TW200642535A - Two-side flexible circuit substrate adapted for repeated bending - Google Patents

Two-side flexible circuit substrate adapted for repeated bending

Info

Publication number
TW200642535A
TW200642535A TW095103415A TW95103415A TW200642535A TW 200642535 A TW200642535 A TW 200642535A TW 095103415 A TW095103415 A TW 095103415A TW 95103415 A TW95103415 A TW 95103415A TW 200642535 A TW200642535 A TW 200642535A
Authority
TW
Taiwan
Prior art keywords
circuit substrate
thickness
insulation layer
flexible circuit
side flexible
Prior art date
Application number
TW095103415A
Other languages
English (en)
Other versions
TWI397351B (zh
Inventor
Yosuke Takahashi
Katsufumi Hiraishi
Yoshihiro Goto
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200642535A publication Critical patent/TW200642535A/zh
Application granted granted Critical
Publication of TWI397351B publication Critical patent/TWI397351B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Telephone Set Structure (AREA)
  • Telephone Function (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW095103415A 2005-02-17 2006-01-27 反覆彎曲用雙面可撓性電路基板 TWI397351B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005040194A JP4722507B2 (ja) 2005-02-17 2005-02-17 繰り返し屈曲用途向け両面フレキシブル回路基板

Publications (2)

Publication Number Publication Date
TW200642535A true TW200642535A (en) 2006-12-01
TWI397351B TWI397351B (zh) 2013-05-21

Family

ID=36947463

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103415A TWI397351B (zh) 2005-02-17 2006-01-27 反覆彎曲用雙面可撓性電路基板

Country Status (4)

Country Link
JP (1) JP4722507B2 (zh)
KR (2) KR101195087B1 (zh)
CN (2) CN1829412B (zh)
TW (1) TWI397351B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393512B (zh) * 2008-08-20 2013-04-11 Unimicron Technology Corp 硬式線路板
US9024198B2 (en) 2009-12-24 2015-05-05 Nippon Mektron, Ltd. Flexible circuit board and method for production thereof
TWI507108B (zh) * 2013-07-29 2015-11-01 Zhen Ding Technology Co Ltd 柔性電路板及其製作方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4969993B2 (ja) * 2006-11-01 2012-07-04 日本メクトロン株式会社 多層フレキシブルプリント配線板およびその製造法
JP5151265B2 (ja) 2007-06-14 2013-02-27 日立電線株式会社 多層配線基板及び多層配線基板の製造方法
KR100956238B1 (ko) * 2007-12-18 2010-05-04 삼성전기주식회사 굴곡성 인쇄회로기판 및 그 제조방법
JP5354018B2 (ja) * 2009-08-11 2013-11-27 株式会社村田製作所 多層基板
JP5284308B2 (ja) 2010-04-19 2013-09-11 日本メクトロン株式会社 フレキシブル回路基板及びその製造方法
CN103069933B (zh) * 2010-08-12 2014-06-04 新日铁住金化学株式会社 覆金属层叠板
JP5540436B2 (ja) * 2011-08-09 2014-07-02 住友電工プリントサーキット株式会社 プリント配線集合シート、該プリント配線集合シートを用いて形成されるプリント配線板、前記プリント配線集合シートの製造方法
CN102843448B (zh) * 2012-08-14 2016-06-15 惠州Tcl移动通信有限公司 一种sim卡座堆叠结构及其手机
CN104320908A (zh) * 2014-11-14 2015-01-28 镇江华印电路板有限公司 散热型多层软硬结合印刷板
KR20160108761A (ko) * 2015-03-06 2016-09-20 삼성전자주식회사 연결 기판
US20160380326A1 (en) * 2015-06-26 2016-12-29 Stephen H. Hall Flexible circuit structures for high-bandwidth communication
US9786790B2 (en) 2015-12-10 2017-10-10 Industrial Technology Research Institute Flexible device
US11452198B2 (en) 2019-07-25 2022-09-20 Borgwarner, Inc. Thermally insulated printed circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11195849A (ja) 1997-12-26 1999-07-21 Fujikura Ltd フレキシブルプリント配線板とその製造方法
JP3490309B2 (ja) * 1998-10-29 2004-01-26 山一電機株式会社 配線基板およびその製造方法
JP4138995B2 (ja) * 1999-03-31 2008-08-27 株式会社クラレ 回路基板およびその製造方法
JP2001102700A (ja) * 1999-07-27 2001-04-13 Sanyo Electric Co Ltd フレキシブルプリント基板及びフレキシブルプリント基板を有する携帯電話端末
JP2003046275A (ja) * 2001-07-31 2003-02-14 Fujitsu Ltd 携帯機器
JP2003258389A (ja) * 2002-03-06 2003-09-12 Sumitomo Electric Printed Circuit Inc フレキシブルプリント配線板
JP3859527B2 (ja) * 2002-03-06 2006-12-20 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の配置構造
JP2004311740A (ja) * 2003-04-08 2004-11-04 Arisawa Mfg Co Ltd フレキシブルプリント配線板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393512B (zh) * 2008-08-20 2013-04-11 Unimicron Technology Corp 硬式線路板
US9024198B2 (en) 2009-12-24 2015-05-05 Nippon Mektron, Ltd. Flexible circuit board and method for production thereof
TWI508634B (zh) * 2009-12-24 2015-11-11 Nippon Mektron Kk 軟性電路基板之製造方法
TWI507108B (zh) * 2013-07-29 2015-11-01 Zhen Ding Technology Co Ltd 柔性電路板及其製作方法

Also Published As

Publication number Publication date
KR20060092087A (ko) 2006-08-22
KR101195087B1 (ko) 2012-10-29
CN1829412A (zh) 2006-09-06
TWI397351B (zh) 2013-05-21
JP4722507B2 (ja) 2011-07-13
JP2006228922A (ja) 2006-08-31
KR101259474B1 (ko) 2013-05-06
CN102231936A (zh) 2011-11-02
CN1829412B (zh) 2012-06-20
KR20120032506A (ko) 2012-04-05
CN102231936B (zh) 2013-02-27

Similar Documents

Publication Publication Date Title
TW200642535A (en) Two-side flexible circuit substrate adapted for repeated bending
TW200746933A (en) Substrate for flexible wiring and method for producing the same
TW200714978A (en) Manufacturing method of liquid crystal display device
TW200622364A (en) Electro-optical device and electronic apparatus
TW200704833A (en) Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
US20100252307A1 (en) Flexible printed circuit board
TWI526125B (zh) Flexible circuit boards for repeated buckling applications, using their electronic machines and mobile phones
TW200700581A (en) Copper foil for printed wiring board
JP6973032B2 (ja) 両面粘着テープ、当該両面粘着テープを備える電子機器、前記両面粘着テープを備えた解体構造、接着構造
WO2009047876A1 (ja) 回路装置
TW200638813A (en) Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board
JP2014141083A (ja) フレキシブル銅張積層板
TW200734732A (en) Display panel having repair lines and signal lines disposed at different substrate
WO2010050759A3 (en) Flexible metal-clad laminate and a method of manufacturing the same
JP2006284925A (ja) フレキシブル光電気混載基板およびこれを用いた電子機器
KR100853711B1 (ko) 변형이 유연한 히트 싱크와 이의 제조방법
TW200626696A (en) Adhesive sheet and copper-clad laminate
TW200605321A (en) Microwave transmission line
CN201403249Y (zh) 抗电磁干扰的柔性电路板结构
KR102288004B1 (ko) 플렉시블 구리 피복 적층판 및 플렉시블 회로 기판
TW200636097A (en) Copper foil and method for manufacturing the same and flexible printed circuit board
JP6917987B2 (ja) フレキシブル金属張積層板の製造方法
KR20090093126A (ko) 진동특성이 개선된 연성 동장적층판
JP2008130760A (ja) フレキシブルプリント基板
WO2006130244A3 (en) Peelable circuit board foil

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees