TW200642842A - Method for preparing flexible mechanically compensated transparent layered material - Google Patents

Method for preparing flexible mechanically compensated transparent layered material

Info

Publication number
TW200642842A
TW200642842A TW094140709A TW94140709A TW200642842A TW 200642842 A TW200642842 A TW 200642842A TW 094140709 A TW094140709 A TW 094140709A TW 94140709 A TW94140709 A TW 94140709A TW 200642842 A TW200642842 A TW 200642842A
Authority
TW
Taiwan
Prior art keywords
transparent
inorganic material
layered material
applying
mechanically compensated
Prior art date
Application number
TW094140709A
Other languages
English (en)
Inventor
Gert Jan Jongerden
Rutger Schlatmann
Jan Willem Gaston Mahy
Original Assignee
Akzo Nobel Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel Nv filed Critical Akzo Nobel Nv
Publication of TW200642842A publication Critical patent/TW200642842A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/30—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being formed of particles, e.g. chips, granules, powder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0005—Separation of the coating from the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
TW094140709A 2004-11-19 2005-11-18 Method for preparing flexible mechanically compensated transparent layered material TW200642842A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04078173 2004-11-19
US63500604P 2004-12-13 2004-12-13

Publications (1)

Publication Number Publication Date
TW200642842A true TW200642842A (en) 2006-12-16

Family

ID=34928675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140709A TW200642842A (en) 2004-11-19 2005-11-18 Method for preparing flexible mechanically compensated transparent layered material

Country Status (7)

Country Link
US (1) US8025929B2 (zh)
EP (1) EP1819508A1 (zh)
JP (1) JP2008520463A (zh)
KR (1) KR20070085639A (zh)
CN (1) CN101060980B (zh)
TW (1) TW200642842A (zh)
WO (1) WO2006053889A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8305743B2 (en) 2008-05-16 2012-11-06 Au Optronics Corp. Curved display panel and method for manufacturing the same
TWI768762B (zh) * 2021-02-17 2022-06-21 南韓商Ｕｔｉ有限公司 可滾動、可滑動和可拉伸的覆蓋窗及其製造方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0803702D0 (en) 2008-02-28 2008-04-09 Isis Innovation Transparent conducting oxides
EP2138607A1 (en) * 2008-06-24 2009-12-30 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Process for preparing a flexible substrate carrying a film of a transparent conductive oxide
US11198270B2 (en) 2008-12-30 2021-12-14 Nanosys, Inc. Quantum dot films, lighting devices, and lighting methods
US9359666B2 (en) * 2009-03-13 2016-06-07 The Board Of Trustees Of The University Of Illinois Rapid crystallization of heavily doped metal oxides and products produced thereby
GB0915376D0 (en) * 2009-09-03 2009-10-07 Isis Innovation Transparent conducting oxides
US8399889B2 (en) * 2009-11-09 2013-03-19 Solarmer Energy, Inc. Organic light emitting diode and organic solar cell stack
KR101669953B1 (ko) 2010-03-26 2016-11-09 삼성전자 주식회사 산화물 박막, 산화물 박막의 형성 방법 및 산화물 박막을 포함하는 전자 소자
KR20200039806A (ko) 2010-11-10 2020-04-16 나노시스, 인크. 양자 도트 필름들, 조명 디바이스들, 및 조명 방법들
TW201228061A (en) * 2010-12-24 2012-07-01 Au Optronics Corp Photovoltaic cell module
FR2986459B1 (fr) 2012-02-08 2015-12-18 B Equipment Procede et machine pour reduire la hauteur de boite a section carree ou rectangulaire
JP2017518897A (ja) * 2014-04-22 2017-07-13 サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ 可撓性の透明な一体型導電性フィルム
US9701099B2 (en) * 2014-05-06 2017-07-11 Darwin Hu Single flexible cover for touch screen
US10227465B2 (en) 2014-08-07 2019-03-12 Sabic Global Technologies B.V. Conductive multilayer sheet for thermal forming applications
CN105098093B (zh) * 2015-06-18 2018-09-11 京东方科技集团股份有限公司 一种有机电致发光器件及显示装置
CN106676472A (zh) * 2016-12-16 2017-05-17 桂林电子科技大学 一种转移ito薄膜的方法
KR20180113232A (ko) * 2017-04-05 2018-10-16 (주)에프티씨 정전용량방식 및 감압방식 동작기능을 갖는 도전성 액정보호필름 및 제조방법
KR102547690B1 (ko) * 2018-04-27 2023-06-27 삼성디스플레이 주식회사 표시장치
CN115207205B (zh) * 2022-07-27 2023-04-25 广东工业大学 一种薄膜振动装置及其制备方法、应用其的清洗装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5898915A (ja) 1981-12-09 1983-06-13 Konishiroku Photo Ind Co Ltd アモルフアスシリコン半導体装置
US4542257A (en) * 1984-04-27 1985-09-17 Hughes Aircraft Company Solar cell array panel and method of manufacture
JPH01119073A (ja) 1987-10-31 1989-05-11 Nitto Denko Corp 可撓性光電変換素子の製造方法
JPH01213991A (ja) * 1988-02-20 1989-08-28 Hitachi Maxell Ltd 透明電極基板とこれを用いたエレクトロルミネツセンス素子
US4952783A (en) * 1989-03-20 1990-08-28 W. H. Brady Co. Light transmitting flexible film electrical heater panels
JP2843096B2 (ja) 1990-03-08 1999-01-06 住友ベークライト株式会社 積層フィルム
JP3101660B2 (ja) 1991-05-21 2000-10-23 藤森工業株式会社 非金属薄膜層を設けた樹脂フィルムの製造法
JPH06232437A (ja) 1992-12-07 1994-08-19 Fuji Electric Co Ltd 可撓性薄膜光電変換素子
JP3360338B2 (ja) 1993-02-19 2002-12-24 東レ株式会社 透明被膜および導電膜付き樹脂板
JP3501820B2 (ja) 1993-02-23 2004-03-02 鐘淵化学工業株式会社 屈曲性に優れた透明導電性フィルム
JP3050739B2 (ja) 1993-12-20 2000-06-12 シャープ株式会社 プラスチック液晶表示素子の製造方法
EP0675157A1 (en) 1994-03-29 1995-10-04 Ppg Industries, Inc. Primer for adhering conductive films to acrylic or polycarbonate substrates
FR2738813B1 (fr) * 1995-09-15 1997-10-17 Saint Gobain Vitrage Substrat a revetement photo-catalytique
EP0875071B1 (en) * 1996-01-16 2005-07-20 World Properties, Inc. Roll coated el panel
BR9711418B1 (pt) 1996-09-26 2010-06-29 folha fotovoltaica, e, processo para a fabricação de uma folha fotovoltaica.
JPH10253936A (ja) * 1997-03-11 1998-09-25 Sharp Corp 液晶表示素子の製造方法
JP3313306B2 (ja) 1997-05-30 2002-08-12 住友ベークライト株式会社 帯電防止フィルム
EP0948004A1 (en) 1998-03-26 1999-10-06 Akzo Nobel N.V. Method for making a photovoltaic cell containing a dye
AU1339700A (en) * 1998-11-02 2000-05-22 Presstek, Inc. Transparent conductive oxides for plastic flat panel displays
JP4233180B2 (ja) 1999-09-29 2009-03-04 帝人株式会社 透明導電性高分子基板
JP4478998B2 (ja) 2000-05-21 2010-06-09 Ｔｄｋ株式会社 透明導電フィルムおよび透明導電積層体
JP2002052636A (ja) 2000-08-09 2002-02-19 Teijin Ltd 透明導電性基板
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
US20050109389A1 (en) * 2002-03-05 2005-05-26 Akzo Nobel N. V, Process for manufacturing a solar cell unit using a temporary substrate
WO2003075351A2 (en) 2002-03-05 2003-09-12 Akzo Nobel N.V. Process for manufacturing a solar cell unit using a temporary substrate
US6933051B2 (en) * 2002-08-17 2005-08-23 3M Innovative Properties Company Flexible electrically conductive film
JP4407265B2 (ja) * 2003-03-11 2010-02-03 住友ベークライト株式会社 表示パネル用プラスチックシートの製造方法
WO2004084282A1 (en) 2003-03-14 2004-09-30 Midwest Research Institute Bifacial structure for tandem solar cell formed with amorphous semiconductor materials
US20050056312A1 (en) * 2003-03-14 2005-03-17 Young David L. Bifacial structure for tandem solar cells
EP1460643B1 (en) 2003-03-20 2009-01-07 Agfa HealthCare NV Manufacturing method of phosphor or scintillator sheets and panels suitable for use in a scanning apparatus.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8305743B2 (en) 2008-05-16 2012-11-06 Au Optronics Corp. Curved display panel and method for manufacturing the same
TWI768762B (zh) * 2021-02-17 2022-06-21 南韓商Ｕｔｉ有限公司 可滾動、可滑動和可拉伸的覆蓋窗及其製造方法

Also Published As

Publication number Publication date
JP2008520463A (ja) 2008-06-19
CN101060980A (zh) 2007-10-24
KR20070085639A (ko) 2007-08-27
WO2006053889A1 (en) 2006-05-26
US8025929B2 (en) 2011-09-27
CN101060980B (zh) 2010-09-22
US20080193717A1 (en) 2008-08-14
EP1819508A1 (en) 2007-08-22

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