conductive layer laminated thereon have a basic configuration. Usually, in this basic configuration, a reinforcing film for workability is used on the side of the base film, and a protective film is used for the conductive layer.

Japanese Patent Laid-Open No. 5-3395 describes a method of using a metal thin film to obtain an excellent shielding effect, and Japanese Patent Laid-Open No. 7-122882 describes a method of combining a conductive adhesive layer using a metal filler and a thin metal film. Are doing.

However, in the case of manufacturing the electromagnetic wave shielding film by applying and drying a conductive adhesive layer on the metal layer in a state in which the carrier film and the metal layer are laminated, and laminating the protective film on the conductive adhesive layer, the bonding strength between the carrier film and the metal layer is Since it is relatively strong compared to the bonding force of the conductive adhesive layer, there is a problem that the metal layer is peeled from the conductive adhesive layer while the metal layer is attached to the carrier film in the process of peeling the carrier film, or there is a problem that the lifting phenomenon occurs in which the metal layer and the conductive adhesive layer are separated from each other. .

In addition, recently produced electronic devices are manufactured with precision, light, thin, short and small, and according to this trend, the line width and spacing of the circuit pattern become narrower, so that a wide ground cannot be secured. There is a problem in that a separate ground film must be used.

Patent Document 1. Japanese Unexamined Patent Application Publication No. 5-3395 (published on Jan. 08, 1993) Patent Document 2. Japanese Unexamined Patent Publication No. 7-122882 (published on May 12, 1995)

Accordingly, an object of the present invention is to solve such a conventional problem, and manufacturing an electromagnetic wave shielding film and a printed circuit board capable of omitting the ground film by widening the ground area of the electromagnetic wave shielding film attached to a printed circuit board. To provide a method and a method of manufacturing an electromagnetic shielding film.

In addition, it is an object of the present invention to provide an electromagnetic wave shielding film for high-speed transmission, a printed circuit board manufacturing method, and an electromagnetic wave shielding film manufacturing method having antioxidant properties and high heat resistance properties.

And, by peeling the carrier film in a semi-cured state of the conductive adhesive layer, an electromagnetic wave shielding film, a printed circuit board manufacturing method, and an electromagnetic wave shielding film manufacturing method that can prevent the metal layer from being arbitrarily separated from the conductive adhesive layer during the peeling process of the carrier film. Can provide.

The object is, according to the present invention, a carrier film; And, a conductive metal layer formed on one surface of the carrier film; And, a conductive adhesive layer formed on the metal layer; And a protective film formed on the conductive adhesive layer.

Here, it is preferable that the conductive adhesive layer includes a binder resin and a conductive filler.

In addition, the conductive filler includes silver, copper, aluminum, nickel, gold, zinc, or iron particles, and the particles are in the form of a flake, spherical, dendrite, or granule. It is preferable to have.

In addition, it is preferable that the particles have a size of 3 μm to 20 μm.

In addition, the binder resin is preferably at least one of polyvinyl butyral, cellulose, polyurethane, polyester, epoxy, phenoxy, novolac, alkyd, amide, imide resin, or modified products thereof.

In addition, it is preferable that a conductive layer is interposed between the metal layer and the conductive adhesive layer.

In addition, the conductive layer is preferably made of a material having relatively excellent electrical conductivity compared to the metal layer.

In addition, the conductive layer is preferably formed by coating a silver (Silver) ink on the metal layer.

In addition, it is preferable that the metal layer is selected from nickel, copper, aluminum, zinc, or an alloy thereof.

In addition, it is preferable that the metal layer is made of a foil having a thickness of 2 μm to 10 μm.

It is an object of the present invention, a carrier film, a metal layer, a conductive adhesive layer, and a shielding film preparation step of preparing a shielding film in which a protective film is sequentially stacked; And, a protective film removing step of removing the protective film of the shielding film; And, the shielding A bonding step of bonding the conductive adhesive layer of the film to the printed circuit board; and a carrier film removing step of removing the carrier film of the shielding film; And an insulating layer forming step of forming an insulating layer in which an opening is formed on a metal layer of the shielding film in a region where the ground extension terminal of the printed circuit board is to be formed, and may be achieved by a method of manufacturing a printed circuit board including.

Here, in the insulating layer forming step, it is preferable to form an insulating layer by printing an insulating paste on the metal layer.

In addition, in the insulating layer forming step, it is preferable to form an insulating layer by attaching an insulating film having an opening formed thereon on the metal layer.

In addition, the insulating layer forming step may include preparing a coverlay in which a carrier film, an insulating layer, an adhesive layer, and a protective film are sequentially stacked; And, by punching out the coverlay, a ground extension terminal of the printed circuit board A punching step of forming an opening in the area where the is to be formed; and a protective film removing step of removing the protective film of the coverlay; And a laminating step of laminating the metal layer of the shielding film and the adhesive layer of the coverlay.

In addition, it is preferable to further include a plating layer forming step of forming a plating layer on the metal layer exposed through the opening of the insulating layer.

In addition, prior to the plating layer forming step, a partial metal layer removing step of partially removing the metal layer exposed through the opening of the insulating layer in the thickness direction; it is preferable to further include.

In addition, prior to the step of removing the carrier film, it is preferable to perform the conductive adhesive layer semi-curing step of semi-curing the conductive adhesive layer.

In addition, after the step of removing the carrier film, the step of completely curing the conductive adhesive layer; it is preferable to perform.

In addition, after the laminating step, it is preferable to perform a coverlay carrier film removal step of removing the carrier film of the coverlay.

In addition, prior to the step of removing the coverlay carrier film, it is preferable to perform an adhesive layer semi-curing step of semi-curing the adhesive layer of the coverlay.

In addition, after the step of removing the coverlay carrier film, it is preferable to perform an adhesive layer completely curing step of completely curing the adhesive layer of the coverlay.

In addition, in the step of preparing the shielding film, it is preferable to form a conductive layer made of a material having relatively excellent electrical conductivity compared to the metal layer between the metal layer and the conductive adhesive layer.

An object of the present invention is a metal layer preparation step of preparing a thin film type metal layer; And, a conductive adhesive layer forming step of forming a conductive adhesive layer on one surface of the metal layer; And, a first of laminating a first protective film on the conductive adhesive layer Forming a protective film; And, An insulating layer forming step of forming an insulating layer on the other surface of the metal layer; And a second protective film forming step of forming a second protective film on the insulating layer.

In addition, prior to the conductive adhesive layer forming step, it is preferable to perform a conductive layer forming step of forming a conductive layer on one surface of the metal layer.

In addition, the conductive layer is preferably made of a material having relatively excellent electrical conductivity compared to the metal layer.

In addition, the conductive layer is preferably formed by coating a silver (Silver) ink on the metal layer.

According to the present invention, there is provided an electromagnetic wave shielding film, a printed circuit board manufacturing method, and an electromagnetic wave shielding film manufacturing method capable of omitting the ground film by widening the ground area of the electromagnetic wave shielding film attached to a printed circuit board. Accordingly, it is possible to solve the difficulty of not taking a wide ground when manufacturing the microcircuit board, and thus, it is possible to provide ease of manufacture of the microcircuit board, thereby reducing the manufacturing process, improving productivity, and reducing manufacturing cost.

In addition, it is possible to manufacture a printed circuit board to which an electromagnetic wave shielding film for high-speed transmission, which has antioxidant properties and high heat resistance properties, is applied.

In addition, by peeling the carrier film while the conductive adhesive layer is semi-cured, it is possible to prevent the metal layer from being arbitrarily separated from the conductive adhesive layer during the peeling process of the carrier film.

1 is a cross-sectional view of an electromagnetic wave shielding film according to a first embodiment of the present invention,
2 is a cross-sectional view for each process of a method for manufacturing a printed circuit board according to a second embodiment of the present invention;
3 is a cross-sectional view for each process of a method for manufacturing a printed circuit board according to a third embodiment of the present invention;
4 is a cross-sectional view of an electromagnetic wave shielding film according to a fourth embodiment of the present invention,
5 is a cross-sectional view of a method for manufacturing a printed circuit board according to a fifth embodiment of the present invention,
6 is a cross-sectional view for each process of a method for manufacturing a printed circuit board according to a sixth embodiment of the present invention;
7 is a cross-sectional view of a method for manufacturing an electromagnetic shielding film according to a seventh embodiment of the present invention,
8 is a cross-sectional view of a method for manufacturing an electromagnetic wave shielding film according to an eighth embodiment of the present invention.

Prior to the description, in various embodiments, components having the same configuration are typically described in the first embodiment by using the same reference numerals, and in other embodiments, configurations different from the first embodiment will be described. do.

Hereinafter, an electromagnetic wave shielding film according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the accompanying drawings, FIG. 1 is a cross-sectional view of an electromagnetic wave shielding film according to a first embodiment of the present invention.

The electromagnetic wave shielding film 10 according to the first embodiment of the present invention includes a carrier film 11, a conductive metal layer 12 formed on one surface of the carrier film 11, and a conductive metal layer 12 formed on the metal layer 12. It includes an adhesive layer 13 and a protective film 14 formed on the conductive adhesive layer 13.

The carrier film 11 is provided in the form of AL-PET (Aluminum-Laminated Polyethylene Terephthalate) in which an aluminum film is laminated on a PET film, or in the form of Copper-PET (Copper-Laminated Polyethylene Terephthalate) in which a copper film is laminated on a PET film. Can be provided.

The metal layer 12 may be made of a metal material having excellent electrical conductivity, such as nickel, copper, aluminum, or zinc, or a metal material in the form of an alloy thereof, and 2 μm to 10 It may be configured in the form of a foil having a thickness of ㎛. The metal layer 12 may be formed by various methods such as plating, printing, coating, and evaporation of a conductive material on one surface of the carrier film 11, and a thin metal layer 12 is formed on one surface of the carrier film 11 It is also possible to use ready-made products.

The conductive adhesive layer 13 may include a conductive filler and a binder resin, a curing agent, a flame retardant and an additive, and the conductive adhesive layer 13 may be formed by applying a conductive adhesive composition to the metal layer 12.

Here, it is preferable that the binder resin has excellent heat resistance, acid resistance, and alkali resistance, particularly excellent adhesion, and has a low effect on the conductivity of the conductive filler due to the properties of the binder.

When the heat resistance of the resin is low, defects in the surface may appear in the solder process, which is an essential process for manufacturing a printed circuit board, or increase in resistance due to heat may be caused. In addition, copper plating or gold plating may be applied to lower the resistance of the circuit or prevent corrosion when the printed circuit board is manufactured. At this time, since the plating solution is strong acid or strong alkali, excellent chemical resistance and alkali resistance are required. In addition, a cleaning operation with an alkaline solution may be performed before and after soldering to clean the surface and remove flux. In some cases, a process of improving the uniformity and adhesion of plating may be performed by performing soft etching.

After the conductive adhesive layer 13 is pre-fixed to the printed circuit board in a semi-cured (B-Stage) state, it must be provided through a main bonding process. Therefore, the binder resin must have room temperature retention in a semi-cured state, and must be completely cured (C-Stage) in the main process.

As the binder resin of the conductive adhesive layer 13, polyvinyl butyral (PVB), cellulose, polyurethane, polyester, epoxy, phenoxy, Novolac, alkyd, amide, imide resin, or a modified product thereof may be used. In this example, a cresol novolak resin was mixed to improve heat resistance with the modified product of the polyester resin.

In addition, the conductive filler is a conductive metal such as silver, copper, aluminum, nickel, gold, zinc, iron, etc. You can use the type of coating. In addition, their shapes may be in the form of a flake, spherical, dendrite, or granule.

The particle size of the conductive filler may be 30 μm or less. More preferably, it is preferably 3 μm or more and 20 μm or less. When using a conductive filler of less than 3㎛, there is a problem in that more metal particles must be used due to an increase in resistance due to the resin, and resistance is also formed high. In addition, particles having a size exceeding 20 µm have a problem in that uncoated (line-off) appears in the coating direction in the coating process, and the dried coating film is uneven and pin-holes occur.

The protective film 14 may be formed of a silicone release-coated PET film, and may be attached to the conductive adhesive layer 13 by laminating the silicon release-treated protective film 14 to the conductive adhesive layer 13.

The electromagnetic wave shielding film 10 of this embodiment includes a carrier film 11 having a thickness of 83 μm, a metal layer 12 having a thickness of 3 μm, a conductive adhesive layer 13 having a thickness of 6 μm, and a protective film 14 having a thickness of 75 μm. Can be done.

In this way, in the case of the electromagnetic wave shielding film 10 having the above configuration, after forming the conductive adhesive layer 13 by coating a conductive adhesive on the carrier film 11 on which the metal layer 12 is formed, the protective film 14 is attached. Alternatively, it may be prepared by coating a conductive adhesive on the protective film 14 to form a conductive adhesive layer 13 and then laminating the carrier film 11 on which the metal layer 12 is formed.

Hereinafter, a method of manufacturing a printed circuit board according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the accompanying drawings, FIG. 2 is a cross-sectional view of a method for manufacturing a printed circuit board according to a second embodiment of the present invention.

The printed circuit board manufacturing method according to the second embodiment of the present invention includes a shielding film preparation step (S110), a shielding film punching step (S120), a protective film removal step (S130), a bonding step (S140), a conductive adhesive layer semi-curing. Step (S150), carrier film removal step (S160), conductive adhesive layer complete curing step (S170), insulating layer forming step (S180), metal layer partially removing step (S190), and plating layer forming step (S200).

In the shielding film preparation step (S110), as shown in Figure 2 (a), a carrier film 11, a metal layer 12, a conductive adhesive layer 13 and a protective film 14 are sequentially stacked shielding film 10 Prepare. This shielding film 10 may be formed of the electromagnetic wave shielding film of the first embodiment of the present invention described above.

In the shielding film punching step (S120), as shown in FIG. 2(b), the sheet-shaped shielding film 10 is punched according to the printed circuit board (PCB) to be attached. Punching of the shielding film 10 may be performed by a press process or a laser cutting process.

In the protective film removing step (S130), the protective film 14 disposed on one surface of the conductive adhesive layer 13 of the shielding film 10 is removed, as shown in FIG. 2C. The protective film 14 can be easily peeled off because it has an appropriate release force for the conductive adhesive layer 13.

In the bonding step (S140), the conductive adhesive layer 13 of the shielding film 10 is in close contact with the surface of the printed circuit board (PCB) on which the circuit pattern is formed, as shown in FIG. 2(d).

In the semi-curing step of the conductive adhesive layer (S150), the shielding film 10 is heated for a predetermined time so that the conductive adhesive layer 13 is in a semi-cured (B-Stage) state. The semi-curing conditions may be changed according to the composition of the conductive adhesive layer 13, and in this embodiment, heating and pressurization was performed at a temperature of 150° C. and a pressure of 3 bar for 20 seconds using a temporary folding machine. By semi-hardening of the conductive adhesive layer 13, the bonding force between the conductive adhesive layer 13 and the metal layer 12 is increased.

In the carrier film removing step (S160), the carrier film 11 attached to the metal layer 12 of the shielding film 10 is removed as shown in FIG. 2(e). At this time, the metal layer 12 to which the carrier film 11 is attached is in a state in which the bonding strength with the conductive adhesive layer 13 is increased as the conductive adhesive layer 13 is semi-hardened, so in the process of removing the carrier film 11 It is possible to prevent the metal layer 12 from being peeled off from the conductive adhesive layer 13.

In the complete curing of the conductive adhesive layer (S170), the conductive adhesive layer 13 is heated and pressurized so that it is in a fully cured (C-Stage) state. Here, the conditions for complete curing of the conductive adhesive layer 13 may be changed according to the composition of the conductive adhesive layer 13, and in this embodiment, a temperature of 150°C±10°C and 40kgf/□ (surface pressure) using a hot press Heated and pressurized for 60 minutes under pressure.

In the insulating layer forming step (S180), as shown in (f) of FIG. 2, the insulating paste may be printed and dried through a screen plated according to a pattern to form the insulating layer 22. In this way, the insulating layer 22 can be formed in a desired area by using the screen printing method, and the insulating layer 22 in which the opening 22a is formed in the area where the ground extension terminal of the printed circuit board (PCB) will be formed is formed. It can be formed on the metal layer 12 of the shielding film 10.

On the other hand, in this embodiment, in addition to printing the insulating paste on the metal layer 12, the insulating film is punched so that the opening 22a is formed in the area where the ground extension terminal of the printed circuit board (PCB) is to be formed. Afterwards, it may be possible to form the insulating layer 22 by attaching it to the metal layer 12.

When the metal layer 12 of the shielding film 10 is electrically connected to the ground circuit of the printed circuit board (PCB) through the conductive adhesive layer 13, the metal layer exposed through the opening 22a of the insulating layer 22 ( 12) This can be used as a ground extension terminal of a printed circuit board (PCB).

The insulating paste may contain a binder resin, a flame retardant, a colorant, a curing agent, and the like.

The binder resin of the insulating layer 22 can be coated and has high flexibility after curing, and has scratch resistance (2H or more) because it is located outside the printed circuit board.

Since the insulating layer 22 is a portion exposed in the manufacturing process of the printed circuit board, it must have excellent heat resistance, chemical resistance, alkali resistance, and acid resistance.

In particular, since it is a part that is directly exposed to heat, it must have excellent heat resistance (300°C), and if there is surface contamination in the manufacturing process, it may be removed with isopropyl alcohol, so it must also have excellent chemical resistance.

In addition, since other reinforcing plates must be attached and marked on the insulating layer 22, it must be designed with excellent adhesion. When the surface is polyimide, there is a problem with the lamination adhesion, so a plasma process may be added.

In the removing part of the metal layer (S190), as shown in FIG. 2(g), the metal layer 12 exposed through the opening 22a of the insulating layer 22 is soft etched to partially remove it in the thickness direction. The oxidized surface of the metal layer 12 is removed (0.3 to 1.0 μm).

Next, in the plating layer forming step (S200), as shown in FIG. 2(h), through an electrolytic plating or electroless plating process, a surface oxidation-preventing conductive material such as gold (Au) is applied to the metal layer 12 from which the surface has been removed. The plating layer 30 is formed by plating. The plating layer 30 protects the metal layer 12 and is electrically connected to the ground circuit of the printed circuit board (PCB), and can be used as a ground extension terminal.

Hereinafter, a method of manufacturing a printed circuit board according to a third embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the accompanying drawings, FIG. 3 is a cross-sectional view of a method for manufacturing a printed circuit board according to a third embodiment of the present invention.

The printed circuit board manufacturing method according to the third embodiment of the present invention includes a shielding film preparation step (S110), a shielding film punching step (S120), a protective film removal step (S130), a bonding step (S140), a conductive adhesive layer semi-curing. Step (S150), carrier film removal step (S160), insulating layer forming step (S180'), metal layer partially removing step (S190), and plating layer forming step (S200).

In the third embodiment of the present invention, except for the step of forming the insulating layer (S180'), the remaining steps are the same as those of the second embodiment, so a detailed description of the same steps will be omitted.

In the insulating layer forming step (S180'), a coverlay preparation step (S181), a coverlay punching step (S182), a protective film removal step (S183), a lamination step (S184), an adhesive layer semi-curing step (S185), a carrier It includes a film removing step (S186) and the adhesive layer completely curing step (S187).

In the coverlay preparation step (S181), as shown in FIG. 3 (f), the coverlay 20 in which the carrier film 21, the insulating layer 22, the adhesive layer 23 and the protective film 24 are sequentially stacked. Prepare.

In this embodiment, the coverlay 20 includes a carrier film 21 having a thickness of 55 μm, an insulating layer 22 having a thickness of 7 μm, an adhesive layer 23 having a thickness of 8 μm, and a protective film 24 having a thickness of 75 μm. Can be made. The carrier film 21 of the coverlay 20 may be provided in the form of semi-matt PET (Semi-matt PET), and the insulating layer 22 and the adhesive layer 23 may include a light absorbing material. have.

In the coverlay punching step (S182), the coverlay 20 is punched out as shown in FIG. 3G to form the opening 22a of FIG. 3J in the region where the ground extension terminal is to be formed. Punching of the coverlay 20 may be performed by a press process or a laser cutting process.

In the protective film removing step (S183), the protective film 24 disposed on one surface of the adhesive layer 23 of the coverlay 20 is removed, as shown in FIG. 3(h). The protective film 24 can be easily peeled off because it has an appropriate release force with respect to the adhesive layer 23.

In the laminating step (S184), as shown in FIG. 3 (i), the adhesive layer 23 of the coverlay 20 is in close contact with the metal layer 12 of the shielding film 10 to be bonded.

In the adhesive layer semi-curing step (S185), the coverlay 20 is heated for a predetermined time so that the adhesive layer 23 of the coverlay 20 becomes a semi-cured (B-Stage) state. The semi-curing conditions may be changed according to the composition of the adhesive layer 23, and in this embodiment, heating and pressurization was performed for 20 seconds at a temperature of 150° C. and a pressure of 3 bar using a folding machine. The bonding force between the adhesive layer 23 and the metal layer 12 is increased by semi-hardening of the adhesive layer 23.

In the carrier film removing step (S186), the carrier film 21 attached to the insulating layer 22 of the coverlay 20 is removed as shown in FIG. 3(j). At this time, the insulating layer 22 to which the carrier film 21 is attached is in a state where the bonding strength with the adhesive layer 23 is increased as the adhesive layer 23 is semi-hardened. It is possible to prevent the insulating layer 22 from peeling off from the adhesive layer 23. In addition, since the conductive adhesive layer 13 of the shielding film 10 is also semi-cured to increase the bonding strength between the metal layer 12 and the printed circuit board (PCB), the carrier film 21 of the coverlay 20 is In the removing process, the bonding surface between the metal layer 12 and the conductive adhesive layer 13 may be separated or the bonding surface between the conductive adhesive layer 13 and the printed circuit board (PCB) may be prevented from being separated.

In the adhesive layer complete curing step (S187), the adhesive layer 23 is heated and pressurized to become a fully cured (C-Stage) state. Here, the conditions for complete curing of the adhesive layer 23 may be changed according to the composition of the adhesive layer 23, and in this embodiment, a temperature of 150°C±10°C and a pressure of 40kgf/□ (surface pressure) using a hot press Heated and pressurized for 60 minutes.

Meanwhile, in the present embodiment, in the process of performing the complete curing of the adhesive layer (S187), the conductive adhesive layer 13 of the shielding film 10 can be completely cured, so that the complete curing of the conductive adhesive layer in the second embodiment (S170) can be omitted. For this purpose, it is preferable that the adhesive layer 23 of the coverlay 20 is configured to be completely cured under the same conditions as the conductive adhesive layer 13 of the shielding film 10.

As described above, in the insulating layer 22 of the coverlay 20 laminated on the upper side of the metal layer 12 of the shielding film 10, an opening 22a in the area where the ground extension terminal of the printed circuit board (PCB) will be formed. Is formed. That is, the metal layer 12 of the shielding film 10 is electrically connected to the ground circuit of the printed circuit board (PCB) through the conductive adhesive layer 13, and the metal layer 12 connected to the ground circuit is the insulating layer 22 Since it is exposed through the opening 22a of, the exposed metal layer 12 can be used as a ground extension terminal of the printed circuit board (PCB).

Meanwhile, the insulating layer 22 of the coverlay 20 is preferably made of the same material as the insulating layer 22 of the second embodiment.

After laminating the insulating layer 22 on the upper side of the shielding film 10 as described above, a partial metal layer removal step (S190) and a plating layer formation step (S200) as shown in (k) and (l) of FIG. 3 are performed. Thus, the plating layer 30 is formed on the metal layer 12 exposed through the opening 22a of the insulating layer 22.

In this way, when using the coverlay 20, the shielding film preparation step (S110) to the insulating layer forming step (S180') may be sequentially performed as in the present embodiment, and regardless of the above order, the shielding film 10 ) And the coverlay 20 may be laminated and pressed, respectively.

Hereinafter, an electromagnetic wave shielding film according to a fourth embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the accompanying drawings, FIG. 4 is a cross-sectional view of an electromagnetic wave shielding film according to a fourth embodiment of the present invention.

The electromagnetic wave shielding film 10' according to the fourth embodiment of the present invention includes a carrier film 11, a conductive metal layer 12 formed on one surface of the carrier film 11, and the metal layer 12. It includes a conductive layer 15, a conductive adhesive layer 13 formed on the conductive layer 15, and a protective film 14 formed on the conductive adhesive layer 13.

The conductive layer 15 is preferably made of a material having relatively higher electrical conductivity than the metal layer 12, and may be formed by coating a silver ink having excellent electrical conductivity on the metal layer 12. As a coating method of the conductive layer 15, gravure coating, screen printing, slot die, spin coating, or the like may be used. When the conductive layer 15 is formed on the metal layer 12 as described above, the electromagnetic wave shielding effect may be further improved.

Meanwhile, the rest of the configuration except for the conductive layer 15 is the same as that of the electromagnetic wave shielding film of the first embodiment illustrated in FIG. 1, so a detailed description of the same configuration will be omitted.

Hereinafter, a method of manufacturing a printed circuit board according to a fifth embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the accompanying drawings, FIG. 5 is a cross-sectional view of a method for manufacturing a printed circuit board according to a fifth embodiment of the present invention.

The printed circuit board manufacturing method according to the fifth embodiment of the present invention shown in FIG. 5 is different from the printed circuit board manufacturing method of the second embodiment in that the electromagnetic wave shielding film 10' of the fourth embodiment of the present invention is used. Has.

Specifically, the printed circuit board manufacturing method according to the fifth embodiment of the present invention shown in FIG. 5 includes a shielding film preparation step (S110'), a shielding film punching step (S120), a protective film removal step (S130), and bonding. Step (S140), the conductive adhesive layer semi-curing step (S150), carrier film removal step (S160), insulating layer forming step (S180), metal layer partially removing step (S190), and plating layer forming step (S200).

In the shielding film preparation step (S110'), as shown in FIG. 5A, a carrier film 11, a metal layer 12, a conductive layer 15, a conductive adhesive layer 13, and a protective film 14 are stacked. Prepare a shielding film (10'). This shielding film 10' may be formed of the electromagnetic wave shielding film 10' of the fourth embodiment of the present invention.

The conductive layer 15 is coated with a silver ink having relatively higher electrical conductivity than the metal layer 12 on the metal layer 12, and the silver ink is gravure coating, screen printing, slot die, and spin coating. It may be coated on the metal layer 12 by, for example.

In the present embodiment, the remaining steps except for the step of preparing the shielding film (S110') are the same as the method of manufacturing the printed circuit of the second embodiment shown in FIG. 2, so a detailed description of the same steps will be omitted.

In addition, FIG. 6 is a cross-sectional view of a method for manufacturing a printed circuit board according to a sixth embodiment of the present invention.

The printed circuit board manufacturing method according to the sixth embodiment of the present invention includes a shielding film preparation step (S110'), a shielding film punching step (S120), a protective film removal step (S130), a bonding step (S140), a conductive adhesive layer radius It includes the step of forming (S150), the step of removing the carrier film (S160), the step of forming an insulating layer (S180'), the step of removing a part of the metal layer (S190), and the step of forming a plating layer (S200).

In this embodiment, the shielding film preparation step (S110') is the same as the shielding film preparation step (S110') of the fifth embodiment shown in FIG. 5, and the remaining steps except for the shielding film preparation step (S110') are Since the shielding film punching step (S120) to the plating layer forming step (S200) of the third embodiment shown in FIG. 3 are the same, a detailed description of the same step will be omitted.

Hereinafter, a method of manufacturing an electromagnetic wave shielding film according to a seventh embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the accompanying drawings, FIG. 7 is a cross-sectional view showing a method for manufacturing an electromagnetic wave shielding film according to a seventh embodiment of the present invention.

The manufacturing method of the electromagnetic wave shielding film according to the seventh embodiment of the present invention includes a metal layer preparation step (S210), a conductive adhesive layer forming step (S220) of forming a conductive adhesive layer 13 on one surface of the metal layer 12, A first protective film forming step (S230) of laminating the first protective film 14 on the conductive adhesive layer 13, and an insulating layer forming step of forming an insulating layer 22 on the other surface of the metal layer 12 ( S240) and a second protective film forming step (S250) of forming a second protective film 14 ′ on the insulating layer 22.

In the metal layer preparation step (S210), a metal layer 12 provided in the form of a copper foil having excellent electrical conductivity as shown in FIG. 7A is prepared.

In the conductive adhesive layer forming step (S220), a conductive adhesive layer 13 is formed by coating a conductive adhesive on one surface of the metal layer 12 as shown in FIG. 7(b) and then drying. Here, the conductive adhesive layer 13 may include a conductive filler and a binder resin, a curing agent, a flame retardant, and an additive, and the conductive adhesive layer 13 may be formed by applying a conductive adhesive composition to the metal layer 12. .

In the first protective film forming step (S230), a method of laminating the first protective film 14 subjected to silicon release treatment to the conductive adhesive layer 13 as shown in FIG. 7C may be used. Here, the first protective film 14 may be formed of a silicone release-coated PET film.

In the insulating layer forming step (S240), as shown in (d) of FIG. 7, an insulating paste is coated on the other surface of the metal layer 12 and then dried to form the insulating layer 22. Here, the insulating paste may include a binder resin, a flame retardant, a colorant, a curing agent, and the like.

In the second protective film forming step (S250), a method of laminating the second protective film 14 ′ subjected to silicon release treatment to the insulating layer 22 as shown in FIG. 7E may be used. Here, the second protective film 14 ′ may be formed of a silicone release-coated PET film.

The electromagnetic wave shielding film prepared as described above is to protect the conductive adhesive layer 13, such as the protective film removing step (S130) to the conductive adhesive layer completely curing step (S170) shown in Figure 2 (c) to (e). The second protective film 14 is peeled off to expose the conductive adhesive layer 13, and the exposed conductive adhesive layer 13 is semi-cured in a state in which it is bonded to the printed circuit board, and protects the insulating layer 22. After removing the protective film 14 ′, the electromagnetic wave shielding film may be bonded on the printed circuit board through the step of completely curing the conductive adhesive layer 13.

That is, in the semi-cured state of the conductive adhesive layer 13, the bonding force between the conductive adhesive layer 13 and the metal layer 12 increases, so that the metal layer 12 and the conductive adhesive layer 13 are removed during the peeling process of the second protective film 14'. The bonding surface of) or the bonding surface of the conductive adhesive layer 13 and the printed circuit board may be prevented from being separated.

In the accompanying drawings, FIG. 8 is a cross-sectional view for each process showing a method of manufacturing an electromagnetic wave shielding film according to an eighth embodiment of the present invention.

The manufacturing method of the electromagnetic wave shielding film according to the eighth embodiment of the present invention includes a metal layer preparation step (S210), a conductive layer forming step (S211) of forming a conductive layer 15 on one surface of the metal layer 12, and the A conductive adhesive layer forming step (S220) of forming a conductive adhesive layer 13 on the conductive layer 15, and a first protective film forming step of laminating the first protective film 14 on the conductive adhesive layer 13 (S230) ) And, an insulating layer forming step (S240) of forming an insulating layer 22 on the other surface of the metal layer 12 and a second protective film forming a second protective film 14' on the insulating layer 22 It includes a forming step (S250).

In the conductive layer forming step S211, the conductive layer 15 may be formed by coating silver ink having excellent electrical conductivity on the metal layer 12 as shown in FIG. 8B. As a coating method of the conductive layer 15, gravure coating, screen printing, slot die, spin coating, or the like may be used. When the conductive layer 15 is formed on the metal layer 12 as described above, the electromagnetic wave shielding effect may be further improved.

Next, in the conductive adhesive layer forming step (S230), a conductive adhesive layer 13 is formed by coating a conductive adhesive on the conductive layer 15 and then drying as shown in FIG. 8C.

Meanwhile, in the eighth embodiment of the present invention, the remaining steps except for the conductive layer forming step (S211) are the same as those of the seventh embodiment described above, and a detailed description of the same steps will be omitted.

Hereinafter, the present invention will be described in detail through examples and experimental results conducted to demonstrate the excellence of the electromagnetic wave shielding film, the printed circuit board manufacturing method, and the electromagnetic wave shielding film manufacturing method of the present invention. However, the following examples are for illustration only, and the present invention is not limited to the following examples.

<Example 1>

67 parts by weight of urethane-modified polyester resin (IT-5000, noru paint) in a stirrer and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone), and cyclohexanone 9 as a solvent After putting in parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (S-403, JB Caltech Co., Ltd.) having a spherical average particle diameter of 4 μm coated with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an anisotropy conductive adhesive composition.

The prepared anisotropic conductive adhesive composition was coated on the surface of a copper foil with a carrier (copper foil 3㎛ thick) using a slot die and heated at 150℃ for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3㎛. . Then, a silicon release-treated PET protective film having a thickness of 50 μm was laminated on an anisotropically conductive adhesive layer to prepare it.

<Example 2>

67 parts by weight of urethane-modified polyester resin (IT-5000, noru paint) in a stirrer and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone), and cyclohexanone 9 as a solvent After putting in parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (S-403, JB Caltech Co., Ltd.) having a spherical average particle diameter of 4 μm coated with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an anisotropy conductive adhesive composition.

The prepared anisotropic conductive adhesive composition was coated on the surface of a copper foil with a carrier (Copper foil, copper thickness 6㎛) using a slot die and heated at 150℃ for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3㎛. . After that, a silicone release-treated 50 μm-thick PET protective film was laminated on an anisotropically conductive adhesive layer to prepare it.

<Example 3>

67 parts by weight of urethane-modified polyester resin (IT-5000, noru paint) in a stirrer and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone), and cyclohexanone 9 as a solvent After putting in parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (S-403, JB Caltech Co., Ltd.) having a spherical average particle diameter of 4 μm coated with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an anisotropy conductive adhesive composition.

The prepared anisotropic conductive adhesive composition was coated on the surface of a copper foil (10 µm thick) with a carrier attached using a slot die and heated at 150° C. for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 µm. . After that, a silicone release-treated 50 μm-thick PET protective film was laminated on an anisotropically conductive adhesive layer to prepare it.

<Example 4>

67 parts by weight of urethane-modified polyester resin (IT-180, noru paint) in a stirrer and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone), and cyclohexanone 9 as a solvent After putting in parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (ACBY-2F, Mitsui metal) having an average particle diameter of 7 um on the branch shape coated with silver with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an isotropy conductive adhesive composition.

The prepared isotropic conductive adhesive composition was coated on the surface of a copper foil with a carrier (copper foil 3㎛ thick) using a slot die and heated at 150℃ for 2 minutes to form an isotropic conductive adhesive layer with a dry thickness of 7㎛. . Thereafter, a 50 μm-thick PET protective film subjected to acrylic adhesive treatment was laminated on an isotropic conductive adhesive layer to prepare it.

<Example 5>

After coating silver ink (TEC-CO-021, Inktech Co., Ltd.) on the surface of a copper foil (copper foil with a carrier film of 3㎛) with a microgravure coater, it was heated and sintered at 150℃ for 4 minutes to achieve a thickness of 0.5㎛. A silver metal layer was prepared.

In addition, 67 parts by weight of a urethane-modified polyester resin (IT-5000, noru paint) and 10 parts by weight of a cresol novolac resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone) in a stirrer, and cyclohexanone as a solvent After adding 9 parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (S-403, JB Caltech, Inc.) having a spherical average particle diameter of 4 μm coated with silver with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an anisotropy conductive adhesive composition.

The prepared anisotropic conductive adhesive composition was coated on the surface of a copper foil with a carrier (copper foil 3㎛ thick) using a slot die and heated at 150℃ for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3㎛. . Then, a silicon release-treated PET protective film having a thickness of 50 μm was laminated on an anisotropically conductive adhesive layer to prepare it.

<Example 6>

67 parts by weight of urethane-modified polyester resin (IT-5000, noru paint) in a stirrer and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone), and cyclohexanone 9 as a solvent After putting in parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (S-403, JB Caltech Co., Ltd.) having a spherical average particle diameter of 4 μm coated with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an anisotropy conductive adhesive composition.

The prepared anisotropic conductive adhesive composition was coated on the surface of a copper foil with a carrier (copper foil 3㎛ thick) using a slot die and heated at 150℃ for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3㎛. . After that, a silicone release-treated 50 μm-thick PET protective film was laminated on an anisotropically conductive adhesive layer to prepare it.

In addition, 3 parts by weight of flame-retardant filler aluminum hydroxide (OSDH-3, Ohsung Corporation) and 2 parts by weight of dispersant (BYK-167, Bayer) were added to 50 parts by weight of polyimide modified resin (HPC-9000-21, Hitachi chemical). 45 parts by weight of cyclohexanone was added and stirred for 20 minutes. The stirred mixed solution was put in a basket mill (DWS-25, Daewon Stech) containing 5 µm of zirconia beads, dispersed at 1,500 rpm for 10 minutes, and then cooled to room temperature.

5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical) was added to 100 parts by weight of this dispersion, and after stirring at a low speed for 1 hour, it was filtered with SUS1000 mesh to obtain an insulating layer composition.

After removing the carrier film of the anisotropic conductive electromagnetic wave shielding film prepared above, the insulating layer composition was coated using a slot die and heated at 150° C. for 5 minutes to form a dry-thick 5 μm insulating layer to form the electromagnetic wave shielding film of Example 6. Was prepared.

<Example 7>

67 parts by weight of urethane-modified polyester resin (IT-180, noru paint) in a stirrer and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone), and cyclohexanone 9 as a solvent After putting in parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (ACBY-2F, Mitsui metal) having an average particle diameter of 7 um on the branch shape coated with silver with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an isotropy conductive adhesive composition.

The prepared isotropic conductive adhesive composition was coated on the surface of a copper foil with a carrier (copper foil 3㎛ thick) using a slot die and heated at 150℃ for 2 minutes to form an isotropic conductive adhesive layer with a dry thickness of 7㎛. . Thereafter, a 50 μm-thick PET protective film subjected to acrylic adhesive treatment was laminated on an isotropic conductive adhesive layer to prepare it.

In addition, 3 parts by weight of flame-retardant filler aluminum hydroxide (OSDH-3, Ohsung Corporation) and 2 parts by weight of dispersant (BYK-167, Bayer) were added to 50 parts by weight of polyimide modified resin (HPC-9000-21, Hitachi chemical). 45 parts by weight of cyclohexanone was added and stirred for 20 minutes. The stirred mixed solution was put in a basket mill (DWS-25, Daewon Stech) containing 5 µm of zirconia beads, dispersed at 1,500 rpm for 10 minutes, and then cooled to room temperature.

5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical) was added to 100 parts by weight of this dispersion, and after stirring at a low speed for 1 hour, it was filtered with SUS1000 mesh to obtain an insulating layer composition.

After removing the carrier film of the anisotropic conductive electromagnetic wave shielding film prepared above, the insulating layer composition was coated using a slot die and heated at 150° C. for 5 minutes to form a dry-thick 5 μm insulating layer to form the electromagnetic wave shielding film of Example 7 Was prepared.

<Comparative Example 1>

Add 3 parts by weight of flame-retardant filler aluminum hydroxide (OSDH-3, Ohsung Corporation) and 2 parts by weight of dispersant (BYK-167, Bayer) into 50 parts by weight of polyimide modified resin (HPC-9000-21, Hitachi chemical) 45 parts by weight of hexanone (Cyclohexanone) was added and stirred for 20 minutes. The stirred mixed solution was put in a basket mill (DWS-25, Daewon Stech) containing 5 µm of zirconia beads, dispersed at 1,500 rpm for 10 minutes, and then cooled to room temperature.

5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical) was added to 100 parts by weight of this dispersion, and after stirring at a low speed for 1 hour, it was filtered with SUS1000 mesh to obtain an insulating layer composition.

The insulating layer composition was applied to a silicone release-treated PET film with a thickness of 50 μm and dried at 150° C. for 2 minutes to obtain a coating film having a dry thickness of 7 μm.

A silver metal layer having a thickness of 0.2 μm was formed on the insulating layer by sputtering silver.

In addition, 67 parts by weight of a urethane-modified polyester resin (IT-5000, noru paint) and 10 parts by weight of a cresol novolac resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone) in a stirrer, and cyclohexanone as a solvent After adding 9 parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (S-403, JB Caltech, Inc.) having a spherical average particle diameter of 4 μm coated with silver with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an anisotropy conductive adhesive composition.

The prepared anisotropic conductive adhesive composition was coated on the surface of the silver metal layer using a slot die and heated at 150° C. for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 μm. Then, a PET protective film having a thickness of 50 μm subjected to silicone release treatment was laminated on an anisotropically conductive adhesive layer to prepare Comparative Example 1.

<Comparative Example 2>

Add 3 parts by weight of flame-retardant filler aluminum hydroxide (OSDH-3, Ohsung Corporation) and 2 parts by weight of dispersant (BYK-167, Bayer) into 50 parts by weight of polyimide modified resin (HPC-9000-21, Hitachi chemical) 45 parts by weight of hexanone (Cyclohexanone) was added and stirred for 20 minutes. The stirred mixed solution was put in a basket mill (DWS-25, Daewon Stech) containing 5 µm of zirconia beads, dispersed at 1,500 rpm for 10 minutes, and then cooled to room temperature.

5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical) was added to 100 parts by weight of this dispersion, and after stirring at a low speed for 1 hour, it was filtered with SUS1000 mesh to obtain an insulating layer composition.

The insulating layer composition was applied to a silicone release-treated PET film with a thickness of 50 μm and dried at 150° C. for 2 minutes to obtain a coating film having a dry thickness of 7 μm.

In addition, 67 parts by weight of a urethane-modified polyester resin (IT-180, noru paint) and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (Methyl isobutyl ketone) in a stirrer, and cyclohexanone as a solvent After adding 9 parts by weight and stirring for 2 hours, 14 parts by weight of AgCu (ACBY-2F, Mitsui metal) having an average particle diameter of 7 um on the branch shape coated with silver with a conductive filler was added and stirred for an additional hour.

The prepared conductive adhesive was filtered through a filter of SUS1000 mesh to obtain an isotropy conductive adhesive composition.

The prepared isotropic conductive adhesive composition is coated on the surface of the silicone release-treated PET release film using a slot die and heated at 150℃ for 3 minutes to form an isotropic conductive adhesive layer with a dry thickness of 12㎛, and an insulating layer is applied to the silicone release PET film. Comparative Example 2 was prepared by rolling the formed film and laminating at a temperature of 100° C. and a pressure of 7 bar.

The stacked structures and thicknesses of Examples 1 to 7 and Comparative Examples 1 to 2 are shown in Table 1 below.

In addition, an evaluation sample was prepared for the prepared electromagnetic wave shielding film in the following manner, and the results are shown in Table 2.

<Evaluation method of electromagnetic shielding film>

1) Interlayer adhesion of electromagnetic shielding film

After cutting the measurement sample into a size of 25.4mm in width and 25cm in length, remove the protective film of the conductive adhesive layer, place a 25㎛-thick PI film (Kapton, DuPont) on one side of the sample, and use a temporary folding machine (temperature 150℃, Pressure 3bar, 20 seconds) and then laminated a 25㎛-thick bonding sheet on the copper surface or insulating layer surface from which the carrier film was removed, and hot press (press condition: temperature 150℃, pressure 40kgf/cm2, time 60 minutes). The adhesive layer was completely cured (C-stage) under heating and pressure. The tensile strength was measured at a tensile speed of 58.8M/min and 180 degrees in an atmosphere of 25°C and 50%RH. The same sample was tested three times and the average value was indicated.

2) Solder heat resistance

Example 1 After removing the protective film of the electromagnetic wave shielding film as shown in the stepped lamination diagram in Figure 1, and attaching a 25㎛-thick PI film (Kapton, DuPont) using a temporary folding machine (temperature 150℃, pressure 3bar, 20 seconds) In ~4, the carrier is removed, an insulating film (BT-012, Inktech, Inc.) is laminated, and the adhesive layer is completely cured by heating and pressing with a hot press (press condition: temperature 150℃, pressure 40kgf/cm2, time 60 minutes). C-stage). The cured sample was placed in 295° C. solder for 1 minute, twice, and visually observed to evaluate the presence or absence of air bubbles, lifting, and color change in appearance. Each sample was tested by 5 and the number of appearance defects was indicated.

[Picture 1]

<Step lamination diagram and surface photograph of solder heat resistance evaluation>

3) Step crack

Put the FRP rod (5mm width, 25cm length) to be used as a step on the 25㎛ thick PI film (Kapton, DuPont) to be used as a step as shown in the step stacking diagram in Figure 2. After fixing with heat-resistant tape and removing the release film of the shielding film on it, attaching it using a temporary folding machine (temperature 150° C., pressure 3 bar, 20 seconds), in Examples 1 to 4, the carrier was removed and the insulating film (BT- 012, Inktech Co.) was laminated and heated and pressed with a Hot Press (press condition: temperature 150°C, pressure 40kgf/cm2, time 60 minutes) to completely cure the adhesive layer (C-stage).

The surface of the insulating layer of the sample was observed with a hand microscope (refer to the surface photo in Figure 2). Five evaluation samples were prepared and the number of cracks generated by the thickness of the step was indicated.

[Picture 2]

<Step stacking diagram and surface photograph of step crack evaluation>

4) reliability

After removing the protective film of the electromagnetic wave shielding film and attaching it to the resistance test coupon (Fig. 3, Inktech) using a temporary folding machine (temperature 150°C, pressure 3bar, 20 seconds), Examples 1 to 4 remove the carrier and insulate The film (BT-012, Inktech) was laminated and heated and pressed with a Hot Press (press condition: temperature 150°C, pressure 40kgf/cm2, time 60 minutes) to completely cure the adhesive layer (C-stage).

The prepared sample was left in a chamber at 85° C. and a humidity of 85% RH for 72 hours, and then changes in appearance and resistance were measured.

[Picture 3]

<Resistance test coupon>

5) Measurement of electromagnetic shielding rate

After removing the protective film of the electromagnetic wave shielding film and pressing a 25 μm-thick PI film (Kapton, DuPont) with a hot plate at 120° C. for 2 seconds, Examples 1 to 4 removed the carrier and the insulating film (BT-012, Inktech Inc.) was laminated and heated and pressed with a hot press (press condition: temperature 150°C, pressure 40kgf/cm2, time 60 minutes) to completely cure (C-stage) the adhesive layer.

The sample was tested according to ASTM D4935 (Standard Measurement Test Method for Shielding Effect of Planar Materials).

The scope of the present invention is not limited to the above-described embodiments, but may be implemented in various forms within the scope of the appended claims. Without departing from the gist of the present invention claimed in the claims, any person of ordinary skill in the art to which the present invention belongs is considered to be within the scope of the description of the claims of the present invention to various ranges that can be modified.

10: shielding film, 11: carrier film, 12: metal layer,
13: conductive adhesive layer, 14: protective film, 15: conductive layer,
20: coverlay, 21: carrier film, 22: insulating layer,
22a: opening, 23: adhesive layer, 24: protective film,
30: plating layer, PCB: printed circuit board,

Claims (26)

delete delete delete delete delete delete delete delete delete delete A shielding film preparation step of preparing a shielding film in which a carrier film, a metal layer, a conductive adhesive layer, and a protective film are sequentially stacked;
A protective film removing step of removing the protective film of the shielding film;
A bonding step of bonding the conductive adhesive layer of the shielding film to a printed circuit board;
A conductive adhesive layer semi-curing step of semi-curing the conductive adhesive layer;
A carrier film removing step of removing the carrier film of the shielding film;
Completely curing the conductive adhesive layer; And
And an insulating layer forming step of forming an insulating layer having an opening formed on a metal layer of the shielding film in a region where a ground extension terminal of the printed circuit board is to be formed, and
In the semi-curing step of the conductive adhesive layer, the conductive adhesive layer is semi-cured to increase the bonding force between the conductive adhesive layer and the metal layer. The method of claim 11,
In the insulating layer forming step, an insulating layer is formed by printing an insulating paste on the metal layer. The method of claim 11,
In the insulating layer forming step, an insulating film having an opening is formed on the metal layer to form an insulating layer. The method of claim 11,
The insulating layer forming step,
A coverlay preparation step of preparing a coverlay in which a carrier film, an insulating layer, an adhesive layer, and a protective film are sequentially stacked;
A punching step of punching the coverlay to form an opening in a region where a ground extension terminal of the printed circuit board is to be formed;
A protective film removing step of removing the protective film of the coverlay; And
A method of manufacturing a printed circuit board comprising a laminating step of laminating the metal layer of the shielding film and the adhesive layer of the coverlay. The method of claim 11 or 14,
The method of manufacturing a printed circuit board further comprising a plating layer forming step of forming a plating layer on the metal layer exposed through the opening of the insulating layer. The method of claim 15,
Prior to the forming of the plating layer, a partial metal layer removing step of partially removing the metal layer exposed through the opening of the insulating layer in the thickness direction. delete delete The method of claim 14,
After the laminating step, a coverlay carrier film removal step of removing the carrier film of the coverlay; a printed circuit board manufacturing method, characterized in that performing. The method of claim 19,
Prior to the step of removing the coverlay carrier film, the adhesive layer semi-curing step of semi-curing the adhesive layer of the coverlay; a printed circuit board manufacturing method, characterized in that performing. The method of claim 20,
After the step of removing the coverlay carrier film, the adhesive layer completely curing step of completely curing the adhesive layer of the coverlay; a printed circuit board manufacturing method, characterized in that performing. The method of claim 11,
In the step of preparing the shielding film, a conductive layer made of a material having relatively excellent electrical conductivity compared to the metal layer is formed between the metal layer and the conductive adhesive layer. delete delete delete delete

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