TW200636097A - Copper foil and method for manufacturing the same and flexible printed circuit board - Google Patents
Copper foil and method for manufacturing the same and flexible printed circuit boardInfo
- Publication number
- TW200636097A TW200636097A TW095104208A TW95104208A TW200636097A TW 200636097 A TW200636097 A TW 200636097A TW 095104208 A TW095104208 A TW 095104208A TW 95104208 A TW95104208 A TW 95104208A TW 200636097 A TW200636097 A TW 200636097A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- plating
- flexible printed
- manufacturing
- circuit board
- Prior art date
Links
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
This invention is to provide copper foil having excellent adhesion to an insulating film, and excellent flexibility after being adhered to the insulating film, and to provide an FPC having excellent flexibility. In the flexible printed wiring board copper foil, smoothing plating is applied on the bright surface of untreated electrolytic copper foil. The smoothing plating is copper plating having a granular crystal structure with an average grain size not larger than 2 μm. In addition, the smoothing plating is copper plating having a carbon content not more than 18 ppm, and a recrystallization temperature not higher than 200 DEG C.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005043554 | 2005-02-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200636097A true TW200636097A (en) | 2006-10-16 |
TWI396779B TWI396779B (en) | 2013-05-21 |
Family
ID=37002195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095104208A TWI396779B (en) | 2005-02-21 | 2006-02-08 | Copper foil and its manufacturing method, and flexible printed circuit board |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101280486B1 (en) |
CN (1) | CN1834302B (en) |
TW (1) | TWI396779B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100958976B1 (en) * | 2008-02-01 | 2010-05-20 | 엘에스엠트론 주식회사 | A High Flexuous Copper Foil And Method For Producing The Same |
JP5490144B2 (en) * | 2009-12-25 | 2014-05-14 | Ykk株式会社 | Fastener components and slide fasteners |
CN103060882B (en) * | 2013-01-21 | 2015-11-04 | 福建清景铜箔有限公司 | The method and system of electrolytic copper foil are produced in a kind of copper-bath countercurrent flow |
KR101734840B1 (en) * | 2016-11-11 | 2017-05-15 | 일진머티리얼즈 주식회사 | Electrolytic copper foil of secondary battery enhanced for flexibility resistance and manufacturing method thereof |
CN111485260B (en) * | 2020-04-30 | 2020-12-08 | 广东嘉元科技股份有限公司 | Low-warpage electrolytic copper foil for secondary battery and method for producing same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU579517B2 (en) * | 1986-06-20 | 1988-11-24 | Gould Inc. | Double matte finish copper foil |
JP3081026B2 (en) * | 1991-07-18 | 2000-08-28 | 古河サーキットフォイル株式会社 | Electrolytic copper foil for printed wiring boards |
US5545466A (en) * | 1993-03-19 | 1996-08-13 | Mitsui Mining & Smelting Co., Ltd. | Copper-clad laminate and printed wiring board |
US5552234A (en) * | 1993-03-29 | 1996-09-03 | Japan Energy Corporation | Copper foil for printed circuits |
JP3608840B2 (en) * | 1995-04-07 | 2005-01-12 | 古河サーキットフォイル株式会社 | Electrolytic copper foil for flexible wiring boards |
US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
JP3313277B2 (en) * | 1995-09-22 | 2002-08-12 | 古河サーキットフォイル株式会社 | Electrodeposited copper foil for fine pattern and its manufacturing method |
EP0857402B1 (en) * | 1996-08-23 | 2007-12-19 | Nikko Materials USA, Inc. | High performance flexible laminate |
TW200404484A (en) * | 2002-09-02 | 2004-03-16 | Furukawa Circuit Foil | Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board |
TW200424359A (en) * | 2003-02-04 | 2004-11-16 | Furukawa Circuit Foil | Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil |
-
2006
- 2006-02-08 TW TW095104208A patent/TWI396779B/en active
- 2006-02-17 KR KR1020060015419A patent/KR101280486B1/en active IP Right Grant
- 2006-02-20 CN CN2006100549264A patent/CN1834302B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20060093280A (en) | 2006-08-24 |
CN1834302A (en) | 2006-09-20 |
TWI396779B (en) | 2013-05-21 |
KR101280486B1 (en) | 2013-07-01 |
CN1834302B (en) | 2012-04-04 |
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