WO2019124624A1

WO2019124624A1 - Electromagnetic wave shielding film, method for manufacturing printed circuit board, and method for manufacturing electromagnetic wave shielding film

Info

Publication number: WO2019124624A1
Application number: PCT/KR2018/000662
Authority: WO
Inventors: 정광춘; 조남부; 박광진; 윤희근
Original assignee: (주)잉크테크
Priority date: 2017-12-18
Filing date: 2018-01-15
Publication date: 2019-06-27
Also published as: KR20190073037A; TWI707940B; JP6724054B2; TW201927968A; CN108495543B; JP2019110282A; KR102197471B1; CN108495543A

Abstract

The present invention relates to an electromagnetic wave shielding film, a method for manufacturing a printed circuit board, and a method for manufacturing an electromagnetic wave shielding film. The electromagnetic wave shielding film according to the present invention comprises: a carrier film; a conductive metal layer formed on one surface of the carrier film; a conductive bonding layer formed on the metal layer; and a protection film formed on the conductive bonding layer.

Description

Electromagnetic wave shielding film, method of manufacturing printed circuit board and method of manufacturing electromagnetic wave shielding film

The present invention relates to an electromagnetic wave shielding film, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film. More particularly, the present invention can broaden the ground area of an electromagnetic wave shielding film attached to a printed circuit board, A method for manufacturing a printed circuit board, and a method for manufacturing an electromagnetic wave shielding film, which can provide excellent environmental reliability, heat resistance and step property.

It has been reported that electromagnetic waves generated from internal elements of electronic devices such as mobile phones, digital cameras, notebook PCs, office equipment and medical devices can affect various diseases such as headache, visual loss, brain tumor, circulatory system abnormality, The controversy about the harmfulness to human body is increasing. In addition, due to the weight reduction of electronic products, the degree of integration of devices increases, and electromagnetic noise generated from each component causes malfunction of peripheral devices, which may cause device failure. Recently, shielding standards for electromagnetic waves generated from household, office, and industrial electronic products such as computers, mobile phones, medical devices, and multimedia players have been strengthened and restrictions on EMI (electromagnetic interference) and RFI And measures against electromagnetic wave shielding of various electronic devices and parts are becoming important tasks.

In recent years, a flexible printed wiring board (hereinafter referred to as FPCB) having a narrow and complicated structure has been widely used in order to meet demands for high performance and miniaturization of office equipment, communication equipment, mobile phones and the like. The FPCB is used with a shield film for shielding electromagnetic noise.

It is widely known that a conventional shield film has a base film and a conductive layer laminated thereon. Normally, a reinforcing film for workability is used for the base film side in this basic constitution, and a protective film is used for the conductive layer to manufacture a product.

Japanese Patent Application Laid-Open No. 5-3395 discloses a method of using a metal thin film to obtain an excellent shielding effect. Japanese Patent Laid-Open No. 7-122882 discloses a method of combining a conductive adhesive layer and a metal thin film using a metal filler .

However, when the electromagnetic wave shielding film is produced by applying and drying a conductive adhesive layer on the metal layer in the state that the carrier film and the metal layer are laminated and laminating a protective film on the conductive adhesive layer, There is a problem that the metal layer is peeled off from the conductive adhesive layer in a state where the metal layer is attached to the carrier film or peeling phenomenon occurs in which the metal layer and the conductive adhesive layer are separated from each other during the peeling of the carrier film .

In addition, recently produced electronic devices are manufactured with precision, light weight and small size. Due to this tendency, the line width and spacing of the circuit patterns are narrowed, and the ground can not be ensured widely. There is a problem in that a separate ground film must be used.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electromagnetic wave shielding film capable of eliminating a ground film by widening a ground area of an electromagnetic wave shielding film attached to a printed circuit board, And a method for manufacturing an electromagnetic wave shielding film.

It is also an object of the present invention to provide an electromagnetic wave shielding film for high-speed transmission, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film having antioxidation characteristics and high heat resistance characteristics.

A method of manufacturing an electromagnetic wave shielding film, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film, which can prevent the metal layer from being arbitrarily separated from the conductive adhesive layer in the peeling process of the carrier film by peeling the carrier film in a state where the conductive adhesive layer is semi-cured .

According to an aspect of the present invention, there is provided a semiconductor device comprising: a carrier film; a conductive metal layer formed on one surface of the carrier film; a conductive adhesive layer formed on the metal layer; And a protective film formed on the conductive adhesive layer.

Here, the conductive adhesive layer preferably includes a binder resin and a conductive filler.

The conductive filler may include silver, copper, aluminum, nickel, gold, zinc or iron particles, and the particles may be in the form of flake, spherical, dendrite or granule .

Further, the particles preferably have a size of 3 mu m to 20 mu m.

It is preferable that the binder resin is at least one of polyvinyl butyral, cellulose, polyurethane, polyester, epoxy, phenoxy, novolak, alkyd, amide, imide resin or modified products thereof.

In addition, it is preferable that a conductive layer is interposed between the metal layer and the conductive adhesive layer.

In addition, it is preferable that the conductive layer is made of a material having an electrical conductivity higher than that of the metal layer.

In addition, the conductive layer is preferably formed by coating a silver ink on a metal layer.

The metal layer is preferably at least one selected from the group consisting of nickel, copper, aluminum, zinc, and alloys thereof.

The metal layer is preferably formed of a foil having a thickness of 2 to 10 mu m.

An object of the present invention is to provide a method of manufacturing a shielding film, comprising the steps of: preparing a shielding film in which a carrier film, a metal layer, a conductive adhesive layer and a protective film are sequentially laminated; a protective film removing step of removing the protective film of the shielding film; A bonding step of bonding the conductive adhesive layer of the film to the printed circuit board; removing the carrier film of the shielding film; And forming an insulation layer on the metal layer of the shielding film, the insulation layer having an opening formed in an area where the ground extension terminal of the printed circuit board is to be formed.

Here, in the insulating layer forming step, it is preferable that an insulating layer is formed by printing an insulating paste on the metal layer.

In the insulating layer forming step, it is preferable to form an insulating layer by attaching an insulating film having openings on the metal layer.

In addition, the insulating layer forming step may include: a coverlay preparing step of preparing a coverlay in which a carrier film, an insulating layer, an adhesive layer, and a protective film are laminated in order; A protective film removing step of removing the protective film of the coverlay; And a lapping step of lapping the metal layer of the shielding film and the adhesive layer of the coverlay.

The method may further include forming a plating layer on the metal layer exposed through the opening of the insulating layer.

The method may further include removing a metal layer partially removing the metal layer exposed through the opening of the insulating layer in the thickness direction prior to the plating layer forming step.

In addition, it is preferable to perform the semi-curing step of the conductive adhesive layer to semi-cure the conductive adhesive layer prior to the carrier film removing step.

Further, it is preferable to perform the step of completely curing the conductive adhesive layer after the step of removing the carrier film.

Further, it is preferable to perform a coverlay carrier film removing step of removing the carrier film of the coverlay after the lapping step.

It is also preferable to perform an adhesive layer semi-curing step of semi-curing the adhesive layer of the coverlay prior to the step of removing the coverlay carrier film.

Further, it is preferable to perform the step of completely curing the adhesive layer to completely cure the adhesive layer of the coverlay after the step of removing the coverlay carrier film.

In addition, in the shielding film preparation step, it is preferable to form a conductive layer of a material having a relatively higher electric conductivity than the metal layer between the metal layer and the conductive adhesive layer.

A conductive adhesive layer forming step of forming a conductive adhesive layer on one surface of the metal layer; a step of forming a conductive adhesive layer on the conductive adhesive layer, the conductive adhesive layer forming a first protective film on the conductive adhesive layer; Forming an insulating layer on the other surface of the metal layer; And a second protective film forming step of forming a second protective film on the insulating layer.

In addition, it is preferable to perform a conductive layer forming step of forming a conductive layer on one surface of the metal layer prior to the step of forming the conductive adhesive layer.

According to the present invention, there is provided an electromagnetic wave shielding film, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film, which can enlarge a ground area of an electromagnetic wave shielding film attached to a printed circuit board to eliminate a ground film. Therefore, it is possible to solve the difficulty that the ground can not be widened in manufacturing the microcircuit substrate, so that it is possible to provide a manufacturing effect of the microcircuit substrate, thereby reducing the manufacturing process, productivity, and manufacturing cost.

In addition, a printed circuit board to which an electromagnetic wave shielding film for high-speed transmission having anti-oxidation characteristics and high heat resistance characteristics are applied can be manufactured.

The carrier film is peeled off while the conductive adhesive layer is semi-cured, thereby preventing the metal layer from being separated from the conductive adhesive layer in the peeling process of the carrier film.

1 is a cross-sectional view of an electromagnetic wave shielding film according to a first embodiment of the present invention,

2 is a cross-sectional view of a process for manufacturing a printed circuit board according to a second embodiment of the present invention,

FIG. 3 is a cross-sectional view of a process for manufacturing a printed circuit board according to a third embodiment of the present invention,

4 is a cross-sectional view of an electromagnetic wave shielding film according to a fourth embodiment of the present invention,

5 is a cross-sectional view of a process for manufacturing a printed circuit board according to a fifth embodiment of the present invention,

6 is a sectional view of a process for manufacturing a printed circuit board according to a sixth embodiment of the present invention,

7 is a cross-sectional view of a process for manufacturing an electromagnetic wave shielding film according to a seventh embodiment of the present invention,

8 is a cross-sectional view of an electromagnetic wave shielding film manufacturing method according to an eighth embodiment of the present invention,

9 is a laminate structure and thickness comparison charts of Examples 1 to 7 and Comparative Examples 1 and 2,

10 is an evaluation result table of the electromagnetic wave shielding film,

11 is a stepwise stacking view and a surface photograph of the solder heat resistance evaluation,

12 is a stepped stacked view and a surface photograph of a stepped crack evaluation,

13 is a resistance test coupon image.

Prior to the description, components having the same configuration are denoted by the same reference numerals as those in the first embodiment. In other embodiments, configurations different from those of the first embodiment will be described do.

Hereinafter, the electromagnetic wave shielding film according to the first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of an electromagnetic wave shielding film according to a first embodiment of the present invention.

The electromagnetic wave shielding film 10 according to the first embodiment of the present invention comprises a carrier film 11, a conductive metal layer 12 formed on one side of the carrier film 11, a conductive metal layer 12 formed on the metal layer 12, And an adhesive layer (13) and a protective film (14) formed on the conductive adhesive layer (13).

The carrier film 11 may be provided in the form of AL-PET (Aluminum-Laminated Polyethylene Terephthalate) laminated with an aluminum film on a PET film or in the form of Copper-Laminated Polyethylene Terephthalate Can be provided.

The metal layer 12 may be made of a metal material having excellent electrical conductivity such as nickel, copper, aluminum, or zinc or a metal material of the alloy type, Lt; RTI ID = 0.0 > um. &Lt; / RTI > The metal layer 12 may be formed on the carrier film 11 by a variety of methods such as plating, printing, coating, or vapor deposition of a conductive material. The metal layer 12 may be formed on one side of the carrier film 11, It is also possible to use ready made products.

The conductive adhesive layer 13 may include a conductive filler and a binder resin, a curing agent, a flame retardant, and an additive. The conductive adhesive layer 13 may be formed by applying a conductive adhesive composition to the metal layer 12.

Here, the binder resin should be excellent in heat resistance, acid resistance, and alkali resistance, and it is particularly preferable that the binder resin is excellent in adhesion and lowers the influence on the conductivity of the conductive filler due to the characteristics of the binder.

When the heat resistance of the resin is low, defects may occur in the surface of the solder process, which is an essential step in the manufacture of a printed circuit board, or the resistance may increase due to heat. In addition, copper plating or gold plating can be performed to lower circuit resistance or prevent corrosion at the time of manufacturing a printed circuit board. Since the plating solution is strongly acidic or strongly alkaline, excellent chemical resistance and alkali resistance are required. In addition, a cleaning operation may be performed with an alkaline solution for surface cleaning and flux removal before and after the solder. In some cases, soft etching may be performed to improve the uniformity and adhesion of the plating.

The conductive adhesive layer 13 should be pre-fixed on the printed circuit board in a B-stage state, and then be supplied to the main process. Therefore, the binder resin should have a semi-cured state at room temperature and should be fully cured in the main process.

Examples of the binder resin of the conductive adhesive layer 13 include polyvinyl butyral (PVB), cellulose, polyurethane, polyester, epoxy, phenoxy, Novolac, Alkyd, Amide, Imide resins or their modifications can be used. In this embodiment, a cresol novolak resin was mixed with a denatured product of a polyester resin to improve heat resistance.

The conductive filler may be a conductive metal such as Silver, Copper, Aluminum, Nickel, Gold, Zinc and Iron, Can be used. These shapes may be in the form of Flake, Spherical, Dendrite, Granule, or the like.

The conductive filler having a particle size of 30 mu m or less can be used. More preferably not less than 3 mu m and not more than 20 mu m. When a conductive filler of less than 3 mu m is used, the resistance of the resin increases, so that more metal particles must be used and the resistance is also increased. In addition, the particles having a size exceeding 20 mu m are uncoated in the coating direction in the coating process, the dried coating film is uneven, and pin-holes are generated.

The protective film 14 may be formed of a PET film coated with a silicon release coating and may be attached to the conductive adhesive layer 13 by a method of laminating a protective film 14 having a silicon release treatment on the conductive adhesive layer 13.

The electromagnetic wave shielding film 10 of the present embodiment has a carrier film 11 having a thickness of 83 탆, a metal layer 12 having a thickness of 3 탆, a conductive adhesive layer 13 having a thickness of 6 탆 and a protective film 14 having a thickness of 75 탆 Lt; / RTI >

In the case of the electromagnetic wave shielding film 10 having the above-described structure, the conductive adhesive layer is formed on the carrier film 11 on which the metal layer 12 is formed to form the conductive adhesive layer 13, Alternatively, a conductive adhesive may be coated on the protective film 14 to form a conductive adhesive layer 13, followed by laminating the carrier film 11 on which the metal layer 12 is formed.

Hereinafter, a method of manufacturing a printed circuit board according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view of a process for manufacturing a printed circuit board according to a second embodiment of the present invention.

The method of manufacturing a printed circuit board according to the second embodiment of the present invention may further include a step of preparing a shielding film (S110), a step of forming a shielding film (S120), a step of removing a protective film (S130), a bonding step (S140) Step S150, the carrier film removing step S160, the conductive adhesive layer complete curing step S170, the insulating layer forming step S180, the metal layer part removing step S190, and the plating layer forming step S200.

2 (a), the shielding film 10 in which the carrier film 11, the metal layer 12, the conductive adhesive layer 13, and the protective film 14 are sequentially laminated is prepared in the step of preparing the shielding film (S110) . The shielding film 10 may be made of the electromagnetic wave shielding film of the first embodiment of the present invention.

As shown in FIG. 2 (b), the shielding film 10 in a sheet form is stuck on a printed circuit board (PCB) to be attached in the shielding film punching step S120. The punching of the shielding film 10 may be performed by a pressing process or a laser cutting process.

The protective film 14 disposed on one side of the conductive adhesive layer 13 of the shielding film 10 is removed in the step of removing the protective film S130 as shown in FIG. Since the protective film 14 has an appropriate releasing force with respect to the conductive adhesive layer 13, it can be easily peeled off.

2 (d), the conductive adhesive layer 13 of the shielding film 10 is adhered to the surface of the printed circuit board (PCB) on which the circuit pattern is formed.

In the conductive adhesive layer semi-curing step S150, the shielding film 10 is heated for a predetermined time so that the conductive adhesive layer 13 is in a B-stage state. The semi-curing condition may be changed depending on the composition of the conductive adhesive layer 13, and in this embodiment, the temperature is raised at a temperature of 150 DEG C and a pressure of 3 bar for 20 seconds using a folding machine. The bonding strength between the conductive adhesive layer 13 and the metal layer 12 is increased by the semi-curing of the conductive adhesive layer 13.

The carrier film 11 attached to the metal layer 12 of the shielding film 10 is removed in the step of removing the carrier film S160 as shown in FIG. At this time, the metal layer 12 to which the carrier film 11 is attached is in a state in which the bonding strength with the conductive adhesive layer 13 is increased as the conductive adhesive layer 13 is semi-cured. Therefore, in the process of removing the carrier film 11 It is possible to prevent the metal layer 12 from being peeled off from the conductive adhesive layer 13.

In the conductive adhesive layer full curing step S170, the conductive adhesive layer 13 is heated and pressed so as to be in a C-Stage state. Here, the complete curing conditions of the conductive adhesive layer 13 may be changed depending on the composition of the conductive adhesive layer 13. In this embodiment, the temperature of 150 占 폚 占 10 占 폚, 40kgf /? (Surface pressure) Lt; / RTI > for 60 minutes.

In the insulating layer forming step (S180), the insulating layer 22 may be formed by printing an insulating paste through a screen formed in accordance with a pattern and then drying the insulating paste as shown in FIG. 2 (f). The insulating layer 22 can be formed in a desired region by using the screen printing method and an insulating layer 22 having an opening 22a formed in a region where a ground expansion terminal of a printed circuit board So that it can be formed on the metal layer 12 of the shielding film 10.

In this embodiment, in addition to printing the insulating paste on the metal layer 12, an insulating film (Coverlay) is formed so that the opening 22a is formed in the area where the ground expansion terminal of the printed circuit board PCB is to be formed It is also possible to form the insulating layer 22 by attaching it to the metal layer 12 later.

The metal layer 12 of the shielding film 10 is electrically connected to the ground circuit of the printed circuit board PCB through the conductive adhesive layer 13 so that the metal layer 12 exposed through the opening 22a of the insulating layer 22 12 can be utilized as a ground expansion terminal of a printed circuit board (PCB).

The insulating paste may include a binder resin, a flame retardant, a colorant, a curing agent, and the like.

The binder resin of the insulating layer 22 should be capable of being coated, have high flexibility after curing, and should have a scratch resistance (2H or more) because it is located outside the printed circuit board.

Since the insulating layer 22 is exposed in the manufacturing process of the printed circuit board, the insulating layer 22 should have excellent heat resistance, chemical resistance, alkali resistance, and acid resistance.

Especially, since it is a region directly exposed to heat, it needs to be excellent in heat resistance (300 ° C.) and in case of surface contamination in the manufacturing process, it is removed with alcohol (isopropyl alcohol).

Further, since the other reinforcing plate is required to be attached and marked on the insulating layer 22, it should be designed to have excellent adhesion. When the surface is polyimide, there is a problem of lamination adhesion, and a plasma process may be added.

2 (g), the metal layer 12 exposed through the opening 22a of the insulating layer 22 is soft-etched and partially removed in the thickness direction (S190) The oxidized surface of the metal layer 12 is removed (0.3 to 1.0 탆).

Next, in the plating layer forming step S200, a surface antioxidation conductive material such as gold (Au) is applied to the metal layer 12 whose surface has been removed through electroplating or electroless plating as shown in FIG. 2 (h) The plating layer 30 is formed by plating. The plating layer 30 may be used as a ground extension terminal while being electrically connected to the ground circuit of the printed circuit board (PCB) while protecting the metal layer 12.

Hereinafter, a method of manufacturing a printed circuit board according to a third embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3 is a cross-sectional view of a process for manufacturing a printed circuit board according to a third embodiment of the present invention.

A method of manufacturing a printed circuit board according to a third embodiment of the present invention includes a step of preparing a shielding film S110, a step of forming a shielding film S120, a step of removing a protective film S130, a bonding step S140, Step S150, carrier film removing step S160, insulating layer forming step S180 ', metal layer part removing step S190, and plating layer forming step S200.

In the third embodiment of the present invention, the remaining steps except for the insulating layer forming step S180 'are the same as those of the second embodiment, so detailed description of the same steps will be omitted.

The insulating layer forming step S180 'may include a cover layer preparing step S181, a covering layer removing step S182, a protective film removing step S183, a lapping step S184, an adhesive layer semi-curing step S185, A film removal step (S186), and an adhesive layer full curing step (S187).

3 (f), in the coverlay preparing step S181, the coverlay 20 in which the carrier film 21, the insulating layer 22, the adhesive layer 23, and the protective film 24 are laminated in this order, .

In this embodiment, the coverlay 20 has a carrier film 21 having a thickness of 55 占 퐉, an insulating layer 22 having a thickness of 7 占 퐉, an adhesive layer 23 having a thickness of 8 占 퐉 and a protective film 24 having a thickness of 75 占 퐉, &Lt; / RTI > The carrier film 21 of the coverlay 20 may be provided in the form of a semi-matt PET and the insulating layer 22 and the adhesive layer 23 may comprise a light absorbing material. have.

As shown in FIG. 3 (g), the coverlay 20 is formed in the coverlay punching step S182 to form the opening 22a of FIG. 3 (j) in a region where the ground extension terminal is to be formed. The punching of the coverlay 20 can be performed by a pressing process, a laser cutting process, or the like.

In step S183, the protective film 24 disposed on one side of the adhesive layer 23 of the coverlay 20 is removed as shown in FIG. 3 (h). Since the protective film 24 has an appropriate releasing force with respect to the adhesive layer 23, it can be easily peeled off.

3 (i), the adhesive layer 23 of the coverlay 20 is adhered to the metal layer 12 of the shielding film 10 in close contact with each other.

In the adhesive layer semi-curing step (S185), the coverlay 20 is heated for a predetermined time so that the adhesive layer 23 of the coverlay 20 is in a B-stage state. The semi-curing conditions may be changed depending on the composition of the adhesive layer 23, and in this embodiment, the temperature is raised at a temperature of 150 DEG C and a pressure of 3 bar for 20 seconds using a folding machine. The bonding strength between the adhesive layer 23 and the metal layer 12 is increased by the semi-curing of the adhesive layer 23.

In the step of removing the carrier film (S186), the carrier film 21 attached to the insulating layer 22 of the coverlay 20 is removed as shown in FIG. 3 (j). At this time, the insulating layer 22 to which the carrier film 21 is attached is in a state in which the bonding strength with the adhesive layer 23 is increased as the adhesive layer 23 is semi-cured. Therefore, in the process of removing the carrier film 21, It is possible to prevent the insulating layer 22 from being peeled off from the adhesive layer 23. Since the conductive adhesive layer 13 of the shielding film 10 is also semi-cured to increase the bonding force between the metal layer 12 and the printed circuit board PCB, the carrier film 21 of the coverlay 20 The bonding surface between the metal layer 12 and the conductive adhesive layer 13 may be separated or the bonding surface between the conductive adhesive layer 13 and the printed circuit board PCB may be prevented from being separated.

In the adhesive layer full curing step (S187), the adhesive layer 23 is heated and pressed so as to be in a C-Stage state. Here, the complete curing condition of the adhesive layer 23 may be changed depending on the composition of the adhesive layer 23. In this embodiment, the temperature of 150 ° C ± 10 ° C and the pressure of 40 kgf / Heated and pressurized for 60 minutes.

Meanwhile, in this embodiment, the conductive adhesive layer 13 of the shielding film 10 can be completely cured in the process of performing the adhesive layer full curing step (S187), so that the conductive adhesive layer completely cured in the second embodiment (S170) can be omitted. The adhesive layer 23 of the coverlay 20 may be completely cured under the same conditions as those of the conductive adhesive layer 13 of the shielding film 10.

The opening 22a is formed in the insulating layer 22 of the coverlay 20 which is laminated on the metal layer 12 of the shielding film 10 so that the ground extension terminal of the printed circuit board PCB is to be formed, Respectively. That is, the metal layer 12 of the shielding film 10 is electrically connected to the ground circuit of the printed circuit board PCB through the conductive adhesive layer 13, and the metal layer 12 connected to the ground circuit is electrically connected to the insulating layer 22, The exposed metal layer 12 can be utilized as a ground extending terminal of the printed circuit board PCB.

On the other hand, the insulating layer 22 of the coverlay 20 is preferably made of the same material as the insulating layer 22 of the second embodiment.

After the insulating layer 22 is laminated on the upper side of the shielding film 10 as described above, a metal layer part removing step (S190) and a plating layer forming step (S200) are performed as shown in (k) and (l) The plating layer 30 is formed on the exposed metal layer 12 through the opening 22a of the insulating layer 22. [

As described above, when the coverlay 20 is used, it may proceed sequentially from the step of preparing the shielding film (S110) to the step of forming the insulating layer (S180 ') as in the present embodiment, And the coverlay 20 may be laminated and pressed, respectively.

Hereinafter, the electromagnetic wave shielding film according to the fourth embodiment of the present invention will be described in detail with reference to the accompanying drawings.

4 is a cross-sectional view of an electromagnetic wave shielding film according to a fourth embodiment of the present invention.

An electromagnetic wave shielding film 10 'according to a fourth embodiment of the present invention includes a carrier film 11, a conductive metal layer 12 formed on one side of the carrier film 11, A conductive layer 15 formed on the conductive layer 15 and a conductive adhesive layer 13 formed on the conductive layer 15 and a protective film 14 formed on the conductive adhesive layer 13.

The conductive layer 15 is preferably made of a material having a relatively higher electrical conductivity than the metal layer 12 and may be formed by coating a silver ink having an excellent electrical conductivity on the metal layer 12. As the coating method of the conductive layer 15, gravure coating, screen printing, slot die, spin coating, or the like can be used. When the conductive layer 15 is formed on the metal layer 12 as described above, the electromagnetic wave shielding effect can be further improved.

Since the remaining structure except for the conductive layer 15 is the same as that of the electromagnetic wave shielding film of the first embodiment shown in FIG. 1, a detailed description of the same structure will be omitted.

Hereinafter, a method of manufacturing a printed circuit board according to a fifth embodiment of the present invention will be described in detail with reference to the accompanying drawings.

5 is a cross-sectional view of a process for manufacturing a printed circuit board according to a fifth embodiment of the present invention.

The method for manufacturing a printed circuit board according to the fifth embodiment of the present invention shown in Fig. 5 differs from the method for manufacturing a printed circuit board of the second embodiment in that the electromagnetic wave shielding film 10 'of the fourth embodiment of the present invention is used, .

5, the method for fabricating a printed circuit board according to the fifth embodiment of the present invention includes a step of preparing a shielding film S110 ', a step of forming a shielding film S120, a step of removing a protective film S130, The conductive adhesive layer semi-curing step S150, the carrier film removing step S160, the insulating layer forming step S180, the metal layer part removing step S190, and the plating layer forming step S200.

5A, the carrier film 11, the metal layer 12, the conductive layer 15, the conductive adhesive layer 13, and the protective film 14 are stacked in the shielding film preparing step S110 ' The shielding film 10 'is prepared. This shielding film 10 'can be made of the electromagnetic wave shielding film 10' of the fourth embodiment of the present invention.

The conductive layer 15 is formed on the metal layer 12 by coating a silver ink having a relatively higher electrical conductivity than the metal layer 12 on the metal layer 12. The silver ink may be gravure-coated, screen-printed, slot- Or the like on the metal layer 12.

In this embodiment, the remaining steps except for the shielding film preparing step S110 'are the same as those of the second embodiment shown in FIG. 2, so that a detailed description of the same steps will be omitted.

6 is a cross-sectional view of a process for manufacturing a printed circuit board according to a sixth embodiment of the present invention.

A method of manufacturing a printed circuit board according to a sixth embodiment of the present invention includes the steps of preparing a shielding film S110 ', removing a shielding film S120, removing a protective film S130, a bonding step S140, A carrier film removing step S160, an insulating layer forming step S180 ', a metal layer part removing step S190, and a plating layer forming step S200.

In this embodiment, the step of preparing the shielding film (S110 ') is the same as the step of preparing the shielding film (S110') of the fifth embodiment shown in FIG. 5, and the remaining steps except for the step of preparing the shielding film (S 120) to the plating layer forming step (S 200) of the third embodiment shown in FIG. 3, detailed description of the same steps will be omitted.

Hereinafter, a method for manufacturing an electromagnetic wave shielding film according to a seventh embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the accompanying drawings, FIG. 7 is a cross-sectional view showing a process for manufacturing an electromagnetic wave shielding film according to a seventh embodiment of the present invention.

A conductive adhesive layer forming step S220 of forming a conductive adhesive layer 13 on one surface of the metal layer 12, a conductive adhesive layer forming step S220 of forming a conductive adhesive layer 13 on the surface of the metal layer 12, A first protective film forming step S230 for bonding the first protective film 14 on the conductive adhesive layer 13 and an insulating layer forming step 22 for forming an insulating layer 22 on the other surface of the metal layer 12 (S240) and forming a second protective film (14 ') on the insulating layer (22).

In the metal layer preparing step S210, a metal layer 12 provided in the form of a copper foil excellent in electric conductivity is prepared as shown in FIG. 7A.

In the conductive adhesive layer forming step S220, a conductive adhesive is coated on one surface of the metal layer 12 and then dried to form a conductive adhesive layer 13, as shown in FIG. 7 (b). The conductive adhesive layer 13 may include a conductive filler and a binder resin, a curing agent, a flame retardant, and an additive. The conductive adhesive layer 13 may be formed by applying a conductive adhesive composition to the metal layer 12 .

In the step of forming the first protective film (S230), a method of laminating the first protective film (14) having a silicon release treatment on the conductive adhesive layer (13) may be used as shown in FIG. 7C. Here, the first protective film 14 may be formed of a PET film coated with a silicon release coating.

In the insulating layer forming step S240, an insulation layer 22 may be formed by coating an insulating paste on the other surface of the metal layer 12 and then drying the insulating paste as shown in FIG. 7D. Here, the insulating paste may include a binder resin, a flame retardant, a colorant, a curing agent, and the like.

In the second protective film forming step S250, a method of laminating the second protective film 14 ', which has been subjected to the silicon release treatment, on the insulating layer 22 may be used as shown in FIG. 7E. Here, the second protective film 14 'may be a PET film coated with a silicon release coating.

The electromagnetic wave shielding film manufactured as described above may be used for protecting the conductive adhesive layer 13 from the step of removing the protective film (S130) to the step of completely hardening the conductive adhesive layer (S170) shown in FIGS. 2C to 2E The first protective film 14 is peeled to expose the conductive adhesive layer 13 and the exposed conductive adhesive layer 13 is semi-cured while being bonded to the printed circuit board, The electromagnetic wave shielding film can be bonded onto the printed circuit board through the step of completely curing the conductive adhesive layer 13 after removing the protective film 14 '.

That is, since the bonding strength between the conductive adhesive layer 13 and the metal layer 12 is increased in the state where the conductive adhesive layer 13 is semi-cured, the metal layer 12 and the conductive adhesive layer 13 Or the bonding surface of the conductive adhesive layer 13 and the printed circuit board can be prevented from being separated from each other.

8 is a cross-sectional view of a process for manufacturing an electromagnetic wave shielding film according to an eighth embodiment of the present invention.

The method of manufacturing an electromagnetic wave shielding film according to an eighth embodiment of the present invention may include a metal layer preparing step S210, a conductive layer forming step S211 for forming a conductive layer 15 on one surface of the metal layer 12, A conductive adhesive layer forming step S220 for forming a conductive adhesive layer 13 on the conductive layer 15 and a first protective film forming step S230 for joining the first protective film 14 on the conductive adhesive layer 13 Forming an insulating layer 22 on the other surface of the metal layer 12 and forming a second protective film 14 'on the insulating layer 22, Forming step S250.

In the conductive layer forming step S211, a silver ink having an excellent electrical conductivity may be coated on the metal layer 12 to form the conductive layer 15 as shown in FIG. 8B. As the coating method of the conductive layer 15, gravure coating, screen printing, slot die, spin coating, or the like can be used. When the conductive layer 15 is formed on the metal layer 12 as described above, the electromagnetic wave shielding effect can be further improved.

Next, in the conductive adhesive layer forming step S230, a conductive adhesive is coated on the conductive layer 15 and then dried to form a conductive adhesive layer 13, as shown in FIG. 8C.

In the eighth embodiment of the present invention, the remaining steps except for the conductive layer forming step S211 are the same as those of the seventh embodiment, so a detailed description of the same steps will be omitted.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail through examples and experimental results for demonstrating the superiority of the electromagnetic wave shielding film, the method for producing a printed circuit board and the method for producing an electromagnetic wave shielding film of the present invention. However, the following examples are for illustrative purposes only, and the present invention is not limited to the following examples.

&Lt; Example 1 >

67 parts by weight of a urethane-modified polyester resin (IT-5000, Norou paint) and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (methyl isobutyl ketone) were added to a stirrer and cyclohexanone 9 14 parts by weight of AgCu (S-403, JB Caltech) having a spherical average particle diameter of 4 탆 and silver coated with a conductive filler was added thereto, followed by further stirring for 1 hour.

The resulting conductive adhesive was filtered through a filter made of SUS 1000 mesh to obtain an anisotropy conductive adhesive composition.

The anisotropic conductive adhesive composition thus prepared was coated on a copper foil (copper foil having a thickness of 3 mu m) with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 mu m . Thereafter, a PET protective film having a thickness of 50 탆 and treated with silicone was laminated on the anisotropic conductive adhesive layer.

&Lt; Example 2 >

The resulting anisotropic conductive adhesive composition was coated on a copper foil (copper foil 6 μm thick) having a carrier by a slot die and heated at 150 ° C. for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 μm . Thereafter, a PET protective film having a thickness of 50 탆 and treated with silicone was laminated on the anisotropic conductive adhesive layer.

&Lt; Example 3 >

The anisotropic conductive adhesive composition thus prepared was coated on a copper foil (copper foil having a thickness of 10 mu m) coated with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 mu m . Thereafter, a PET protective film having a thickness of 50 탆 and treated with silicone was laminated on the anisotropic conductive adhesive layer.

67 parts by weight of a urethane-modified polyester resin (IT-180, Noru paint) and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in methyl isobutyl ketone (MIBK) were mixed in a stirrer and cyclohexanone 9 (ACBY-2F, Mitsui Metals) having an average particle diameter of 7 mu m on a branch coated with silver as a conductive filler were put in 14 parts by weight and further stirred for 1 hour.

The conductive adhesive thus prepared was filtered with a filter made of SUS 1000 mesh to obtain an isotropic conductive adhesive composition.

The isotropic conductive adhesive composition thus prepared was coated on a surface of a copper foil (copper foil having a thickness of 3 mu m) with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an isotropic conductive adhesive layer having a dry thickness of 7 mu m . Thereafter, an acrylic adhesive-treated PET protective film having a thickness of 50 탆 was laminated on the isotropic conductive adhesive layer.

&Lt; Example 5 >

A silver ink (TEC-CO-021, manufactured by InkTec Co., Ltd.) was coated on the surface of a copper foil (copper foil having a copper thickness of 3 mu m) having a carrier film attached thereto by a micro gravure coater and then heated and sintered at 150 DEG C for 4 minutes, Silver metal layer.

In addition, 67 parts by weight of a urethane-modified polyester resin (IT-5000, Norou paint), 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in methyl isobutyl ketone (MIBK) and 10 parts by weight of cyclohexanone, And stirring for 2 hours, 14 parts by weight of AgCu (S-403, JB Caltech) having a spherical average particle size of 4 um and silver coated with a conductive filler was added and further stirred for 1 hour.

The conductive adhesive thus prepared was filtered through a SUS 1000 mesh filter to obtain an anisotropy conductive adhesive composition.

&Lt; Example 6 >

3 parts by weight of flame retardant filler aluminum hydroxide (OSDH-3, manufactured by Ohseong Company) and 2 parts by weight of a dispersant (BYK-167, manufactured by Bayer AG) were added to 50 parts by weight of a polyimide modified resin (HPC-9000-21, Hitachi chemical) 45 parts by weight of cyclohexanone were added and stirred for 20 minutes. The mixed solution was added to a basket mill (DWS-25, Daewon Estek) containing 5 탆 of zirconia beads, dispersed at 1,500 rpm for 10 minutes, and then cooled to room temperature.

5 parts by weight of a modified epoxy resin (Arakid-9201N, Arakawa Chemical Industries, Ltd.) was added to 100 parts by weight of this dispersion, and the mixture was stirred at a low speed for 1 hour and filtered through SUS1000 mesh to obtain an insulating layer composition.

After removing the carrier film of the anisotropic conductive electromagnetic wave shielding film prepared above, the insulating layer composition was coated using a slot die and heated at 150 DEG C for 5 minutes to form an insulation layer having a dry thickness of 5 mu m, .

&Lt; Example 7 >

After removing the carrier film of the anisotropically conductive electromagnetic wave shielding film prepared above, the insulating layer composition was coated using a slot die and heated at 150 DEG C for 5 minutes to form an insulation layer having a dry thickness of 5 mu m, .

&Lt; Comparative Example 1 &

3 parts by weight of flame-retardant filler aluminum hydroxide (OSDH-3, manufactured by Ohseong Company) and 2 parts by weight of a dispersant (BYK-167, manufactured by Bayer AG) were added to 50 parts by weight of a polyimide modified resin (HPC-9000-21, Hitachi chemical) And 45 parts by weight of hexanol (Cyclohexanone) were added thereto, followed by stirring for 20 minutes. The mixed solution was added to a basket mill (DWS-25, Daewon Estek) containing 5 탆 of zirconia beads, dispersed at 1,500 rpm for 10 minutes, and then cooled to room temperature.

The insulating layer composition was applied to a 50 mu m-thick PET film treated with silicone and then dried at 150 DEG C for 2 minutes to obtain a coating film having a dry thickness of 7 mu m.

A silver metal layer having a thickness of 0.2 占 퐉 was formed on the insulating layer by sputtering.

The prepared anisotropic conductive adhesive composition was coated on the surface of the silver metal layer using a slot die and heated at 150 DEG C for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 mu m. Then, a 50 μm thick PET protective film treated with silicone was laminated to an anisotropic conductive adhesive layer to prepare Comparative Example 1. [

&Lt; Comparative Example 2 &

Further, 67 parts by weight of a urethane-modified polyester resin (IT-180, Noru paint) and 10 parts by weight of a cresol novolak resin solution dissolved in 70% solids in MIBK (methyl isobutyl ketone) were added to a stirrer, , And stirred for 2 hours. 14 parts by weight of AgCu (ACBY-2F, Mitsui Metal) having an average particle diameter of 7 mu m on a branch coated with silver as a conductive filler was added and further stirred for 1 hour.

The isotropic conductive adhesive composition thus prepared was coated on the surface of a PET release film of a silicon release mold using a slot die and heated at 150 캜 for 3 minutes to form an isotropic conductive adhesive layer having a dry thickness of 12 탆 to form an insulating layer on the silicone release PET film Comparative Example 2 was prepared by roll lamination at a temperature of 100 캜 and a pressure of 7 bar.

The lamination structure and thicknesses of Examples 1 to 7 and Comparative Examples 1 and 2 are shown in Fig.

An evaluation sample was prepared for the electromagnetic wave shielding film by the following method, and the results are shown in FIG.

&Lt; Evaluation method of electromagnetic wave shielding film &

1) Interlayer adhesion of electromagnetic wave shielding film

The test sample was cut to a size of 25.4 mm in length and 25 cm in length and then the protective film of the conductive adhesive layer was removed, and a 25 μm thick PI film (Kapton, DuPont) was placed on one surface thereof. (Pressure: 3 bar, 20 seconds), and then a 25 μm thick bonding sheet was laminated on the copper surface or the insulating layer surface from which the carrier film was removed, and hot press (press condition: temperature: 150 ° C., pressure: 40 kgf / cm 2, time: 60 minutes) The adhesive layer was fully cured (C-stage) under heating and pressurization. And the tensile strength at a tensile rate of 58.8 M / min and a 180 degree was measured under an atmosphere of 25 ° C and 50% RH. The same sample was tested 3 times and the average value was indicated.

2) Solder heat resistance

The protective film of the electromagnetic wave shielding film was removed and a PI film (Kapton, DuPont) having a thickness of 25 mu m was attached by using a folding machine (temperature: 150 DEG C, pressure 3 bar, 20 seconds) To 4 were prepared by completely removing the carrier and laminating an insulating film (BT-012, manufactured by InkTec Co., Ltd.) and heating and pressurizing the adhesive layer by Hot Press (press condition: temperature: 150 캜, pressure: 40 kgf / C-stage). The cured samples were visually observed at 295 ° C solder for 1 minute and 2 times, and evaluated for bubble, lifting, and appearance color change. Five samples of each sample were tested to indicate the number of appearance defects.

3) Step crack

A FRP rod (width 5 mm, length 25 cm) to be used as a level step as shown in Fig. 12 was placed on a PI film (Kapton, DuPont) having a thickness of 100 탆, 200 탆, 300 탆 and 400 탆, (Temperature: 150 ° C, pressure: 3 bar, 20 seconds), and then the carrier was removed and the insulating film (BT- 012, manufactured by InkTec Co., Ltd.) was laminated and pressurized by a hot press (press condition: temperature: 150 DEG C, pressure: 40 kgf / cm2, time: 60 minutes) to completely cure the adhesive layer (C-stage).

The surface of the insulating layer of the sample was observed with a hand microscope for cracks at the stepped portions (see the photograph of the surface of FIG. 12). Five evaluation samples were prepared, and the number of cracks was indicated by the step thickness.

4) Reliability

After the protective film of the electromagnetic wave shielding film was removed and attached to a resistance test coupon (Fig. 13, InkTec Co., Ltd.) using a folding machine (temperature: 150 DEG C, pressure: 3 bar, 20 seconds) (BT-012, manufactured by InkTech Co., Ltd.) was laminated and pressurized by hot press (press condition: temperature: 150 DEG C, pressure: 40 kgf / cm2, time: 60 minutes) to completely cure the adhesive layer (C-stage).

The prepared sample was allowed to stand in a 85 ° C and 85% RH chamber for 72 hours, and the appearance and resistance change were measured.

5) Measurement of electromagnetic wave shielding rate

After removing the protective film of the electromagnetic wave shielding film, the PI film (Kapton, DuPont) having a thickness of 25 탆 was pressed on the hot plate at 120 캜 for 2 seconds. Then, in Examples 1 to 4, the carrier was removed, Ltd.) was laminated and pressurized by hot pressing (press condition: temperature: 150 占 폚, pressure: 40 kgf / cm2, time: 60 minutes) to completely cure the adhesive layer (C-stage).

Samples were tested according to ASTM D4935 (Standard Test Method for Shielding Effectiveness of Flat Materials).

The scope of the present invention is not limited to the above-described embodiments, but may be embodied in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

[Description of Symbols]

10: shielding film, 11: carrier film, 12: metal layer,

13: conductive adhesive layer, 14: protective film, 15: conductive layer,

20: coverlay, 21: carrier film, 22: insulating layer,

22a: opening, 23: adhesive layer, 24: protective film,

30: Plated layer, PCB: Printed circuit board

Claims

Carrier film;

A conductive metal layer formed on one surface of the carrier film;

A conductive adhesive layer formed on the metal layer; And

And a protective film formed on the conductive adhesive layer.
The method according to claim 1,

Wherein the conductive adhesive layer comprises a binder resin and a conductive filler.
3. The method of claim 2,

Wherein the conductive filler comprises silver, copper, aluminum, nickel, gold, zinc or iron particles, wherein the particles are in the form of flake, spherical, dendrite or granule Wherein the electromagnetic wave shielding film is made of a metal.
The method of claim 3,

Wherein the particles have a size of 3 mu m to 20 mu m.
3. The method of claim 2,

Wherein the binder resin is at least one of polyvinyl butyral, cellulose, polyurethane, polyester, epoxy, phenoxy, novolac, alkyd, amide, imide resin or modified products thereof.
The method according to claim 1,

Wherein a conductive layer is interposed between the metal layer and the conductive adhesive layer.
The method according to claim 6,

Wherein the conductive layer is made of a material having a relatively higher electrical conductivity than the metal layer.
8. The method of claim 7,

Wherein the conductive layer is formed by coating a silver ink on a metal layer.
The method according to claim 1,

Wherein the metal layer is at least one selected from the group consisting of nickel, copper, aluminum, zinc, and alloys thereof.
10. The method of claim 9,

Wherein the metal layer is formed of a foil having a thickness of 2 占 퐉 to 10 占 퐉.
A shielding film preparing step of preparing a shielding film in which a carrier film, a metal layer, a conductive adhesive layer and a protective film are sequentially stacked;

A protective film removing step of removing the protective film of the shielding film;

A bonding step of bonding the conductive adhesive layer of the shielding film to a printed circuit board;

A carrier film removing step of removing the carrier film of the shielding film; And

And forming an insulating layer on the metal layer of the shielding film, the opening being formed in a region where the ground extension terminal of the printed circuit board is to be formed.
12. The method of claim 11,

Wherein the insulating layer is formed by printing an insulating paste on the metal layer in the insulating layer forming step.
12. The method of claim 11,

Wherein in the step of forming an insulating layer, an insulating film on which an opening is formed is adhered to the metal layer to form an insulating layer.
12. The method of claim 11,

In the insulating layer forming step,

A coverlay preparation step of preparing a coverlay in which a carrier film, an insulating layer, an adhesive layer and a protective film are stacked in this order;

A punching step of punching the coverlay to form an opening in an area where a ground expansion terminal of the printed circuit board is to be formed;

A protective film removing step of removing the protective film of the coverlay; And

And laminating a metal layer of the shielding film and an adhesive layer of the coverlay.
15. The method according to claim 11 or 14,

And forming a plating layer on the metal layer exposed through the opening of the insulating layer.
16. The method of claim 15,

And removing the metal layer partially removing the metal layer exposed through the opening of the insulating layer in the thickness direction prior to the plating layer forming step.
15. The method according to claim 11 or 14,

Wherein the step of semi-curing the conductive adhesive layer comprises semi-curing the conductive adhesive layer prior to the step of removing the carrier film.
18. The method of claim 17,

And completely curing the conductive adhesive layer after the removal of the carrier film.
15. The method of claim 14,

And removing the cover film carrier film from the cover film after the lapping step.
20. The method of claim 19,

Curing an adhesive layer semi-curing step of semi-curing the adhesive layer of the coverlay prior to the step of removing the coverlay carrier film.
21. The method of claim 20,

Wherein the adhesive layer is completely cured after the step of removing the coverlay carrier film to completely cure the adhesive layer of the coverlay.
12. The method of claim 11,

Wherein in the step of preparing the shielding film, a conductive layer having a higher electrical conductivity than the metal layer is formed between the metal layer and the conductive adhesive layer.
A metal layer preparation step of preparing a thin metal layer;

A conductive adhesive layer forming step of forming a conductive adhesive layer on one surface of the metal layer;

A first protective film forming step of forming a first protective film on the conductive adhesive layer;

Forming an insulating layer on the other surface of the metal layer; And

And a second protective film forming step of forming a second protective film on the insulating layer.
24. The method of claim 23,

Prior to the step of forming the conductive adhesive layer,

And forming a conductive layer on one side of the metal layer.
25. The method of claim 24,

Wherein the conductive layer is made of a material having a relatively higher electrical conductivity than the metal layer.
26. The method of claim 25,

Wherein the conductive layer is formed by coating a silver ink on a metal layer.