TW200715627A - Organic electroluminscence element and manufacturing method of the same, and organic electroluminscence panel - Google Patents

Organic electroluminscence element and manufacturing method of the same, and organic electroluminscence panel

Info

Publication number
TW200715627A
TW200715627A TW095130215A TW95130215A TW200715627A TW 200715627 A TW200715627 A TW 200715627A TW 095130215 A TW095130215 A TW 095130215A TW 95130215 A TW95130215 A TW 95130215A TW 200715627 A TW200715627 A TW 200715627A
Authority
TW
Taiwan
Prior art keywords
electroluminscence
organic
manufacturing
panel
same
Prior art date
Application number
TW095130215A
Other languages
English (en)
Inventor
Gaku Harada
Tetsuji Omura
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of TW200715627A publication Critical patent/TW200715627A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW095130215A 2005-08-31 2006-08-17 Organic electroluminscence element and manufacturing method of the same, and organic electroluminscence panel TW200715627A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005252752A JP2007066775A (ja) 2005-08-31 2005-08-31 有機ｅｌ素子の製造方法及び有機ｅｌ素子

Publications (1)

Publication Number Publication Date
TW200715627A true TW200715627A (en) 2007-04-16

Family

ID=37817699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130215A TW200715627A (en) 2005-08-31 2006-08-17 Organic electroluminscence element and manufacturing method of the same, and organic electroluminscence panel

Country Status (5)

Country Link
US (1) US20070194303A1 (zh)
JP (1) JP2007066775A (zh)
KR (1) KR20070026154A (zh)
CN (1) CN1925138B (zh)
TW (1) TW200715627A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481929B (zh) * 2012-12-06 2015-04-21 Protec Co Ltd 薄膜電晶體液晶顯示面板製造方法

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KR101213103B1 (ko) * 2006-06-30 2013-01-09 엘지디스플레이 주식회사 합착 장치 및 이를 이용한 전계발광소자의 제조방법
JP4827698B2 (ja) * 2006-10-27 2011-11-30 キヤノン株式会社 発光素子の形成方法
US7652305B2 (en) * 2007-02-23 2010-01-26 Corning Incorporated Methods and apparatus to improve frit-sealed glass package
JP4910780B2 (ja) * 2007-03-02 2012-04-04 セイコーエプソン株式会社 入力機能付有機エレクトロルミネッセンス装置、及び電子機器
JP4893392B2 (ja) * 2007-03-15 2012-03-07 ソニー株式会社 表示装置および電子機器
JP2009037812A (ja) * 2007-07-31 2009-02-19 Sumitomo Chemical Co Ltd 有機ｅｌ装置およびその製造方法
KR100899423B1 (ko) * 2007-08-16 2009-05-27 삼성모바일디스플레이주식회사 유기전계발광소자 및 그의 제조방법
JP2009047879A (ja) * 2007-08-20 2009-03-05 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、電子機器
WO2009066403A1 (ja) * 2007-11-19 2009-05-28 Sharp Kabushiki Kaisha 表示装置の製造方法及び表示装置
JP2011018669A (ja) * 2009-07-07 2011-01-27 Nitto Denko Corp 半導体ウェハダイシング用粘着シート及び該粘着シートを用いる半導体ウェハのダイシング方法
JP2012043689A (ja) * 2010-08-20 2012-03-01 Toshiba Tec Corp 有機ｅｌ装置の製造方法
US20130154478A1 (en) * 2010-08-25 2013-06-20 Sharp Kabushiki Kaisha Organic light emitting device and antistatic method for the same
JP5766491B2 (ja) * 2011-04-11 2015-08-19 株式会社Ｊｏｌｅｄ 発光パネル、表示装置および電子機器
TWI493685B (zh) 2012-02-10 2015-07-21 E Ink Holdings Inc 主動陣列基板上之靜電防護結構
JP6267920B2 (ja) * 2013-10-15 2018-01-24 常陽工学株式会社 封止装置および封止方法
TWI754193B (zh) * 2014-04-30 2022-02-01 日商半導體能源研究所股份有限公司 發光元件、發光裝置、照明裝置、及電子設備
JP2015216072A (ja) 2014-05-13 2015-12-03 株式会社ジャパンディスプレイ 有機ｅｌ装置及びその製造方法
CN106876424A (zh) * 2015-12-14 2017-06-20 上海和辉光电有限公司 一种有机发光显示器及其制备方法
CN105428373B (zh) * 2015-12-31 2018-12-28 京东方科技集团股份有限公司 Oled用覆膜基板、用其制备oled显示器件的方法和oled显示器件
CN105679957B (zh) * 2016-04-20 2017-12-05 京东方科技集团股份有限公司 有机发光器件及其制备方法
CN108231654B (zh) * 2018-01-12 2020-09-18 上海华虹宏力半导体制造有限公司 对形成有mos结构的基底的静电吸附的方法
US11552163B2 (en) * 2019-02-22 2023-01-10 Vuereal Inc. Staggered and tile stacked microdevice integration and driving
CN112366281B (zh) * 2020-11-09 2023-04-07 合肥京东方卓印科技有限公司 一种封装盖板及其制造方法、显示板面、显示装置

Family Cites Families (11)

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JP2663011B2 (ja) * 1989-03-15 1997-10-15 日本シイエムケイ株式会社 シールド層を備えるプリント配線板
JP2000173778A (ja) * 1998-12-01 2000-06-23 Tdk Corp 有機ｅｌ表示装置
US7112115B1 (en) * 1999-11-09 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
JP4798322B2 (ja) * 2001-01-26 2011-10-19 ソニー株式会社 表示装置及び表示装置の製造方法
JP2002318546A (ja) * 2001-02-19 2002-10-31 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
KR100483988B1 (ko) * 2001-11-29 2005-04-15 삼성에스디아이 주식회사 투명도전막의 투과도 변형방법
JP2004047179A (ja) * 2002-07-09 2004-02-12 Dainippon Printing Co Ltd 帯電防止有機ｅｌ素子およびその製造方法
CN100438119C (zh) * 2003-12-15 2008-11-26 乐金显示有限公司 双面板型有机电致发光器件及其制造方法
JP4801346B2 (ja) * 2003-12-26 2011-10-26 株式会社半導体エネルギー研究所 発光装置の作製方法
JP2005303262A (ja) * 2004-03-18 2005-10-27 Sharp Corp アクティブマトリクス基板、その製造装置、及び表示デバイス
JP2006004907A (ja) * 2004-05-18 2006-01-05 Seiko Epson Corp エレクトロルミネッセンス装置及び電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481929B (zh) * 2012-12-06 2015-04-21 Protec Co Ltd 薄膜電晶體液晶顯示面板製造方法

Also Published As

Publication number Publication date
KR20070026154A (ko) 2007-03-08
US20070194303A1 (en) 2007-08-23
CN1925138A (zh) 2007-03-07
JP2007066775A (ja) 2007-03-15
CN1925138B (zh) 2013-05-29

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