TW200715404A - Microelectronic assembly and method for forming the same - Google Patents
Microelectronic assembly and method for forming the sameInfo
- Publication number
- TW200715404A TW200715404A TW095134084A TW95134084A TW200715404A TW 200715404 A TW200715404 A TW 200715404A TW 095134084 A TW095134084 A TW 095134084A TW 95134084 A TW95134084 A TW 95134084A TW 200715404 A TW200715404 A TW 200715404A
- Authority
- TW
- Taiwan
- Prior art keywords
- forming
- substrate
- same
- microelectronic assembly
- hole
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000004377 microelectronic Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 6
- 239000004065 semiconductor Substances 0.000 abstract 3
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/465—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/239,986 US7425485B2 (en) | 2005-09-30 | 2005-09-30 | Method for forming microelectronic assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200715404A true TW200715404A (en) | 2007-04-16 |
TWI417958B TWI417958B (zh) | 2013-12-01 |
Family
ID=37901096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134084A TWI417958B (zh) | 2005-09-30 | 2006-09-14 | 微電子總成及形成其之方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US7425485B2 (zh) |
EP (1) | EP1935022B1 (zh) |
JP (1) | JP4722999B2 (zh) |
KR (1) | KR101303413B1 (zh) |
CN (1) | CN101501838B (zh) |
TW (1) | TWI417958B (zh) |
WO (1) | WO2007040992A2 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070173070A1 (en) * | 2006-01-26 | 2007-07-26 | Mei-Ling Chen | Porous low-k dielectric film and fabrication method thereof |
US8860544B2 (en) * | 2007-06-26 | 2014-10-14 | Mediatek Inc. | Integrated inductor |
US20100295150A1 (en) * | 2009-05-22 | 2010-11-25 | Chan Kuei-Ti | Semiconductor device with oxide define dummy feature |
CN102456612A (zh) * | 2010-10-27 | 2012-05-16 | 上海华虹Nec电子有限公司 | 半导体集成电感的制作方法及结构 |
CN102616727B (zh) * | 2011-01-31 | 2015-04-29 | 中芯国际集成电路制造(上海)有限公司 | Mems器件及其制作方法 |
DE102011010248B3 (de) * | 2011-02-03 | 2012-07-12 | Infineon Technologies Ag | Ein Verfahren zum Herstellen eines Halbleiterbausteins |
US8354325B1 (en) * | 2011-06-29 | 2013-01-15 | Freescale Semiconductor, Inc. | Method for forming a toroidal inductor in a semiconductor substrate |
CN104752157A (zh) * | 2013-12-30 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | 半导体衬底及其制作方法、集成无源器件及其制作方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3102885B2 (ja) * | 1991-07-10 | 2000-10-23 | ゼネラル・エレクトリック・カンパニィ | チャンバを設けた高密度相互接続構造体 |
US5500552A (en) * | 1993-07-26 | 1996-03-19 | T.I.F. Co., Ltd. | LC element, semiconductor device and LC element manufacturing method |
TW275152B (zh) * | 1993-11-01 | 1996-05-01 | Ikeda Takeshi | |
US5828101A (en) * | 1995-03-30 | 1998-10-27 | Kabushiki Kaisha Toshiba | Three-terminal semiconductor device and related semiconductor devices |
US6492705B1 (en) * | 1996-06-04 | 2002-12-10 | Intersil Corporation | Integrated circuit air bridge structures and methods of fabricating same |
US5773870A (en) * | 1996-09-10 | 1998-06-30 | National Science Council | Membrane type integrated inductor and the process thereof |
JPH10321802A (ja) * | 1997-05-22 | 1998-12-04 | Toshiba Corp | インダクタ素子 |
US5930637A (en) * | 1997-10-31 | 1999-07-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of fabricating a microwave inductor |
DE19810825A1 (de) * | 1998-03-12 | 1999-09-16 | Siemens Ag | Integrierte elektronische Schaltungsanordnung und Verfahren zu ihrer Herstellung |
US6025261A (en) * | 1998-04-29 | 2000-02-15 | Micron Technology, Inc. | Method for making high-Q inductive elements |
US6307247B1 (en) * | 1999-07-12 | 2001-10-23 | Robert Bruce Davies | Monolithic low dielectric constant platform for passive components and method |
JP4969715B2 (ja) * | 2000-06-06 | 2012-07-04 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
DE10054484A1 (de) * | 2000-11-03 | 2002-05-08 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
SE519893C2 (sv) * | 2000-11-09 | 2003-04-22 | Ericsson Telefon Ab L M | Induktorstruktur hos integrerad krets samt icke-förstörande mätning av etsningsdjup |
TW523920B (en) * | 2000-11-18 | 2003-03-11 | Lenghways Technology Co Ltd | Integrated multi-channel communication passive device manufactured by using micro-electromechanical technique |
US6737727B2 (en) * | 2001-01-12 | 2004-05-18 | International Business Machines Corporation | Electronic structures with reduced capacitance |
US7148553B1 (en) * | 2001-08-01 | 2006-12-12 | Davies Robert B | Semiconductor device with inductive component and method of making |
JP2003113940A (ja) * | 2001-08-02 | 2003-04-18 | Riken Corp | スチール製ピストンリング |
CN1131557C (zh) * | 2001-08-24 | 2003-12-17 | 清华大学 | 硅基单面加工悬浮结构微机械电感的制作方法 |
JP2003179148A (ja) | 2001-10-04 | 2003-06-27 | Denso Corp | 半導体基板およびその製造方法 |
DE10212630A1 (de) * | 2002-03-21 | 2003-10-16 | Infineon Technologies Ag | Spule auf einem Halbleitersubstrat und Verfahren zu deren Herstellung |
US7701022B2 (en) * | 2002-05-01 | 2010-04-20 | Rohm Co., Ltd. | Semiconductor device and method of producing the same |
JP4135564B2 (ja) * | 2002-11-12 | 2008-08-20 | 株式会社デンソー | 半導体基板およびその製造方法 |
TW570896B (en) * | 2003-05-26 | 2004-01-11 | Prime View Int Co Ltd | A method for fabricating an interference display cell |
JP4651920B2 (ja) | 2003-07-15 | 2011-03-16 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US6989578B2 (en) * | 2003-07-31 | 2006-01-24 | Taiwan Semiconductor Manufacturing Company | Inductor Q value improvement |
DE10352001A1 (de) * | 2003-11-07 | 2005-06-09 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit einer Membran und Verfahren zur Herstellung eines solchen Bauelements |
JP2007505505A (ja) * | 2004-01-10 | 2007-03-08 | エイチブイブイアイ・セミコンダクターズ・インコーポレイテッド | パワー半導体装置およびそのための方法 |
JP2005221450A (ja) * | 2004-02-09 | 2005-08-18 | Yamaha Corp | 物理量センサ |
US7704868B2 (en) * | 2005-04-12 | 2010-04-27 | University Of Florida Research Foundation, Inc. | Fabrication of a micro-electromechanical system (MEMS) device from a complementary metal oxide semiconductor (CMOS) |
-
2005
- 2005-09-30 US US11/239,986 patent/US7425485B2/en not_active Expired - Fee Related
-
2006
- 2006-09-14 TW TW095134084A patent/TWI417958B/zh not_active IP Right Cessation
- 2006-09-20 EP EP06803913.0A patent/EP1935022B1/en not_active Expired - Fee Related
- 2006-09-20 KR KR1020087007606A patent/KR101303413B1/ko active IP Right Grant
- 2006-09-20 CN CN2006800357169A patent/CN101501838B/zh not_active Expired - Fee Related
- 2006-09-20 WO PCT/US2006/036638 patent/WO2007040992A2/en active Application Filing
- 2006-09-20 JP JP2008533444A patent/JP4722999B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-05 US US12/186,224 patent/US7723821B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4722999B2 (ja) | 2011-07-13 |
WO2007040992A2 (en) | 2007-04-12 |
EP1935022A2 (en) | 2008-06-25 |
CN101501838B (zh) | 2011-04-20 |
JP2009510778A (ja) | 2009-03-12 |
US20080290480A1 (en) | 2008-11-27 |
US7723821B2 (en) | 2010-05-25 |
KR20080054388A (ko) | 2008-06-17 |
EP1935022A4 (en) | 2011-09-28 |
CN101501838A (zh) | 2009-08-05 |
US20070075394A1 (en) | 2007-04-05 |
TWI417958B (zh) | 2013-12-01 |
US7425485B2 (en) | 2008-09-16 |
KR101303413B1 (ko) | 2013-09-05 |
EP1935022B1 (en) | 2013-04-10 |
WO2007040992A3 (en) | 2009-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |