TW200717677A - Semiconductor apparatus testing arrangement and semiconductor apparatus testing method - Google Patents

Semiconductor apparatus testing arrangement and semiconductor apparatus testing method

Info

Publication number
TW200717677A
TW200717677A TW095103064A TW95103064A TW200717677A TW 200717677 A TW200717677 A TW 200717677A TW 095103064 A TW095103064 A TW 095103064A TW 95103064 A TW95103064 A TW 95103064A TW 200717677 A TW200717677 A TW 200717677A
Authority
TW
Taiwan
Prior art keywords
semiconductor apparatus
apparatus testing
semiconductor
arrangement
testing
Prior art date
Application number
TW095103064A
Other languages
English (en)
Other versions
TWI317980B (zh
Inventor
Shigeyuki Maruyama
Yoshikazu Arisaka
Kazuhiro Tashiro
Takayuki Katayama
Tetsu Ozawa
Yuushin Kimura
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200717677A publication Critical patent/TW200717677A/zh
Application granted granted Critical
Publication of TWI317980B publication Critical patent/TWI317980B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW095103064A 2005-10-31 2006-01-26 Semiconductor apparatus testing arrangement and semiconductor apparatus testing method TW200717677A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005315995A JP2007121180A (ja) 2005-10-31 2005-10-31 半導体装置の試験装置及び半導体装置の試験方法

Publications (2)

Publication Number Publication Date
TW200717677A true TW200717677A (en) 2007-05-01
TWI317980B TWI317980B (zh) 2009-12-01

Family

ID=37995448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103064A TW200717677A (en) 2005-10-31 2006-01-26 Semiconductor apparatus testing arrangement and semiconductor apparatus testing method

Country Status (5)

Country Link
US (1) US7355421B2 (zh)
JP (1) JP2007121180A (zh)
KR (1) KR100768291B1 (zh)
CN (1) CN100565231C (zh)
TW (1) TW200717677A (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7688085B2 (en) * 2006-06-13 2010-03-30 Formfactor, Inc. Contactor having a global spring structure and methods of making and using the contactor
JP2009115456A (ja) * 2007-11-01 2009-05-28 Advantest Corp ハンドラ、テストトレイおよびメモリ装置
KR101016385B1 (ko) 2008-04-18 2011-02-21 티에스씨멤시스(주) 전기 검사 장치 및 그 제조 방법
KR20100069300A (ko) * 2008-12-16 2010-06-24 삼성전자주식회사 프로브 카드와, 이를 이용한 반도체 디바이스 테스트 장치 및 방법
TWM361634U (en) * 2009-04-10 2009-07-21 Princeton Technology Corp Testing circuit board
CN102221814A (zh) * 2010-04-19 2011-10-19 王锐 多拼板测试台
KR101431915B1 (ko) * 2012-12-21 2014-08-26 삼성전기주식회사 예비 공간 변환기 및 이를 이용하여 제조된 공간 변환기, 그리고 상기 공간 변환기를 구비하는 반도체 소자 검사 장치
US20150168482A1 (en) * 2013-12-12 2015-06-18 Todd M. Flynn Configurable test equipment
TWI586967B (zh) * 2015-10-27 2017-06-11 Mpi Corp Probe module
EP3185026B1 (en) * 2015-12-23 2020-10-28 IMEC vzw Probing device for testing integrated circuits
CN107422242A (zh) * 2016-05-23 2017-12-01 北大方正集团有限公司 一种vdmos芯片的测试装置及方法
KR102205616B1 (ko) * 2019-04-24 2021-01-21 주식회사 엑시콘 시스템 응용 보드와 사각 형상의 프로브 카드가 결합된 dut 테스트 시스템
CN113433352A (zh) * 2021-06-22 2021-09-24 合肥维信诺科技有限公司 屏体性能测试装置和屏体性能测试方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661136A (en) * 1979-10-25 1981-05-26 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor test equipment
US4649339A (en) * 1984-04-25 1987-03-10 Honeywell Inc. Integrated circuit interface
JPH07114227B2 (ja) * 1989-01-07 1995-12-06 三菱電機株式会社 ウエハ試験用探触板
KR920022574A (ko) * 1991-05-03 1992-12-19 김광호 반도체 장치의 칩 수명테스트 장치
EP0707214A3 (en) * 1994-10-14 1997-04-16 Hughes Aircraft Co Multiport membrane probe to test complete semiconductor plates
JP3135825B2 (ja) * 1995-09-27 2001-02-19 株式会社東芝 プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法
JPH09172143A (ja) 1995-12-19 1997-06-30 Mitsubishi Electric Corp 半導体集積回路装置及びそのテスト方法
JP4010588B2 (ja) 1996-12-19 2007-11-21 株式会社日本マイクロニクス 検査用ヘッド
JPH1116963A (ja) 1997-06-25 1999-01-22 Ii S J:Kk 半導体ウェハーのテスト方法および装置
JP2001291749A (ja) * 2000-04-06 2001-10-19 Seiko Epson Corp プローブカード及びそれを用いたチップ領域ソート方法
JP2001077162A (ja) * 2000-08-01 2001-03-23 Toshiba Corp 半導体集積回路のプロービング試験方法
JP2002350494A (ja) * 2001-05-24 2002-12-04 Ricoh Co Ltd バリアブルソケット及び半導体集積回路の評価装置
JP2005121553A (ja) 2003-10-17 2005-05-12 Matsushita Electric Ind Co Ltd プローブカード及び半導体チップの試験方法

Also Published As

Publication number Publication date
TWI317980B (zh) 2009-12-01
CN1959425A (zh) 2007-05-09
CN100565231C (zh) 2009-12-02
US7355421B2 (en) 2008-04-08
KR20070046692A (ko) 2007-05-03
KR100768291B1 (ko) 2007-10-18
JP2007121180A (ja) 2007-05-17
US20070096761A1 (en) 2007-05-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees