TW200643669A - Quality control system, quality control method, and method of lot-to-lot wafer processing - Google Patents

Quality control system, quality control method, and method of lot-to-lot wafer processing

Info

Publication number
TW200643669A
TW200643669A TW095107769A TW95107769A TW200643669A TW 200643669 A TW200643669 A TW 200643669A TW 095107769 A TW095107769 A TW 095107769A TW 95107769 A TW95107769 A TW 95107769A TW 200643669 A TW200643669 A TW 200643669A
Authority
TW
Taiwan
Prior art keywords
lot
quality control
stores
storage unit
internal information
Prior art date
Application number
TW095107769A
Other languages
English (en)
Chinese (zh)
Other versions
TWI320518B (enExample
Inventor
Akira Ogawa
Yukihiro Ushiku
Tomomi Ino
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200643669A publication Critical patent/TW200643669A/zh
Application granted granted Critical
Publication of TWI320518B publication Critical patent/TWI320518B/zh

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32097—Recipe programming for flexible batch
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32194—Quality prediction
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
TW095107769A 2005-04-05 2006-03-08 Quality control system, quality control method, and method of lot-to-lot wafer processing TW200643669A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005109209A JP4693464B2 (ja) 2005-04-05 2005-04-05 品質管理システム、品質管理方法及びロット単位のウェハ処理方法

Publications (2)

Publication Number Publication Date
TW200643669A true TW200643669A (en) 2006-12-16
TWI320518B TWI320518B (enExample) 2010-02-11

Family

ID=37077600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107769A TW200643669A (en) 2005-04-05 2006-03-08 Quality control system, quality control method, and method of lot-to-lot wafer processing

Country Status (4)

Country Link
US (1) US7463941B2 (enExample)
JP (1) JP4693464B2 (enExample)
CN (1) CN100424599C (enExample)
TW (1) TW200643669A (enExample)

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TWI459169B (zh) * 2008-03-06 2014-11-01 Applied Materials Inc 用於控制設備工程系統之良率預測反饋之方法、系統、及記錄相關指令的非暫態電腦可讀取媒體

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JP2008121447A (ja) * 2006-11-09 2008-05-29 Nissan Diesel Motor Co Ltd 燃料噴射制御装置
JPWO2008075404A1 (ja) * 2006-12-19 2010-04-02 株式会社システムブイマネジメント 半導体製造システム
JP5169098B2 (ja) * 2007-09-14 2013-03-27 Ｊｆｅスチール株式会社 品質予測装置、品質予測方法及び製造方法
JP5169096B2 (ja) * 2007-09-14 2013-03-27 Ｊｆｅスチール株式会社 品質予測装置、品質予測方法及び製品の製造方法
US7962440B2 (en) * 2007-09-27 2011-06-14 Rockwell Automation Technologies, Inc. Adaptive industrial systems via embedded historian data
US8002871B2 (en) * 2008-02-01 2011-08-23 Honeywell International Inc. Methods and apparatus for an oxygen furnace quality control system
US7974802B2 (en) * 2008-03-07 2011-07-05 International Business Machines Corporation Photomask image inspection
JP2009257922A (ja) * 2008-04-16 2009-11-05 Jatco Ltd 自動変速機の検査方法および自動変速機の検査装置
WO2010137488A1 (ja) * 2009-05-29 2010-12-02 株式会社村田製作所 製品検査装置、製品検査方法及びコンピュータプログラム
JP5287985B2 (ja) * 2009-05-29 2013-09-11 株式会社村田製作所 製品選別装置、製品選別方法及びコンピュータプログラム
US8437870B2 (en) * 2009-06-05 2013-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for implementing a virtual metrology advanced process control platform
JP5503564B2 (ja) * 2011-01-18 2014-05-28 東京エレクトロン株式会社 処理装置の異常判定システム及びその異常判定方法
JP5855841B2 (ja) 2011-04-01 2016-02-09 株式会社日立国際電気 管理装置
NL2009853A (en) 2011-12-23 2013-06-26 Asml Netherlands Bv Methods and apparatus for measuring a property of a substrate.
JP5783975B2 (ja) 2012-08-29 2015-09-24 株式会社東芝 半導体製造処理システムおよび方法
US20150253762A1 (en) * 2012-09-26 2015-09-10 Hitachi Kokusai Electric Inc. Integrated management system, management device, method of displaying information for substrate processing apparatus, and recording medium
WO2014153409A2 (en) * 2013-03-20 2014-09-25 Lifetime Brands, Inc. Method and apparatus for mobile quality management inspections
US9666417B2 (en) 2013-08-28 2017-05-30 Sakai Display Products Corporation Plasma processing apparatus and method for monitoring plasma processing apparatus
CN104794318B (zh) * 2014-01-17 2017-11-21 无锡华润上华科技有限公司 用于建立半导体器件统计模型的数据处理方法
CN105470156B (zh) * 2014-09-09 2018-09-04 中芯国际集成电路制造(上海)有限公司 一种基于rtd的量测工艺
JP6178768B2 (ja) * 2014-09-17 2017-08-09 株式会社東芝 品質管理装置およびその管理方法
JP6385914B2 (ja) * 2015-12-16 2018-09-05 三菱重工業株式会社 品質モニタリングシステムおよび品質モニタリング方法
JP6453805B2 (ja) 2016-04-25 2019-01-16 ファナック株式会社 製品の異常に関連する変数の判定値を設定する生産システム
CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
US11335607B2 (en) 2020-07-09 2022-05-17 Tokyo Electron Limited Apparatus and methods for wafer to wafer bonding
TWI853979B (zh) * 2020-07-13 2024-09-01 日商東京威力科創股份有限公司 晶圓間接合用設備及方法
CN114198878B (zh) * 2020-09-17 2023-08-04 青岛海信电子产业控股股份有限公司 空气质量的调节方法及智能设备
US12474281B2 (en) * 2022-02-16 2025-11-18 Kla Corporation Semiconductor measurements with robust in-line tool matching
CN115881529B (zh) * 2023-02-06 2023-05-12 合肥新晶集成电路有限公司 湿法刻蚀方法、装置、系统、计算机设备以及介质

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI459169B (zh) * 2008-03-06 2014-11-01 Applied Materials Inc 用於控制設備工程系統之良率預測反饋之方法、系統、及記錄相關指令的非暫態電腦可讀取媒體

Also Published As

Publication number Publication date
CN100424599C (zh) 2008-10-08
JP2006293433A (ja) 2006-10-26
JP4693464B2 (ja) 2011-06-01
TWI320518B (enExample) 2010-02-11
US20060235560A1 (en) 2006-10-19
US7463941B2 (en) 2008-12-09
CN1848006A (zh) 2006-10-18

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