TW200718310A - Mold for forming a wiring board and method for making such a mold, a wiring board and method for making same, method for making a multiple layer laminate wiring board, and method for forming a via hole - Google Patents

Mold for forming a wiring board and method for making such a mold, a wiring board and method for making same, method for making a multiple layer laminate wiring board, and method for forming a via hole

Info

Publication number
TW200718310A
TW200718310A TW095119339A TW95119339A TW200718310A TW 200718310 A TW200718310 A TW 200718310A TW 095119339 A TW095119339 A TW 095119339A TW 95119339 A TW95119339 A TW 95119339A TW 200718310 A TW200718310 A TW 200718310A
Authority
TW
Taiwan
Prior art keywords
wiring board
forming
making
mold
impressing
Prior art date
Application number
TW095119339A
Other languages
English (en)
Chinese (zh)
Inventor
Hitoshi Kajino
Takeo Taguchi
Kanji Sato
Masahito Ishii
Tatsuo Kataoka
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005161618A external-priority patent/JP2006339366A/ja
Priority claimed from JP2005161617A external-priority patent/JP2006339365A/ja
Priority claimed from JP2005351001A external-priority patent/JP2007158017A/ja
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200718310A publication Critical patent/TW200718310A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW095119339A 2005-06-01 2006-06-01 Mold for forming a wiring board and method for making such a mold, a wiring board and method for making same, method for making a multiple layer laminate wiring board, and method for forming a via hole TW200718310A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005161618A JP2006339366A (ja) 2005-06-01 2005-06-01 配線基板形成用モールドおよびその製造方法
JP2005161617A JP2006339365A (ja) 2005-06-01 2005-06-01 配線基板およびその製造方法、多層積層配線基板の製造方法並びにビアホールの形成方法
JP2005351001A JP2007158017A (ja) 2005-12-05 2005-12-05 配線基板およびその製造方法

Publications (1)

Publication Number Publication Date
TW200718310A true TW200718310A (en) 2007-05-01

Family

ID=37481662

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119339A TW200718310A (en) 2005-06-01 2006-06-01 Mold for forming a wiring board and method for making such a mold, a wiring board and method for making same, method for making a multiple layer laminate wiring board, and method for forming a via hole

Country Status (3)

Country Link
KR (1) KR20080017403A (ja)
TW (1) TW200718310A (ja)
WO (1) WO2006129734A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8894892B2 (en) 2009-12-28 2014-11-25 Fujikura Ltd. Mold and manufacturing method therefor

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100741677B1 (ko) 2006-03-06 2007-07-23 삼성전기주식회사 임프린팅에 의한 기판의 제조방법
KR100925762B1 (ko) * 2008-04-28 2009-11-11 삼성전기주식회사 임프린트 방법
JP5310743B2 (ja) * 2008-12-22 2013-10-09 富士通株式会社 電子部品の製造方法
JPWO2011058978A1 (ja) * 2009-11-10 2013-04-04 株式会社フジクラ 配線基板の製造方法
JP2014036064A (ja) * 2012-08-08 2014-02-24 Ube Ind Ltd プリント配線板の製造方法
JP7373162B2 (ja) * 2019-11-01 2023-11-02 国立研究開発法人産業技術総合研究所 コネクタ及びその製造方法
CN112235943B (zh) * 2019-11-19 2022-06-10 江苏上达电子有限公司 一种双面压膜线路成型工艺
CN115023057B (zh) * 2022-07-27 2023-03-24 北京自然韩桦科技有限公司 超高密度柔性薄膜电路制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186698A (ja) * 1997-12-18 1999-07-09 Matsushita Electric Ind Co Ltd 回路基板の製造方法および回路基板
JP2000124581A (ja) * 1998-10-20 2000-04-28 Yotaro Hatamura 配線パターン形成方法及び積層配線基板の製造方法
JP2004253432A (ja) * 2003-02-18 2004-09-09 Matsushita Electric Ind Co Ltd プリント配線基板の製造方法
JP2004304097A (ja) * 2003-04-01 2004-10-28 Sharp Corp パターン形成方法および半導体装置の製造方法
JP2005093945A (ja) * 2003-09-19 2005-04-07 Ngk Spark Plug Co Ltd セラミック配線基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8894892B2 (en) 2009-12-28 2014-11-25 Fujikura Ltd. Mold and manufacturing method therefor

Also Published As

Publication number Publication date
KR20080017403A (ko) 2008-02-26
WO2006129734A1 (ja) 2006-12-07

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