WO2019124624A1 - Film de protection contre les ondes électromagnétiques, procédé de fabrication de carte de circuit imprimé, et procédé de fabrication de film de protection contre les ondes électromagnétiques - Google Patents

Film de protection contre les ondes électromagnétiques, procédé de fabrication de carte de circuit imprimé, et procédé de fabrication de film de protection contre les ondes électromagnétiques Download PDF

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Publication number
WO2019124624A1
WO2019124624A1 PCT/KR2018/000662 KR2018000662W WO2019124624A1 WO 2019124624 A1 WO2019124624 A1 WO 2019124624A1 KR 2018000662 W KR2018000662 W KR 2018000662W WO 2019124624 A1 WO2019124624 A1 WO 2019124624A1
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WIPO (PCT)
Prior art keywords
layer
adhesive layer
film
metal layer
conductive adhesive
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PCT/KR2018/000662
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English (en)
Korean (ko)
Inventor
정광춘
조남부
박광진
윤희근
Original Assignee
(주)잉크테크
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Publication of WO2019124624A1 publication Critical patent/WO2019124624A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

  • the present invention relates to an electromagnetic wave shielding film, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film. More particularly, the present invention can broaden the ground area of an electromagnetic wave shielding film attached to a printed circuit board, A method for manufacturing a printed circuit board, and a method for manufacturing an electromagnetic wave shielding film, which can provide excellent environmental reliability, heat resistance and step property.
  • FPCB flexible printed wiring board
  • the FPCB is used with a shield film for shielding electromagnetic noise.
  • a conventional shield film has a base film and a conductive layer laminated thereon. Normally, a reinforcing film for workability is used for the base film side in this basic constitution, and a protective film is used for the conductive layer to manufacture a product.
  • Japanese Patent Application Laid-Open No. 5-3395 discloses a method of using a metal thin film to obtain an excellent shielding effect.
  • Japanese Patent Laid-Open No. 7-122882 discloses a method of combining a conductive adhesive layer and a metal thin film using a metal filler .
  • the electromagnetic wave shielding film is produced by applying and drying a conductive adhesive layer on the metal layer in the state that the carrier film and the metal layer are laminated and laminating a protective film on the conductive adhesive layer.
  • the metal layer is peeled off from the conductive adhesive layer in a state where the metal layer is attached to the carrier film or peeling phenomenon occurs in which the metal layer and the conductive adhesive layer are separated from each other during the peeling of the carrier film .
  • an object of the present invention to provide an electromagnetic wave shielding film capable of eliminating a ground film by widening a ground area of an electromagnetic wave shielding film attached to a printed circuit board, And a method for manufacturing an electromagnetic wave shielding film.
  • a method of manufacturing an electromagnetic wave shielding film, a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film which can prevent the metal layer from being arbitrarily separated from the conductive adhesive layer in the peeling process of the carrier film by peeling the carrier film in a state where the conductive adhesive layer is semi-cured .
  • a semiconductor device comprising: a carrier film; a conductive metal layer formed on one surface of the carrier film; a conductive adhesive layer formed on the metal layer; And a protective film formed on the conductive adhesive layer.
  • the conductive adhesive layer preferably includes a binder resin and a conductive filler.
  • the conductive filler may include silver, copper, aluminum, nickel, gold, zinc or iron particles, and the particles may be in the form of flake, spherical, dendrite or granule .
  • the particles preferably have a size of 3 mu m to 20 mu m.
  • the binder resin is at least one of polyvinyl butyral, cellulose, polyurethane, polyester, epoxy, phenoxy, novolak, alkyd, amide, imide resin or modified products thereof.
  • a conductive layer is interposed between the metal layer and the conductive adhesive layer.
  • the conductive layer is made of a material having an electrical conductivity higher than that of the metal layer.
  • the conductive layer is preferably formed by coating a silver ink on a metal layer.
  • the metal layer is preferably at least one selected from the group consisting of nickel, copper, aluminum, zinc, and alloys thereof.
  • the metal layer is preferably formed of a foil having a thickness of 2 to 10 mu m.
  • An object of the present invention is to provide a method of manufacturing a shielding film, comprising the steps of: preparing a shielding film in which a carrier film, a metal layer, a conductive adhesive layer and a protective film are sequentially laminated; a protective film removing step of removing the protective film of the shielding film; A bonding step of bonding the conductive adhesive layer of the film to the printed circuit board; removing the carrier film of the shielding film; And forming an insulation layer on the metal layer of the shielding film, the insulation layer having an opening formed in an area where the ground extension terminal of the printed circuit board is to be formed.
  • an insulating layer is formed by printing an insulating paste on the metal layer.
  • the insulating layer forming step it is preferable to form an insulating layer by attaching an insulating film having openings on the metal layer.
  • the insulating layer forming step may include: a coverlay preparing step of preparing a coverlay in which a carrier film, an insulating layer, an adhesive layer, and a protective film are laminated in order; A protective film removing step of removing the protective film of the coverlay; And a lapping step of lapping the metal layer of the shielding film and the adhesive layer of the coverlay.
  • the method may further include forming a plating layer on the metal layer exposed through the opening of the insulating layer.
  • the method may further include removing a metal layer partially removing the metal layer exposed through the opening of the insulating layer in the thickness direction prior to the plating layer forming step.
  • the semi-curing step of the conductive adhesive layer it is preferable to perform the semi-curing step of the conductive adhesive layer to semi-cure the conductive adhesive layer prior to the carrier film removing step.
  • a coverlay carrier film removing step of removing the carrier film of the coverlay after the lapping step it is preferable to perform a coverlay carrier film removing step of removing the carrier film of the coverlay after the lapping step.
  • step of completely curing the adhesive layer to completely cure the adhesive layer of the coverlay after the step of removing the coverlay carrier film.
  • a conductive layer of a material having a relatively higher electric conductivity than the metal layer between the metal layer and the conductive adhesive layer it is preferable to form a conductive layer of a material having a relatively higher electric conductivity than the metal layer between the metal layer and the conductive adhesive layer.
  • a conductive layer forming step of forming a conductive layer on one surface of the metal layer prior to the step of forming the conductive adhesive layer it is preferable to perform a conductive layer forming step of forming a conductive layer on one surface of the metal layer prior to the step of forming the conductive adhesive layer.
  • the conductive layer is made of a material having an electrical conductivity higher than that of the metal layer.
  • the conductive layer is preferably formed by coating a silver ink on a metal layer.
  • an electromagnetic wave shielding film a method of manufacturing a printed circuit board, and a method of manufacturing an electromagnetic wave shielding film, which can enlarge a ground area of an electromagnetic wave shielding film attached to a printed circuit board to eliminate a ground film. Therefore, it is possible to solve the difficulty that the ground can not be widened in manufacturing the microcircuit substrate, so that it is possible to provide a manufacturing effect of the microcircuit substrate, thereby reducing the manufacturing process, productivity, and manufacturing cost.
  • a printed circuit board to which an electromagnetic wave shielding film for high-speed transmission having anti-oxidation characteristics and high heat resistance characteristics are applied can be manufactured.
  • the carrier film is peeled off while the conductive adhesive layer is semi-cured, thereby preventing the metal layer from being separated from the conductive adhesive layer in the peeling process of the carrier film.
  • FIG. 1 is a cross-sectional view of an electromagnetic wave shielding film according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view of a process for manufacturing a printed circuit board according to a second embodiment of the present invention
  • FIG. 3 is a cross-sectional view of a process for manufacturing a printed circuit board according to a third embodiment of the present invention
  • FIG. 4 is a cross-sectional view of an electromagnetic wave shielding film according to a fourth embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a process for manufacturing a printed circuit board according to a fifth embodiment of the present invention.
  • FIG. 6 is a sectional view of a process for manufacturing a printed circuit board according to a sixth embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a process for manufacturing an electromagnetic wave shielding film according to a seventh embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of an electromagnetic wave shielding film manufacturing method according to an eighth embodiment of the present invention.
  • FIG. 1 is a cross-sectional view of an electromagnetic wave shielding film according to a first embodiment of the present invention.
  • the electromagnetic wave shielding film 10 comprises a carrier film 11, a conductive metal layer 12 formed on one side of the carrier film 11, a conductive metal layer 12 formed on the metal layer 12, And an adhesive layer (13) and a protective film (14) formed on the conductive adhesive layer (13).
  • the carrier film 11 may be provided in the form of AL-PET (Aluminum-Laminated Polyethylene Terephthalate) laminated with an aluminum film on a PET film or in the form of Copper-Laminated Polyethylene Terephthalate Can be provided.
  • AL-PET Alluminum-Laminated Polyethylene Terephthalate
  • the metal layer 12 may be formed on the carrier film 11 by a variety of methods such as plating, printing, coating, or vapor deposition of a conductive material.
  • the metal layer 12 may be formed on one side of the carrier film 11, It is also possible to use ready made products.
  • the conductive adhesive layer 13 may include a conductive filler and a binder resin, a curing agent, a flame retardant, and an additive.
  • the conductive adhesive layer 13 may be formed by applying a conductive adhesive composition to the metal layer 12.
  • the binder resin should be excellent in heat resistance, acid resistance, and alkali resistance, and it is particularly preferable that the binder resin is excellent in adhesion and lowers the influence on the conductivity of the conductive filler due to the characteristics of the binder.
  • the heat resistance of the resin When the heat resistance of the resin is low, defects may occur in the surface of the solder process, which is an essential step in the manufacture of a printed circuit board, or the resistance may increase due to heat.
  • copper plating or gold plating can be performed to lower circuit resistance or prevent corrosion at the time of manufacturing a printed circuit board. Since the plating solution is strongly acidic or strongly alkaline, excellent chemical resistance and alkali resistance are required.
  • a cleaning operation may be performed with an alkaline solution for surface cleaning and flux removal before and after the solder. In some cases, soft etching may be performed to improve the uniformity and adhesion of the plating.
  • the conductive adhesive layer 13 should be pre-fixed on the printed circuit board in a B-stage state, and then be supplied to the main process. Therefore, the binder resin should have a semi-cured state at room temperature and should be fully cured in the main process.
  • binder resin of the conductive adhesive layer 13 examples include polyvinyl butyral (PVB), cellulose, polyurethane, polyester, epoxy, phenoxy, Novolac, Alkyd, Amide, Imide resins or their modifications can be used.
  • PVB polyvinyl butyral
  • cellulose polyurethane
  • polyester epoxy, phenoxy, Novolac, Alkyd
  • Amide Imide resins or their modifications can be used.
  • a cresol novolak resin was mixed with a denatured product of a polyester resin to improve heat resistance.
  • the conductive filler may be a conductive metal such as Silver, Copper, Aluminum, Nickel, Gold, Zinc and Iron, Can be used. These shapes may be in the form of Flake, Spherical, Dendrite, Granule, or the like.
  • the conductive filler having a particle size of 30 mu m or less can be used. More preferably not less than 3 mu m and not more than 20 mu m.
  • a conductive filler of less than 3 mu m is used, the resistance of the resin increases, so that more metal particles must be used and the resistance is also increased.
  • the particles having a size exceeding 20 mu m are uncoated in the coating direction in the coating process, the dried coating film is uneven, and pin-holes are generated.
  • the protective film 14 may be formed of a PET film coated with a silicon release coating and may be attached to the conductive adhesive layer 13 by a method of laminating a protective film 14 having a silicon release treatment on the conductive adhesive layer 13.
  • the electromagnetic wave shielding film 10 of the present embodiment has a carrier film 11 having a thickness of 83 ⁇ , a metal layer 12 having a thickness of 3 ⁇ , a conductive adhesive layer 13 having a thickness of 6 ⁇ and a protective film 14 having a thickness of 75 ⁇ Lt; / RTI >
  • the conductive adhesive layer is formed on the carrier film 11 on which the metal layer 12 is formed to form the conductive adhesive layer 13
  • a conductive adhesive may be coated on the protective film 14 to form a conductive adhesive layer 13, followed by laminating the carrier film 11 on which the metal layer 12 is formed.
  • FIG. 2 is a cross-sectional view of a process for manufacturing a printed circuit board according to a second embodiment of the present invention.
  • the method of manufacturing a printed circuit board according to the second embodiment of the present invention may further include a step of preparing a shielding film (S110), a step of forming a shielding film (S120), a step of removing a protective film (S130), a bonding step (S140) Step S150, the carrier film removing step S160, the conductive adhesive layer complete curing step S170, the insulating layer forming step S180, the metal layer part removing step S190, and the plating layer forming step S200.
  • the shielding film 10 in which the carrier film 11, the metal layer 12, the conductive adhesive layer 13, and the protective film 14 are sequentially laminated is prepared in the step of preparing the shielding film (S110) .
  • the shielding film 10 may be made of the electromagnetic wave shielding film of the first embodiment of the present invention.
  • the shielding film 10 in a sheet form is stuck on a printed circuit board (PCB) to be attached in the shielding film punching step S120.
  • the punching of the shielding film 10 may be performed by a pressing process or a laser cutting process.
  • the protective film 14 disposed on one side of the conductive adhesive layer 13 of the shielding film 10 is removed in the step of removing the protective film S130 as shown in FIG. Since the protective film 14 has an appropriate releasing force with respect to the conductive adhesive layer 13, it can be easily peeled off.
  • the conductive adhesive layer 13 of the shielding film 10 is adhered to the surface of the printed circuit board (PCB) on which the circuit pattern is formed.
  • the shielding film 10 is heated for a predetermined time so that the conductive adhesive layer 13 is in a B-stage state.
  • the semi-curing condition may be changed depending on the composition of the conductive adhesive layer 13, and in this embodiment, the temperature is raised at a temperature of 150 DEG C and a pressure of 3 bar for 20 seconds using a folding machine.
  • the bonding strength between the conductive adhesive layer 13 and the metal layer 12 is increased by the semi-curing of the conductive adhesive layer 13.
  • the carrier film 11 attached to the metal layer 12 of the shielding film 10 is removed in the step of removing the carrier film S160 as shown in FIG.
  • the metal layer 12 to which the carrier film 11 is attached is in a state in which the bonding strength with the conductive adhesive layer 13 is increased as the conductive adhesive layer 13 is semi-cured. Therefore, in the process of removing the carrier film 11 It is possible to prevent the metal layer 12 from being peeled off from the conductive adhesive layer 13.
  • the conductive adhesive layer 13 is heated and pressed so as to be in a C-Stage state.
  • the complete curing conditions of the conductive adhesive layer 13 may be changed depending on the composition of the conductive adhesive layer 13.
  • the insulating layer 22 may be formed by printing an insulating paste through a screen formed in accordance with a pattern and then drying the insulating paste as shown in FIG. 2 (f).
  • the insulating layer 22 can be formed in a desired region by using the screen printing method and an insulating layer 22 having an opening 22a formed in a region where a ground expansion terminal of a printed circuit board So that it can be formed on the metal layer 12 of the shielding film 10.
  • an insulating film (Coverlay) is formed so that the opening 22a is formed in the area where the ground expansion terminal of the printed circuit board PCB is to be formed It is also possible to form the insulating layer 22 by attaching it to the metal layer 12 later.
  • the metal layer 12 of the shielding film 10 is electrically connected to the ground circuit of the printed circuit board PCB through the conductive adhesive layer 13 so that the metal layer 12 exposed through the opening 22a of the insulating layer 22 12 can be utilized as a ground expansion terminal of a printed circuit board (PCB).
  • PCB printed circuit board
  • the insulating paste may include a binder resin, a flame retardant, a colorant, a curing agent, and the like.
  • the binder resin of the insulating layer 22 should be capable of being coated, have high flexibility after curing, and should have a scratch resistance (2H or more) because it is located outside the printed circuit board.
  • the insulating layer 22 Since the insulating layer 22 is exposed in the manufacturing process of the printed circuit board, the insulating layer 22 should have excellent heat resistance, chemical resistance, alkali resistance, and acid resistance.
  • the other reinforcing plate is required to be attached and marked on the insulating layer 22, it should be designed to have excellent adhesion.
  • the surface is polyimide, there is a problem of lamination adhesion, and a plasma process may be added.
  • the metal layer 12 exposed through the opening 22a of the insulating layer 22 is soft-etched and partially removed in the thickness direction (S190)
  • the oxidized surface of the metal layer 12 is removed (0.3 to 1.0 ⁇ ).
  • a surface antioxidation conductive material such as gold (Au) is applied to the metal layer 12 whose surface has been removed through electroplating or electroless plating as shown in FIG. 2 (h)
  • the plating layer 30 is formed by plating.
  • the plating layer 30 may be used as a ground extension terminal while being electrically connected to the ground circuit of the printed circuit board (PCB) while protecting the metal layer 12.
  • FIG 3 is a cross-sectional view of a process for manufacturing a printed circuit board according to a third embodiment of the present invention.
  • a method of manufacturing a printed circuit board includes a step of preparing a shielding film S110, a step of forming a shielding film S120, a step of removing a protective film S130, a bonding step S140, Step S150, carrier film removing step S160, insulating layer forming step S180 ', metal layer part removing step S190, and plating layer forming step S200.
  • the remaining steps except for the insulating layer forming step S180 ' are the same as those of the second embodiment, so detailed description of the same steps will be omitted.
  • the insulating layer forming step S180 ' may include a cover layer preparing step S181, a covering layer removing step S182, a protective film removing step S183, a lapping step S184, an adhesive layer semi-curing step S185, A film removal step (S186), and an adhesive layer full curing step (S187).
  • the coverlay 20 has a carrier film 21 having a thickness of 55 ⁇ ⁇ , an insulating layer 22 having a thickness of 7 ⁇ ⁇ , an adhesive layer 23 having a thickness of 8 ⁇ ⁇ and a protective film 24 having a thickness of 75 ⁇ ⁇ , ≪ / RTI >
  • the carrier film 21 of the coverlay 20 may be provided in the form of a semi-matt PET and the insulating layer 22 and the adhesive layer 23 may comprise a light absorbing material. have.
  • the coverlay 20 is formed in the coverlay punching step S182 to form the opening 22a of FIG. 3 (j) in a region where the ground extension terminal is to be formed.
  • the punching of the coverlay 20 can be performed by a pressing process, a laser cutting process, or the like.
  • step S183 the protective film 24 disposed on one side of the adhesive layer 23 of the coverlay 20 is removed as shown in FIG. 3 (h). Since the protective film 24 has an appropriate releasing force with respect to the adhesive layer 23, it can be easily peeled off.
  • the adhesive layer 23 of the coverlay 20 is adhered to the metal layer 12 of the shielding film 10 in close contact with each other.
  • the coverlay 20 is heated for a predetermined time so that the adhesive layer 23 of the coverlay 20 is in a B-stage state.
  • the semi-curing conditions may be changed depending on the composition of the adhesive layer 23, and in this embodiment, the temperature is raised at a temperature of 150 DEG C and a pressure of 3 bar for 20 seconds using a folding machine.
  • the bonding strength between the adhesive layer 23 and the metal layer 12 is increased by the semi-curing of the adhesive layer 23.
  • the carrier film 21 attached to the insulating layer 22 of the coverlay 20 is removed as shown in FIG. 3 (j).
  • the insulating layer 22 to which the carrier film 21 is attached is in a state in which the bonding strength with the adhesive layer 23 is increased as the adhesive layer 23 is semi-cured. Therefore, in the process of removing the carrier film 21, It is possible to prevent the insulating layer 22 from being peeled off from the adhesive layer 23.
  • the carrier film 21 of the coverlay 20 The bonding surface between the metal layer 12 and the conductive adhesive layer 13 may be separated or the bonding surface between the conductive adhesive layer 13 and the printed circuit board PCB may be prevented from being separated.
  • the adhesive layer 23 is heated and pressed so as to be in a C-Stage state.
  • the complete curing condition of the adhesive layer 23 may be changed depending on the composition of the adhesive layer 23.
  • the conductive adhesive layer 13 of the shielding film 10 can be completely cured in the process of performing the adhesive layer full curing step (S187), so that the conductive adhesive layer completely cured in the second embodiment (S170) can be omitted.
  • the adhesive layer 23 of the coverlay 20 may be completely cured under the same conditions as those of the conductive adhesive layer 13 of the shielding film 10.
  • the opening 22a is formed in the insulating layer 22 of the coverlay 20 which is laminated on the metal layer 12 of the shielding film 10 so that the ground extension terminal of the printed circuit board PCB is to be formed, Respectively. That is, the metal layer 12 of the shielding film 10 is electrically connected to the ground circuit of the printed circuit board PCB through the conductive adhesive layer 13, and the metal layer 12 connected to the ground circuit is electrically connected to the insulating layer 22, The exposed metal layer 12 can be utilized as a ground extending terminal of the printed circuit board PCB.
  • the insulating layer 22 of the coverlay 20 is preferably made of the same material as the insulating layer 22 of the second embodiment.
  • a metal layer part removing step (S190) and a plating layer forming step (S200) are performed as shown in (k) and (l)
  • the plating layer 30 is formed on the exposed metal layer 12 through the opening 22a of the insulating layer 22.
  • the coverlay 20 when used, it may proceed sequentially from the step of preparing the shielding film (S110) to the step of forming the insulating layer (S180 ') as in the present embodiment, And the coverlay 20 may be laminated and pressed, respectively.
  • FIG. 4 is a cross-sectional view of an electromagnetic wave shielding film according to a fourth embodiment of the present invention.
  • An electromagnetic wave shielding film 10 ' according to a fourth embodiment of the present invention includes a carrier film 11, a conductive metal layer 12 formed on one side of the carrier film 11, A conductive layer 15 formed on the conductive layer 15 and a conductive adhesive layer 13 formed on the conductive layer 15 and a protective film 14 formed on the conductive adhesive layer 13.
  • the conductive layer 15 is preferably made of a material having a relatively higher electrical conductivity than the metal layer 12 and may be formed by coating a silver ink having an excellent electrical conductivity on the metal layer 12.
  • a coating method of the conductive layer 15 gravure coating, screen printing, slot die, spin coating, or the like can be used.
  • FIG. 5 is a cross-sectional view of a process for manufacturing a printed circuit board according to a fifth embodiment of the present invention.
  • the method for manufacturing a printed circuit board according to the fifth embodiment of the present invention shown in Fig. 5 differs from the method for manufacturing a printed circuit board of the second embodiment in that the electromagnetic wave shielding film 10 'of the fourth embodiment of the present invention is used, .
  • the method for fabricating a printed circuit board according to the fifth embodiment of the present invention includes a step of preparing a shielding film S110 ', a step of forming a shielding film S120, a step of removing a protective film S130, The conductive adhesive layer semi-curing step S150, the carrier film removing step S160, the insulating layer forming step S180, the metal layer part removing step S190, and the plating layer forming step S200.
  • the shielding film 10 ' is prepared.
  • This shielding film 10 ' can be made of the electromagnetic wave shielding film 10' of the fourth embodiment of the present invention.
  • the conductive layer 15 is formed on the metal layer 12 by coating a silver ink having a relatively higher electrical conductivity than the metal layer 12 on the metal layer 12.
  • the silver ink may be gravure-coated, screen-printed, slot- Or the like on the metal layer 12.
  • the remaining steps except for the shielding film preparing step S110 ' are the same as those of the second embodiment shown in FIG. 2, so that a detailed description of the same steps will be omitted.
  • FIG. 6 is a cross-sectional view of a process for manufacturing a printed circuit board according to a sixth embodiment of the present invention.
  • a method of manufacturing a printed circuit board includes the steps of preparing a shielding film S110 ', removing a shielding film S120, removing a protective film S130, a bonding step S140, A carrier film removing step S160, an insulating layer forming step S180 ', a metal layer part removing step S190, and a plating layer forming step S200.
  • the step of preparing the shielding film (S110 ') is the same as the step of preparing the shielding film (S110') of the fifth embodiment shown in FIG. 5, and the remaining steps except for the step of preparing the shielding film (S 120) to the plating layer forming step (S 200) of the third embodiment shown in FIG. 3, detailed description of the same steps will be omitted.
  • FIG. 7 is a cross-sectional view showing a process for manufacturing an electromagnetic wave shielding film according to a seventh embodiment of the present invention.
  • a metal layer 12 provided in the form of a copper foil excellent in electric conductivity is prepared as shown in FIG. 7A.
  • a conductive adhesive is coated on one surface of the metal layer 12 and then dried to form a conductive adhesive layer 13, as shown in FIG. 7 (b).
  • the conductive adhesive layer 13 may include a conductive filler and a binder resin, a curing agent, a flame retardant, and an additive.
  • the conductive adhesive layer 13 may be formed by applying a conductive adhesive composition to the metal layer 12 .
  • the first protective film 14 may be formed of a PET film coated with a silicon release coating.
  • an insulation layer 22 may be formed by coating an insulating paste on the other surface of the metal layer 12 and then drying the insulating paste as shown in FIG. 7D.
  • the insulating paste may include a binder resin, a flame retardant, a colorant, a curing agent, and the like.
  • the second protective film forming step S250 a method of laminating the second protective film 14 ', which has been subjected to the silicon release treatment, on the insulating layer 22 may be used as shown in FIG. 7E.
  • the second protective film 14 ' may be a PET film coated with a silicon release coating.
  • the electromagnetic wave shielding film manufactured as described above may be used for protecting the conductive adhesive layer 13 from the step of removing the protective film (S130) to the step of completely hardening the conductive adhesive layer (S170) shown in FIGS. 2C to 2E
  • the first protective film 14 is peeled to expose the conductive adhesive layer 13 and the exposed conductive adhesive layer 13 is semi-cured while being bonded to the printed circuit board,
  • the electromagnetic wave shielding film can be bonded onto the printed circuit board through the step of completely curing the conductive adhesive layer 13 after removing the protective film 14 '.
  • the bonding strength between the conductive adhesive layer 13 and the metal layer 12 is increased in the state where the conductive adhesive layer 13 is semi-cured, the metal layer 12 and the conductive adhesive layer 13 Or the bonding surface of the conductive adhesive layer 13 and the printed circuit board can be prevented from being separated from each other.
  • FIG. 8 is a cross-sectional view of a process for manufacturing an electromagnetic wave shielding film according to an eighth embodiment of the present invention.
  • the method of manufacturing an electromagnetic wave shielding film according to an eighth embodiment of the present invention may include a metal layer preparing step S210, a conductive layer forming step S211 for forming a conductive layer 15 on one surface of the metal layer 12, A conductive adhesive layer forming step S220 for forming a conductive adhesive layer 13 on the conductive layer 15 and a first protective film forming step S230 for joining the first protective film 14 on the conductive adhesive layer 13 Forming an insulating layer 22 on the other surface of the metal layer 12 and forming a second protective film 14 'on the insulating layer 22, Forming step S250.
  • a silver ink having an excellent electrical conductivity may be coated on the metal layer 12 to form the conductive layer 15 as shown in FIG. 8B.
  • the coating method of the conductive layer gravure coating, screen printing, slot die, spin coating, or the like can be used.
  • the conductive layer 15 is formed on the metal layer 12 as described above, the electromagnetic wave shielding effect can be further improved.
  • a conductive adhesive is coated on the conductive layer 15 and then dried to form a conductive adhesive layer 13, as shown in FIG. 8C.
  • the remaining steps except for the conductive layer forming step S211 are the same as those of the seventh embodiment, so a detailed description of the same steps will be omitted.
  • the resulting conductive adhesive was filtered through a filter made of SUS 1000 mesh to obtain an anisotropy conductive adhesive composition.
  • the anisotropic conductive adhesive composition thus prepared was coated on a copper foil (copper foil having a thickness of 3 mu m) with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 mu m . Thereafter, a PET protective film having a thickness of 50 ⁇ and treated with silicone was laminated on the anisotropic conductive adhesive layer.
  • the resulting conductive adhesive was filtered through a filter made of SUS 1000 mesh to obtain an anisotropy conductive adhesive composition.
  • the resulting anisotropic conductive adhesive composition was coated on a copper foil (copper foil 6 ⁇ m thick) having a carrier by a slot die and heated at 150 ° C. for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 ⁇ m . Thereafter, a PET protective film having a thickness of 50 ⁇ and treated with silicone was laminated on the anisotropic conductive adhesive layer.
  • the resulting conductive adhesive was filtered through a filter made of SUS 1000 mesh to obtain an anisotropy conductive adhesive composition.
  • the anisotropic conductive adhesive composition thus prepared was coated on a copper foil (copper foil having a thickness of 10 mu m) coated with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 mu m . Thereafter, a PET protective film having a thickness of 50 ⁇ and treated with silicone was laminated on the anisotropic conductive adhesive layer.
  • the conductive adhesive thus prepared was filtered with a filter made of SUS 1000 mesh to obtain an isotropic conductive adhesive composition.
  • the isotropic conductive adhesive composition thus prepared was coated on a surface of a copper foil (copper foil having a thickness of 3 mu m) with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an isotropic conductive adhesive layer having a dry thickness of 7 mu m . Thereafter, an acrylic adhesive-treated PET protective film having a thickness of 50 ⁇ was laminated on the isotropic conductive adhesive layer.
  • a silver ink (TEC-CO-021, manufactured by InkTec Co., Ltd.) was coated on the surface of a copper foil (copper foil having a copper thickness of 3 mu m) having a carrier film attached thereto by a micro gravure coater and then heated and sintered at 150 DEG C for 4 minutes, Silver metal layer.
  • the conductive adhesive thus prepared was filtered through a SUS 1000 mesh filter to obtain an anisotropy conductive adhesive composition.
  • the anisotropic conductive adhesive composition thus prepared was coated on a copper foil (copper foil having a thickness of 3 mu m) with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 mu m . Thereafter, a PET protective film having a thickness of 50 ⁇ and treated with silicone was laminated on the anisotropic conductive adhesive layer.
  • the resulting conductive adhesive was filtered through a filter made of SUS 1000 mesh to obtain an anisotropy conductive adhesive composition.
  • the anisotropic conductive adhesive composition thus prepared was coated on a copper foil (copper foil having a thickness of 3 mu m) with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 mu m . Thereafter, a PET protective film having a thickness of 50 ⁇ and treated with silicone was laminated on the anisotropic conductive adhesive layer.
  • a modified epoxy resin (Arakid-9201N, Arakawa Chemical Industries, Ltd.) was added to 100 parts by weight of this dispersion, and the mixture was stirred at a low speed for 1 hour and filtered through SUS1000 mesh to obtain an insulating layer composition.
  • the insulating layer composition was coated using a slot die and heated at 150 DEG C for 5 minutes to form an insulation layer having a dry thickness of 5 mu m, .
  • the conductive adhesive thus prepared was filtered with a filter made of SUS 1000 mesh to obtain an isotropic conductive adhesive composition.
  • the isotropic conductive adhesive composition thus prepared was coated on a surface of a copper foil (copper foil having a thickness of 3 mu m) with a carrier using a slot die and heated at 150 DEG C for 2 minutes to form an isotropic conductive adhesive layer having a dry thickness of 7 mu m . Thereafter, an acrylic adhesive-treated PET protective film having a thickness of 50 ⁇ was laminated on the isotropic conductive adhesive layer.
  • a modified epoxy resin (Arakid-9201N, Arakawa Chemical Industries, Ltd.) was added to 100 parts by weight of this dispersion, and the mixture was stirred at a low speed for 1 hour and filtered through SUS1000 mesh to obtain an insulating layer composition.
  • the insulating layer composition was coated using a slot die and heated at 150 DEG C for 5 minutes to form an insulation layer having a dry thickness of 5 mu m, .
  • a modified epoxy resin (Arakid-9201N, Arakawa Chemical Industries, Ltd.) was added to 100 parts by weight of this dispersion, and the mixture was stirred at a low speed for 1 hour and filtered through SUS1000 mesh to obtain an insulating layer composition.
  • the insulating layer composition was applied to a 50 mu m-thick PET film treated with silicone and then dried at 150 DEG C for 2 minutes to obtain a coating film having a dry thickness of 7 mu m.
  • a silver metal layer having a thickness of 0.2 ⁇ ⁇ was formed on the insulating layer by sputtering.
  • the resulting conductive adhesive was filtered through a filter made of SUS 1000 mesh to obtain an anisotropy conductive adhesive composition.
  • the prepared anisotropic conductive adhesive composition was coated on the surface of the silver metal layer using a slot die and heated at 150 DEG C for 2 minutes to form an anisotropic conductive adhesive layer having a dry thickness of 3 mu m. Then, a 50 ⁇ m thick PET protective film treated with silicone was laminated to an anisotropic conductive adhesive layer to prepare Comparative Example 1.
  • a modified epoxy resin (Arakid-9201N, Arakawa Chemical Industries, Ltd.) was added to 100 parts by weight of this dispersion, and the mixture was stirred at a low speed for 1 hour and filtered through SUS1000 mesh to obtain an insulating layer composition.
  • the insulating layer composition was applied to a 50 mu m-thick PET film treated with silicone and then dried at 150 DEG C for 2 minutes to obtain a coating film having a dry thickness of 7 mu m.
  • the conductive adhesive thus prepared was filtered with a filter made of SUS 1000 mesh to obtain an isotropic conductive adhesive composition.
  • the isotropic conductive adhesive composition thus prepared was coated on the surface of a PET release film of a silicon release mold using a slot die and heated at 150 ⁇ for 3 minutes to form an isotropic conductive adhesive layer having a dry thickness of 12 ⁇ to form an insulating layer on the silicone release PET film Comparative Example 2 was prepared by roll lamination at a temperature of 100 ⁇ and a pressure of 7 bar.
  • the test sample was cut to a size of 25.4 mm in length and 25 cm in length and then the protective film of the conductive adhesive layer was removed, and a 25 ⁇ m thick PI film (Kapton, DuPont) was placed on one surface thereof. (Pressure: 3 bar, 20 seconds), and then a 25 ⁇ m thick bonding sheet was laminated on the copper surface or the insulating layer surface from which the carrier film was removed, and hot press (press condition: temperature: 150 ° C., pressure: 40 kgf / cm 2, time: 60 minutes) The adhesive layer was fully cured (C-stage) under heating and pressurization. And the tensile strength at a tensile rate of 58.8 M / min and a 180 degree was measured under an atmosphere of 25 ° C and 50% RH. The same sample was tested 3 times and the average value was indicated.
  • PI film Kerpton, DuPont
  • the protective film of the electromagnetic wave shielding film was removed and a PI film (Kapton, DuPont) having a thickness of 25 mu m was attached by using a folding machine (temperature: 150 DEG C, pressure 3 bar, 20 seconds)
  • a folding machine temperature: 150 DEG C, pressure 3 bar, 20 seconds
  • To 4 were prepared by completely removing the carrier and laminating an insulating film (BT-012, manufactured by InkTec Co., Ltd.) and heating and pressurizing the adhesive layer by Hot Press (press condition: temperature: 150 ⁇ , pressure: 40 kgf / C-stage).
  • the cured samples were visually observed at 295 ° C solder for 1 minute and 2 times, and evaluated for bubble, lifting, and appearance color change. Five samples of each sample were tested to indicate the number of appearance defects.
  • a FRP rod (width 5 mm, length 25 cm) to be used as a level step as shown in Fig. 12 was placed on a PI film (Kapton, DuPont) having a thickness of 100 ⁇ , 200 ⁇ , 300 ⁇ and 400 ⁇ , (Temperature: 150 ° C, pressure: 3 bar, 20 seconds), and then the carrier was removed and the insulating film (BT- 012, manufactured by InkTec Co., Ltd.) was laminated and pressurized by a hot press (press condition: temperature: 150 DEG C, pressure: 40 kgf / cm2, time: 60 minutes) to completely cure the adhesive layer (C-stage).
  • a hot press press condition: temperature: 150 DEG C, pressure: 40 kgf / cm2, time: 60 minutes
  • the surface of the insulating layer of the sample was observed with a hand microscope for cracks at the stepped portions (see the photograph of the surface of FIG. 12). Five evaluation samples were prepared, and the number of cracks was indicated by the step thickness.
  • the prepared sample was allowed to stand in a 85 ° C and 85% RH chamber for 72 hours, and the appearance and resistance change were measured.
  • the PI film Kerpton, DuPont
  • the carrier was removed, Ltd.
  • hot pressing press condition: temperature: 150 ⁇ ⁇ , pressure: 40 kgf / cm2, time: 60 minutes

Abstract

La présente invention concerne un film de protection contre les ondes électromagnétiques, un procédé de fabrication d'une carte de circuit imprimé, et un procédé de fabrication d'un film de protection contre les ondes électromagnétiques. Le film de protection contre les ondes électromagnétiques selon la présente invention comprend : un film de support ; une couche métallique conductrice formée sur une surface du film de support ; une couche de liaison conductrice formée sur la couche métallique ; et un film de protection formé sur la couche de liaison conductrice.
PCT/KR2018/000662 2017-12-18 2018-01-15 Film de protection contre les ondes électromagnétiques, procédé de fabrication de carte de circuit imprimé, et procédé de fabrication de film de protection contre les ondes électromagnétiques WO2019124624A1 (fr)

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KR10-2017-0174287 2017-12-18
KR1020170174287A KR102197471B1 (ko) 2017-12-18 2017-12-18 전자파 차폐필름, 인쇄회로기판 제조방법 및 전자파 차폐필름 제조방법

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CN112406217B (zh) * 2020-10-27 2022-04-26 瑞声精密制造科技(常州)有限公司 金属塑料复合膜及其制备方法和应用
JP7232995B2 (ja) * 2021-03-19 2023-03-06 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器
JP7001187B1 (ja) 2021-03-19 2022-01-19 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器
TW202237716A (zh) * 2021-03-26 2022-10-01 日商拓自達電線股份有限公司 導電性接著劑層

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KR102197471B1 (ko) 2021-01-04
TW201927968A (zh) 2019-07-16
KR20190073037A (ko) 2019-06-26
CN108495543A (zh) 2018-09-04
TWI707940B (zh) 2020-10-21

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