TW200636097A - Copper foil and method for manufacturing the same and flexible printed circuit board - Google Patents

Copper foil and method for manufacturing the same and flexible printed circuit board

Info

Publication number
TW200636097A
TW200636097A TW095104208A TW95104208A TW200636097A TW 200636097 A TW200636097 A TW 200636097A TW 095104208 A TW095104208 A TW 095104208A TW 95104208 A TW95104208 A TW 95104208A TW 200636097 A TW200636097 A TW 200636097A
Authority
TW
Taiwan
Prior art keywords
copper foil
plating
flexible printed
manufacturing
circuit board
Prior art date
Application number
TW095104208A
Other languages
Chinese (zh)
Other versions
TWI396779B (en
Inventor
Akitoshi Suzuki
Shin Fukuda
Original Assignee
Furukawa Circuit Foil
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Circuit Foil filed Critical Furukawa Circuit Foil
Publication of TW200636097A publication Critical patent/TW200636097A/en
Application granted granted Critical
Publication of TWI396779B publication Critical patent/TWI396779B/en

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

This invention is to provide copper foil having excellent adhesion to an insulating film, and excellent flexibility after being adhered to the insulating film, and to provide an FPC having excellent flexibility. In the flexible printed wiring board copper foil, smoothing plating is applied on the bright surface of untreated electrolytic copper foil. The smoothing plating is copper plating having a granular crystal structure with an average grain size not larger than 2 μm. In addition, the smoothing plating is copper plating having a carbon content not more than 18 ppm, and a recrystallization temperature not higher than 200 DEG C.
TW095104208A 2005-02-21 2006-02-08 Copper foil and its manufacturing method, and flexible printed circuit board TWI396779B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005043554 2005-02-21

Publications (2)

Publication Number Publication Date
TW200636097A true TW200636097A (en) 2006-10-16
TWI396779B TWI396779B (en) 2013-05-21

Family

ID=37002195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104208A TWI396779B (en) 2005-02-21 2006-02-08 Copper foil and its manufacturing method, and flexible printed circuit board

Country Status (3)

Country Link
KR (1) KR101280486B1 (en)
CN (1) CN1834302B (en)
TW (1) TWI396779B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100958976B1 (en) * 2008-02-01 2010-05-20 엘에스엠트론 주식회사 A High Flexuous Copper Foil And Method For Producing The Same
JP5490144B2 (en) * 2009-12-25 2014-05-14 Ｙｋｋ株式会社 Fastener components and slide fasteners
CN103060882B (en) * 2013-01-21 2015-11-04 福建清景铜箔有限公司 The method and system of electrolytic copper foil are produced in a kind of copper-bath countercurrent flow
KR101734840B1 (en) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 Electrolytic copper foil of secondary battery enhanced for flexibility resistance and manufacturing method thereof
CN111485260B (en) * 2020-04-30 2020-12-08 广东嘉元科技股份有限公司 Low-warpage electrolytic copper foil for secondary battery and method for producing same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU579517B2 (en) * 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
JP3081026B2 (en) * 1991-07-18 2000-08-28 古河サーキットフォイル株式会社 Electrolytic copper foil for printed wiring boards
US5545466A (en) * 1993-03-19 1996-08-13 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate and printed wiring board
US5552234A (en) * 1993-03-29 1996-09-03 Japan Energy Corporation Copper foil for printed circuits
JP3608840B2 (en) * 1995-04-07 2005-01-12 古河サーキットフォイル株式会社 Electrolytic copper foil for flexible wiring boards
US6132887A (en) * 1995-06-16 2000-10-17 Gould Electronics Inc. High fatigue ductility electrodeposited copper foil
JP3313277B2 (en) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 Electrodeposited copper foil for fine pattern and its manufacturing method
EP0857402B1 (en) * 1996-08-23 2007-12-19 Nikko Materials USA, Inc. High performance flexible laminate
TW200404484A (en) * 2002-09-02 2004-03-16 Furukawa Circuit Foil Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board
TW200424359A (en) * 2003-02-04 2004-11-16 Furukawa Circuit Foil Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil

Also Published As

Publication number Publication date
KR20060093280A (en) 2006-08-24
CN1834302A (en) 2006-09-20
TWI396779B (en) 2013-05-21
KR101280486B1 (en) 2013-07-01
CN1834302B (en) 2012-04-04

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