TW200712266A - Tin electrodeposits having properties or characteristics that minimize tin whisker growth - Google Patents
Tin electrodeposits having properties or characteristics that minimize tin whisker growthInfo
- Publication number
- TW200712266A TW200712266A TW095122777A TW95122777A TW200712266A TW 200712266 A TW200712266 A TW 200712266A TW 095122777 A TW095122777 A TW 095122777A TW 95122777 A TW95122777 A TW 95122777A TW 200712266 A TW200712266 A TW 200712266A
- Authority
- TW
- Taiwan
- Prior art keywords
- tin
- deposit
- phosphorous
- minimize
- growth
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69855005P | 2005-07-11 | 2005-07-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200712266A true TW200712266A (en) | 2007-04-01 |
Family
ID=36992667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095122777A TW200712266A (en) | 2005-07-11 | 2006-06-23 | Tin electrodeposits having properties or characteristics that minimize tin whisker growth |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070007144A1 (zh) |
EP (1) | EP1904669A1 (zh) |
JP (1) | JP2009500527A (zh) |
KR (1) | KR20080024525A (zh) |
CN (1) | CN101243210A (zh) |
TW (1) | TW200712266A (zh) |
WO (1) | WO2007008369A1 (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008274316A (ja) * | 2007-04-25 | 2008-11-13 | Toyota Motor Corp | めっき部材およびその製造方法 |
JP4986141B2 (ja) * | 2007-05-08 | 2012-07-25 | 国立大学法人秋田大学 | 錫メッキの針状ウィスカの発生を抑制する方法 |
US10231344B2 (en) * | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
US8404160B2 (en) * | 2007-05-18 | 2013-03-26 | Applied Nanotech Holdings, Inc. | Metallic ink |
US8506849B2 (en) * | 2008-03-05 | 2013-08-13 | Applied Nanotech Holdings, Inc. | Additives and modifiers for solvent- and water-based metallic conductive inks |
US9730333B2 (en) * | 2008-05-15 | 2017-08-08 | Applied Nanotech Holdings, Inc. | Photo-curing process for metallic inks |
US20090286383A1 (en) * | 2008-05-15 | 2009-11-19 | Applied Nanotech Holdings, Inc. | Treatment of whiskers |
CN102027569B (zh) * | 2008-06-30 | 2013-03-13 | 艾格瑞系统有限公司 | 防止或减缓在金属膜上生长形成物 |
US20100000762A1 (en) * | 2008-07-02 | 2010-01-07 | Applied Nanotech Holdings, Inc. | Metallic pastes and inks |
JP5474092B2 (ja) | 2009-01-14 | 2014-04-16 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 金属又は金属合金表面のハンダ付け性及び耐食性を増加するための溶液及び方法 |
US8647979B2 (en) | 2009-03-27 | 2014-02-11 | Applied Nanotech Holdings, Inc. | Buffer layer to enhance photo and/or laser sintering |
US8422197B2 (en) * | 2009-07-15 | 2013-04-16 | Applied Nanotech Holdings, Inc. | Applying optical energy to nanoparticles to produce a specified nanostructure |
EP2476779B1 (en) * | 2011-01-13 | 2013-03-20 | Atotech Deutschland GmbH | Immersion tin or tin alloy plating bath with improved removal of cupurous ions |
EP2481835B1 (en) * | 2011-01-28 | 2013-09-11 | Atotech Deutschland GmbH | Autocatalytic plating bath composition for deposition of tin and tin alloys |
WO2014011578A1 (en) | 2012-07-09 | 2014-01-16 | Applied Nanotech Holdings, Inc. | Photosintering of micron-sized copper particles |
US10072347B2 (en) | 2012-07-31 | 2018-09-11 | The Boeing Company | Systems and methods for tin antimony plating |
US10633754B2 (en) | 2013-07-05 | 2020-04-28 | The Boeing Company | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium |
US10260159B2 (en) | 2013-07-05 | 2019-04-16 | The Boeing Company | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold |
CN103526238A (zh) * | 2013-09-29 | 2014-01-22 | 东台市东环电工机械有限公司 | 提高接线头c型连接器电连接性能的方法 |
DE102014005941A1 (de) * | 2014-04-24 | 2015-11-12 | Te Connectivity Germany Gmbh | Verfahren zum Herstellen eines elektrischen Kontaktelements zur Vermeidung von Zinnwhiskerbildung, und Kontaktelement |
CN108103540B (zh) * | 2018-01-24 | 2020-01-07 | 永星化工(上海)有限公司 | 锡合金电镀液 |
CN111321435B (zh) * | 2020-04-17 | 2022-03-01 | 广州鑫睿表面技术有限公司 | 一种酸性电镀锡液及其制备方法与应用 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3616306A (en) * | 1969-11-19 | 1971-10-26 | Conversion Chem Corp | Tin plating bath and method |
US3770559A (en) * | 1971-01-11 | 1973-11-06 | Evode Ltd | Pressure-sensitive adhesive laminate |
US4029556A (en) * | 1975-10-22 | 1977-06-14 | Emlee Monaco | Plating bath and method of plating therewith |
US4331518A (en) * | 1981-01-09 | 1982-05-25 | Vulcan Materials Company | Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor |
US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
JPS5967387A (ja) * | 1982-10-08 | 1984-04-17 | Hiyougoken | すず、鉛及びすず―鉛合金メッキ浴 |
US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
JPS642330A (en) * | 1987-06-25 | 1989-01-06 | Nippon Mining Co Ltd | Film carrier and manufacture thereof |
US5538617A (en) * | 1995-03-08 | 1996-07-23 | Bethlehem Steel Corporation | Ferrocyanide-free halogen tin plating process and bath |
US5628893A (en) * | 1995-11-24 | 1997-05-13 | Atotech Usa, Inc. | Halogen tin composition and electrolytic plating process |
US5750017A (en) * | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
AU8670798A (en) * | 1997-07-30 | 1999-02-22 | Whitaker Corporation, The | Two layer solderable tin coating |
DE19804667C1 (de) * | 1998-02-06 | 1999-09-09 | Mohr Adolf Maschf | Verfahren zum Justieren eines Messers beim Messerwechsel sowie Schneidmaschine mit Messerwechselvorrichtung |
US6248455B1 (en) * | 1998-12-22 | 2001-06-19 | International Business Machines Corporation | Alloy-plated sheet steel cured with a thin layer of insulating polymer material forming an electrically nonconductive breachable metal substrate |
US6361823B1 (en) * | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
US20020166774A1 (en) * | 1999-12-10 | 2002-11-14 | Shipley Company, L.L.C. | Alloy composition and plating method |
JP2002167676A (ja) * | 2000-11-24 | 2002-06-11 | Millenium Gate Technology Co Ltd | 無電解金メッキ方法 |
JP3908912B2 (ja) * | 2001-02-22 | 2007-04-25 | 新日本製鐵株式会社 | 半田濡れ性、耐錆性、耐ホイスカー性に優れた環境対応型電子部品用表面処理鋼板 |
CN1407141A (zh) * | 2001-03-16 | 2003-04-02 | 希普雷公司 | 镀锡 |
US20020192492A1 (en) * | 2001-05-11 | 2002-12-19 | Abys Joseph Anthony | Metal article coated with near-surface doped tin or tin alloy |
US20030025182A1 (en) * | 2001-06-22 | 2003-02-06 | Abys Joseph A. | Metal article coated with tin or tin alloy under tensile stress to inhibit whisker growth |
US20030159938A1 (en) * | 2002-02-15 | 2003-08-28 | George Hradil | Electroplating solution containing organic acid complexing agent |
US6860981B2 (en) * | 2002-04-30 | 2005-03-01 | Technic, Inc. | Minimizing whisker growth in tin electrodeposits |
EP1518944B1 (en) * | 2002-06-05 | 2014-05-14 | JFE Steel Corporation | Tin-plated steel plate and method for production thereof |
US6982030B2 (en) * | 2002-11-27 | 2006-01-03 | Technic, Inc. | Reduction of surface oxidation during electroplating |
JP2004339583A (ja) * | 2003-05-16 | 2004-12-02 | Sony Corp | 錫又は錫合金材の表面処理剤、錫又は錫合金材及びその表面処理方法、錫合金系はんだ材料及びこれを用いたはんだペースト、錫合金系はんだ材料の製造方法、電子部品、プリント配線板、並びに電子部品の実装構造 |
DE102004030930A1 (de) * | 2004-06-25 | 2006-02-23 | Ormecon Gmbh | Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung |
-
2006
- 2006-06-23 JP JP2008521404A patent/JP2009500527A/ja active Pending
- 2006-06-23 TW TW095122777A patent/TW200712266A/zh unknown
- 2006-06-23 EP EP06785451A patent/EP1904669A1/en not_active Withdrawn
- 2006-06-23 US US11/473,413 patent/US20070007144A1/en not_active Abandoned
- 2006-06-23 KR KR1020087000822A patent/KR20080024525A/ko not_active Application Discontinuation
- 2006-06-23 CN CNA2006800296042A patent/CN101243210A/zh active Pending
- 2006-06-23 WO PCT/US2006/024513 patent/WO2007008369A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20080024525A (ko) | 2008-03-18 |
JP2009500527A (ja) | 2009-01-08 |
EP1904669A1 (en) | 2008-04-02 |
US20070007144A1 (en) | 2007-01-11 |
CN101243210A (zh) | 2008-08-13 |
WO2007008369A1 (en) | 2007-01-18 |
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