TW200712019A - Ultrasonic induced crack propagation in a brittle material - Google Patents

Ultrasonic induced crack propagation in a brittle material

Info

Publication number
TW200712019A
TW200712019A TW095115937A TW95115937A TW200712019A TW 200712019 A TW200712019 A TW 200712019A TW 095115937 A TW095115937 A TW 095115937A TW 95115937 A TW95115937 A TW 95115937A TW 200712019 A TW200712019 A TW 200712019A
Authority
TW
Taiwan
Prior art keywords
brittle material
crack propagation
induced crack
score line
ultrasonic induced
Prior art date
Application number
TW095115937A
Other languages
English (en)
Inventor
Ljerka Ukrainczyk
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of TW200712019A publication Critical patent/TW200712019A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/14—Means for treating work or cutting member to facilitate cutting by tensioning the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0341—Processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW095115937A 2005-05-06 2006-05-03 Ultrasonic induced crack propagation in a brittle material TW200712019A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/124,435 US20060249553A1 (en) 2005-05-06 2005-05-06 Ultrasonic induced crack propagation in a brittle material

Publications (1)

Publication Number Publication Date
TW200712019A true TW200712019A (en) 2007-04-01

Family

ID=37393188

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115937A TW200712019A (en) 2005-05-06 2006-05-03 Ultrasonic induced crack propagation in a brittle material

Country Status (7)

Country Link
US (1) US20060249553A1 (zh)
EP (1) EP1883511A4 (zh)
JP (1) JP2008540169A (zh)
KR (1) KR20080006643A (zh)
CN (1) CN101193731B (zh)
TW (1) TW200712019A (zh)
WO (1) WO2006121756A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681936B (zh) * 2008-10-31 2020-01-11 美商康寧公司 製造玻璃片之方法及玻璃製造系統

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US20060261118A1 (en) * 2005-05-17 2006-11-23 Cox Judy K Method and apparatus for separating a pane of brittle material from a moving ribbon of the material
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US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
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KR100937965B1 (ko) * 2008-07-16 2010-01-21 삼성모바일디스플레이주식회사 평판 디스플레이 패널 절단 장치
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JP2011088382A (ja) 2009-10-23 2011-05-06 Mitsuboshi Diamond Industrial Co Ltd ブレイク装置およびブレイク方法
US20110126593A1 (en) * 2009-11-30 2011-06-02 Rashid Abdul-Rahman Apparatus and method for separating a glass sheet
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WO2017104386A1 (ja) * 2015-12-15 2017-06-22 日本電気硝子株式会社 ガラス板の製造方法及び製造装置
EP3427044A4 (en) 2016-03-08 2019-10-09 Arizona Board of Regents on behalf of Arizona State University SOUND-ASSISTED CRACKING PROPAGATION FOR FORMING SEMICONDUCTOR WAFERS
CN107402151B (zh) * 2017-07-31 2020-06-05 水利部交通运输部国家能源局南京水利科学研究院 一种超声激励控制脆性材料表面及贯穿裂纹尺寸的方法
JP7193542B2 (ja) * 2017-09-26 2022-12-20 コーニング インコーポレイテッド 帯状ガラスを分離するためのガラス製造装置および方法
CN107892471A (zh) * 2017-11-13 2018-04-10 武汉先河激光技术有限公司 一种用于手机全面屏的超声波裂片装置及裂片方法
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Publication number Priority date Publication date Assignee Title
TWI681936B (zh) * 2008-10-31 2020-01-11 美商康寧公司 製造玻璃片之方法及玻璃製造系統

Also Published As

Publication number Publication date
KR20080006643A (ko) 2008-01-16
CN101193731A (zh) 2008-06-04
WO2006121756A3 (en) 2007-11-15
EP1883511A2 (en) 2008-02-06
CN101193731B (zh) 2010-11-10
EP1883511A4 (en) 2010-04-07
US20060249553A1 (en) 2006-11-09
JP2008540169A (ja) 2008-11-20
WO2006121756A2 (en) 2006-11-16

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